JP2017527688A - 高リン無電解ニッケル - Google Patents
高リン無電解ニッケル Download PDFInfo
- Publication number
- JP2017527688A JP2017527688A JP2016570983A JP2016570983A JP2017527688A JP 2017527688 A JP2017527688 A JP 2017527688A JP 2016570983 A JP2016570983 A JP 2016570983A JP 2016570983 A JP2016570983 A JP 2016570983A JP 2017527688 A JP2017527688 A JP 2017527688A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- electroless nickel
- deposit
- ion source
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 221
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 102
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000011574 phosphorus Substances 0.000 title claims abstract description 44
- 229910052698 phosphorus Inorganic materials 0.000 title claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 52
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 35
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 26
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 24
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002244 precipitate Substances 0.000 claims abstract description 22
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229940081974 saccharin Drugs 0.000 claims abstract description 19
- 235000019204 saccharin Nutrition 0.000 claims abstract description 19
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims abstract description 19
- 239000000654 additive Substances 0.000 claims abstract description 13
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229940005631 hypophosphite ion Drugs 0.000 claims abstract description 12
- 239000002738 chelating agent Substances 0.000 claims abstract description 10
- 239000002253 acid Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 10
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 10
- 230000007797 corrosion Effects 0.000 claims description 9
- -1 nickel alkyl sulfonate Chemical class 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 5
- 239000000872 buffer Substances 0.000 claims description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 4
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 3
- GJYJYFHBOBUTBY-UHFFFAOYSA-N alpha-camphorene Chemical compound CC(C)=CCCC(=C)C1CCC(CCC=C(C)C)=CC1 GJYJYFHBOBUTBY-UHFFFAOYSA-N 0.000 claims description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 3
- XXSPKSHUSWQAIZ-UHFFFAOYSA-L 36026-88-7 Chemical compound [Ni+2].[O-]P=O.[O-]P=O XXSPKSHUSWQAIZ-UHFFFAOYSA-L 0.000 claims description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 2
- UQPSGBZICXWIAG-UHFFFAOYSA-L nickel(2+);dibromide;trihydrate Chemical compound O.O.O.Br[Ni]Br UQPSGBZICXWIAG-UHFFFAOYSA-L 0.000 claims description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 229910001380 potassium hypophosphite Inorganic materials 0.000 claims 2
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 claims 2
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims 1
- 229940078494 nickel acetate Drugs 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- 239000003638 chemical reducing agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 239000008139 complexing agent Substances 0.000 description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 229910052717 sulfur Inorganic materials 0.000 description 6
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 5
- 229910002651 NO3 Inorganic materials 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 4
- 229910001096 P alloy Inorganic materials 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 150000002815 nickel Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000007857 degradation product Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical compound [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- YWMAPNNZOCSAPF-UHFFFAOYSA-N Nickel(1+) Chemical compound [Ni+] YWMAPNNZOCSAPF-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003060 catalysis inhibitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229940006444 nickel cation Drugs 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemically Coating (AREA)
Abstract
Description
a)ニッケルイオン源と;
b)有効量のチオ尿素と;
c)有効量のサッカリンと;
d)次亜リン酸イオン源と;
e)1以上のキレート剤と;
f)任意に、他の添加剤と;
を含むことを特徴とする無電解ニッケルめっき浴に関する。
a)その上に無電解ニッケルを受容するように前記基材を調製する工程と;
b)前記基材を無電解ニッケルめっき浴に浸漬する工程と;を含み、
前記無電解ニッケルめっき浴が、
i)ニッケルイオン源と;
ii)有効量のチオ尿素と;
iii)有効量のサッカリンと;
iv)次亜リン酸イオン源と;
v)1以上のキレート剤と;
vi)任意に、他の添加剤と;を含み、
前記高リン無電解ニッケル析出物がRCA硝酸試験に合格可能であり、前記RCA硝酸試験は、その上に前記高リンニッケル析出物を有する前記基材を濃ニッケル酸に30秒間浸漬し、黒色又は灰色に変化しない前記析出物が前記RCA硝酸試験に合格したものとすることを特徴とする方法に関する。
a)ニッケルイオン源と;
b)有効量のチオ尿素と;
c)有効量のサッカリンと;
d)次亜リン酸イオン源と;
e)1以上のキレート剤と;
f)任意に、他の添加剤と;
を含む無電解ニッケルめっき浴に関する。
a)その上に無電解ニッケルを受容するように前記基材を調製する工程と;
b)前記基材を無電解ニッケルめっき浴に浸漬する工程と;を含み、
前記無電解ニッケルめっき浴が、
i)ニッケルイオン源と;
ii)有効量のチオ尿素と;
iii)有効量のサッカリンと;
iv)次亜リン酸イオン源と;
v)1以上のキレート剤と;
vi)任意に、他の添加剤と;を含み、
前記高リン無電解ニッケル析出物がRCA硝酸試験に合格可能であり、前記RCA硝酸試験は、その上に前記高リンニッケル析出物を有する前記基材を濃ニッケル酸に30秒間浸漬し、黒色又は灰色に変化しない前記析出物が前記RCA硝酸試験に合格したものとすることを特徴とする方法に関する。
a)その上に無電解ニッケルを受容するように前記基材を調製する工程と;
b)前記基材を無電解ニッケルめっき浴に浸漬する工程と;を含み、
前記無電解ニッケルめっき浴が、
i)ニッケルイオン源と;
ii)有効量のチオ尿素と;
iii)有効量のサッカリンと;
iv)次亜リン酸イオン源と;
v)1以上のキレート剤と;
vi)任意に、他の添加剤と;を含み、
前記高リン無電解ニッケル析出物がRCA硝酸試験に合格可能であり、前記RCA硝酸試験は、その上に前記高リンニッケル析出物を有する前記基材を濃硝酸に30秒間浸漬し、黒色又は灰色に変化しない前記析出物が前記RCA硝酸試験に合格したものとすることを特徴とする方法に関する。
a)その上に無電解ニッケルを受容するように前記基材を調製する工程と;
b)前記基材を無電解ニッケルめっき浴に浸漬する工程と;を含み、
前記無電解ニッケルめっき浴が、
i)ニッケルイオン源と;
ii)有効量のチオ尿素と;
iii)有効量のサッカリンと;
iv)次亜リン酸イオン源と;
v)1以上のキレート剤と;
vi)任意に、他の添加剤と;を含み、
前記高リン無電解ニッケル析出物がRCA硝酸試験に合格可能であり、前記RCA硝酸試験は、その上に前記高リンニッケル析出物を有する前記基材を濃硝酸に30秒間浸漬し、黒色又は灰色に変化しない前記析出物が前記RCA硝酸試験に合格したものとすることを特徴とする方法に関する。
Claims (21)
- 基材上に高リン無電解ニッケルめっき析出物を提供する方法であって、
a)その上に無電解ニッケルを受容するように前記基材を調製する工程と;
b)前記基材を無電解ニッケルめっき浴に浸漬する工程と;を含み、
前記無電解ニッケルめっき浴が、
i)ニッケルイオン源と;
ii)有効量のチオ尿素と;
iii)有効量のサッカリンと;
iv)次亜リン酸イオン源と;
v)1以上のキレート剤と;
vi)任意に、他の添加剤と;を含み、
前記高リン無電解ニッケル析出物がRCA硝酸試験に合格可能であり、前記RCA硝酸試験は、その上に前記高リンニッケル析出物を有する前記基材を濃ニッケル酸に30秒間浸漬し、黒色又は灰色に変化しない前記析出物が前記RCA硝酸試験に合格したものとすることを特徴とする方法。 - 前記ニッケルイオン源が、臭化ニッケル、ホウフッ化ニッケル、スルホン酸ニッケル、スルファミン酸ニッケル、アルキルスルホン酸ニッケル、硫酸ニッケル、塩化ニッケル、酢酸ニッケル、次亜リン酸ニッケル、及びこれらの1以上の組合せからなる群から選択される請求項1に記載の方法。
- 前記ニッケルイオン源が硫酸ニッケルである請求項2に記載の方法。
- 前記次亜リン酸イオン源が、次亜リン酸、次亜リン酸ナトリウム、次亜リン酸カリウム、次亜リン酸アンモニウム、及びこれらの1以上の組合せからなる群から選択される請求項1に記載の方法。
- 前記可溶性ニッケルイオン源が、前記浴中のニッケル金属の濃度を、約1g/L〜約50g/Lの範囲とする量で前記無電解ニッケルめっき浴中に存在する請求項1に記載の方法。
- 前記可溶性ニッケルイオン源が、前記浴中のニッケル金属の濃度を、約5g/L〜約10g/Lの範囲とする量で前記無電解ニッケルめっき浴中に存在する請求項5に記載の方法。
- 前記次亜リン酸イオン源が、次亜リン酸、次亜リン酸ナトリウム、次亜リン酸カリウム、次亜リン酸アンモニウム、及びこれらの1以上の組合せからなる群から選択される請求項1に記載の方法。
- 前記次亜リン酸イオン源が、約0.01g/L〜約200g/Lの範囲の濃度で前記無電解ニッケルめっき浴中に存在する請求項7に記載の方法。
- 前記チオ尿素が、約0.5mg/L〜約3.0mg/Lの範囲の濃度で前記無電解ニッケルめっき浴中に存在する請求項1に記載の方法。
- 前記チオ尿素が、約1.0mg/L〜約2.0mg/Lの範囲の濃度で前記無電解ニッケルめっき浴中に存在する請求項9に記載の方法。
- 前記サッカリンが、約0.1mg/L〜約5.0g/Lの範囲の濃度で前記無電解ニッケルめっき浴中に存在する請求項1に記載の方法。
- 前記サッカリンが、約100mg/L〜約200mg/Lの範囲の濃度で前記無電解ニッケルめっき浴中に存在する請求項11に記載の方法。
- 前記無電解ニッケルめっき浴が1以上の添加剤を含み、前記1以上の添加剤が、緩衝剤、湿潤剤、促進剤、安定剤、及び腐食防止剤からなる群から選択される請求項1に記載の方法。
- 前記ニッケルイオン源を前記チオ尿素と混合して混合物を生成し、次いで前記混合物を残りの浴成分に添加する工程を更に含む請求項1に記載の方法。
- 前記高リン無電解ニッケル析出物が、前記析出物中に約9重量%〜約13重量%のリンを含有する請求項1に記載の方法。
- 前記無電解ニッケルめっき浴のpHが、約4〜約10の範囲である請求項1に記載の方法。
- 請求項1に記載の方法によって製造された高リンニッケル析出物をその上に有することを特徴とする基材。
- 前記高リンニッケル析出物が、前記RCA硝酸試験に合格可能である請求項17に記載の基材。
- 前記高リンニッケル析出物が、前記析出物中に約9重量%〜約13重量%のリンを含有する請求項17に記載の基材。
- 前記高リン無電解ニッケル析出物の光沢度が、少なくとも110GUである請求項17に記載の基材。
- 前記高リン無電解ニッケル析出物の光沢度が、少なくとも125GUである請求項20に記載の基材。
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