JP2017515299A5 - - Google Patents
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- Publication number
- JP2017515299A5 JP2017515299A5 JP2016557930A JP2016557930A JP2017515299A5 JP 2017515299 A5 JP2017515299 A5 JP 2017515299A5 JP 2016557930 A JP2016557930 A JP 2016557930A JP 2016557930 A JP2016557930 A JP 2016557930A JP 2017515299 A5 JP2017515299 A5 JP 2017515299A5
- Authority
- JP
- Japan
- Prior art keywords
- dome
- processing apparatus
- substrate processing
- energy source
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/219,644 US10053777B2 (en) | 2014-03-19 | 2014-03-19 | Thermal processing chamber |
| US14/219,644 | 2014-03-19 | ||
| PCT/US2015/019829 WO2015142578A1 (en) | 2014-03-19 | 2015-03-11 | Improved thermal processing chamber |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017515299A JP2017515299A (ja) | 2017-06-08 |
| JP2017515299A5 true JP2017515299A5 (enExample) | 2018-08-23 |
| JP6578297B2 JP6578297B2 (ja) | 2019-09-18 |
Family
ID=54141541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016557930A Active JP6578297B2 (ja) | 2014-03-19 | 2015-03-11 | 改良された熱処理チャンバ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10053777B2 (enExample) |
| JP (1) | JP6578297B2 (enExample) |
| KR (1) | KR102381819B1 (enExample) |
| CN (2) | CN107557759A (enExample) |
| SG (1) | SG11201606665YA (enExample) |
| TW (1) | TWI653357B (enExample) |
| WO (1) | WO2015142578A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10053777B2 (en) * | 2014-03-19 | 2018-08-21 | Applied Materials, Inc. | Thermal processing chamber |
| US10752991B2 (en) | 2017-02-06 | 2020-08-25 | Applied Materials, Inc. | Half-angle nozzle |
| JP6863041B2 (ja) * | 2017-04-21 | 2021-04-21 | 東京エレクトロン株式会社 | 基板加熱装置 |
| EP3665718B1 (en) * | 2017-08-07 | 2024-04-24 | Sharpack Technology Pte. Ltd. | Hot wall flux free solder ball treatment arrangement |
| US10770319B2 (en) * | 2018-02-23 | 2020-09-08 | Applied Materials, Inc. | EPI thickness tuning by pulse or profile spot heating |
| WO2021170240A1 (en) * | 2020-02-27 | 2021-09-02 | Applied Materials Italia S.R.L | Support device for supporting a substrate, method of processing a substrate and semiconductor substrate |
| KR20230002087A (ko) * | 2021-06-29 | 2023-01-05 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 처리 시스템에서 반응 챔버를 냉각하기 위한 장치 및 방법 |
| CN115547896B (zh) * | 2022-11-29 | 2023-03-10 | 无锡邑文电子科技有限公司 | 一种无水冷的半导体晶圆低温处理设备 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03220734A (ja) * | 1990-01-25 | 1991-09-27 | Fujitsu Ltd | 気相エピタキシャル結晶成長装置 |
| JPH0613324A (ja) * | 1992-06-26 | 1994-01-21 | Fujitsu Ltd | 真空加熱装置 |
| JP3165304B2 (ja) * | 1992-12-04 | 2001-05-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法及び半導体処理装置 |
| US5650082A (en) * | 1993-10-29 | 1997-07-22 | Applied Materials, Inc. | Profiled substrate heating |
| JPH07201753A (ja) * | 1993-12-29 | 1995-08-04 | Nippon Steel Corp | 薄膜製造方法およびその装置 |
| JPH07283096A (ja) * | 1994-04-08 | 1995-10-27 | Hitachi Ltd | 半導体基板の処理方法及び装置 |
| JP3247270B2 (ja) * | 1994-08-25 | 2002-01-15 | 東京エレクトロン株式会社 | 処理装置及びドライクリーニング方法 |
| JPH08139046A (ja) * | 1994-11-09 | 1996-05-31 | Hitachi Ltd | 熱処理装置 |
| JPH08191097A (ja) * | 1995-01-11 | 1996-07-23 | Touyoko Kagaku Kk | 高速熱処理装置 |
| JPH0917217A (ja) * | 1995-06-28 | 1997-01-17 | Hitachi Ltd | 光源装置及びその調光方法ならびに半導体製造装置および半導体製造方法 |
| JPH09199501A (ja) * | 1995-10-02 | 1997-07-31 | Applied Materials Inc | ＳｉＦ４を用いて安定な弗素ドープ膜を堆積するプロセス及び装置 |
| JPH09143691A (ja) * | 1995-11-22 | 1997-06-03 | Tokyo Electron Ltd | 成膜・熱処理装置 |
| US6153260A (en) * | 1997-04-11 | 2000-11-28 | Applied Materials, Inc. | Method for heating exhaust gas in a substrate reactor |
| US6222990B1 (en) * | 1997-12-03 | 2001-04-24 | Steag Rtp Systems | Heating element for heating the edges of wafers in thermal processing chambers |
| US6108491A (en) * | 1998-10-30 | 2000-08-22 | Applied Materials, Inc. | Dual surface reflector |
| US7015422B2 (en) | 2000-12-21 | 2006-03-21 | Mattson Technology, Inc. | System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy |
| JP4374854B2 (ja) * | 2001-12-25 | 2009-12-02 | 東京エレクトロン株式会社 | 処理装置及びそのクリーニング方法 |
| US7026009B2 (en) * | 2002-03-27 | 2006-04-11 | Applied Materials, Inc. | Evaluation of chamber components having textured coatings |
| US6987240B2 (en) | 2002-04-18 | 2006-01-17 | Applied Materials, Inc. | Thermal flux processing by scanning |
| JP2005317925A (ja) * | 2004-04-02 | 2005-11-10 | Ricoh Co Ltd | 光源装置、記録装置、製版装置及び画像形成装置 |
| US20060105114A1 (en) * | 2004-11-16 | 2006-05-18 | White John M | Multi-layer high quality gate dielectric for low-temperature poly-silicon TFTs |
| US7976634B2 (en) * | 2006-11-21 | 2011-07-12 | Applied Materials, Inc. | Independent radiant gas preheating for precursor disassociation control and gas reaction kinetics in low temperature CVD systems |
| US20080257263A1 (en) * | 2007-04-23 | 2008-10-23 | Applied Materials, Inc. | Cooling shield for substrate processing chamber |
| KR101571558B1 (ko) * | 2008-04-16 | 2015-11-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 프로세싱 증착 차폐 컴포넌트들 |
| US8441640B2 (en) | 2008-05-02 | 2013-05-14 | Applied Materials, Inc. | Non-contact substrate support position sensing system and corresponding adjustments |
| JP2010129861A (ja) * | 2008-11-28 | 2010-06-10 | Tokyo Electron Ltd | 熱処理装置 |
| US8150242B2 (en) * | 2008-10-31 | 2012-04-03 | Applied Materials, Inc. | Use of infrared camera for real-time temperature monitoring and control |
| US9758871B2 (en) * | 2008-12-10 | 2017-09-12 | Sumco Techxiv Corporation | Method and apparatus for manufacturing epitaxial silicon wafer |
| US8372667B2 (en) | 2009-04-20 | 2013-02-12 | Applied Materials, Inc. | Fiber laser substrate processing |
| ES1071023Y (es) | 2009-05-25 | 2010-03-04 | Veridentia S L | Dispositivo con cierre electromecanico para la distribucion segura de hemocomponentes o farmacos |
| KR20110044698A (ko) | 2009-10-23 | 2011-04-29 | 주성엔지니어링(주) | 기판 처리 장치 |
| US20120052216A1 (en) | 2010-08-27 | 2012-03-01 | Applied Materials, Inc. | Gas distribution showerhead with high emissivity surface |
| TW201218301A (en) | 2010-10-28 | 2012-05-01 | Applied Materials Inc | Apparatus having improved substrate temperature uniformity using direct heating methods |
| JP6051535B2 (ja) * | 2011-02-28 | 2016-12-27 | 株式会社リコー | 画像処理方法及び画像処理装置 |
| US9347132B2 (en) | 2011-04-29 | 2016-05-24 | Applied Materials, Inc. | Optical endpoint detection system |
| CN106935532B (zh) | 2012-01-26 | 2021-01-26 | 应用材料公司 | 具有顶部基板支撑组件的热处理腔室 |
| US10734257B2 (en) | 2012-04-25 | 2020-08-04 | Applied Materials, Inc. | Direct current lamp driver for substrate processing |
| US9905444B2 (en) * | 2012-04-25 | 2018-02-27 | Applied Materials, Inc. | Optics for controlling light transmitted through a conical quartz dome |
| US10202707B2 (en) | 2012-04-26 | 2019-02-12 | Applied Materials, Inc. | Substrate processing system with lamphead having temperature management |
| CN104428879B (zh) | 2012-05-30 | 2018-01-30 | 应用材料公司 | 用于快速热处理的设备及方法 |
| US9842753B2 (en) * | 2013-04-26 | 2017-12-12 | Applied Materials, Inc. | Absorbing lamphead face |
| JP6542245B2 (ja) * | 2014-02-14 | 2019-07-10 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 射出アセンブリ付きの上方ドーム |
| US10053777B2 (en) * | 2014-03-19 | 2018-08-21 | Applied Materials, Inc. | Thermal processing chamber |
-
2014
- 2014-03-19 US US14/219,644 patent/US10053777B2/en active Active
-
2015
- 2015-03-02 TW TW104106542A patent/TWI653357B/zh active
- 2015-03-11 CN CN201710619838.2A patent/CN107557759A/zh active Pending
- 2015-03-11 KR KR1020167029103A patent/KR102381819B1/ko active Active
- 2015-03-11 JP JP2016557930A patent/JP6578297B2/ja active Active
- 2015-03-11 WO PCT/US2015/019829 patent/WO2015142578A1/en not_active Ceased
- 2015-03-11 CN CN201580009756.5A patent/CN106104750B/zh active Active
- 2015-03-11 SG SG11201606665YA patent/SG11201606665YA/en unknown
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