|
JPH03220734A
(ja)
*
|
1990-01-25 |
1991-09-27 |
Fujitsu Ltd |
気相エピタキシャル結晶成長装置
|
|
JPH0613324A
(ja)
*
|
1992-06-26 |
1994-01-21 |
Fujitsu Ltd |
真空加熱装置
|
|
JP3165304B2
(ja)
*
|
1992-12-04 |
2001-05-14 |
株式会社半導体エネルギー研究所 |
半導体装置の作製方法及び半導体処理装置
|
|
US5650082A
(en)
*
|
1993-10-29 |
1997-07-22 |
Applied Materials, Inc. |
Profiled substrate heating
|
|
JPH07201753A
(ja)
*
|
1993-12-29 |
1995-08-04 |
Nippon Steel Corp |
薄膜製造方法およびその装置
|
|
JPH07283096A
(ja)
*
|
1994-04-08 |
1995-10-27 |
Hitachi Ltd |
半導体基板の処理方法及び装置
|
|
JP3247270B2
(ja)
*
|
1994-08-25 |
2002-01-15 |
東京エレクトロン株式会社 |
処理装置及びドライクリーニング方法
|
|
JPH08139046A
(ja)
*
|
1994-11-09 |
1996-05-31 |
Hitachi Ltd |
熱処理装置
|
|
JPH08191097A
(ja)
*
|
1995-01-11 |
1996-07-23 |
Touyoko Kagaku Kk |
高速熱処理装置
|
|
JPH0917217A
(ja)
*
|
1995-06-28 |
1997-01-17 |
Hitachi Ltd |
光源装置及びその調光方法ならびに半導体製造装置および半導体製造方法
|
|
JPH09199501A
(ja)
*
|
1995-10-02 |
1997-07-31 |
Applied Materials Inc |
ＳｉＦ４を用いて安定な弗素ドープ膜を堆積するプロセス及び装置
|
|
JPH09143691A
(ja)
*
|
1995-11-22 |
1997-06-03 |
Tokyo Electron Ltd |
成膜・熱処理装置
|
|
US6153260A
(en)
*
|
1997-04-11 |
2000-11-28 |
Applied Materials, Inc. |
Method for heating exhaust gas in a substrate reactor
|
|
US6222990B1
(en)
*
|
1997-12-03 |
2001-04-24 |
Steag Rtp Systems |
Heating element for heating the edges of wafers in thermal processing chambers
|
|
US6108491A
(en)
*
|
1998-10-30 |
2000-08-22 |
Applied Materials, Inc. |
Dual surface reflector
|
|
US7015422B2
(en)
|
2000-12-21 |
2006-03-21 |
Mattson Technology, Inc. |
System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
|
|
JP4374854B2
(ja)
*
|
2001-12-25 |
2009-12-02 |
東京エレクトロン株式会社 |
処理装置及びそのクリーニング方法
|
|
US7026009B2
(en)
*
|
2002-03-27 |
2006-04-11 |
Applied Materials, Inc. |
Evaluation of chamber components having textured coatings
|
|
US6987240B2
(en)
|
2002-04-18 |
2006-01-17 |
Applied Materials, Inc. |
Thermal flux processing by scanning
|
|
JP2005317925A
(ja)
*
|
2004-04-02 |
2005-11-10 |
Ricoh Co Ltd |
光源装置、記録装置、製版装置及び画像形成装置
|
|
US20060105114A1
(en)
*
|
2004-11-16 |
2006-05-18 |
White John M |
Multi-layer high quality gate dielectric for low-temperature poly-silicon TFTs
|
|
US7976634B2
(en)
*
|
2006-11-21 |
2011-07-12 |
Applied Materials, Inc. |
Independent radiant gas preheating for precursor disassociation control and gas reaction kinetics in low temperature CVD systems
|
|
US20080257263A1
(en)
*
|
2007-04-23 |
2008-10-23 |
Applied Materials, Inc. |
Cooling shield for substrate processing chamber
|
|
KR102025330B1
(ko)
*
|
2008-04-16 |
2019-09-25 |
어플라이드 머티어리얼스, 인코포레이티드 |
웨이퍼 프로세싱 증착 차폐 컴포넌트들
|
|
US8398777B2
(en)
|
2008-05-02 |
2013-03-19 |
Applied Materials, Inc. |
System and method for pedestal adjustment
|
|
JP2010129861A
(ja)
*
|
2008-11-28 |
2010-06-10 |
Tokyo Electron Ltd |
熱処理装置
|
|
US8150242B2
(en)
*
|
2008-10-31 |
2012-04-03 |
Applied Materials, Inc. |
Use of infrared camera for real-time temperature monitoring and control
|
|
US9758871B2
(en)
*
|
2008-12-10 |
2017-09-12 |
Sumco Techxiv Corporation |
Method and apparatus for manufacturing epitaxial silicon wafer
|
|
US8372667B2
(en)
|
2009-04-20 |
2013-02-12 |
Applied Materials, Inc. |
Fiber laser substrate processing
|
|
ES1071023Y
(es)
|
2009-05-25 |
2010-03-04 |
Veridentia S L |
Dispositivo con cierre electromecanico para la distribucion segura de hemocomponentes o farmacos
|
|
KR20110044698A
(ko)
|
2009-10-23 |
2011-04-29 |
주성엔지니어링(주) |
기판 처리 장치
|
|
US20120052216A1
(en)
|
2010-08-27 |
2012-03-01 |
Applied Materials, Inc. |
Gas distribution showerhead with high emissivity surface
|
|
TW201218301A
(en)
|
2010-10-28 |
2012-05-01 |
Applied Materials Inc |
Apparatus having improved substrate temperature uniformity using direct heating methods
|
|
JP6051535B2
(ja)
*
|
2011-02-28 |
2016-12-27 |
株式会社リコー |
画像処理方法及び画像処理装置
|
|
US9347132B2
(en)
*
|
2011-04-29 |
2016-05-24 |
Applied Materials, Inc. |
Optical endpoint detection system
|
|
WO2013112313A1
(en)
|
2012-01-26 |
2013-08-01 |
Applied Materials, Inc. |
Thermal processing chamber with top substrate support assembly
|
|
US9905444B2
(en)
*
|
2012-04-25 |
2018-02-27 |
Applied Materials, Inc. |
Optics for controlling light transmitted through a conical quartz dome
|
|
US10734257B2
(en)
|
2012-04-25 |
2020-08-04 |
Applied Materials, Inc. |
Direct current lamp driver for substrate processing
|
|
US10202707B2
(en)
|
2012-04-26 |
2019-02-12 |
Applied Materials, Inc. |
Substrate processing system with lamphead having temperature management
|
|
US9029739B2
(en)
|
2012-05-30 |
2015-05-12 |
Applied Materials, Inc. |
Apparatus and methods for rapid thermal processing
|
|
US9842753B2
(en)
*
|
2013-04-26 |
2017-12-12 |
Applied Materials, Inc. |
Absorbing lamphead face
|
|
WO2015123022A1
(en)
*
|
2014-02-14 |
2015-08-20 |
Applied Materials, Inc. |
Upper dome with injection assembly
|
|
US10053777B2
(en)
*
|
2014-03-19 |
2018-08-21 |
Applied Materials, Inc. |
Thermal processing chamber
|