JP2017508145A5 - - Google Patents

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Publication number
JP2017508145A5
JP2017508145A5 JP2016551168A JP2016551168A JP2017508145A5 JP 2017508145 A5 JP2017508145 A5 JP 2017508145A5 JP 2016551168 A JP2016551168 A JP 2016551168A JP 2016551168 A JP2016551168 A JP 2016551168A JP 2017508145 A5 JP2017508145 A5 JP 2017508145A5
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JP
Japan
Prior art keywords
target
specific
filling element
measurement target
periodic structure
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Application number
JP2016551168A
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English (en)
Japanese (ja)
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JP2017508145A (ja
JP6635926B2 (ja
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Priority claimed from PCT/US2014/054811 external-priority patent/WO2015122932A1/en
Publication of JP2017508145A publication Critical patent/JP2017508145A/ja
Publication of JP2017508145A5 publication Critical patent/JP2017508145A5/ja
Application granted granted Critical
Publication of JP6635926B2 publication Critical patent/JP6635926B2/ja
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JP2016551168A 2014-02-12 2014-09-09 不正確さを低減し且つコントラストを維持する充填要素を有する計測ターゲット Active JP6635926B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461939129P 2014-02-12 2014-02-12
US61/939,129 2014-02-12
PCT/US2014/054811 WO2015122932A1 (en) 2014-02-12 2014-09-09 Metrology targets with filling elements that reduce inaccuracies and maintain contrast

Publications (3)

Publication Number Publication Date
JP2017508145A JP2017508145A (ja) 2017-03-23
JP2017508145A5 true JP2017508145A5 (enExample) 2017-10-19
JP6635926B2 JP6635926B2 (ja) 2020-01-29

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ID=53800509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016551168A Active JP6635926B2 (ja) 2014-02-12 2014-09-09 不正確さを低減し且つコントラストを維持する充填要素を有する計測ターゲット

Country Status (5)

Country Link
US (1) US10002806B2 (enExample)
JP (1) JP6635926B2 (enExample)
KR (1) KR102119290B1 (enExample)
CN (1) CN104835754B (enExample)
WO (1) WO2015122932A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102312241B1 (ko) * 2012-11-21 2021-10-13 케이엘에이 코포레이션 프로세스 호환 세그먼팅된 타겟들 및 설계 방법들
US20170146465A1 (en) * 2014-06-19 2017-05-25 Nova Measuring Instruments Ltd. Test structure design for metrology measurements in patterned samples
TWI780741B (zh) * 2016-02-24 2022-10-11 美商克萊譚克公司 光學計量之準確度提升
US10303839B2 (en) * 2016-06-07 2019-05-28 Kla-Tencor Corporation Electrically relevant placement of metrology targets using design analysis
US10754261B2 (en) * 2017-06-06 2020-08-25 Kla-Tencor Corporation Reticle optimization algorithms and optimal target design
US10795268B2 (en) * 2017-09-29 2020-10-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for measuring overlay errors using overlay measurement patterns
US10837919B2 (en) 2017-11-06 2020-11-17 Kla Corporation Single cell scatterometry overlay targets
KR102791110B1 (ko) 2019-11-04 2025-04-07 삼성전자주식회사 반도체 소자 제조 방법
US11512948B2 (en) * 2020-05-26 2022-11-29 Kla Corporation Imaging system for buried metrology targets
US11703767B2 (en) 2021-06-28 2023-07-18 Kla Corporation Overlay mark design for electron beam overlay
US11720031B2 (en) 2021-06-28 2023-08-08 Kla Corporation Overlay design for electron beam and scatterometry overlay measurements
US11862524B2 (en) 2021-06-28 2024-01-02 Kla Corporation Overlay mark design for electron beam overlay

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037671A (en) * 1998-11-03 2000-03-14 Advanced Micro Devices, Inc. Stepper alignment mark structure for maintaining alignment integrity
US6850858B1 (en) * 2001-07-06 2005-02-01 Dupont Photomasks, Inc. Method and apparatus for calibrating a metrology tool
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US7687925B2 (en) * 2005-09-07 2010-03-30 Infineon Technologies Ag Alignment marks for polarized light lithography and method for use thereof
KR100871801B1 (ko) * 2005-12-28 2008-12-02 동부일렉트로닉스 주식회사 반도체 소자의 얼라인먼트 키 및 그 형성 방법
KR101096145B1 (ko) * 2007-06-04 2011-12-19 에이에스엠엘 네델란즈 비.브이. 모델-기반 리소그래피 안내 레이아웃 설계를 수행하는 방법들
KR20100079145A (ko) * 2008-12-30 2010-07-08 주식회사 동부하이텍 오버레이 마크의 디싱 방지를 위한 더미 패턴
US8513821B2 (en) * 2010-05-21 2013-08-20 Taiwan Semiconductor Manufacturing Company, Ltd. Overlay mark assistant feature
JP2012033923A (ja) * 2010-07-29 2012-02-16 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
US9927718B2 (en) * 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
KR20120025765A (ko) * 2010-09-08 2012-03-16 주식회사 하이닉스반도체 반도체 소자의 오버레이 버니어
JP2013120872A (ja) * 2011-12-08 2013-06-17 Toshiba Corp 重ね合わせ計測方法
CN106965554B (zh) * 2012-01-02 2018-12-21 穆特拉茨国际有限公司 喷墨系统

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