JP2017503923A5 - - Google Patents

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Publication number
JP2017503923A5
JP2017503923A5 JP2016541544A JP2016541544A JP2017503923A5 JP 2017503923 A5 JP2017503923 A5 JP 2017503923A5 JP 2016541544 A JP2016541544 A JP 2016541544A JP 2016541544 A JP2016541544 A JP 2016541544A JP 2017503923 A5 JP2017503923 A5 JP 2017503923A5
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JP
Japan
Prior art keywords
fastener
pad
head
diameter
hole
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JP2016541544A
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JP2017503923A (ja
JP6662780B2 (ja
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Priority claimed from US14/182,831 external-priority patent/US9960021B2/en
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Description

図2Cおよび図2Dはそれぞれ、締め具240を介してバッキング板102に固定することができる例示的なパッド210の上面図および横断面(線D−Dに沿って)側面図である。図2Cに示すように、パッド210は、支承表面212と、パッド210の本体内へ部分的に延びる第1の直径を有する皿穴付き凹み250と、第1の直径より小さい第2の直径を有する貫通孔252とを含む。締め具240は、締め具240のヘッドが、支承表面212の下で皿穴に埋められるように(すなわち、締め具240のヘッドが、図4に関して以下で論じる密封リング481に接触しないように)、または締め具240のヘッドが、支承表面212と平面になるように、皿穴付き凹み250および貫通孔252内に配置することができる。締め具240のヘッドは、パッド210の表面256と接触する。締め具240のシャフトは、パッド210をバッキング板102に固定するように、貫通孔252を通して配置される。パッド210の設置表面214は、凹み120の底面202と接触する。
JP2016541544A 2013-12-18 2014-11-11 低摩擦パッドを有する物理的気相堆積(pvd)ターゲット Active JP6662780B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361917630P 2013-12-18 2013-12-18
US61/917,630 2013-12-18
US14/182,831 2014-02-18
US14/182,831 US9960021B2 (en) 2013-12-18 2014-02-18 Physical vapor deposition (PVD) target having low friction pads
PCT/US2014/065023 WO2015094515A1 (en) 2013-12-18 2014-11-11 Physical vapor deposition (pvd) target having low friction pads

Publications (3)

Publication Number Publication Date
JP2017503923A JP2017503923A (ja) 2017-02-02
JP2017503923A5 true JP2017503923A5 (ja) 2017-12-14
JP6662780B2 JP6662780B2 (ja) 2020-03-11

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ID=53369351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016541544A Active JP6662780B2 (ja) 2013-12-18 2014-11-11 低摩擦パッドを有する物理的気相堆積(pvd)ターゲット

Country Status (6)

Country Link
US (1) US9960021B2 (ja)
JP (1) JP6662780B2 (ja)
KR (1) KR102208950B1 (ja)
CN (2) CN105874565A (ja)
TW (1) TWI648419B (ja)
WO (1) WO2015094515A1 (ja)

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USD836572S1 (en) 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
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USD1037954S1 (en) 2020-10-23 2024-08-06 Applied Materials, Inc. Self-retained low friction pad
US11618943B2 (en) * 2020-10-23 2023-04-04 Applied Materials, Inc. PVD target having self-retained low friction pads
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
KR102446965B1 (ko) * 2021-01-28 2022-09-26 (주)지오엘리먼트 강성이 강화된 오링용 그루브를 갖는 스퍼터링 타겟 및 이의 제조방법
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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