JP2017501592A5 - - Google Patents

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Publication number
JP2017501592A5
JP2017501592A5 JP2016560046A JP2016560046A JP2017501592A5 JP 2017501592 A5 JP2017501592 A5 JP 2017501592A5 JP 2016560046 A JP2016560046 A JP 2016560046A JP 2016560046 A JP2016560046 A JP 2016560046A JP 2017501592 A5 JP2017501592 A5 JP 2017501592A5
Authority
JP
Japan
Prior art keywords
foil
conductive pattern
emitting diode
pattern layer
electrode area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016560046A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017501592A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/FI2014/051016 external-priority patent/WO2015092140A1/en
Publication of JP2017501592A publication Critical patent/JP2017501592A/ja
Publication of JP2017501592A5 publication Critical patent/JP2017501592A5/ja
Pending legal-status Critical Current

Links

JP2016560046A 2013-12-18 2014-12-17 発光膜構造体 Pending JP2017501592A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20136284 2013-12-18
FI20136284 2013-12-18
PCT/FI2014/051016 WO2015092140A1 (en) 2013-12-18 2014-12-17 Illuminating film structure

Publications (2)

Publication Number Publication Date
JP2017501592A JP2017501592A (ja) 2017-01-12
JP2017501592A5 true JP2017501592A5 (enExample) 2017-11-02

Family

ID=53402172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016560046A Pending JP2017501592A (ja) 2013-12-18 2014-12-17 発光膜構造体

Country Status (7)

Country Link
US (1) US20160315236A1 (enExample)
EP (1) EP3084290A4 (enExample)
JP (1) JP2017501592A (enExample)
KR (1) KR20160100359A (enExample)
CN (1) CN105980768A (enExample)
CA (1) CA2934465A1 (enExample)
WO (1) WO2015092140A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016109054A1 (de) * 2016-05-17 2017-11-23 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung
US10964678B2 (en) 2016-06-21 2021-03-30 Ledfoil Finland Oy LED screen or illumination means with a flexible film structure
EP3264241A1 (en) * 2016-06-29 2018-01-03 Saint-Gobain Glass France Lighting laminated glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturing
DE102017113380A1 (de) 2017-06-19 2018-12-20 Schreiner Group Gmbh & Co. Kg Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie
DE102017113375A1 (de) 2017-06-19 2018-12-20 Schreiner Group Gmbh & Co. Kg Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie
FI130299B (en) 2017-12-28 2023-06-09 Ledfoil Finland Oy DISPLAY STRUCTURE SUITABLE FOR ICE AND OUTDOOR USE
CN108354394B (zh) * 2018-03-29 2024-06-04 江苏集萃有机光电技术研究所有限公司 一种oled照明屏风
KR102486207B1 (ko) * 2021-02-10 2023-01-10 주식회사 파이헬스케어 광원용 기판 및 그 제조방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0216787D0 (en) * 2002-07-19 2002-08-28 Pilkington Plc Laminated glazing panel
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
TWI306652B (en) * 2005-10-28 2009-02-21 Chipmos Technologies Inc Light emitting diode package structure
TW200935621A (en) * 2008-02-05 2009-08-16 Asmobile Inc Light emitting diode package structure and light emitting diode packaging method
US8177392B2 (en) * 2008-05-29 2012-05-15 Norm Tarko Light strip including a core layer of insulating material receiving spaced apart light emitting diodes
KR101104026B1 (ko) * 2010-05-27 2012-01-06 강민수 Ｌｅｄ 전원용 압전회로부를 포함하는 전자식 카드
CN102340931B (zh) * 2010-07-20 2013-08-28 王定锋 采用并置的导线制作单面电路板的方法
US9179543B2 (en) * 2010-11-03 2015-11-03 3M Innovative Properties Company Flexible LED device with wire bond free die
WO2012084662A1 (en) * 2010-12-22 2012-06-28 Microconnections Sas Circuit for a light emitting component and method of manufacturing the same
CN202189512U (zh) * 2011-06-18 2012-04-11 浙江志江光电科技有限公司 一种smd led柔性显示屏
CN102881780B (zh) * 2011-07-15 2015-04-01 展晶科技(深圳)有限公司 发光模组及其制造方法
CN202302941U (zh) * 2011-07-22 2012-07-04 王宁 一种半柔性led灯条及显示屏
CN104081109A (zh) * 2012-02-02 2014-10-01 宝洁公司 双向光片
US9111464B2 (en) * 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer

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