JP2017500555A - 反射光学素子、特にマイクロリソグラフィの光学特性を測定する測定構成体 - Google Patents
反射光学素子、特にマイクロリソグラフィの光学特性を測定する測定構成体 Download PDFInfo
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- 230000003287 optical effect Effects 0.000 title claims abstract description 104
- 238000001393 microlithography Methods 0.000 title claims abstract description 15
- 238000005259 measurement Methods 0.000 claims abstract description 49
- 238000003384 imaging method Methods 0.000 claims abstract description 40
- 230000005855 radiation Effects 0.000 claims abstract description 21
- 238000005286 illumination Methods 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 210000001747 pupil Anatomy 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 230000005670 electromagnetic radiation Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 4
- 238000000386 microscopy Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 238000000985 reflectance spectrum Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
- G02B17/0605—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror using two curved mirrors
- G02B17/0615—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror using two curved mirrors off-axis or unobscured systems in wich all of the mirrors share a common axis of rotational symmetry
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
- G02B19/0023—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors) at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0085—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with both a detector and a source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
- G01N2021/557—Detecting specular reflective parts on sample
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Microscoopes, Condenser (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Description
‐EUV光源と、
‐反射光学素子で反射されるEUV放射を検出する検出器と、
‐反射光学素子の物点を検出器の像点にそれぞれ結像する結像システムとを有し、
‐結像システムは、EUV放射を反射するための、1つの第1光学構成部品及び少なくとも1つの第2光学構成部品を有し、
‐第1光学構成部品及び第2光学構成部品において、EUV放射の反射中に発生する、面法線に対する反射角度はそれぞれ少なくとも70°(「かすり入射」)である。
‐EUV光源と、
‐反射光学素子で反射されるEUV放射を検出する検出器と、
‐反射光学素子の物点を検出器の像点にそれぞれ結像する結像システムとを有し、
‐測定構成体は少なくとも△λ=3nmの所定の波長間隔に亘って、100μm未満の横空間分解能を有する。
Claims (18)
- 反射光学素子、特にマイクロリソグラフィの光学特性を測定する測定構成体であって、
‐EUV光源(5)と、
‐前記反射光学素子(10)に反射したEUV放射を検出する検出器(20)と、
‐前記反射光学素子(10)の物点を前記検出器(20)の像点にそれぞれ結像する結像システム(30,40,50,60,70,80,90)とを備え、
‐前記結像システムは、前記EUV放射を反射するために、1つの第1光学構成部品(31,41,51,61,71,81,91)及び少なくとも1つの第2光学構成部品(32,42,52,62,72,82,92)を有し、
‐前記第1光学構成部品(31,41,51,61,71,81,91)及び前記第2光学構成部品(32,42,52,62,72,82,92)において、前記EUV放射の反射中に発生する、面法線に対する反射角度はそれぞれ少なくとも70°である測定構成体。 - 請求項1に記載の測定構成体において、前記第1光学構成部品(31,41,51,61,71,81,91)及び前記第2光学構成部品(32,42,52,62,72,82,92)はそれぞれ円錐断面を有することを特徴とする測定構成体。
- 請求項1又は2に記載の測定構成体において、前記第1光学構成部品(31,41,51,61,71,81,91)は楕円体ミラーであることを特徴とする測定構成体。
- 請求項1〜3の何れか一項に記載の測定構成体において、前記第2光学構成部品(32,42,52,62)は双曲面ミラーであることを特徴とする測定構成体。
- 請求項1〜3の何れか一項に記載の測定構成体において、前記第2光学構成部品(72,82,92)は楕円体ミラーであることを特徴とする測定構成体。
- 請求項1〜5の何れか一項に記載の測定構成体において、前記第1光学構成部品(31,41,51,61,71,81,91)の焦点及び前記第2光学構成部品(32,42,52,62,72,82,92)の焦点は一致することを特徴とする測定構成体。
- 請求項1〜6の何れか一項に記載の測定構成体において、前記検出器(20)はCCDカメラ又はCMOSセンサを有することを特徴とする測定構成体。
- 請求項1〜7の何れか一項に記載の測定構成体において、前記反射光学素子(10)はマイクロリソグラフィ投影露光装置.のミラーであることを特徴とする測定構成体。
- 請求項1〜7の何れか一項に記載の測定構成体において、前記反射光学素子(10)はファセットミラー、特にマイクロリソグラフィ投影露光装置の照明装置の視野ファセットミラー又は瞳ファセットミラーのミラーファセットであることを特徴とする測定構成体。
- 請求項1〜7の何れか一項に記載の測定構成体において、前記反射光学素子はマイクロリソグラフィマスクであることを特徴とする測定構成体。
- 請求項1〜10の何れか一項に記載の測定構成体において、前記EUV光源(5)は、少なくとも△λ=1nm、特に少なくとも△λ=3nm、より特に少なくとも△λ=5nm、更に特に少なくとも△λ=10nm、また更に特に少なくとも△λ=20nmの波長間隔に亘って異なる波長のEUV放射を生成する広帯域光源または調整可能な光源であることを特徴とする測定構成体。
- 請求項1〜11の何れか一項に記載の測定構成体において、所定波長間隔に亘って、100μm未満、特に50μm未満、特に20μm未満、より特に10μm未満の横空間分解能を有することを特徴とする測定構成体。
- 請求項12に記載の測定構成体において、前記波長間隔は少なくとも△λ=3nm、より特に少なくとも△λ=5nm、更に特に少なくとも△λ=10nm、そしてより特に少なくとも△λ=20nmであることを特徴とする測定構成体。
- 反射光学素子、特にマイクロリソグラフィの光学特性を測定する測定構成体であって、
‐EUV光源(5)と、
‐前記反射光学素子(10)に反射したEUV放射を検出する検出器(20)と、
‐前記反射光学素子(10)の物点を前記検出器(20)の像点にそれぞれ結像する結像システム(30,40,50,60,70,80,90)とを備え、
‐少なくとも△λ=3nmの所定波長間隔に亘って100μm未満の横空間分解能を有する測定構成体。 - マスク検査システムであって、請求項1〜14の何れか一項に記載の測定構成体を有することを特徴とするマスク検査システム。
- EUV顕微鏡であって、請求項1〜14の何れか一項に記載の測定構成体を有することを特徴とするEUV顕微鏡。
- 反射光学素子、特にマイクロリソグラフィの光学特性を測定する方法であって、前記反射光学素子(10)はEUV光源(5)のEUV放射で照射され、前記反射光学素子(10)の物点は結像システム(30,40,50,60,70,80,90)によって検出器(20)の像点にそれぞれ結像され、このために請求項1〜14の何れか一項に記載の測定構成体を使用することを特徴とする方法。
- 請求項17に記載の方法において、前記反射光学素子(10)の前記物点の検出器(20)の像点へのそれぞれの結像は、該結像の使用波長に応じて異なる複数のサブステップによって行われることを特徴とする方法。
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DE102013224435.5 | 2013-11-28 | ||
DE102013224435.5A DE102013224435A1 (de) | 2013-11-28 | 2013-11-28 | Messanordnung zur Messung optischer Eigenschaften eines reflektiven optischen Elements, insbesondere für die Mikrolithographie |
PCT/EP2014/075537 WO2015078861A1 (de) | 2013-11-28 | 2014-11-25 | Messanordnung zur messung optischer eigenschaften eines reflektiven optischen elements, insbesondere für die mikrolithographie |
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DE102017216893A1 (de) * | 2017-09-25 | 2019-03-28 | Carl Zeiss Smt Gmbh | Abbildende Optik zur Abbildung eines Objektfeldes in ein Bildfeld |
KR102374206B1 (ko) | 2017-12-05 | 2022-03-14 | 삼성전자주식회사 | 반도체 장치 제조 방법 |
KR101895236B1 (ko) * | 2017-12-22 | 2018-09-07 | 주식회사 이엘티센서 | 가스센서용 광 공동 및 이 광 공동을 갖는 가스센서 |
CN110118645B (zh) * | 2019-04-19 | 2021-11-05 | 西北核技术研究所 | 一种半椭球反射面的光学性能综合评价方法 |
US11815810B2 (en) | 2021-09-22 | 2023-11-14 | Intel Corporation | Measurement tool and methods for EUV lithography masks |
US20220011679A1 (en) * | 2021-09-23 | 2022-01-13 | Intel Corporation | Measurement tool and method for lithography masks |
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DE102013224435A1 (de) | 2015-05-28 |
US20160274029A1 (en) | 2016-09-22 |
WO2015078861A1 (de) | 2015-06-04 |
EP3074821B9 (de) | 2021-04-14 |
EP3074821B1 (de) | 2020-10-28 |
US9709494B2 (en) | 2017-07-18 |
EP3074821A1 (de) | 2016-10-05 |
JP6546172B2 (ja) | 2019-07-17 |
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