JP2017220495A - Mounting system and conveyance tray - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting system capable of mounting with high precision, while mounting a work-piece on a conveyance tray, without transferring the work-piece from the conveyance tray onto a positioning stage.SOLUTION: A mounting system includes a conveyance tray (10) and a mounting device (20). The conveyance tray (10) has a through hole (12), and a support (13) for supporting a work-piece (41) while positioning the periphery thereof at at least a part of the periphery of the through hole (12). The mounting device (20) includes a stage (21) having a positioning support (31) for positioning the work-piece (41) supported by the conveyance tray (10), while supporting through the through hole (12), a Y-axis direction movement mechanism (60) for moving this stage (21) in the Y-axis direction, and an X-axis direction movement mechanism (70) for moving the stage (21) in the X-axis direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mounting system such as an organic EL (electroluminescence), a liquid crystal display device, and a semiconductor device, and a transport tray.

  Conventionally, in a mounting apparatus that performs COF (Chip On Film: mounting a semiconductor chip on a film-like wiring board), a film-like flexible wiring board (FPC) or the like is mounted on a transport tray without holes, An IC (integrated circuit) chip or the like was mounted with high accuracy on the positioned FPC or the like (Patent Document 1: Japanese Patent Laid-Open No. 2009-239262).

JP 2009-239262 A

  However, the conventional mounting apparatus has a problem that the FPC or the like has to be transferred from the transport tray without holes onto the positioning stage, which increases man-hours and cannot be mounted quickly.

  In recent mounting of an organic EL or the like, a parallelism within 3 μm is required, so a film-like FPC or the like that is still mounted on a tray cannot exhibit a parallelism within 3 μm. Therefore, it is necessary to transfer the FPC or the like from the transport tray without holes onto the positioning stage of the mounting apparatus.

  Accordingly, an object of the present invention is to provide a mounting system that can be mounted with high accuracy while the work is mounted on the transport tray without transferring the work from the transport tray onto the positioning stage.

In order to solve the above problems, the mounting system of the present invention is:
A transport tray having a through hole and a support portion that positions and supports the peripheral portion of the workpiece at least at a part of the periphery of the through hole; and
A stage having a positioning support portion for supporting and positioning the work on the transport tray through the through hole, a Y-axis direction moving mechanism for moving the stage in the Y-axis direction, and moving the stage in the X-axis direction And a mounting apparatus including an X-axis direction moving mechanism.

  According to the mounting system of the above configuration, the positioning support portion of the stage of the mounting apparatus can be passed through the through hole of the transport tray, and the workpiece on the transport tray can be supported and accurately positioned by the positioning support portion. For example, IC chips can be mounted with the workpiece positioned on the transfer tray, and the transfer process from the transfer tray to the stage can be made unnecessary. Can be done quickly.

  Further, since the mounted work remains on the transport tray, the mounted work can be immediately mounted on the transport tray and transported.

The transport tray of the present invention is
In addition to having a through hole, a support portion for positioning and supporting the peripheral portion of the workpiece is provided at least at a part of the periphery of the through hole.

  According to the transport tray having the above-described configuration, when the work supported by the support portion is mounted, the positioning support portion of the stage of the mounting apparatus is passed through the through hole so that the work is positioned on the transport tray. In this state, the workpiece can be accurately supported and positioned by the positioning support portion.

  According to this invention, even if the work is not transferred from the transport tray onto the positioning stage, the work can be quickly and accurately mounted while the work is still positioned on the transport tray.

1 is a perspective view showing a mounting system according to an embodiment of the present invention. 1 is a perspective view showing a mounting system according to an embodiment of the present invention. 1 is a perspective view showing a mounting system according to an embodiment of the present invention. It is explanatory drawing explaining the mounting process of IC.

  Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

  As shown in FIG. 1, the mounting system of this embodiment includes a transport tray 10 and a mounting device 20.

  The transport tray 10 is provided around a body portion 11 having a substantially rectangular outer shape, a plurality of substantially rectangular through holes 12, 12,... Arranged in alignment with the body portion 11. .. Having a stepped portion formed thereon. The support portion 13 around the through hole 12 supports the outer peripheral portion of a substantially rectangular FPC 41 as an example of a workpiece and performs rough positioning.

  On the other hand, the mounting apparatus 20 includes a substantially rectangular stage 21, and the stage 21 is provided with a plurality of positioning support portions 31, 31,. The positioning support portion 31 is a substantially rectangular convex portion, and has a substantially cross-shaped suction hole 33 in the center. The height of the positioning support portion 31, that is, the thickness is larger than the height of the support portion 13 of the transport tray 10, that is, the thickness, and the positioning support portion 31 passes through the through hole 12 of the transport tray 10. It penetrates and the surface of the positioning support part 31 can protrude outside the support part 13 of the through hole 12.

  The surface of the positioning support portion 31 is processed with extremely high accuracy, for example, so as to satisfy parallelism, straightness, and flatness within 3 μm. Therefore, the workpiece such as the FPC 41 placed on the surface of the positioning support portion 31 can be positioned with extremely high accuracy.

  The mounting apparatus 20 includes a Y-axis direction moving mechanism 60 that moves the stage 21 in the Y-axis direction, and an X-axis direction moving mechanism 70 that moves the stage 21 in the X-axis direction. The Y-axis and the X-axis have the same definition as the normal definition, extend in the horizontal direction, and are orthogonal to each other.

  The Y-axis direction moving mechanism 60 includes a slider 24 attached to the stage 21, a Y-axis direction guide 22 that guides the slider 24 in the Y-axis direction, and a Y that drives the slider 24 along the Y-axis direction guide 22. An axial drive unit 23 is included. The X-axis direction moving mechanism 70 includes a slider 27 fixed to the Y-axis direction guide 22, an X-axis direction guide 25 for guiding the slider 27 in the X-axis direction, and the slider 27 along the X-axis direction guide 25. An X-axis direction driving unit 26 is driven.

  Further, a turning mechanism 28 for turning the stage 21 is provided between the slider 24 and the stage 21.

  Further, adjustment screws 51, 51,... For finely adjusting the posture of the stage 21 are provided at the four corners of the stage 21.

  Reference numeral 45 denotes a robot arm.

  The Z-axis direction moving mechanism 47 moves the stage 21 up and down in the Z-axis direction that is the vertical direction.

  Although not shown in the drawings, the mounting apparatus 20 is a pressure bonding apparatus that pressurizes and heats a workpiece, an imaging apparatus that images the workpiece, a sensor that detects the position of the workpiece, the height of the surface of the workpiece, the position of the stage, and the like. Although sensors for detecting the height are provided, these are not related to the gist of the present invention, and thus illustration and description thereof are omitted.

  In the mounting system having the above configuration, first, as shown in FIGS. 1 and 2, the substantially rectangular FPCs 41, 41,... Are positioned on the substantially rectangular through holes 12, 12,. Are supported by the stepped support portions 13, 13,... Around the 12, 12,..., And the FPCs 41, 41,.

  Next, as shown in FIG. 3, the robot arm 45 sandwiches the main body 11 of the transport tray 10 from the left and right sides (only one side of the two arms 45 is shown), and transports the transport tray 10 to implement the mounting device. .. Are mounted on 20 stage 21, and substantially rectangular through holes 12, 12,... Are passed through substantially rectangular convex positioning support portions 31, 31,. Are directly mounted on the surface of the FPC.

  As described above, the FPCs 41, 41,... Can be placed directly on the surfaces of the positioning support portions 31, 31,... With the FPCs 41, 41,. ,... Can be dispensed with from the transfer tray 10 to the stage 21, so that the mounting operation can be performed quickly.

  As described above, before the FPCs 41, 41,... Are directly placed on the surfaces of the positioning support portions 31, 31,. The position of the stage 21 is adjusted by appropriately operating the axial movement mechanism 60, the X-axis movement mechanism 70, and the turning mechanism 28.

  Next, the FPCs 41, 41,... Are vacuum-sucked by the substantially cross-shaped suction holes 33, 33,... Of the positioning support portions 31, 31,. Fix directly on 31,. The surfaces of the positioning support portions 31, 31,... Of the stage 21 are processed with extremely high accuracy compared to the transport tray 10, for example, with extremely high accuracy satisfying parallelism within 3 μm. Can be positioned on the positioning support portions 31, 31,... With extremely high accuracy. If the FPC is mounted on the transport tray and positioned, the parallelism within 3 μm cannot be satisfied.

  In this way, after the FPCs 41, 41,... Are positioned and fixed on the surfaces of the positioning support portions 31, 31,... Of the stage 21, the IC mounting process shown in FIG.

  Before that, the Y-axis direction moving mechanism 60, the X-axis direction moving mechanism 70, the Z-axis direction moving mechanism 47, and the turning mechanism 28 are actuated as necessary to adjust the position of the stage 21.

  Next, the steps of ACF (anisotropic conductive film) sticking, IC (integrated circuit chip) mounting (temporary pressure bonding), and IC mounting (main pressure bonding) shown in FIG. 4 are performed. That is, as shown in FIGS. 3 and 4, after the FPC 41 is accurately positioned and fixed on the high-precision positioning support portion 31 of the stage 21, an ACF (anisotropic conductive film) is placed at a predetermined position of the FPC 41. 81 is pasted by thermocompression bonding with a crimping device (not shown). At this time, the pressure of the crimping device is 10 to 150 [N], and the temperature of the tool of the crimping device is RT (room temperature) to 120 ° C.

  Next, as shown in FIG. 4, an IC (integrated circuit) chip 91 is temporarily pressure-bonded onto the ACF 81 attached to the FPC 41. At this time, the pressure of the crimping device is 10 to 50 [N], and the temperature of the tool of the crimping device is RT (room temperature) to 120 ° C.

  Next, as shown in FIG. 4, the IC chip 91 on the ACF 81 on the FPC 41 is finally bonded. At this time, the pressure of the crimping device is 50 to 400 [N], and the temperature of the tool of the crimping device is RT (room temperature) to 350 ° C. The positioning support portion 31 of the stage 21 at this time, that is, the backup temperature is RT (room temperature) to 100 ° C. The above-mentioned applied pressure and temperature are merely examples, and vary depending on the type of ACF and the type of FPC.

  In this manner, the FPCs 41, 41,... On which the IC chips 91, 91,... Are mounted via the ACFs 81, 81,. The FPCs 41, 41,... Can be immediately transported by the transport tray 10 without separately performing a transfer operation to the tray 10. Therefore, the mounting process can be performed quickly.

  In the above-described embodiment, the FPC is described as an example of the workpiece. However, the workpiece may be a glass substrate, a PWB (printed wiring substrate), a ceramic substrate, or the like. Further, the width of the support portion around the through hole of the transport tray may be made larger than that of the above-described embodiment, for example, to support the FPC portion other than the ACF to be mounted.

  It goes without saying that the constituent elements described in the above-described embodiments and modifications may be combined as appropriate, and may be selected, replaced, or deleted as appropriate.

DESCRIPTION OF SYMBOLS 10 Conveyance tray 12 Through-hole 13 Support part 20 Mounting apparatus 21 Stage 31 Positioning support part 33 Suction hole 41 FPC
60 Y-axis direction moving mechanism 70 X-axis direction moving mechanism 81 ACF
91 IC chip

Claims (2)

A transport tray having a through hole and a support portion that positions and supports the peripheral portion of the workpiece at least at a part of the periphery of the through hole; and
A stage having a positioning support portion for supporting and positioning the work on the transport tray through the through hole, a Y-axis direction moving mechanism for moving the stage in the Y-axis direction, and moving the stage in the X-axis direction A mounting system comprising a mounting device including an X-axis direction moving mechanism.   A transport tray having a through hole and a support portion for positioning and supporting the peripheral portion of the workpiece at least at a part of the periphery of the through hole.

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