JP2017209744A5 - - Google Patents

Download PDF

Info

Publication number
JP2017209744A5
JP2017209744A5 JP2016103410A JP2016103410A JP2017209744A5 JP 2017209744 A5 JP2017209744 A5 JP 2017209744A5 JP 2016103410 A JP2016103410 A JP 2016103410A JP 2016103410 A JP2016103410 A JP 2016103410A JP 2017209744 A5 JP2017209744 A5 JP 2017209744A5
Authority
JP
Japan
Prior art keywords
workpiece
window structure
plate
window
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016103410A
Other languages
English (en)
Japanese (ja)
Other versions
JP6602725B2 (ja
JP2017209744A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016103410A priority Critical patent/JP6602725B2/ja
Priority claimed from JP2016103410A external-priority patent/JP6602725B2/ja
Priority to KR1020170060433A priority patent/KR102318327B1/ko
Priority to CN201710352370.5A priority patent/CN107414666B/zh
Priority to TW106117069A priority patent/TWI707742B/zh
Publication of JP2017209744A publication Critical patent/JP2017209744A/ja
Publication of JP2017209744A5 publication Critical patent/JP2017209744A5/ja
Application granted granted Critical
Publication of JP6602725B2 publication Critical patent/JP6602725B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016103410A 2016-05-24 2016-05-24 ワークの板厚計測用窓構造 Active JP6602725B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造
KR1020170060433A KR102318327B1 (ko) 2016-05-24 2017-05-16 워크의 판 두께 계측용 창 구조
CN201710352370.5A CN107414666B (zh) 2016-05-24 2017-05-18 工件的板厚计测用窗结构
TW106117069A TWI707742B (zh) 2016-05-24 2017-05-23 工件之板厚測量用窗結構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造

Publications (3)

Publication Number Publication Date
JP2017209744A JP2017209744A (ja) 2017-11-30
JP2017209744A5 true JP2017209744A5 (enrdf_load_stackoverflow) 2019-01-10
JP6602725B2 JP6602725B2 (ja) 2019-11-06

Family

ID=60425135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016103410A Active JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造

Country Status (4)

Country Link
JP (1) JP6602725B2 (enrdf_load_stackoverflow)
KR (1) KR102318327B1 (enrdf_load_stackoverflow)
CN (1) CN107414666B (enrdf_load_stackoverflow)
TW (1) TWI707742B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034785B2 (ja) * 2018-03-20 2022-03-14 株式会社東京精密 研磨装置
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7466964B1 (ja) 2023-07-03 2024-04-15 株式会社多聞 基板厚測定装置及び基板厚測定方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10160420A (ja) * 1996-12-03 1998-06-19 Tokyo Seimitsu Co Ltd ウェーハの厚さ及び厚さ変化量測定装置
JPH10199951A (ja) * 1997-01-14 1998-07-31 Tokyo Seimitsu Co Ltd ウェーハの研磨面位置測定装置
TW372483U (en) * 1998-04-13 1999-10-21 Taiwan Semiconductor Mfg Light penetrative grinding system
KR100435246B1 (ko) * 1999-03-31 2004-06-11 가부시키가이샤 니콘 연마체, 연마장치, 연마장치의 조정방법, 연마막 두께또는 연마종점의 측정방법, 및 반도체 디바이스의 제조방법
JP2002170800A (ja) * 2000-12-01 2002-06-14 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20030114076A1 (en) * 2001-12-14 2003-06-19 Hui-Chun Chang Apparatus for chemical mechanical polishing
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
KR100716935B1 (ko) * 2005-11-25 2007-05-14 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
KR100889084B1 (ko) * 2007-07-06 2009-03-17 두산메카텍 주식회사 반도체 웨이퍼 표면연마공정을 위한 연마 종말점 검출 장치
SG192518A1 (en) * 2008-07-31 2013-08-30 Shinetsu Handotai Kk Wafer polishing method
JP5917994B2 (ja) * 2012-04-23 2016-05-18 スピードファム株式会社 研磨装置の計測用窓構造
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
JP6229737B2 (ja) * 2014-01-10 2017-11-15 株式会社Sumco ワークの厚さ測定装置、測定方法、及びワークの研磨装置
JP6230921B2 (ja) * 2014-01-16 2017-11-15 株式会社ディスコ 研磨装置

Similar Documents

Publication Publication Date Title
USD905816S1 (en) Optical device reticle
USD884819S1 (en) Eyepiece with reticle
USD749594S1 (en) Electronic device kickstand shell
USD828195S1 (en) Measuring apparatus
USD851005S1 (en) Wheel
USD716905S1 (en) Opticle device reticle
USD742958S1 (en) Calibration eyeglasses
PH12018500670A1 (en) Sheet for semiconductor processing
JP2017209744A5 (enrdf_load_stackoverflow)
USD787344S1 (en) Watch
USD796413S1 (en) Wiper blade with tire tread cover
JP2014175535A5 (enrdf_load_stackoverflow)
JP3213040U7 (enrdf_load_stackoverflow)
USD838616S1 (en) Measuring apparatus
TW201611969A (en) Robot
MX368468B (es) Protector de mandril para torno.
MX2018004279A (es) Herramienta de montaje de sensor.
USD838614S1 (en) Measuring apparatus
FR3017483B1 (fr) Feuille de verre avec code d'identification
USD810602S1 (en) Watch dial
USD697614S1 (en) Earplug
GB2574768B (en) Suction tool with integrated optical probe and use thereof
PT4054788T (pt) Dispositivo de soldagem por ultrassom com disposição de câmara integrada
USD864995S1 (en) Electrical test and measurement apparatus
PL3774141T3 (pl) Hydrauliczny uchwyt rozprężny i jego zastosowanie