JP2017209744A5 - - Google Patents
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- Publication number
- JP2017209744A5 JP2017209744A5 JP2016103410A JP2016103410A JP2017209744A5 JP 2017209744 A5 JP2017209744 A5 JP 2017209744A5 JP 2016103410 A JP2016103410 A JP 2016103410A JP 2016103410 A JP2016103410 A JP 2016103410A JP 2017209744 A5 JP2017209744 A5 JP 2017209744A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- window structure
- plate
- window
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 8
- 230000002093 peripheral Effects 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims 10
- 230000000149 penetrating Effects 0.000 claims 1
- 230000000452 restraining Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005296 abrasive Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Description
窓板３２は、石英ガラス、ＢＫ−７等のガラス系材料、サファイア、樹脂等の透光性を
有する材料により板状に形成されている。この窓板３２は、筒状部３１の下端に溶着、接
着、または一体成型等により設けられている。また、筒状部３１と窓板３２は、研磨剤や
研磨かす等による傷つき発生防止の観点から、透光性を有する脆性材料により形成される
ことが好ましい。なお、筒状部３１及び窓板３２の材料として脆性材料が選択される場
合は、窓板３２は筒状部３１に溶着により設けられることが好ましい。被覆材３３は、樹
脂からなる熱収縮チューブで構成されている。この被覆材３３は、筒状部３１の外周面３
１ａに密着されている。
The window plate 32 is formed in a plate shape from a glass-based material such as quartz glass or BK-7, or a translucent material such as sapphire or resin. The window plate 32 is provided at the lower end of the cylindrical portion 31 by welding, bonding, integral molding, or the like. Moreover, it is preferable that the cylindrical part 31 and the window board 32 are formed with the brittle material which has translucency from a viewpoint of generation | occurrence | production of the damage | wound by an abrasive | polishing agent, grinding | polishing residue, etc. In the case where the brittle material is selected as the material of the cylindrical portion 31 and the window plate 32, the window plate 32 is preferably provided by welding to the tubular portion 31. The covering material 33 is composed of a heat shrinkable tube made of resin. The covering material 33 is formed on the outer peripheral surface 3 of the cylindrical portion 31.
It is closely attached to 1a.
Claims (7)
前記計測孔に一端側が挿入された筒状部及び前記筒状部の一端に設けられた透光性の窓板を有する窓部材と、
前記筒状部の他端側の外周面を面接触するように保持して前記定盤の表面に固定された固定部と、
を備えることを特徴とするワークの板厚計測用窓構造。 A measurement hole penetrating the front and back surfaces of a surface plate of a polishing apparatus for polishing a thin plate workpiece,
A window member having a cylindrical portion in which one end side is inserted into the measurement hole and a translucent window plate provided at one end of the cylindrical portion;
A fixed portion that is fixed to the surface of the surface plate by holding the outer peripheral surface of the other end side of the cylindrical portion in surface contact;
A window structure for measuring the thickness of a workpiece.
前記固定部は、前記筒状部の他端側が通されたスリーブと、前記スリーブの外周面に嵌め込まれた円環状弾性部材と、前記円環状弾性部材の外周を拘束させて前記定盤の表面に固定された固定部本体とを備えることを特徴とするワークの板厚計測用窓構造。 In the thickness measurement window structure of the workpiece according to claim 1,
The fixing portion includes a sleeve through which the other end side of the cylindrical portion is passed, an annular elastic member fitted on the outer peripheral surface of the sleeve, and a surface of the surface plate by restraining an outer periphery of the annular elastic member A window structure for measuring a plate thickness of a workpiece, comprising: a fixed portion main body fixed to the workpiece.
前記スリーブの両端側には、それぞれ複数の切り欠きが周方向に所定の間隔で設けられていることを特徴とするワークの板厚計測用窓構造。 In the thickness measurement window structure of the workpiece according to claim 2,
A thickness measurement window structure for a workpiece, wherein a plurality of notches are provided at predetermined intervals in the circumferential direction on both ends of the sleeve.
前記筒状部及び前記窓板は透光性を有する脆性材料で形成されていることを特徴とするワークの板厚計測用窓構造。 In the window thickness measurement window structure of the workpiece according to any one of claims 1 to 3,
The tubular portion and the window plate window structure for a plate thickness of the workpiece measuring, characterized in that it is formed in the brittle material having a light-transmitting property.
前記窓部材及び前記固定部を覆って前記定盤の表面に固定されたカバーを備え、前記カバーには、前記筒状部の他端の開口部と対向する部分に透光性を有する透光部が設けられていることを特徴とするワークの板厚計測用窓構造。 In the window thickness measurement window structure of the workpiece according to any one of claims 1 to 4,
A cover that covers the window member and the fixing portion and is fixed to the surface of the surface plate, the cover having a light-transmitting property at a portion facing the opening at the other end of the cylindrical portion. A window structure for measuring a plate thickness of a workpiece, characterized in that a part is provided.
前記透光部は、前記定盤の表面に対して前記定盤の内周側から外周側へ斜めに下げて配置されていることを特徴とするワークの板厚計測用窓構造。 In the window thickness measurement window structure of the workpiece according to claim 5,
The work thickness measurement window structure according to claim 1, wherein the translucent portion is disposed so as to be obliquely lowered from the inner peripheral side to the outer peripheral side of the surface plate with respect to the surface of the surface plate.
前記透光部の周囲には前記透光部を囲む囲繞部が設けられており、前記囲繞部の前記定盤の外周側には、前記囲繞部の内部と外部とを連通する連通部が設けられていることを特徴とするワークの板厚計測用窓構造。 In the plate | board thickness measurement window structure of the workpiece | work of Claim 5 or Claim 6,
An encircling portion surrounding the translucent portion is provided around the translucent portion, and a communication portion that communicates the inside and the outside of the encircling portion is provided on the outer peripheral side of the surface plate of the encircling portion. A window structure for measuring the thickness of workpieces.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016103410A JP6602725B2 (en) | 2016-05-24 | 2016-05-24 | Window structure for workpiece thickness measurement |
| KR1020170060433A KR102318327B1 (en) | 2016-05-24 | 2017-05-16 | Plate thickness measurement window structure of work |
| CN201710352370.5A CN107414666B (en) | 2016-05-24 | 2017-05-18 | Window structure for measuring plate thickness of workpiece |
| TW106117069A TWI707742B (en) | 2016-05-24 | 2017-05-23 | Window structure for measuring thickness of workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016103410A JP6602725B2 (en) | 2016-05-24 | 2016-05-24 | Window structure for workpiece thickness measurement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017209744A JP2017209744A (en) | 2017-11-30 |
| JP2017209744A5 true JP2017209744A5 (en) | 2019-01-10 |
| JP6602725B2 JP6602725B2 (en) | 2019-11-06 |
Family
ID=60425135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016103410A Active JP6602725B2 (en) | 2016-05-24 | 2016-05-24 | Window structure for workpiece thickness measurement |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6602725B2 (en) |
| KR (1) | KR102318327B1 (en) |
| CN (1) | CN107414666B (en) |
| TW (1) | TWI707742B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7034785B2 (en) * | 2018-03-20 | 2022-03-14 | 株式会社東京精密 | Polishing equipment |
| JP7435113B2 (en) * | 2020-03-23 | 2024-02-21 | 株式会社Sumco | Double-sided polishing device for workpieces |
| JP7466964B1 (en) | 2023-07-03 | 2024-04-15 | 株式会社多聞 | Substrate thickness measuring device and substrate thickness measuring method |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10160420A (en) * | 1996-12-03 | 1998-06-19 | Tokyo Seimitsu Co Ltd | Instrument for measuring thickness and thickness variation of wafer |
| JPH10199951A (en) * | 1997-01-14 | 1998-07-31 | Tokyo Seimitsu Co Ltd | Apparatus for measuring position of polishing face of wafer |
| TW372483U (en) * | 1998-04-13 | 1999-10-21 | Taiwan Semiconductor Mfg | Light penetrative grinding system |
| KR100435246B1 (en) * | 1999-03-31 | 2004-06-11 | 가부시키가이샤 니콘 | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| JP2002170800A (en) * | 2000-12-01 | 2002-06-14 | Nikon Corp | Polishing apparatus, method for manufacturing semiconductor device using the same and semiconductor device manufactured by this method |
| US20030114076A1 (en) * | 2001-12-14 | 2003-06-19 | Hui-Chun Chang | Apparatus for chemical mechanical polishing |
| US6991514B1 (en) * | 2003-02-21 | 2006-01-31 | Verity Instruments, Inc. | Optical closed-loop control system for a CMP apparatus and method of manufacture thereof |
| JP4202841B2 (en) * | 2003-06-30 | 2008-12-24 | 株式会社Ｓｕｍｃｏ | Surface polishing equipment |
| KR100716935B1 (en) * | 2005-11-25 | 2007-05-14 | 두산디앤디 주식회사 | Loading device for chemical mechanical polisher of semiconductor wafer |
| KR100889084B1 (en) * | 2007-07-06 | 2009-03-17 | 두산메카텍 주식회사 | End point detecting apparatus for semiconductor wafer polishing process |
| WO2010013390A1 (en) * | 2008-07-31 | 2010-02-04 | 信越半導体株式会社 | Wafer polishing method and double side polishing apparatus |
| JP5917994B2 (en) * | 2012-04-23 | 2016-05-18 | スピードファム株式会社 | Measuring window structure for polishing equipment |
| JP6255991B2 (en) * | 2013-12-26 | 2018-01-10 | 株式会社Sumco | Double-side polishing machine for workpieces |
| JP6229737B2 (en) * | 2014-01-10 | 2017-11-15 | 株式会社Sumco | Work thickness measuring apparatus, measuring method, and work polishing apparatus |
| JP6230921B2 (en) * | 2014-01-16 | 2017-11-15 | 株式会社ディスコ | Polishing equipment |
-
2016
- 2016-05-24 JP JP2016103410A patent/JP6602725B2/en active Active
-
2017
- 2017-05-16 KR KR1020170060433A patent/KR102318327B1/en active IP Right Grant
- 2017-05-18 CN CN201710352370.5A patent/CN107414666B/en active Active
- 2017-05-23 TW TW106117069A patent/TWI707742B/en active
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