KR102318327B1 - 워크의 판 두께 계측용 창 구조 - Google Patents

워크의 판 두께 계측용 창 구조 Download PDF

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Publication number
KR102318327B1
KR102318327B1 KR1020170060433A KR20170060433A KR102318327B1 KR 102318327 B1 KR102318327 B1 KR 102318327B1 KR 1020170060433 A KR1020170060433 A KR 1020170060433A KR 20170060433 A KR20170060433 A KR 20170060433A KR 102318327 B1 KR102318327 B1 KR 102318327B1
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South Korea
Prior art keywords
plate
window
thickness
measuring
window structure
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KR1020170060433A
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English (en)
Korean (ko)
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KR20170132667A (ko
Inventor
요시오 고이케
유스케 이노우에
히데아키 요시하라
Original Assignee
스피드팸 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020170060433A 2016-05-24 2017-05-16 워크의 판 두께 계측용 창 구조 Active KR102318327B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-103410 2016-05-24
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造

Publications (2)

Publication Number Publication Date
KR20170132667A KR20170132667A (ko) 2017-12-04
KR102318327B1 true KR102318327B1 (ko) 2021-10-28

Family

ID=60425135

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170060433A Active KR102318327B1 (ko) 2016-05-24 2017-05-16 워크의 판 두께 계측용 창 구조

Country Status (4)

Country Link
JP (1) JP6602725B2 (enrdf_load_stackoverflow)
KR (1) KR102318327B1 (enrdf_load_stackoverflow)
CN (1) CN107414666B (enrdf_load_stackoverflow)
TW (1) TWI707742B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034785B2 (ja) * 2018-03-20 2022-03-14 株式会社東京精密 研磨装置
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7466964B1 (ja) 2023-07-03 2024-04-15 株式会社多聞 基板厚測定装置及び基板厚測定方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000060650A1 (fr) 1999-03-31 2000-10-12 Nikon Corporation Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur
JP2013223908A (ja) * 2012-04-23 2013-10-31 Speedfam Co Ltd 研磨装置の計測用窓構造

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10160420A (ja) * 1996-12-03 1998-06-19 Tokyo Seimitsu Co Ltd ウェーハの厚さ及び厚さ変化量測定装置
JPH10199951A (ja) * 1997-01-14 1998-07-31 Tokyo Seimitsu Co Ltd ウェーハの研磨面位置測定装置
TW372483U (en) * 1998-04-13 1999-10-21 Taiwan Semiconductor Mfg Light penetrative grinding system
JP2002170800A (ja) * 2000-12-01 2002-06-14 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20030114076A1 (en) * 2001-12-14 2003-06-19 Hui-Chun Chang Apparatus for chemical mechanical polishing
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
KR100716935B1 (ko) * 2005-11-25 2007-05-14 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
KR100889084B1 (ko) * 2007-07-06 2009-03-17 두산메카텍 주식회사 반도체 웨이퍼 표면연마공정을 위한 연마 종말점 검출 장치
SG192518A1 (en) * 2008-07-31 2013-08-30 Shinetsu Handotai Kk Wafer polishing method
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
JP6229737B2 (ja) * 2014-01-10 2017-11-15 株式会社Sumco ワークの厚さ測定装置、測定方法、及びワークの研磨装置
JP6230921B2 (ja) * 2014-01-16 2017-11-15 株式会社ディスコ 研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000060650A1 (fr) 1999-03-31 2000-10-12 Nikon Corporation Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur
KR100435246B1 (ko) 1999-03-31 2004-06-11 가부시키가이샤 니콘 연마체, 연마장치, 연마장치의 조정방법, 연마막 두께또는 연마종점의 측정방법, 및 반도체 디바이스의 제조방법
JP2013223908A (ja) * 2012-04-23 2013-10-31 Speedfam Co Ltd 研磨装置の計測用窓構造

Also Published As

Publication number Publication date
JP6602725B2 (ja) 2019-11-06
KR20170132667A (ko) 2017-12-04
CN107414666B (zh) 2020-12-08
CN107414666A (zh) 2017-12-01
TW201741072A (zh) 2017-12-01
TWI707742B (zh) 2020-10-21
JP2017209744A (ja) 2017-11-30

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