TWI707742B - 工件之板厚測量用窗結構 - Google Patents

工件之板厚測量用窗結構 Download PDF

Info

Publication number
TWI707742B
TWI707742B TW106117069A TW106117069A TWI707742B TW I707742 B TWI707742 B TW I707742B TW 106117069 A TW106117069 A TW 106117069A TW 106117069 A TW106117069 A TW 106117069A TW I707742 B TWI707742 B TW I707742B
Authority
TW
Taiwan
Prior art keywords
workpiece
measuring
window
plate
thickness
Prior art date
Application number
TW106117069A
Other languages
English (en)
Chinese (zh)
Other versions
TW201741072A (zh
Inventor
小池喜雄
井上裕介
吉原秀明
Original Assignee
日商創技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商創技股份有限公司 filed Critical 日商創技股份有限公司
Publication of TW201741072A publication Critical patent/TW201741072A/zh
Application granted granted Critical
Publication of TWI707742B publication Critical patent/TWI707742B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW106117069A 2016-05-24 2017-05-23 工件之板厚測量用窗結構 TWI707742B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-103410 2016-05-24
JP2016103410A JP6602725B2 (ja) 2016-05-24 2016-05-24 ワークの板厚計測用窓構造

Publications (2)

Publication Number Publication Date
TW201741072A TW201741072A (zh) 2017-12-01
TWI707742B true TWI707742B (zh) 2020-10-21

Family

ID=60425135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106117069A TWI707742B (zh) 2016-05-24 2017-05-23 工件之板厚測量用窗結構

Country Status (4)

Country Link
JP (1) JP6602725B2 (enrdf_load_stackoverflow)
KR (1) KR102318327B1 (enrdf_load_stackoverflow)
CN (1) CN107414666B (enrdf_load_stackoverflow)
TW (1) TWI707742B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034785B2 (ja) * 2018-03-20 2022-03-14 株式会社東京精密 研磨装置
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7466964B1 (ja) 2023-07-03 2024-04-15 株式会社多聞 基板厚測定装置及び基板厚測定方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW372483U (en) * 1998-04-13 1999-10-21 Taiwan Semiconductor Mfg Light penetrative grinding system
TW200721289A (en) * 2005-11-25 2007-06-01 Doosan Dnd Co Ltd Loading device of chemical methanical polishing equipment for semiconductor wafers
TW201021109A (en) * 2008-07-31 2010-06-01 Shinetsu Handotai Kk Wafer polishing method and double side polishing apparatus
JP2013223908A (ja) * 2012-04-23 2013-10-31 Speedfam Co Ltd 研磨装置の計測用窓構造
TW201527041A (zh) * 2014-01-10 2015-07-16 Sumco Corp 工件厚度的測定裝置、測定方法及工件的硏磨裝置
TW201536473A (zh) * 2013-12-26 2015-10-01 Sumco Corp 工件之兩面硏磨裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10160420A (ja) * 1996-12-03 1998-06-19 Tokyo Seimitsu Co Ltd ウェーハの厚さ及び厚さ変化量測定装置
JPH10199951A (ja) * 1997-01-14 1998-07-31 Tokyo Seimitsu Co Ltd ウェーハの研磨面位置測定装置
KR100435246B1 (ko) * 1999-03-31 2004-06-11 가부시키가이샤 니콘 연마체, 연마장치, 연마장치의 조정방법, 연마막 두께또는 연마종점의 측정방법, 및 반도체 디바이스의 제조방법
JP2002170800A (ja) * 2000-12-01 2002-06-14 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20030114076A1 (en) * 2001-12-14 2003-06-19 Hui-Chun Chang Apparatus for chemical mechanical polishing
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
KR100889084B1 (ko) * 2007-07-06 2009-03-17 두산메카텍 주식회사 반도체 웨이퍼 표면연마공정을 위한 연마 종말점 검출 장치
JP6230921B2 (ja) * 2014-01-16 2017-11-15 株式会社ディスコ 研磨装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW372483U (en) * 1998-04-13 1999-10-21 Taiwan Semiconductor Mfg Light penetrative grinding system
TW200721289A (en) * 2005-11-25 2007-06-01 Doosan Dnd Co Ltd Loading device of chemical methanical polishing equipment for semiconductor wafers
TW201021109A (en) * 2008-07-31 2010-06-01 Shinetsu Handotai Kk Wafer polishing method and double side polishing apparatus
JP2013223908A (ja) * 2012-04-23 2013-10-31 Speedfam Co Ltd 研磨装置の計測用窓構造
TW201536473A (zh) * 2013-12-26 2015-10-01 Sumco Corp 工件之兩面硏磨裝置
TW201527041A (zh) * 2014-01-10 2015-07-16 Sumco Corp 工件厚度的測定裝置、測定方法及工件的硏磨裝置

Also Published As

Publication number Publication date
KR102318327B1 (ko) 2021-10-28
JP6602725B2 (ja) 2019-11-06
KR20170132667A (ko) 2017-12-04
CN107414666B (zh) 2020-12-08
CN107414666A (zh) 2017-12-01
TW201741072A (zh) 2017-12-01
JP2017209744A (ja) 2017-11-30

Similar Documents

Publication Publication Date Title
TWI707742B (zh) 工件之板厚測量用窗結構
JP5917994B2 (ja) 研磨装置の計測用窓構造
KR102248159B1 (ko) 플립 칩 본딩장치의 가압 헤드 및 그를 포함하는 가압 어셈블리
JP6464513B2 (ja) 表面形状の測定方法および測定装置
KR102246521B1 (ko) 연마 장치
CN104858772B (zh) 研磨装置
US11821788B2 (en) Monitoring light output from at least one solid-state light source
KR20170103761A (ko) 회전체 유닛, 회전체 및 프로젝터
EP4434674A1 (en) Method of polishing a surface of a waveguide
JP2013008504A (ja) 照明器具
CN110052961A (zh) 研磨装置
US20140219310A1 (en) Apparatus for calibrating pyrometer
TWI835975B (zh) 晶圓處理設備及該設備的控制方法
US20190157843A1 (en) Laser light source unit
TW202135980A (zh) 工件的兩面研磨裝置
KR102017286B1 (ko) Led 모듈
WO2012063758A1 (ja) 照明装置および表示装置
US20160281957A1 (en) Light emitting device, surface light source device and display apparatus
WO2015125215A1 (ja) 発光装置
JP7278188B2 (ja) 試料ホルダ
US9500530B2 (en) Apparatus for calibrating pyrometer
KR100743454B1 (ko) 화학적 기계적 연마장비의 연마 종점 검출장치
CN113917643B (zh) 一种用于光谱仪的可调式光栅安装装置及安装方法
JPS58155168A (ja) ポリシング用セラミツク定盤の固定装置
TW202514872A (zh) 半導體封裝之封裝托盤及相關方法