JP2017199824A5 - - Google Patents

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Publication number
JP2017199824A5
JP2017199824A5 JP2016090193A JP2016090193A JP2017199824A5 JP 2017199824 A5 JP2017199824 A5 JP 2017199824A5 JP 2016090193 A JP2016090193 A JP 2016090193A JP 2016090193 A JP2016090193 A JP 2016090193A JP 2017199824 A5 JP2017199824 A5 JP 2017199824A5
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JP
Japan
Prior art keywords
sus
base material
substrate
etched
etchant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2016090193A
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English (en)
Japanese (ja)
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JP2017199824A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016090193A priority Critical patent/JP2017199824A/ja
Priority claimed from JP2016090193A external-priority patent/JP2017199824A/ja
Priority to US15/481,848 priority patent/US10096564B2/en
Priority to CN201710239394.XA priority patent/CN107342236A/zh
Priority to TW106112542A priority patent/TW201802967A/zh
Priority to KR1020170048961A priority patent/KR20170123241A/ko
Publication of JP2017199824A publication Critical patent/JP2017199824A/ja
Publication of JP2017199824A5 publication Critical patent/JP2017199824A5/ja
Withdrawn legal-status Critical Current

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JP2016090193A 2016-04-28 2016-04-28 半導体パッケージの製造方法 Withdrawn JP2017199824A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016090193A JP2017199824A (ja) 2016-04-28 2016-04-28 半導体パッケージの製造方法
US15/481,848 US10096564B2 (en) 2016-04-28 2017-04-07 Manufacturing method of semiconductor package
CN201710239394.XA CN107342236A (zh) 2016-04-28 2017-04-13 半导体封装件的制造方法
TW106112542A TW201802967A (zh) 2016-04-28 2017-04-14 半導體封裝件之製造方法
KR1020170048961A KR20170123241A (ko) 2016-04-28 2017-04-17 반도체 패키지의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016090193A JP2017199824A (ja) 2016-04-28 2016-04-28 半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JP2017199824A JP2017199824A (ja) 2017-11-02
JP2017199824A5 true JP2017199824A5 (enExample) 2018-12-27

Family

ID=60158515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016090193A Withdrawn JP2017199824A (ja) 2016-04-28 2016-04-28 半導体パッケージの製造方法

Country Status (5)

Country Link
US (1) US10096564B2 (enExample)
JP (1) JP2017199824A (enExample)
KR (1) KR20170123241A (enExample)
CN (1) CN107342236A (enExample)
TW (1) TW201802967A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10297561B1 (en) * 2017-12-22 2019-05-21 Micron Technology, Inc. Interconnect structures for preventing solder bridging, and associated systems and methods
CN114407455B (zh) * 2021-12-29 2023-08-18 沈阳和研科技股份有限公司 小颗粒电子封装材料加工用复合夹层结构及其加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159330A (ja) * 2003-11-05 2005-06-16 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
WO2007069789A1 (ja) * 2005-12-16 2007-06-21 Ibiden Co., Ltd. 多層プリント配線板およびその製造方法
JP5322531B2 (ja) * 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5419441B2 (ja) * 2008-12-26 2014-02-19 富士フイルム株式会社 多層配線基板の形成方法
JP2010278334A (ja) 2009-05-29 2010-12-09 Elpida Memory Inc 半導体装置
JP2013251368A (ja) * 2012-05-31 2013-12-12 Hitachi Chemical Co Ltd 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれにより得られる半導体装置
JP5903337B2 (ja) * 2012-06-08 2016-04-13 新光電気工業株式会社 半導体パッケージ及びその製造方法
JP2014150091A (ja) * 2013-01-31 2014-08-21 Kyocer Slc Technologies Corp 配線基板およびその製造方法
JP5925961B2 (ja) * 2014-03-31 2016-05-25 三井金属鉱業株式会社 キャリア箔付銅箔、銅張積層板及びプリント配線板の製造方法
JP6457206B2 (ja) * 2014-06-19 2019-01-23 株式会社ジェイデバイス 半導体パッケージ及びその製造方法
JP2016035969A (ja) * 2014-08-01 2016-03-17 味の素株式会社 回路基板及びその製造方法

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