JP2017188511A - Power conversion device - Google Patents

Power conversion device Download PDF

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JP2017188511A
JP2017188511A JP2016074584A JP2016074584A JP2017188511A JP 2017188511 A JP2017188511 A JP 2017188511A JP 2016074584 A JP2016074584 A JP 2016074584A JP 2016074584 A JP2016074584 A JP 2016074584A JP 2017188511 A JP2017188511 A JP 2017188511A
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heat generating
covering member
generating component
heat
main body
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勲 藤巻
Isao Fujimaki
勲 藤巻
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Toyota Industries Corp
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Toyota Industries Corp
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Priority to JP2016074584A priority Critical patent/JP2017188511A/en
Priority to PCT/JP2017/011900 priority patent/WO2017170184A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dc-Dc Converters (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device capable of suppressing thermal interference between heating components.SOLUTION: The power conversion device comprises: a first heating component 20 having a main body part 21 and terminal parts 22, 23; a second heating component 30 having a main body part 31 and terminal parts 32, 33; and a substrate 50 in which terminal parts 22, 23 of the first heating component 20 and terminal parts 32, 33 of the second heating component 30 are electrically connected. The main body part 21 of the first heating component 20 is covered with a first covering member 65, and the main body part 31 of the second heating component 30 is covered with a second covering member 66. The first covering member 65 and the second covering member 66 are brought into contact with a cooling material. A flow channel 90a to which the cooling material flows is formed in a space where one side face 65a as a part of the first covering member 65 and one side face 66a as a part of the second covering member 66 are faced to each other.SELECTED DRAWING: Figure 2

Description

本発明は、電力変換装置に関するものである。   The present invention relates to a power conversion device.

車載電力変換装置の一般的な構造の一例を図3に示す。図3に示すように筐体100の突部100a,100bに基板101がねじ102,103により固定され、基板101には発熱部品104,105,106等が搭載され、その上には冷却器107が放熱部材108,109,110を介して配置されている。発熱部品104,105,106は、コイル、トランス、パワーMOSFET、パワーダイオード等である。なお、特許文献1に開示の半導体装置においては、使用時に発熱する半導体素子と、半導体素子の放熱のための冷却液を収容する冷却器とを有し、半導体素子は、冷却器の一面における内面側に取り付けられており、冷却器の内部には、半導体素子と冷却液との接触を防ぐ防水層が設けられている。   An example of a general structure of the in-vehicle power converter is shown in FIG. As shown in FIG. 3, the substrate 101 is fixed to the protrusions 100 a and 100 b of the housing 100 by screws 102 and 103. Are disposed via the heat dissipating members 108, 109, 110. The heat generating components 104, 105, and 106 are a coil, a transformer, a power MOSFET, a power diode, and the like. Note that the semiconductor device disclosed in Patent Document 1 includes a semiconductor element that generates heat during use and a cooler that contains a coolant for heat dissipation of the semiconductor element, and the semiconductor element is an inner surface on one surface of the cooler. A waterproof layer that prevents contact between the semiconductor element and the coolant is provided inside the cooler.

特開2010−245329号公報JP 2010-245329 A

ところが、発熱部品間で熱干渉が発生する。即ち、図3における発熱部品104と発熱部品105との間、及び、発熱部品105と発熱部品106との間で熱干渉する。
本発明の目的は、発熱部品間での熱干渉を抑制することができる電力変換装置を提供することにある。
However, heat interference occurs between the heat generating components. That is, thermal interference occurs between the heat generating component 104 and the heat generating component 105 in FIG. 3 and between the heat generating component 105 and the heat generating component 106.
The objective of this invention is providing the power converter device which can suppress the thermal interference between heat-emitting components.

請求項1に記載の発明では、本体部と端子部とを有する第1の発熱部品と、本体部と端子部とを有する第2の発熱部品と、前記第1の発熱部品の端子部及び前記第2の発熱部品の端子部が電気的に接続される基板と、を備える電力変換装置であって、前記第1の発熱部品の本体部は第1の被覆部材によって覆われており、前記第2の発熱部品の本体部は第2の被覆部材によって覆われており、前記第1の被覆部材及び前記第2の被覆部材は冷却材と接触し、前記第1の被覆部材の一部と前記第2の被覆部材の一部とが互いに対向する空間には冷却材が流れる流路が形成されていることを要旨とする。   In the first aspect of the present invention, the first heat generating component having the main body portion and the terminal portion, the second heat generating component having the main body portion and the terminal portion, the terminal portion of the first heat generating component, and the And a substrate to which a terminal portion of the second heat generating component is electrically connected, wherein the main body portion of the first heat generating component is covered with a first covering member, The heat generating component body 2 is covered with a second covering member, the first covering member and the second covering member are in contact with a coolant, and a part of the first covering member and the The gist is that a channel through which a coolant flows is formed in a space where a part of the second covering member faces each other.

請求項1に記載の発明によれば、第1の被覆部材及び第2の被覆部材は冷却材と接触し、且つ、第1の被覆部材の一部と第2の被覆部材の一部とが互いに対向する空間には冷却材が流れるため、第1の発熱部品と第2の発熱部品との間で熱干渉しにくく、発熱部品間での熱干渉を抑制することができる。   According to the first aspect of the present invention, the first covering member and the second covering member are in contact with the coolant, and a part of the first covering member and a part of the second covering member are in contact with each other. Since the coolant flows in the spaces facing each other, it is difficult for heat interference between the first heat generating component and the second heat generating component, and heat interference between the heat generating components can be suppressed.

請求項2に記載の発明は、請求項1に記載の電力変換装置において、前記第1の被覆部材及び前記第2の被覆部材の少なくとも一方は金属製であることを要旨とする。
請求項2に記載の発明によれば、ノイズシールド可能となる。
The invention according to claim 2 is summarized in that, in the power conversion device according to claim 1, at least one of the first covering member and the second covering member is made of metal.
According to the second aspect of the present invention, noise shielding is possible.

請求項3に記載の発明は、請求項1に記載の電力変換装置において、前記第1の被覆部材と前記第2の被覆部材とは一体化されていることを要旨とする。
請求項3に記載の発明によれば、部品点数を減らすことができる。
The gist of the invention according to claim 3 is that, in the power conversion device according to claim 1, the first covering member and the second covering member are integrated.
According to the invention described in claim 3, the number of parts can be reduced.

請求項4に記載の発明は、請求項1〜3のいずれか1項に記載の電力変換装置において、前記第1の発熱部品と前記第2の発熱部品とは隣り合っていることを要旨とする。
請求項4に記載の発明によれば、より小型化可能となる。
The invention according to claim 4 is the power conversion device according to any one of claims 1 to 3, wherein the first heat generating component and the second heat generating component are adjacent to each other. To do.
According to the invention described in claim 4, it is possible to further reduce the size.

請求項5に記載の発明は、請求項1〜4のいずれか1項に記載の電力変換装置において、前記基板の一方の面に前記第1の発熱部品の本体部及び前記第2の発熱部品の本体部が配置され、前記基板の一方の面にキャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つが配置されていることを要旨とする。   According to a fifth aspect of the present invention, in the power conversion device according to any one of the first to fourth aspects, the main body portion of the first heat generating component and the second heat generating component are provided on one surface of the substrate. The main body is disposed, and at least one of a capacitor element, a resistor component, and a control semiconductor element is disposed on one surface of the substrate.

請求項5に記載の発明によれば、キャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つを第1の発熱部品の本体部及び第2の発熱部品の本体部に近づけて配置しても熱に弱いキャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つに熱を伝えにくくできる。   According to the fifth aspect of the present invention, at least one of the capacitor element, the resistor component, and the control semiconductor element may be disposed close to the main body portion of the first heat generating component and the main body portion of the second heat generating component. Heat can be hardly transmitted to at least one of the capacitor element, the resistance component, and the control semiconductor element that are vulnerable to heat.

本発明によれば、発熱部品間での熱干渉を抑制することができる。   According to the present invention, thermal interference between heat-generating components can be suppressed.

実施形態における車載充電器のブロック図。The block diagram of the vehicle-mounted charger in embodiment. 車載充電器の断面構造図。The cross-section figure of a vehicle-mounted charger. 背景技術を説明するための断面構造図。The cross-section figure for demonstrating background art.

以下、本発明を車載充電器を例として具体化した一実施形態を図面に従って説明する。
図1に示すように、本実施形態の車載充電器10は、ACフィルタ11とPFC回路(力率改善回路)12と平滑コンデンサ部13とDC/DCコンバータ14と整流回路15と平滑コイル部16とDCフィルタ17を備えている。そして、車両の外部からAC100〜200Vを入力してACフィルタ11とPFC回路12と平滑コンデンサ部13を通してDC/DCコンバータ14においてDC/DC変換して整流回路15と平滑コイル部16とDCフィルタ17を通して300〜500Vバッテリに供給して300〜500Vバッテリを充電する。
Hereinafter, an embodiment in which the present invention is embodied by taking an in-vehicle charger as an example will be described with reference to the drawings.
As shown in FIG. 1, the on-vehicle charger 10 of the present embodiment includes an AC filter 11, a PFC circuit (power factor correction circuit) 12, a smoothing capacitor unit 13, a DC / DC converter 14, a rectifier circuit 15, and a smoothing coil unit 16. And a DC filter 17. And AC100-200V is input from the exterior of a vehicle, DC / DC conversion is performed in the DC / DC converter 14 through the AC filter 11, the PFC circuit 12, and the smoothing capacitor part 13, and the rectifier circuit 15, the smoothing coil part 16, and the DC filter 17 are obtained. The 300-500V battery is charged through the 300-500V battery.

ACフィルタ11はコイルを有し、PFC回路12はパワーMOSFET、パワーダイオード、コイルを有し、平滑コンデンサ部13はコンデンサを有し、DC/DCコンバータ14はパワーMOSFET、トランス、コイルを有する。整流回路15はパワーダイオードを有し、平滑コイル部16はコイルを有し、DCフィルタ17はコイルを有する。   The AC filter 11 includes a coil, the PFC circuit 12 includes a power MOSFET, a power diode, and a coil, the smoothing capacitor unit 13 includes a capacitor, and the DC / DC converter 14 includes a power MOSFET, a transformer, and a coil. The rectifier circuit 15 includes a power diode, the smoothing coil unit 16 includes a coil, and the DC filter 17 includes a coil.

ここで、背の高い部品としてDC/DCコンバータ14のトランス、PFC回路12のコイル、平滑コンデンサ部13のコンデンサなどがある。また、重たい部品としてDC/DCコンバータ14のトランス、PFC回路12のコイル、平滑コイル部16のコイルなどがある。さらに、冷却が必要な部品として、DC/DCコンバータ14のパワーMOSFET、整流回路15のパワーダイオード、PFC回路12のコイル、DC/DCコンバータ14のトランスがある。   Here, there are a transformer of the DC / DC converter 14, a coil of the PFC circuit 12, a capacitor of the smoothing capacitor unit 13, and the like as tall parts. Heavy components include a transformer of the DC / DC converter 14, a coil of the PFC circuit 12, and a coil of the smoothing coil unit 16. Furthermore, components that require cooling include a power MOSFET of the DC / DC converter 14, a power diode of the rectifier circuit 15, a coil of the PFC circuit 12, and a transformer of the DC / DC converter 14.

図2に示す車載充電器10の断面構造において、本体部21と端子部22,23とを有する第1の発熱部品20と、本体部31と端子部32,33とを有する第2の発熱部品30と、本体部41と端子部42,43とを有する電子部品40を備える。各本体部21,31,41は円柱もしくは、多角柱形状をしており、直方体形状であれば、6面を有する。さらに、第1の発熱部品20の端子部22,23、第2の発熱部品30の端子部32,33及び電子部品40の端子部42,43が電気的に接続される基板50を備える。発熱部品20,30は、発熱量が大きいコイル、トランス等であり、他にも、DC/DCコンバータ14を構成するパワーMOSFET等であり、図2においては発熱部品20,30の高さは異なっている。電子部品40は、熱に弱い半導体部品や熱により性能低下する抵抗部品などであり、例えば、キャパシタ素子も挙げることができ、キャパシタ素子は電力平滑、フィルタ用の電解コンデンサ、フィルムコンデンサ等である。なお、電子部品40は、広義には、熱に弱い部品や熱により性能劣化する部品(パワーMOSFETを制御する制御用半導体素子、抵抗部品、コンデンサ等)である。   In the cross-sectional structure of the in-vehicle charger 10 shown in FIG. 2, a first heat generating component 20 having a main body portion 21 and terminal portions 22 and 23, and a second heat generating component having a main body portion 31 and terminal portions 32 and 33. 30, and an electronic component 40 having a main body 41 and terminal portions 42 and 43. Each main-body part 21,31,41 has the shape of a cylinder or a polygonal column, and if it is a rectangular parallelepiped shape, it has six sides. Furthermore, the board | substrate 50 with which the terminal parts 22 and 23 of the 1st heat-emitting component 20, the terminal parts 32 and 33 of the 2nd heat-emitting component 30, and the terminal parts 42 and 43 of the electronic component 40 are electrically connected is provided. The heat generating components 20 and 30 are a coil, a transformer, and the like that generate a large amount of heat. In addition, the heat generating components 20 and 30 are power MOSFETs that constitute the DC / DC converter 14, and in FIG. ing. The electronic component 40 is a heat-sensitive semiconductor component or a resistance component whose performance is deteriorated by heat. Examples of the electronic component 40 include a capacitor element. Examples of the capacitor element include power smoothing, electrolytic capacitors for filters, and film capacitors. The electronic component 40 is, in a broad sense, a component that is vulnerable to heat or a component that deteriorates in performance due to heat (such as a control semiconductor element that controls a power MOSFET, a resistor component, or a capacitor).

このように、電子部品40は、キャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つである。
発熱部品と基板を区切っている金属板60は水平方向に延びており、金属板60の上面に第1の発熱部品20、第2の発熱部品30及び電子部品40が離間して配置されている。各本体部21,31,41は、その一面が金属板60の上面と当接している(面接触している)。金属板60上に配された第1の発熱部品20は、断面コ字状の金属製蓋材61で囲まれている。金属製蓋材61と金属板60とは一体化されており、金属製蓋材61と金属板60の間に隙間は無い。
As described above, the electronic component 40 is at least one of a capacitor element, a resistance component, and a control semiconductor element.
The metal plate 60 separating the heat generating component and the substrate extends in the horizontal direction, and the first heat generating component 20, the second heat generating component 30, and the electronic component 40 are spaced apart from each other on the upper surface of the metal plate 60. . One surface of each of the main body portions 21, 31, 41 is in contact with the upper surface of the metal plate 60 (surface contact). The first heat generating component 20 disposed on the metal plate 60 is surrounded by a metal lid member 61 having a U-shaped cross section. The metal lid member 61 and the metal plate 60 are integrated, and there is no gap between the metal lid member 61 and the metal plate 60.

このように、断面コ字状の金属製蓋材61における開口部が金属板60で塞がれた構造をなし、第1の被覆部材65を構成している。そして、第1の発熱部品20の本体部21は第1の被覆部材65によって覆われている。   Thus, the opening part in the metal lid member 61 having a U-shaped cross section is closed by the metal plate 60, and the first covering member 65 is configured. The main body 21 of the first heat generating component 20 is covered with a first covering member 65.

同様に、金属板60上に配された第2の発熱部品30は、断面コ字状の金属製蓋材62で囲まれている。金属製蓋材62と金属板60とは一体化されており、金属製蓋材62と金属板60の間に隙間は無い。このように、断面コ字状の金属製蓋材62における開口部が金属板60で塞がれた構造をなし、第2の被覆部材66を構成している。そして、第2の発熱部品30の本体部31は第2の被覆部材66によって覆われている。   Similarly, the second heat generating component 30 disposed on the metal plate 60 is surrounded by a metal lid member 62 having a U-shaped cross section. The metal lid member 62 and the metal plate 60 are integrated, and there is no gap between the metal lid member 62 and the metal plate 60. As described above, the opening in the metal lid member 62 having a U-shaped cross section is closed by the metal plate 60, and the second covering member 66 is configured. The main body 31 of the second heat generating component 30 is covered with a second covering member 66.

金属板60上に配された電子部品40は、断面コ字状の金属製蓋材63で囲まれている。金属製蓋材63と金属板60とは一体化されており、金属製蓋材63と金属板60の間に隙間は無い。このように、断面コ字状の金属製蓋材63における開口部が金属板60で塞がれた構造をなし、第3の被覆部材67を構成している。そして、電子部品40の本体部41は第3の被覆部材67によって覆われている。   The electronic component 40 disposed on the metal plate 60 is surrounded by a metal lid member 63 having a U-shaped cross section. The metal lid member 63 and the metal plate 60 are integrated, and there is no gap between the metal lid member 63 and the metal plate 60. As described above, the opening portion of the metal lid member 63 having a U-shaped cross section is closed by the metal plate 60, and the third covering member 67 is configured. The main body 41 of the electronic component 40 is covered with a third covering member 67.

また、金属板60上に配された発熱部品20,30、電子部品40及び金属製蓋材61,62,63は、断面コ字状の金属製蓋材68で囲まれている。つまり、断面コ字状の金属製蓋材68における開口部が金属板60で塞がれた構造をなし、金属製蓋材61,62,63は金属製蓋材68によって覆われている。金属製蓋材68と金属板60の間に隙間は無い。   Further, the heat generating components 20 and 30, the electronic component 40, and the metal lid members 61, 62, and 63 disposed on the metal plate 60 are surrounded by a metal lid member 68 having a U-shaped cross section. That is, the opening in the metal lid member 68 having a U-shaped cross section is closed by the metal plate 60, and the metal lid members 61, 62, 63 are covered with the metal lid member 68. There is no gap between the metal lid 68 and the metal plate 60.

金属製蓋材68の内部における金属製蓋材61,62,63の外部との間の空間が冷却材通路90となっている。冷却材通路90に冷却材が流れる。冷却材は液体(例えば水)でも気体(例えば空気)でもよい。そして、第1の被覆部材65、第2の被覆部材66及び第3の被覆部材67は冷却材と接触する。   A space between the inside of the metal lid 68 and the outside of the metal lids 61, 62, 63 serves as a coolant passage 90. The coolant flows through the coolant passage 90. The coolant may be liquid (eg water) or gas (eg air). The first covering member 65, the second covering member 66, and the third covering member 67 are in contact with the coolant.

ここで、第1の被覆部材65の一部としての一側面65aと第2の被覆部材66の一部としての一側面66aとが互いに対向する空間には冷却材が流れる流路90aが形成されている。また、第2の被覆部材66の一部である他の側面66bと第3の被覆部材67の一部である一側面67aとは互いに対向している。その対向する空間に冷却材が流れる。   Here, a flow path 90a through which a coolant flows is formed in a space where one side surface 65a as a part of the first covering member 65 and one side surface 66a as a part of the second covering member 66 face each other. ing. The other side surface 66 b that is a part of the second covering member 66 and the one side surface 67 a that is a part of the third covering member 67 are opposed to each other. The coolant flows in the space that faces it.

第1の被覆部材65、第2の被覆部材66及び第3の被覆部材67は金属製である。広義には、第1の被覆部材65及び第2の被覆部材66の少なくとも一方は金属製である。第1の被覆部材65と第2の被覆部材66と第3の被覆部材67とは一体化されており、一つの部品である。第1の発熱部品20と第2の発熱部品30とは隣り合っているとともに、第2の発熱部品30と電子部品40とは隣り合っている。   The first covering member 65, the second covering member 66, and the third covering member 67 are made of metal. In a broad sense, at least one of the first covering member 65 and the second covering member 66 is made of metal. The first covering member 65, the second covering member 66, and the third covering member 67 are integrated, and are one part. The first heat generating component 20 and the second heat generating component 30 are adjacent to each other, and the second heat generating component 30 and the electronic component 40 are adjacent to each other.

また、基板50の一方の面である上面に第1の発熱部品20の本体部21、第2の発熱部品30の本体部31及び電子部品40が配置されている。つまり、基板50の一方の面である上面に電子部品(キャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つ)40が配置されている。   Further, the main body portion 21 of the first heat generating component 20, the main body portion 31 of the second heat generating component 30, and the electronic component 40 are arranged on the upper surface, which is one surface of the substrate 50. That is, an electronic component (at least one of a capacitor element, a resistance component, and a control semiconductor element) 40 is disposed on the upper surface, which is one surface of the substrate 50.

第1の発熱部品20の端子部22,23は、下方に延びており、金属板60を貫通し、基板50に対しコネクタ51または、半田、ねじ等により電気的に接続されている。第2の発熱部品30の端子部32,33は、下方に延びており、金属板60を貫通し、基板50に対しコネクタ52または、半田、ねじ等により電気的に接続されている。電子部品40の端子部42,43は、下方に延びており、金属板60を貫通し、基板50に対しコネクタ53または、半田、ねじ等により電気的に接続されている。   The terminal portions 22 and 23 of the first heat generating component 20 extend downward, penetrate the metal plate 60, and are electrically connected to the substrate 50 by a connector 51, solder, screws, or the like. The terminal portions 32 and 33 of the second heat generating component 30 extend downward, penetrate the metal plate 60, and are electrically connected to the substrate 50 by a connector 52, solder, screws, or the like. The terminal portions 42 and 43 of the electronic component 40 extend downward, penetrate the metal plate 60, and are electrically connected to the substrate 50 by a connector 53, solder, screws, or the like.

金属板60の下面側に配された基板50は、断面コ字状の金属製蓋材70で囲まれている。つまり、断面コ字状の金属製蓋材70における開口部が金属板60で塞がれた構造をなし、基板50は金属製蓋材70によって覆われている。金属製蓋材70と金属板60の間に隙間は無い。   The substrate 50 disposed on the lower surface side of the metal plate 60 is surrounded by a metal lid member 70 having a U-shaped cross section. That is, an opening in the metal lid member 70 having a U-shaped cross section is closed by the metal plate 60, and the substrate 50 is covered with the metal lid member 70. There is no gap between the metal lid 70 and the metal plate 60.

次に、作用について説明する。
車載充電器10の駆動に伴い第1の発熱部品20の本体部31、第2の発熱部品30の本体部31が発熱する。この熱は冷却材通路90に流れる冷却材との間で熱交換される。
Next, the operation will be described.
As the in-vehicle charger 10 is driven, the main body 31 of the first heat generating component 20 and the main body 31 of the second heat generating component 30 generate heat. This heat is exchanged with the coolant flowing in the coolant passage 90.

図2に示すように装置を上下に2分割することで基板50から発熱部品20,30を分離して、分離した発熱部品20,30側の筐体(金属板60、蓋材61,62,68)は送風もしくは水流を与えることで強制冷却を行うことができる。なお、放熱バランスが保てるなら金属製蓋材68を外し、自然冷却することも可能である。   As shown in FIG. 2, the heat generating components 20 and 30 are separated from the substrate 50 by dividing the apparatus into two vertically, and the separated heat generating components 20 and 30 side casing (metal plate 60, lid members 61 and 62, 68) can perform forced cooling by supplying air or water flow. If the heat radiation balance can be maintained, it is possible to remove the metal lid 68 and allow natural cooling.

以上のごとく、発熱部品20,30から基板50への熱放散が防げるので、基板50の周辺の容量(占有容量)を減らすことが可能であり、装置の小型化が可能となる。
以下、図3と比較する。
As described above, since heat dissipation from the heat generating components 20 and 30 to the substrate 50 can be prevented, the capacity (occupied capacity) around the substrate 50 can be reduced, and the apparatus can be downsized.
Hereinafter, it will be compared with FIG.

図3の構成とした場合には発熱部品104,105,106の1面(上面)からしか放熱できなかったが、図2の本実施形態においては発熱部品20,30の5面(下面以外の面)から冷却することが可能となる。その結果、ヒートシンクレスでも発熱部品20,30の温度上昇を抑えることが可能となり、ヒートシンク削減による小型化、部品コスト低減が図られる。発熱部品の損失が大きく、発熱大となる場合でも、図3の構成とした場合に比べヒートシンクを小型化することが可能となる。   In the case of the configuration of FIG. 3, heat can be radiated from only one surface (upper surface) of the heat generating components 104, 105, 106, but in the present embodiment of FIG. From the surface). As a result, it is possible to suppress the temperature rise of the heat generating components 20 and 30 even without a heat sink, and it is possible to reduce the size and cost of the components by reducing the heat sink. Even when the loss of the heat-generating component is large and the heat generation is large, the heat sink can be downsized as compared with the configuration shown in FIG.

また、図3の構成とした場合において耐久性を確保すべくコンデンサ容量を増やすことでコンデンサ自己発熱を低減させるとコンデンサを余分に搭載する必要があるとともに、部品を近接して置けないため装置の小型化ができず、さらにヒートシンクによる放熱を行う場合、ヒートシンク分のサイズアップ、コストアップが発生する。   Further, in the case of the configuration of FIG. 3, if the capacitor self-heating is reduced by increasing the capacitor capacity to ensure the durability, it is necessary to mount an extra capacitor and the parts cannot be placed close to each other. If it is impossible to reduce the size of the heat sink and heat is released by the heat sink, the heat sink is increased in size and cost.

これに対し本実施形態では、発熱部品20,30と基板50を熱的に分離し、基板50の温度、内気温度の低減が図られる。また、専用ヒートシンクを用いずに発熱部品20,30が効率よく冷却される。また、筐体内に発熱部品を置いた場合の熱分布として、発熱部品の温度が高くなると筐体の温度も高くなるが、筐体の外部に発熱部品20,30を配置した場合の熱分布として、発熱部品20,30の温度を低くできるとともに基板50を囲う筐体(金属板60、蓋材70)の温度も低くできる。これにより、基板50を囲う筐体(金属板60、蓋材70)の温度上昇が抑えられる。   On the other hand, in the present embodiment, the heat generating components 20 and 30 and the substrate 50 are thermally separated to reduce the temperature of the substrate 50 and the inside air temperature. Further, the heat generating components 20 and 30 are efficiently cooled without using a dedicated heat sink. Further, as the heat distribution when the heat generating component is placed in the housing, the temperature of the housing increases as the temperature of the heat generating component increases. However, as the heat distribution when the heat generating components 20 and 30 are arranged outside the housing, In addition, the temperature of the heat generating components 20 and 30 can be lowered, and the temperature of the casing (metal plate 60 and lid member 70) surrounding the substrate 50 can be lowered. Thereby, the temperature rise of the housing | casing (metal plate 60, the cover material 70) surrounding the board | substrate 50 is suppressed.

また、金属製の被覆部材65,66,67がグランド電位にされることによりノイズシールドすることができる。
図3の構成では発熱部品間で熱干渉が発生する。より詳しくは、各発熱部品104,105,106が冷却器107と基板101の両方に面しているため発熱部品104,105,106からの熱が基板101側にも伝わりやすくなっており、装置を小型化すると発熱部品104,105,106が接近するため動作不良や寿命低減等を引き起こす懸念がある。これを防止するためには発熱部品104と発熱部品105との間の距離L1、及び、発熱部品105と発熱部品106との間の距離L2を大きくする必要があり、こうすると装置の小型化を阻害することになってしまう。
Further, noise shielding can be performed by setting the metal covering members 65, 66, and 67 to the ground potential.
In the configuration of FIG. 3, thermal interference occurs between the heat generating components. More specifically, since each heat generating component 104, 105, 106 faces both the cooler 107 and the substrate 101, heat from the heat generating component 104, 105, 106 is easily transmitted to the substrate 101 side, and the device If the size is reduced, the heat generating components 104, 105, and 106 are brought close to each other, and there is a concern of causing an operation failure and a reduction in life. In order to prevent this, it is necessary to increase the distance L1 between the heat generating component 104 and the heat generating component 105 and the distance L2 between the heat generating component 105 and the heat generating component 106, which reduces the size of the apparatus. It will be obstructed.

本実施形態では、発熱部品と発熱部品との間の熱干渉を抑制することにより発熱部品と発熱部品とを近づけて配置でき、その結果、小型化が図られる。つまり、発熱部品の周りに空間を区画形成して冷却材を流すことにより発熱部品間の熱干渉を抑制して発熱部品同士を接近して配置でき、その結果、小型化が図られる。特に、背の高い部品を基板の1面に集めつつ熱干渉を避け小型化を図ることが可能となる。   In the present embodiment, the heat generating component and the heat generating component can be arranged close to each other by suppressing the heat interference between the heat generating component, and as a result, the size can be reduced. That is, by forming a space around the heat generating component and flowing the coolant, the heat interference between the heat generating components can be suppressed and the heat generating components can be arranged close to each other, and as a result, the size can be reduced. In particular, it is possible to reduce the size by gathering tall components on one surface of the substrate while avoiding thermal interference.

また、背の高い発熱部品20,30、電子部品40を冷却材通路側に配置することにより基板50側には背の高い発熱部品が無いため基板50に対し筐体(金属製蓋材70)までの距離を小さくできる。   Further, since the tall heat-generating components 20 and 30 and the electronic component 40 are arranged on the coolant passage side, there is no tall heat-generating component on the substrate 50 side, so that the housing (metal lid member 70) with respect to the substrate 50 is provided. Can be reduced.

上記実施形態によれば、以下のような効果を得ることができる。
(1)電力変換装置としての車載充電器10の構成として、本体部21と端子部22,23とを有する第1の発熱部品20と、本体部31と端子部32,33とを有する第2の発熱部品30と、第1の発熱部品20の端子部22,23及び第2の発熱部品30の端子部32,33が電気的に接続される基板50と、を備える。第1の発熱部品20の本体部21は第1の被覆部材65によって覆われており、第2の発熱部品30の本体部31は第2の被覆部材66によって覆われている。第1の被覆部材65及び第2の被覆部材66は冷却材と接触する。第1の被覆部材65の一部としての一側面65aと第2の被覆部材66の一部としての一側面66aとが互いに対向する空間には冷却材が流れる流路90aが形成されている。
According to the above embodiment, the following effects can be obtained.
(1) As a configuration of the in-vehicle charger 10 as a power conversion device, a second heat generating component 20 having a main body portion 21 and terminal portions 22 and 23, and a second heat generating component 20 having a main body portion 31 and terminal portions 32 and 33 are provided. And the substrate 50 to which the terminal portions 22 and 23 of the first heat generating component 20 and the terminal portions 32 and 33 of the second heat generating component 30 are electrically connected. The main body portion 21 of the first heat generating component 20 is covered with a first covering member 65, and the main body portion 31 of the second heat generating component 30 is covered with a second covering member 66. The first covering member 65 and the second covering member 66 are in contact with the coolant. A channel 90a through which a coolant flows is formed in a space where one side surface 65a as a part of the first covering member 65 and one side surface 66a as a part of the second covering member 66 face each other.

よって、第1の被覆部材65及び第2の被覆部材66は冷却材と接触し、且つ、第1の被覆部材65の一部と第2の被覆部材66の一部とが互いに対向する空間には冷却材が流れるため、第1の発熱部品20と第2の発熱部品30との間で熱干渉しにくく、発熱部品間での熱干渉を抑制することができる。   Therefore, the first covering member 65 and the second covering member 66 are in contact with the coolant, and in a space where a part of the first covering member 65 and a part of the second covering member 66 face each other. Since the coolant flows, it is difficult for the first heat-generating component 20 and the second heat-generating component 30 to interfere with heat, and the heat interference between the heat-generating components can be suppressed.

また、小型化すると冷却材は流れにくくなり、流れにくいと熱干渉しやすくなるが、第1の被覆部材65及び第2の被覆部材66は冷却材と接触しているので、熱干渉抑制と小型化とを図ることができる。   Further, when the size is reduced, the coolant becomes difficult to flow, and when it is difficult to flow, heat interference is likely to occur. However, since the first covering member 65 and the second covering member 66 are in contact with the coolant, the heat interference is suppressed and the size is reduced. Can be achieved.

(2)第1の被覆部材65及び第2の被覆部材66の少なくとも一方は金属製である。よって、ノイズシールド可能となる。
(3)第1の被覆部材65と第2の被覆部材66とは一体化されている。よって、部品点数を減らすことができる。
(2) At least one of the first covering member 65 and the second covering member 66 is made of metal. Therefore, noise shielding is possible.
(3) The first covering member 65 and the second covering member 66 are integrated. Therefore, the number of parts can be reduced.

(4)第1の発熱部品20と第2の発熱部品30とは隣り合っている。よって、より小型化可能となる。
(5)基板50の一方の面に第1の発熱部品20の本体部21及び第2の発熱部品30の本体部31が配置され、基板50の一方の面に電子部品(キャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つ)40が配置(実装)されている。つまり、基板50には熱に弱い半導体部品や熱により性能低下する抵抗部品などが実装されている。そして、電子部品(キャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つ)40を第1の発熱部品20の本体部21及び第2の発熱部品30の本体部31に近づけて配置しても熱に弱い電子部品(キャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つ)40に熱を伝えにくくできる。
(4) The first heat generating component 20 and the second heat generating component 30 are adjacent to each other. Therefore, the size can be further reduced.
(5) The main body portion 21 of the first heat generating component 20 and the main body portion 31 of the second heat generating component 30 are disposed on one surface of the substrate 50, and electronic components (capacitor elements and resistor components) are disposed on one surface of the substrate 50. And at least one of the control semiconductor elements) 40 is disposed (mounted). That is, the substrate 50 is mounted with a semiconductor component that is vulnerable to heat, a resistance component whose performance is degraded by heat, and the like. The electronic component (at least one of the capacitor element, the resistor component, and the control semiconductor element) 40 may be disposed close to the main body portion 21 of the first heat generating component 20 and the main body portion 31 of the second heat generating component 30. Heat can be hardly transmitted to an electronic component (at least one of a capacitor element, a resistance component, and a control semiconductor element) 40 that is vulnerable to heat.

また、基板50における発熱部品20,30の配置面とは反対の面に電子部品40を配置すると基板50の両面に背の高い部品が配置されるので小型化には不向きになるとともに実装性の悪化を招く。本実施形態では発熱部品20,30に電子部品40(キャパシタ素子など熱に弱い部品)を近づけて配置することができる。   Further, if the electronic component 40 is disposed on the surface opposite to the surface on which the heat generating components 20 and 30 are disposed on the substrate 50, tall components are disposed on both surfaces of the substrate 50. Deteriorating. In the present embodiment, the electronic component 40 (component that is weak against heat, such as a capacitor element) can be disposed close to the heat generating components 20 and 30.

実施形態は前記に限定されるものではなく、例えば、次のように具体化してもよい。
・被覆部材65,66,67は導電性フィラーやフェライトなどの入った樹脂でもよい。つまり、導電性樹脂、ノイズ吸収性樹脂とすることによりノイズを吸収することができる。
The embodiment is not limited to the above, and may be embodied as follows, for example.
The covering members 65, 66, and 67 may be a resin containing a conductive filler or ferrite. That is, noise can be absorbed by using conductive resin or noise absorbing resin.

・被覆部材65,66,67は熱的に干渉しなければシールド機能は無くてもよく、この場合、樹脂製とすることもできる。
・被覆部材65,66,67の下面(金属板60の下面)にも冷却材を流すことにより、即ち、金属製蓋材(基板筐体)70と金属製蓋材(冷却筐体)68の間に冷却材通路を設けることで発熱部品20,30における6面を冷却面にすることも可能である。
The covering members 65, 66, 67 may not have a shielding function as long as they do not interfere with heat, and in this case, they can be made of resin.
The coolant is allowed to flow also on the lower surfaces of the covering members 65, 66, and 67 (the lower surface of the metal plate 60), that is, the metal lid member (substrate casing) 70 and the metal lid member (cooling casing) 68. By providing a coolant passage between them, the six surfaces of the heat generating components 20 and 30 can be used as cooling surfaces.

・金属板60、蓋材61,62,63,68,70は、一体化されていてもよいし、部品毎に分割されていてもよい。
・第1の発熱部品20の本体部21と第1の被覆部材65との間、第2の発熱部品30の本体部31と第2の被覆部材66との間、及び、電子部品40の本体部41と第3の被覆部材67との間は、サーマルコンパウンドを充填してよい。
-The metal plate 60 and the lid | cover materials 61, 62, 63, 68, 70 may be integrated, and may be divided | segmented for every component.
Between the main body 21 of the first heat generating component 20 and the first covering member 65, between the main body 31 of the second heat generating component 30 and the second covering member 66, and the main body of the electronic component 40 Between the portion 41 and the third covering member 67, a thermal compound may be filled.

・第1の発熱部品20の本体部21と第1の被覆部材65とは密着させてもよい。同様に、第2の発熱部品30の本体部31と第2の被覆部材66とは密着させてもよい。電子部品40の本体部41と第3の被覆部材67とは密着させてもよい。   The main body 21 of the first heat generating component 20 and the first covering member 65 may be in close contact with each other. Similarly, the main body 31 of the second heat generating component 30 and the second covering member 66 may be brought into close contact with each other. The main body 41 of the electronic component 40 and the third covering member 67 may be in close contact with each other.

・図2では2つの発熱部品20,30と電子部品40が配される場合を示したが、発熱部品の数は「2」でも「3」以上でもよい。
・電力変換装置は車載充電器に代わり、例えば、車載ACインバータ、車載DC/DCコンバータ、車載走行用インバータに適用することができる。
FIG. 2 shows the case where the two heat generating components 20 and 30 and the electronic component 40 are arranged, but the number of heat generating components may be “2” or “3” or more.
The power conversion device can be applied to, for example, an in-vehicle AC inverter, an in-vehicle DC / DC converter, and an in-vehicle traveling inverter instead of the in-vehicle charger.

10…車載充電器、20…第1の発熱部品、21…本体部、22,23…端子部、30…第2の発熱部品、31…本体部、32,33…端子部、40…電子部品、50…基板、65…第1の被覆部材、65a…一側面、66…第2の被覆部材、66a…一側面。   DESCRIPTION OF SYMBOLS 10 ... Car-mounted charger, 20 ... 1st heat-emitting component, 21 ... Main-body part, 22, 23 ... Terminal part, 30 ... 2nd heat-generating component, 31 ... Main-body part, 32, 33 ... Terminal part, 40 ... Electronic component 50 ... Substrate, 65 ... First covering member, 65a ... One side surface, 66 ... Second covering member, 66a ... One side surface.

Claims (5)

本体部と端子部とを有する第1の発熱部品と、
本体部と端子部とを有する第2の発熱部品と、
前記第1の発熱部品の端子部及び前記第2の発熱部品の端子部が電気的に接続される基板と、
を備える電力変換装置であって、
前記第1の発熱部品の本体部は第1の被覆部材によって覆われており、
前記第2の発熱部品の本体部は第2の被覆部材によって覆われており、
前記第1の被覆部材及び前記第2の被覆部材は冷却材と接触し、
前記第1の被覆部材の一部と前記第2の被覆部材の一部とが互いに対向する空間には冷却材が流れる流路が形成されていることを特徴とする電力変換装置。
A first heat-generating component having a main body portion and a terminal portion;
A second heat generating component having a main body portion and a terminal portion;
A substrate to which a terminal portion of the first heat generating component and a terminal portion of the second heat generating component are electrically connected;
A power conversion device comprising:
The main body of the first heat generating component is covered with a first covering member,
The main body of the second heat generating component is covered with a second covering member,
The first covering member and the second covering member are in contact with a coolant;
A power conversion device, wherein a flow path through which a coolant flows is formed in a space where a part of the first covering member and a part of the second covering member face each other.
前記第1の被覆部材及び前記第2の被覆部材の少なくとも一方は金属製であることを特徴とする請求項1に記載の電力変換装置。   The power conversion device according to claim 1, wherein at least one of the first covering member and the second covering member is made of metal. 前記第1の被覆部材と前記第2の被覆部材とは一体化されていることを特徴とする請求項1に記載の電力変換装置。   The power conversion device according to claim 1, wherein the first covering member and the second covering member are integrated. 前記第1の発熱部品と前記第2の発熱部品とは隣り合っていることを特徴とする請求項1〜3のいずれか1項に記載の電力変換装置。   The power converter according to any one of claims 1 to 3, wherein the first heat generating component and the second heat generating component are adjacent to each other. 前記基板の一方の面に前記第1の発熱部品の本体部及び前記第2の発熱部品の本体部が配置され、
前記基板の一方の面にキャパシタ素子および抵抗部品および制御用半導体素子の少なくとも一つが配置されていることを特徴とする請求項1〜4のいずれか1項に記載の電力変換装置。
A main body portion of the first heat generating component and a main body portion of the second heat generating component are disposed on one surface of the substrate,
5. The power conversion device according to claim 1, wherein at least one of a capacitor element, a resistance component, and a control semiconductor element is disposed on one surface of the substrate.
JP2016074584A 2016-04-01 2016-04-01 Power conversion device Pending JP2017188511A (en)

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WO2020153190A1 (en) * 2019-01-21 2020-07-30 ローム株式会社 Semiconductor module and ac/dc converter unit

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JPS6118159A (en) * 1984-07-04 1986-01-27 Hitachi Ltd Semiconductor device
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WO2020153190A1 (en) * 2019-01-21 2020-07-30 ローム株式会社 Semiconductor module and ac/dc converter unit
JPWO2020153190A1 (en) * 2019-01-21 2021-12-02 ローム株式会社 Semiconductor module and AC / DC converter unit
JP7461307B2 (en) 2019-01-21 2024-04-03 ローム株式会社 AC/DC converter unit

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