JP5992235B2 - Control device - Google Patents

Description

  The present invention relates to a control device having a power module such as a motor control device.

  As a control device having a power module, one having a heat sink that contacts the power module is known (for example, Patent Document 1). In Patent Document 1, a flat spacer is provided between a substrate on which a plurality of power modules are mounted and a heat sink facing the substrate, and the plurality of power modules are accommodated in the holes of the spacer. The spacer is made of a heat insulating resin. In the control device of Patent Document 1, the area of the heat sink is substantially equal to the total area of the plurality of power modules when viewed in the direction in which the heat sink and the substrate face each other.

International Publication No. 2006/030606

  The control device may be formed so that the heat sink extends greatly to the outside of the power module when viewed from the opposite direction of the heat sink and the substrate from various viewpoints such as improvement of heat dissipation. Furthermore, a component that dislikes heat (there is a risk that electrical characteristics and the like may be reduced by heat) may be mounted at a position on the substrate facing the extended portion of the heat sink. In this case, the heat transferred from the power module to the heat sink may affect components that dislike heat. Therefore, it is desired to suppress the influence of such heat.

  A control device according to an aspect of the present invention includes a heat sink having a predetermined surface, a first substrate facing the predetermined surface, and a power mounted on the first substrate and in close contact with the first region of the predetermined surface. The module is mounted on the first substrate or another substrate arranged in a stacked manner on the first substrate, and the first of the predetermined surfaces when viewed in the opposing direction of the first substrate and the predetermined surface. A component that is at least partially located in a second region outside the one region and that generates less heat than the power module, and at least a portion that is located in at least a portion between the second region and the component. And a member.

  Preferably, the control device further includes a housing that houses the heat sink, the first substrate, the power module, the component, and the heat insulating member, and the heat sink dissipates heat on a side opposite to the predetermined surface. And the interior of the housing is located on the predetermined surface side with respect to the heat sink, a first housing space for housing the power module, the component, and the heat insulating member, and the heat sink It is located on the heat radiating part side and is partitioned into a second accommodation space where the heat radiating part is exposed, and the heat insulating member is overlapped with at least a part of the second region.

  Suitably, the said heat insulation member is piled up over 90% or more with respect to area | regions other than the said 1st area | region among the said predetermined surfaces.

  Preferably, the heat insulating member is separated from the first substrate.

  Preferably, the heat insulating member is separated from the heat sink.

  Suitably, the said heat insulation member is a heat insulation sheet.

  Preferably, the heat insulating member is filled between the heat sink and the first substrate or the component.

  According to the present invention, the influence of heat from the heat sink on the component can be suppressed.

FIG. 1A is a perspective view showing an appearance of a control device according to an embodiment of the present invention, and FIG. 1B is a perspective view showing an outline of the inside of the control device of FIG. The side view which shows the inside of the control apparatus of FIG. The disassembled perspective view which shows the attachment structure in the inside of the control apparatus of FIG. FIG. 4A and FIG. 4B are side views showing the inside of a control device according to a modification.

  Fig.1 (a) is a perspective view which shows the external appearance of the control apparatus 1 which concerns on embodiment of this invention. In the present embodiment, the positive side in the z direction is vertically upward. In the following, the positive side and the negative side in the x direction may be referred to as the front and rear, and the y direction may be referred to as the left and right direction.

  For example, the control device 1 controls the operation of a motor (not shown), and includes a servo amplifier. And the control apparatus 1 produces | generates the direct current | flow or alternating current of a suitable voltage based on the instruction | command produced | generated based on the command from the outside or the preset program etc., and outputs it to a motor. .

  The control device 1 has a housing 3 that accommodates a substrate and the like to be described later. The shape and size of the housing 3 may be appropriately set according to the size of the circuit board accommodated therein. For example, the housing 3 is generally formed in a rectangular parallelepiped shape as a whole, and includes a housing body 3a having an opening formed in the front and a door 3b for opening and closing the opening. As for the external dimensions of the housing 3, for example, one side is on the order of 10 cm. The housing 3 is preferably made of a material having high thermal conductivity such as metal. For example, the housing 3 is made of sheet metal.

  The casing 3 is provided with a hole provided at an appropriate position for air intake or exhaust in order to air-cool components and the like housed therein. For example, a plurality of intake holes 3e are formed at the rear and lower side of the side surface of the housing 3, and a plurality of exhaust holes 3f are formed at the rear of the upper surface of the housing 3. A plurality of vent holes 3g are formed in the door 3b).

  FIG. 1B is a perspective view showing an outline of the inside of the control device 1. In addition, about the mounting plate 23 and the heat insulation member 25 (FIG. 2) mentioned later, illustration is abbreviate | omitted in FIG.1 (b).

  The housing 3 includes a partition 3c that partitions the inside of the housing 3 into a first housing space S1 on the front side and a second housing space S2 on the rear side. The control assembly 5 is housed in the first housing space S1, and the heat sink 7 is housed in the second housing space S2.

  Since the first accommodation space S1 and the second accommodation space S2 are partitioned, air does not flow between them. That is, in the first accommodation space S1 and the second accommodation space S2, the air flows for air cooling are independent of each other.

  However, the first housing space S1 and the second housing space S2 do not need to be strictly airtight as long as the air flow is independent to some extent. For example, a slight gap may exist in the partition portion 3c for convenience related to manufacture of the housing 3 or attachment of components to the housing 3.

  The intake hole 3e and the exhaust hole 3f described above communicate the second accommodation space S2 and the outside of the housing 3 and contribute to air cooling in the second accommodation space S2. The vent 3g communicates the first housing space S1 and the outside of the housing 3 and contributes to air cooling of the first housing space S1.

  The partition portion 3c is fixed to a portion of the housing 3 that constitutes the outer surface thereof. The partition part 3c is made of, for example, a sheet metal, for example, similarly to the part constituting the outer surface. However, the partition part 3c may be comprised with the material (for example, resin or FRP) excellent in heat insulation rather than the material (for example, metal) of the part which comprises the outer surface of the housing | casing 3. FIG.

  An opening 3h is formed in the partition portion 3c. The control assembly 5 and the heat sink 7 are connected via the opening 3h. The shape and area of the opening 3 h may be appropriately set according to the shape and size of the control assembly 5 and the heat sink 7. FIG. 1B illustrates a case where the opening 3h is more than half of the area of the partition 3c and is formed in a rectangular shape.

  The heat sink 7 is made of a material having high thermal conductivity, for example, a metal such as aluminum. The heat sink 7 has a mounting surface 7a facing the control assembly 5 and a plurality of fins 7b projecting on the opposite side.

  The attachment surface 7a is formed in a planar shape, and the shape and size thereof are the same as, for example, the opening 3h. The mounting surface 7a is exposed to the first accommodation space S1 through the opening 3h. The attachment surface 7a (heat sink 7) blocks the opening 3h and contributes to partitioning the first accommodation space S1 and the second accommodation space S2 together with the partition portion 3c.

  The plurality of fins 7b are accommodated in the second accommodation space S2 (exposed to the second accommodation space S2). For example, the plurality of fins 7b extend in the vertical direction and are arranged at regular intervals in the horizontal direction. The part including the plurality of fins 7b of the heat sink 7 (the part opposite to the mounting surface 7a) constitutes a heat radiating part 7d that releases the heat transmitted to the heat sink 7 to the surrounding air.

  The control assembly 5 includes a first substrate 9 that faces the mounting surface 7 a of the heat sink 7, a second substrate 11 that is stacked on the opposite side of the first substrate 9 from the heat sink 7, and a first substrate 9. Alternatively, it has a plurality of mounting components 13 mounted on the second substrate 11.

  The first substrate 9 and the second substrate 11 are constituted by, for example, a rigid printed wiring board. The first substrate 9 may be a single-sided plate that can mount components only on the heat sink 7 side, or may be a double-sided plate or multilayer plate that can mount components on both sides. The second substrate 11 may be a single-sided board, or a double-sided board or a multilayer board that can mount components on both sides.

  The shapes and sizes of the first substrate 9 and the second substrate 11 may be set as appropriate. For example, the first substrate 9 has substantially the same shape and size as the opening 3h (mounting surface 7a). The second substrate 11 has, for example, a shape and size obtained by removing a part (downward side) from the first substrate 9.

  The first substrate 9 and the second substrate 11 are fixed to each other by, for example, a plurality of first spacers 15, a plurality of second spacers 17, a plurality of first screws 19, and a plurality of second screws 21, It is fixed to the heat sink 7. This will be described later.

  The mounting component 13 is, for example, an IC, a resistor, a capacitor, an inductor, or a connector. The mounting method may be a lead insertion type or a surface mounting type.

  FIG. 2 is a side view showing the inside of the housing 3.

  A power module 13 </ b> A, which is one of a plurality of mounting components 13, is mounted on the mounting surface of the first substrate 9 on the heat sink 7 side. The power module (power semiconductor module) 13A is configured by packaging a plurality of power devices. The power device is, for example, a rectifier diode or a power transistor. The top surface of the power module 13A (the surface opposite to the surface mounted on the first substrate 9) is out of the mounting surface 7a of the heat sink 7 through the opening 3h (not shown in FIG. 2) of the partition 3c. Of the first region 7aa. Therefore, the heat of the power module 13A is transmitted to the heat sink 7 through the first region 7aa.

  In the present application, the “close contact” of the power module 13A with the heat sink 7 is not limited to a direct contact mode, but is a material for optimizing the transfer of heat from the power module 13A to the heat sink 7 (for example, heat radiation grease, heat radiation). Sheet) is included.

  In plan view of the first substrate 9, the size of the power module 13A (first region 7aa) is set to be relatively smaller than the size of the first substrate 9 (attachment surface 7a). For example, the size of the power module 13A is less than 1/2 or less than 1/3 of the size of the first substrate 9.

  On the first substrate 9, a component 13 </ b> B having a smaller calorific value than that of the power module 13 </ b> A is mounted outside the arrangement area of the power module 13 </ b> A. The component 13B is, for example, an IC or the like as already described.

  In the plan view of the first substrate 9 (mounting surface 7a), the component 13B is at least partially located in the second region 7ab outside the first region 7aa where the power module 13A is in close contact with the mounting surface 7a. In FIG. 2, the component 13B is mounted only on the surface of the first substrate 9 on the side opposite to the heat sink 7, but may be mounted on the surface on the heat sink 7 side.

  A fan 21 for air-cooling the heat sink 7 is provided in the second housing space S2. The fan 21 is located on one side (downward in the present embodiment) in the direction in which the plurality of fins 7 b extend with respect to the heat sink 7. The fan 21 draws air outside the housing 3 into the housing 3 through the intake holes 3e (FIG. 1A) and sends it out toward the plurality of fins 7b. The sent air flows while exchanging heat with the plurality of fins 7b, and is discharged from the exhaust hole 3f (FIG. 1A).

  Note that an air cooling fan is not provided in the first accommodation space S1. Therefore, the mounting components 13 other than the power module 13A are cooled by the diffusion of air in the first housing space S1 and the ventilation of the first housing space S1 by the vent holes 3g.

  A mounting plate 23 and a heat insulating member 25 are laminated on the mounting surface 7 a (FIG. 1B) of the heat sink 7. These are accommodated in the first accommodation space S1.

  The mounting plate 23 is fixed to the heat sink 7 by the first spacer 15 as will be described in detail later. The mounting plate 23 is fixed to the partition portion 3 c by bolts 27 and nuts 29. Thereby, the heat sink 7 is being fixed to the partition part 3c (housing 3). The mounting plate 23 is made of, for example, metal (sheet metal).

  The heat insulating member 25 is joined to the mounting plate 23 with an adhesive, for example. The heat insulating member 25 covers substantially the entire surface (including 90% or more of the region) other than the first region 7aa (including the second region 7ab) with which the power module 13A abuts on the mounting surface 7a of the heat sink 7. . Therefore, heat transmitted from the power module 13A to the heat sink 7 is suppressed from being radiated from the region of the mounting surface 7a where the power module 13A is not in contact to the first accommodation space S1.

  The heat insulating member 25 may be made of a material generally used as a heat insulating material, for example. Examples of such materials include resin foam (for example, polyethylene foam, polyurethane foam, phenol foam), glass wool, glass fiber, or glass wool and binder (for example, borate binder, phosphate binder, epoxy resin binder). , And a silicate-based binder).

Moreover, even if the heat insulating member 25 is not generally used as a heat insulating material, for example, the heat conductivity of the material is sufficiently lower than the material (metal) constituting the heat sink 7. If it is. For example, since the thermal conductivity of metal is on the order of 10 to 100 W · m ⁻¹ · K ⁻¹ (for example, the thermal conductivity of aluminum is approximately 230 to 240 W · m ⁻¹ · K ⁻¹ ), the thermal conductivity is 1W · ^{m -1} · ^K -1 orders, and more preferably, may be a material of 0.1W · ^{m -1} · ^K -1 orders.

  The heat insulating member 25 may be formed of a heat insulating sheet (having flexibility) or a heat insulating plate (having no flexibility). Preferably, the heat insulating member 25 is configured by a heat insulating sheet. Both the heat insulating sheet and the heat insulating plate may be made of any of the materials exemplified above. The thickness of the heat insulating member 25 may be appropriately set in consideration of thermal resistance and / or cost. For example, the thickness of the heat insulating member 25 is on the order of 1 mm.

  FIG. 3 is an exploded perspective view showing a mounting structure inside the control device 1. In addition, although the mounting component 13 is mounted on the first substrate 9 and the second substrate 11 before the assembly of the control assembly 5, the illustration is omitted in FIG. 3.

  In the control device 1, for example, first, the heat insulating member 25 is bonded to the mounting plate 23. Note that the shape and size of the heat insulating member 25 in plan view are, for example, substantially the same as the shape and size of the mounting plate 23 in plan view.

  Next, the mounting plate 23 is fixed to the heat sink 7 by the first spacer 15. Specifically, it is as follows.

  The first spacer 15 is interposed between the mounting plate 23 and the first substrate 9, and has a nut-like portion formed with a female screw, a smaller diameter than the nut-like portion, and from the nut-like portion to the mounting plate 23. It is a member which has the internal thread which protrudes to the side. On the other hand, the mounting plate 23 is formed with a fixing hole 23c having a diameter larger than that of the male screw of the first spacer 15 and smaller than that of the nut-like portion of the first spacer 15.

  The male screw of the first spacer 15 is inserted into the fixing hole 23 c and screwed into the female screw 7 c formed on the heat sink 7. Thereby, the mounting plate 23 is fixed to the heat sink 7. The number and arrangement of the first spacers 15 may be set as appropriate. FIG. 3 illustrates a case where nine are provided at positions near the outer peripheral edge of the mounting surface 7a.

  An insertion hole 25 c is formed in the heat insulating member 25 at a position corresponding to the fixing hole 23 c of the mounting plate 23. The insertion hole 25c is slightly larger than the fixing hole 23c, and is sized to allow the nut-like portion of the first spacer 15 to be inserted.

  Therefore, the thickness of the heat insulating member 25 does not affect the distance between the mounting plate 23 and the first substrate 9. Thereby, for example, even when the heat insulating member 25 is made of a material having a low elastic coefficient, the distance between the mounting plate 23 and the first substrate 9 is stably set to the design value. As a result, the power module 13A stably adheres to the mounting surface 7a.

  However, the insertion hole 25c may have the same size as the fixing hole 23c (a size that prevents the nut-like portion of the first spacer 15 from being inserted). In this case, there is an advantage that the fixing of the heat insulating member 25 to the mounting plate 23 or the like is strengthened.

  When the attachment plate 23 (and the heat insulating member 25) is attached to the attachment surface 7a, the first substrate 9 is fixed to the heat sink 7 and the attachment plate 23 by the second spacer 17 and the first screw 19. Specifically, it is as follows.

  The second spacer 17 has the same configuration as the first spacer 15, a nut-like portion interposed between the first substrate 9 and the second substrate 11, a smaller diameter than the nut-like portion, and a nut shape And a male screw protruding from the portion toward the first substrate 9 side.

  On the other hand, the first substrate 9 has a larger diameter than the male thread of the second spacer 17 in the region (upper region) overlapping the second substrate 11, and the nut-like portion of the first spacer 15 and the second spacer A fixing hole 9c having a smaller diameter than the nut-shaped portion 17 is formed. The first substrate 9 is larger in diameter than the male screw portion of the first screw 19 in a region not overlapping the second substrate 11, and the nut-like portion of the first spacer 15 and the screw head of the first screw 19. A fixing hole 9c having a smaller diameter is formed.

  And in the area | region which overlaps with the 2nd board | substrate 11 of the 1st board | substrate 9, the external thread of the 2nd spacer 17 is penetrated by the fixing hole 9c, and is screwed by the nut-shaped part of the 1st spacer 15. FIG. In the region of the first substrate 9 that does not overlap the second substrate 11, the first screw 19 is inserted through the fixing hole 9 c and screwed into the nut-like portion of the first spacer 15. As a result, the first substrate 9 is fixed to the first spacer 15 and, consequently, fixed to the heat sink 7 to which the first spacer 15 is fixed. Further, the distance between the mounting plate 23 and the first substrate 9 is kept constant by the nut-shaped portion of the first spacer 15.

  Openings 23h and 25h are formed in the mounting plate 23 and the heat insulating member 25 at positions corresponding to the power module 13A. Therefore, the power module 13A is in close contact with the mounting surface 7a of the heat sink 7 through these openings. The shapes and sizes of the openings 23h and 25h are, for example, substantially the same as the shape and size of the top surface of the power module 13A. Note that FIG. 3 illustrates a case where two rectangular openings are formed corresponding to two power modules 13A having a generally thin rectangular parallelepiped shape.

  Next, the second substrate 11 is fixed to the first substrate 9 by the second screw 21. Specifically, it is as follows.

  The second substrate 11 is formed with a fixing hole 11c having a diameter larger than that of the male screw portion of the second screw 21 and smaller than that of the nut portion of the second spacer 17 and the screw head of the second screw 21. ing. Then, the second board 21 is fixed to the second spacer 17 by inserting the second screw 21 through the fixing hole 11c and screwing into the nut-like portion of the second spacer 17, and as a result, Fixed to one substrate 9 and heat sink 7.

  Thereafter, the heat sink 7 and the control assembly 5 (the first substrate 9 and the second substrate 11) fixed to each other are fixed to the partition portion 3c. Specifically, it is as follows.

  The mounting plate 23 (and the heat insulating member 25) has an extending portion 23 d (25 d) that extends outward from the mounting surface 7 a of the heat sink 7. The extending part 23d may be formed in any direction of up, down, left and right directions with respect to the mounting surface 7a. In this embodiment, the case where the extension part 23d is formed in the up-down direction is illustrated.

  A fixing hole 23e having a diameter larger than that of the male screw portion of the bolt 27 and smaller than that of the bolt head and the nut 29 (FIG. 2) is formed in the upper extending portion 23d. Further, a fixed notch 23f having a diameter larger than that of the male thread portion of the bolt 27 and smaller than at least a bolt head of the bolt 27 and a nut 29 in the left-right direction is formed in the lower extending portion 23d. The partition portion 3c is provided with a fixing hole 3k having a diameter equivalent to that of the fixing hole 23e at a position corresponding to the fixing hole 23e and the notch 23f.

  Then, the bolt 27 is inserted into the fixing hole 23e, the fixing notch 23f, and the fixing hole 3k and screwed into the nut 29, whereby the mounting plate 23 is fixed to the partition portion 3c. As a result, the heat sink 7 and the control assembly 5 are fixed to the housing 3.

  In the heat insulating member 25, a fixing hole 25e having a size equivalent to the fixing hole 23e is formed at a position corresponding to the fixing hole 23e of the mounting plate 23. In addition, a fixed notch 23f having a size equivalent to that of the fixed notch 23f is formed at a position corresponding to the fixed notch 23f of the mounting plate 23.

  The heat insulating member 25 is fastened together with the mounting plate 23 by bolts 27. The diameter of the fixing hole 25e and the fixing notch 25f may be set larger than the diameter of the bolt head of the bolt 27 so that the heat insulating member 25 is not fastened together.

  In the mounting plate 23 and the heat insulating member 25, the space through which the bolt 27 is inserted is not a hole but a notch in the lower part. Therefore, the bolt 27 is inserted in advance into the fixing hole 3k below the partition portion 3c and screwed into the nut 29, and then the bolt 27 is fixed to the fixing notch 23f of the mounting plate 23 and the fixing notch of the heat insulating member 25. The heat sink 7 and the control assembly 5 can be mounted on the bolt 27 so as to be inserted through 25f. As a result, work is facilitated.

  The first spacer 15, the second spacer 17, the first screw 19, the second screw 21, and the bolt 27 are appropriately temporarily tightened and finally tightened, thereby favorably aligning and fixing each member. May be done.

  As described above, in the present embodiment, the control device 1 is mounted on the heat sink 7 having the attachment surface 7a, the first substrate 9 facing the attachment surface 7a, and the first substrate 9, and the first of the attachment surfaces 7a. The power module 13A that is in close contact with the first region 7aa and the first substrate 9 are mounted on at least a part of the second region 7ab outside the first region 7aa when viewed in the opposing direction of the mounting surface 7a and the first substrate 9. Is located and has a component 13B that generates less heat than the power module 13A, and a heat insulating member 25 positioned between the second region 7ab and the component 13B.

  Therefore, the heat transmitted from the power module 13A to the heat sink 7 via the first region 7aa is suppressed from being released from the second region 7ab and affecting the component 13B. As a result, it is possible to reduce the necessity of providing a space for heat dissipation around the component 13B, or to eliminate a fan for cooling the component 13B. As a result, size reduction of the control apparatus 1 is achieved.

  In the present embodiment, the control device 1 further includes a housing 3 that houses the heat sink 7, the first substrate 9, the power module 13 </ b> A, the component 13 </ b> B, and the heat insulating member 25. The heat sink 7 has a heat radiating portion 7d on the side opposite to the mounting surface 7a. The interior of the housing 3 is located on the mounting surface 7 a side with respect to the heat sink 7, the first housing space S 1 that houses the power module 13 A, the component 13 B, and the heat insulating member 25, and the heat sink 7 d side. It divides into 2nd accommodation space S2 which is located and heat dissipation part 7d exposes. And the heat insulation member 25 is overlaid on the 2nd area | region 7ab.

  Accordingly, the surrounding air (air in the first housing space S1) of the component 13B and the like is prevented from being mixed with the air (air in the second housing space S2) with which the heat radiating portion 7d of the heat sink 7 is in contact. Furthermore, since the heat insulating member 25 is superimposed on the second region 7ab, the heat transmitted from the power module 13A to the heat sink 7 is suppressed from being released from the second region 7ab to the air in the first accommodation space S1. (Compare with the first modification described later (FIG. 4A)). As a result, the above-described effects of reducing the necessity for providing a space for heat dissipation around the component 13B and eliminating the need for a fan for cooling the component 13B are increased. Further, since the heat dissipating part 7d is isolated, the heat dissipating part 7d can be intensively cooled by the fan 21, and the whole can be efficiently cooled.

  Moreover, in this embodiment, the heat insulation member 25 is overlaid over 90% or more with respect to area | regions (including 2nd area | region 7ab) other than 1st area | region 7aa among the attachment surfaces 7a. Therefore, the effect which suppresses that heat | fever is discharge | released from the attachment surface 7a to 1st accommodating space S1 mentioned above, and suppresses the temperature rise of 1st accommodating space S1 increases.

  In the present embodiment, the heat insulating member 25 is separated from the first substrate 9. Therefore, in the first housing space S1, an area where the first substrate 9 and the component 13B mounted on the first substrate 9 come into contact with air can be ensured, and the component 13B can be air-cooled suitably.

  In the present embodiment, the heat insulating member 25 is a heat insulating sheet. Therefore, the heat insulating member 25 can be easily brought into close contact with the mounting surface 7a (strictly, the mounting plate 23), and air leaked from the mounting surface 7a is prevented from leaking from the gap between the mounting surface 7a and the heat insulating member 25. Is done. As a result, the component 13B is suppressed from being affected by the heat of the heat sink 7. Further, it is possible to flexibly cope with the undulation of the mounting surface 7a. For example, in the present embodiment, the mounting plate 23 is fixed to the heat sink 7 by the first spacer 15 that is also inserted into the heat insulating member 25, but when the mounting plate 23 is fixed to the heat sink 7 with screws, the screw head ( The protrusions from the mounting plate 23) can be covered by the heat insulating member 25.

  Fig.4 (a) is the side view similar to FIG. 2 which shows the control apparatus 201 which concerns on a 1st modification. However, FIG. 4A is drawn more schematically than FIG.

  In the embodiment, the heat insulating member 25 is provided so as to overlap the mounting surface 7 a (strictly, the mounting plate 23) of the heat sink 7. On the other hand, in the first modified example, the heat insulating member 225 is provided so as to overlap the surface of the first substrate 9 on the heat sink 7 side, and is separated from the mounting surface 7a. In addition, the heat insulation member 225 is affixed on the 1st board | substrate 9 with the adhesive agent, for example.

  Also in this modified example, since the heat insulating member 25 is provided between the second region 7ab and the component 13B, heat that is released from the mounting surface 7a as compared with the case where the heat insulating member 25 is not provided. Has an effect on the component 13B. Specifically, the influence of heated air between the first substrate 9 and the mounting surface 7a on the component 13B is reduced.

  FIG. 4B is a side view (partly including a cross-sectional view) similar to FIG. 2 and showing the control device 301 according to the second modification. However, FIG.4 (b) is drawn more typically than FIG.

  In this modification, the heat insulating member 325 is formed by filling a material having heat insulating properties between the heat sink 7 (strictly, the mounting plate 23) and the first substrate 9. The material constituting the heat insulating member 325 preferably has insulating properties and contributes to the insulation of the power module 13A and the component 13B.

  Examples of the material of the heat insulating member 325 include the same materials as those constituting the heat insulating member 25. In addition, for example, a material used as an adhesive such as a polyurethane-based hot melt adhesive can be used.

  In FIG. 4B, the heat insulating member 325 is provided only between the heat sink 7 and the first substrate 9, but the heat insulating member 325 seals the control assembly 5 from the heat sink 7 to an appropriate height. You can do it. For example, the surface of the first substrate 9 opposite to the surface opposite to the heat sink 7 may be sealed, the component 13B mounted on the surface may be sealed, or substantially the entire control assembly 5 ( However, the connector or the like may be exposed).

  When the component 13B is mounted on the surface of the first substrate 9 on the heat sink 7 side, the heat insulating member 325 may be filled only between the top surface of the component 13B and the heat sink 7 (first It may not be in contact with the substrate 9).

  The present invention is not limited to the above embodiments and modifications, and may be implemented in various aspects.

  The control device is not limited to the one for controlling the motor. For example, a heating device or a light source may be controlled. Further, the control device may be distributed in the market without having a housing.

  The configuration of the housing, the shape and position of the air holes, the arrangement of the substrate and the heat sink, and the like are not limited to those of the embodiment. For example, the housing may not have a door, and the substrate and the heat sink may face each other in the vertical direction.

  In the case where the first storage space and the second storage space that are partitioned from each other are configured inside the housing, the partition portion may not be provided. For example, the heat sink may be the same size as the housing, and the first storage space and the second storage space may be partitioned only by the heat sink.

  In the embodiment, the control device is configured such that a fan is provided in the first accommodation space S1 and no fan is provided in the second accommodation space S2. However, the control device is provided in both the first accommodation space S1 and the second accommodation space S2. The fan may be provided, or the fan may not be provided in both the first accommodation space S1 and the second accommodation space S2.

  The heat sink may not have fins, and the fins may not be air-cooled by the fan. In addition, the heat sink does not need to have a heat radiating portion on the surface opposite to the surface on which the power module is in close contact, and the heat radiating portion is formed in a portion that is appropriately extended from the position where the power module is in contact. It may be.

  The heat sink may be directly attached to the housing without using the attachment plate. For example, a heat sink having a shape in which the heat sink and the mounting plate of the embodiment are integrally formed may be formed, and the heat sink may be attached to the housing.

  In the case where the first accommodation space and the second accommodation space are configured in the housing, the heat sink does not need to be located entirely in the second accommodation space, and the heat radiating portion only needs to be exposed in the second accommodation space. For example, as described above, the portion related to the attachment of the heat sink to the housing may be located in the first accommodation space.

DESCRIPTION OF SYMBOLS 1 ... Control apparatus, 7 ... Heat sink, 7a ... Mounting surface, 7aa ... 1st area | region, 7ab ... 2nd area | region, 9 ... 1st board | substrate, 13A ... Power module, 13B ... Components, 25 ... Thermal insulation member.

Claims (4)

A heat sink having a planar predetermined surface;
A first substrate facing the predetermined surface;
A power module mounted on the first substrate and in close contact with a first region of the predetermined surface;
Mounted on the first substrate or another substrate arranged in a stacked manner on the first substrate, and viewed in the opposing direction of the first substrate and the predetermined surface, the first region of the predetermined surface A component that is at least partially located in the outer second region and that generates less heat than the power module;
A heat insulating member at least partially located in at least a portion between the second region and the component;
I have a,
The heat insulating member is a control device filled between the heat sink and the first substrate or the component . A housing that houses the heat sink, the first substrate, the power module, the component, and the heat insulating member;
The heat sink has a heat radiating portion on the side opposite to the predetermined surface,
The interior of the housing is located on the predetermined surface side with respect to the heat sink, a first accommodation space for accommodating the power module, the component, and the heat insulating member, and located on the heat radiating portion side with respect to the heat sink. And is partitioned into a second accommodating space in which the heat dissipating part is exposed,
The control device according to claim 1, wherein the heat insulating member is overlaid on at least a part of the second region. The control device according to claim 2, wherein the heat insulating member is overlapped over 90% or more of the predetermined surface with respect to a region other than the first region. The component is mounted on a surface of the first substrate facing the heat sink;
The control device according to claim 2, wherein the heat insulating member is filled between the heat sink and the component and is separated from the first substrate.

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