JP6285279B2 - Electronic equipment - Google Patents

Description

  The present invention relates to a sealed electronic apparatus having a heat dissipation structure installed outdoors, such as a wireless transmission / reception apparatus used in a relay station of a mobile communication system.

  In mobile communication systems such as mobile phones and PHS (Personal Handy-phone System), for example, wireless transmission / reception devices used in relay stations (base stations) are usually installed outdoors. Furthermore, the wireless transmission / reception apparatus is often installed at a high place such as a utility pole or a steel tower so that other obstacles do not interfere with signal transmission / reception.

In addition, since the wireless transmission / reception apparatus is installed outdoors, a sealed housing structure is employed in order to prevent intrusion of moisture such as rainwater and moisture, and dust and dirt. In the wireless transceiver, heat radiation fins are provided on the upper and lower sides of the both sides of the sealed casing, and a cooling fan is disposed above the heat sink fins, so that heat generated from the components with heat generated in the casing is generated. Generally, a method of radiating heat to the outside through the heat radiation fin is often performed.
Furthermore, in the wireless transmission / reception device, when cooling outside air is sucked in the lowest stage and the warmed air is exhausted from the upper cooling fan, the external environment such as rain, snow, wind or sunlight is used. In general, a cover that covers the cooling fan is provided above the sealed casing to protect the cooling fan and the sealed casing (see FIGS. 2 and 4 of Patent Document 1).

JP 2005-268885 A

  However, in the conventional wireless transmission / reception apparatus, as described in FIG. 4 and FIG. 2 of Patent Document 1, in addition to the size (height) of the hermetic casing, the installation space for the cooling fan and the cooling fan There is a problem that a space for inflow and outflow of the cooling air is necessarily required, and the height of the entire apparatus becomes large.

  The present invention has been made to solve such a problem. A concave structure portion for arranging a cooling fan is provided on the upper portion of the hermetic casing, and the cooling fan is attached to a recess of the concave structure portion. Even if the cooling fan is housed in the device volume space, the space utilization efficiency in the device volume can be improved compared to the conventional device by not exceeding the height of the sealed casing, and the device can be downsized. It is an object of the present invention to provide an electronic device that can be reduced in weight and can improve the performance of a radiator.

  In order to achieve the above object, an electronic device according to the present invention is arranged in a hermetically sealed housing having a concave structure portion at an upper portion thereof and a recess of the concave shape structure portion of the hermetic housing, and from below to above. A cooling fan that exhales air, an upper cover that is arranged so as to cover the entire circumference of the recessed structure portion of the sealed casing together with the cooling fan, and a lower side surface having a recess of the recessed structure portion of the sealed casing A lower cover that guides the air that has passed through the gap provided between the sealed casing and the suction port of the cooling fan, and a first cover that generates heat that is mounted in the lower portion of the sealed casing. And a second part with heat generation that is mounted in the concave structure portion of the hermetic casing beside the cooling fan, and the first part is cooled by the air sucked by the cooling fan. The cooling Is discharged from § down, the second part by the air returned hit the upper cover inside ceiling is characterized in that it is cooled.

  In order to achieve the above object, the electronic device according to the present invention is the above-described electronic device, wherein the hermetic casing is a lower stage heat radiating arranged side by side in the lower part of the side surface having the depression of the concave structure portion. It is characterized by having fins.

  In order to achieve the above object, the electronic device according to the present invention is the above-described electronic device, wherein the hermetically sealed housing is a plurality of upper side heat radiations arranged side by side in the upper part of the side surface having the depression of the concave structure portion. It is characterized by having fins.

  In order to achieve the above object, the electronic device according to the present invention is the electronic device described above, wherein the first component is attached so as to be in contact with an inner wall of a side surface of the sealed casing provided with the lower radiating fin. It is characterized by.

  In order to achieve the above object, the electronic device according to the present invention is the above-described electronic device, wherein the second component is attached so as to be in contact with an inner wall of a side surface of the sealed casing provided with the upper radiating fin. It is characterized by.

  In order to achieve the above object, an electronic device according to the present invention is the above electronic device, wherein the first component is disposed on an inner wall of a side surface of the sealed housing having the lower radiating fin via a heat conductive sheet. It is characterized by being attached.

  In order to achieve the above object, an electronic device according to the present invention is the above-described electronic device, wherein the second component is disposed on the inner wall of the side surface of the sealed casing having the upper radiating fin via a heat conductive sheet. It is characterized by being attached.

  As described above, according to the present invention, the concave structure part for disposing the cooling fan is provided on the upper part of the sealed casing, and the cooling fan is attached to the recess of the concave structure part to cool the apparatus volume space. Even if the fan is housed, the space utilization efficiency in the device volume can be improved and the device can be made smaller and lighter than the conventional device by not exceeding the height of the sealed housing. And the performance of the radiator can be improved.

It is a front perspective view from diagonally upward which shows the external appearance of the electronic device which concerns on Embodiment 1 of this invention. It is a front perspective view from the slanting lower part which shows the external appearance of the electronic apparatus which concerns on Embodiment 1 of this invention. It is a front view of the electronic device which concerns on Embodiment 1 of this invention. It is a right view of the electronic device which concerns on Embodiment 1 of this invention. 1 is an exploded perspective view of an electronic device according to Embodiment 1 of the present invention. It is a perspective view of the heat radiator (rear) of the electronic device which concerns on Embodiment 1 of this invention. It is a perspective view of the heat radiator (front) of the electronic device which concerns on Embodiment 1 of this invention. It is sectional drawing at the time of cut | disconnecting by the AA surface shown in FIG. It is the enlarged view to which the K section of FIG. 8 was expanded. It is sectional drawing at the time of cut | disconnecting by the BB surface shown in FIG. It is sectional drawing at the time of cut | disconnecting by CC plane shown in FIG. It is a figure for demonstrating the whole flow path of the cooling air in the electronic device which concerns on Embodiment 1 of this invention. It is a front perspective view from diagonally upward which shows the external appearance of the electronic device which concerns on Embodiment 2 of this invention. It is a right view of the electronic device which concerns on Embodiment 2 of this invention. It is a disassembled perspective view of the electronic device which concerns on Embodiment 2 of this invention. It is sectional drawing at the time of cut | disconnecting by the DD plane shown in FIG.

<Embodiment 1>
Hereinafter, an electronic device according to Embodiment 1 of the present invention will be described.
In the electronic device 1 according to the first embodiment of the present invention, a concave structure part for disposing the cooling fan is provided on the upper part of the hermetically sealed casing, and the cooling fan is attached to the depression of the concave structure part, whereby the device volume space is obtained. Even if a cooling fan is housed in the housing, the height of the sealed housing should not be exceeded. Furthermore, by making the lateral width of the concave structure portion of the sealed casing sufficiently larger than the size of the cooling fan, a space for accommodating high heat-generating components is provided in the sealed casing on both sides of the cooling fan.

Further, in the electronic device 1, in order to cool components with heat generation in the sealed casing, lower radiating fins are provided on the lower side of both side walls (radiators) in the front-rear direction constituting the sealed casing, and the lower radiating fins are covered. A lower cover is provided for wrapping and allowing all of the cooling air flowing along the gap between the lower radiating fins to flow into the intake side of the cooling fan disposed at the upper part of the hermetic casing.
On the other hand, in order to protect the concave structure part of the sealed casing and the cooling fan attached to the recess of the concave structure part from the external environment, an upper cover arranged so as to cover the entire circumference of the concave structure part, including the cooling fan, is provided. Install in a sealed enclosure. In addition, in order to allow the cooling air exhausted from the cooling fan to flow into the upper radiating fin for the high heat-generating component provided at the upper stage of the radiator, a gap is provided between the upper cover and the sealed casing, The discharged cooling air collides with the inner surface of the top cover, reverses the flow direction, flows into the gap between the upper radiating fins, and is discharged to the outside from the lower end of the upper cover.

With the configuration described above, in the electronic device 1 of the present invention, the space utilization efficiency in the device volume can be increased, and the device volume can be kept small. Furthermore, the cooling performance of a radiator can be improved because the cooling air by a cooling fan flows into a lower radiation fin and an upper radiation fin. In addition, the flow of cooling air toward the ceiling through the gap between the lower radiating fins can hit the upper cover and the flow can be easily reversed, and the overall width of the upper radiating fin is narrower than the total width of the lower radiating fin. Therefore, the cooling wind speed is accelerated and the cooling efficiency is further improved.
In addition, since the flow path space necessary for the inflow and outflow of the cooling fan can be formed by the recessed part of the concave structure part of the sealed housing, the cooling fan can be installed without increasing the height of the apparatus compared to the conventional apparatus. Can be stored in the device.

[Configuration of Electronic Device 1]
Next, the configuration of the electronic device according to the first embodiment of the present invention will be described in detail with reference to FIGS.
FIG. 1 is a front perspective view of the electronic apparatus according to the first embodiment of the present invention, as viewed from obliquely above. FIG. 2 is a front perspective view of the electronic apparatus according to the first embodiment of the present invention, as viewed from obliquely below. FIG. 3 is a front view of the electronic device according to the first embodiment of the present invention. FIG. 4 is a right side view of the electronic device according to Embodiment 1 of the present invention. FIG. 5 is an exploded perspective view of the electronic device according to Embodiment 1 of the present invention. FIG. 6 is a perspective view of a radiator (rear) of the electronic device according to Embodiment 1 of the present invention. FIG. 7 is a perspective view of a radiator (front) of the electronic device according to Embodiment 1 of the present invention. 8 is a cross-sectional view taken along the plane AA shown in FIG. FIG. 9 is an enlarged view of a portion K in FIG. FIG. 10 is a cross-sectional view taken along the plane BB shown in FIG.

  The electronic device 1 according to Embodiment 1 of the present invention has the appearance shown in FIGS. In the present embodiment, the electronic device 1 is described as a wireless transmission / reception device used in a relay station (base station) of a mobile communication system such as a mobile phone or a PHS (Personal Handy-phone System). The present invention can be applied to any device as long as it is a sealed electronic device used outdoors, not limited to a transmission / reception device.

  As shown in FIG. 5, the electronic device 1 of the present invention mainly includes a sealed casing including a frame 10, a radiator (rear) 11, and a radiator (front) 12, and 2 mounted inside the sealed casing. Two power amplification units 16, a power supply unit 17, a transmission / reception duplexer (L) 18, a transmission / reception duplexer (R) 19, a signal processing / radio transmission frequency conversion unit 20, and a recess in the concave structure portion 10 a of the frame 10 The cooling fan 21, the rear cover 13, the front cover 14, and the top cover 15 are configured.

The frame 10 is a frame having a concave structure portion 10a for arranging the cooling fan 21 on the upper portion. The frame 10 is manufactured, for example, by performing additional processing on a member formed by die casting of an aluminum alloy or extrusion molding of an aluminum material.
As shown in FIG. 6, the radiator (rear) 11 includes a base part (rear) 11 c, and a plurality of lower radiating fins (rear) 11 a erected in the left-right direction at the rear lower stage of the base part (rear) 11 c. , And a plurality of upper radiating fins (rear) 11b erected side by side on the left and right sides of the recess provided on the upper stage of the base (rear) 11c. A continuous concave groove (see FIG. 9) is formed in the outer periphery of the front surface of the base portion (rear) 11c of the radiator (rear) 11 so that the radiator (rear) 11 is attached to the rear side of the frame 10. For example, a silicone rubber seal member (see FIG. 9) having a circular or elliptical cross-sectional shape is inserted into the recess of the groove and fastened with screws. ) The airtightness with 11 is ensured.
As shown in FIG. 7, the radiator (front) 12 includes a base portion (front) 12 c, and lower radiating fins (front) 12 a that are erected on the front lower portion of the base portion (front) 12 c in a horizontal direction. , And a plurality of upper radiating fins (front) 12b erected side by side on the front left and right sides of the recess provided in the upper stage of the base part (front) 12c. A continuous concave groove (see FIG. 9) is formed in the outer periphery of the rear surface of the base (front) 12c of the radiator (front) 12 so that the radiator (front) 12 is attached to the front of the frame 10 frame. For example, a silicone rubber sealing member (see FIG. 9) having a circular or elliptical cross-sectional shape is inserted into the recess of the concave groove and screwed, so that the frame 10 and the radiator ( Airtightness with the front) 12 is ensured.
That is, a hermetically sealed housing is formed by screwing the radiator (front) 12 and the radiator (rear) 11 to the front and rear of the frame 10.

The power amplification unit 16 has a function of amplifying the signal input from the signal processing / radio transmission frequency conversion unit 20, and is a component that generates heat. Further, as shown in FIG. 8, the power amplification unit 16 sandwiches the heat conductive sheet (2) 32 therebetween and is screwed to the base part (rear) 11c of the radiator (rear) 11 so that the power amplifying unit 16 The generated heat is released to the outside through the lower radiating fin (rear) 11a of the radiator (rear) 11.
The power supply unit 17 has a function of supplying electric power to each component mounted in the sealed casing, and is a component that generates heat. Further, as shown in FIG. 8, the power supply unit 17 is generated from itself by sandwiching a heat conductive sheet (1) 31 and screwing it to the base part (rear) 11 c of the radiator (rear) 11. The released heat is released to the outside through the lower radiating fin (rear) 11a of the radiator (rear) 11.

  The transmission / reception duplexer (L) 18 and the transmission / reception duplexer (R) 19 process a signal amplified by the power amplification unit 16 to a not-shown antenna and a received signal input from the antenna to perform signal processing. It has a function of outputting to the radio transmission frequency conversion unit 20 and is a component that requires heat dissipation so as to keep the internal temperature within a predetermined temperature range in order to stabilize the operation. In addition, as shown in FIG. 5, each of the duplexer (L) 18 and the duplexer (R) 19 has an antenna connection connector portion at the upper portion, and is provided in a hole portion (not shown) provided in the chassis 10. The antenna connecting connector part is inserted, the waterproof packing is sandwiched between them, and the nut is fastened. Further, as shown in FIG. 10, the front and rear surfaces of the transmission / reception duplexer (L) 18 and the transmission / reception duplexer (R) 19 are connected to the base portion (rear) 11 c of the radiator (rear) 11 and the radiator (front) 12. By attaching the base part (front) 12c so as to be in contact with each other, the heat generated from the base part (front) 12c is converted into the upper radiating fin (rear) 11b of the radiator (rear) 11 and the upper radiating fin (front) 12b of the radiator (front) 12. It is discharged to the outside through.

  The signal processing / radio transmission frequency conversion unit 20 has a function of processing a signal input from the outside and performing transmission frequency conversion, and a plurality of heat generating components 20a are mounted on the front surface and the rear surface of the circuit board 20b. Yes. Further, as shown in FIG. 8, the signal processing / radio transmission frequency conversion unit 20 is screwed to the base portion (front) 12c of the radiator (front) 12 with the heat conductive sheet (3) 33 interposed therebetween. Thus, the heat generated from itself is released to the outside through the lower radiating fin (front) 12a of the radiator (front) 12.

  As shown in FIGS. 8 and 9, the cooling fan 21 is sandwiched between the fan mounting bracket (1) 22 and the fan mounting bracket (2) 23, and is fixed to both brackets using long screws (not shown). Is done. Further, as shown in FIG. 5, the cooling fan 21 is attached to the recess of the concave structure portion 10 a of the frame 10 via the fan mounting bracket (2) 23.

The rear cover 13 is formed so as to cover the entire lower radiating fin (rear) 11 a of the radiator (rear) 11, and the upper portion of the cooling fan 21 circulates cooling air flowing along the gap between the lower radiating fin (rear) 11 a. It has a convex shape to guide it to the inlet. Further, as shown in FIGS. 1, 2, and 4, the rear cover 13 is screwed together with a radiator (rear) 11 in a screw processing hole provided around the chassis 10.
The front cover 14 is formed so as to cover and entirely cover the lower radiating fin (front) 12a of the radiator (front) 12, and the upper part is provided with cooling air that flows along the gap between the lower radiating fin (front) 12a. It has a convex shape to guide it to the inlet. 1 to 4, the front cover 14 is screwed together with a radiator (front) 12 to a screw processing hole provided around the chassis 10.

  The top cover 15 is formed so as to cover the entire circumference of the concave structure portion 10a of the frame 10 including the cooling fan 21, and the cooling air discharged from the cooling fan 21 collides with the inside of the top surface to reverse the flow direction. A predetermined space (see FIGS. 8, 9 and 11). Further, as shown in FIGS. 8, 9 and 10, the top cover 15 has a louver hole (1) 15a and a louver hole (3) 15c for exhausting the exhaust air from the cooling fan 21 to the outside outside. A louver hole (2) 15b and a louver hole (4) 15d are provided for exhausting the air discharged from the cooling fan 21 to the front outside.

[Heat dissipation method of electronic device 1]
Next, the heat dissipation method of the electronic device 1 according to the first embodiment of the present invention will be described in detail with reference to FIGS.
11 is a cross-sectional view taken along the line CC shown in FIG. Moreover, FIG. 12 is a figure for demonstrating the whole flow path of the cooling air in the electronic device which concerns on Embodiment 1 of this invention.
8 to 11, black thick arrows indicate the flow path of the cooling air by the cooling fan 21.
In FIG. 12, the rear cover 13, the front cover 14, and the top cover 15 are shown in a transparent state, and the white arrow indicates the overall flow of the cooling air, and the bold white arrow Indicates a flow path of cooling air flowing outside the electronic device 1, and a thin white arrow indicates a flow path of cooling air flowing inside the electronic device 1.

In the electronic device 1, when the cooling fan 21 is operated, as shown in FIGS. 8 to 11, the lower opening between the radiator (rear) 11 and the rear cover 13, the radiator (front) 12, the front cover 14, Cooling air flows from the lower opening between them as indicated by the channel 501 and the channel 511.
Cooling air that has flowed in from the flow path 501 and the flow path 511 flows into a gap between the plurality of lower radiating fins (rear) 11 a of the radiator (rear) 11 and the plurality of lower radiating fins (front) 12 a of the radiator (front) 12. Along the flow path 502 and the flow path 512. Accordingly, the power supply unit 17 and the power amplification unit 16 attached to the base portion (rear) 11c of the radiator (rear) 11 via the heat conductive sheet (1) 31 and the heat conductive sheet (2) 32, and the heat radiator The heat generating component 20a mounted on the signal processing / radio transmission frequency conversion unit 20 attached to the base portion (front) 12c of the (front) 12 via the heat conductive sheet (3) 33 is cooled.
Further, the cooling air that flows along the lower radiating fins on both the front and rear radiators flows along the inside of the convex portion of each of the rear cover 13 and the front cover 14, and is sucked into the cooling fan 21 through the flow paths 503 and 513. It is.

  The cooling air discharged from the cooling fan 21 collides with the inside of the top surface of the top cover 15, is dispersed in all directions, flows through the channels 504 and 514, and flows in the front-rear direction through the channels 504 and 514. As shown in FIGS. 8 and 9, at the center, the louver holes (1) 15a and louver holes (2) 15b provided in the top cover 15 are discharged to the outside as flow paths 515 and 505. Further, on both the left and right sides, as shown in FIGS. 10 and 11, a plurality of upper radiating fins (rear) 11b of the radiator (rear) 11 and a plurality of upper radiating fins (front) 12b of the radiator (front) 12, respectively. Along the gap between the louver hole (3) 15c and the louver hole (4) 15d provided in the top cover 15 and discharged to the outside as the flow path 517 and the flow path 507. The As a result, the transmission / reception duplexer (L) 18 and the transmission / reception duplexer (R) attached in contact with the base (rear) 11c of the radiator (rear) 11 and the base (front) 12c of the radiator (front) 12 are contacted. ) 19 is cooled.

  In the present embodiment, the concave structure portion for arranging the cooling fan is provided on the upper part of the hermetic casing, and the concave portion of the concave structure portion for attaching the cooling fan is provided at the substantially center. The space in the sealed housing on the opposite side where the cooling fan is aligned and the cooling fan is aligned, with the position of is slightly shifted to the left or right, or completely moved to one side, In addition, for example, one or a plurality of components that generate heat, such as a duplexer, may be stored side by side. However, it is necessary to change the positions of the upper radiating fins provided in the radiators on both the front and rear sides in accordance with the positions of the above-described depressions. In this way, even if the cooling fan is stored in the device volume space, the height of the sealed casing can be prevented from exceeding.

  As described above, according to the electronic device 1 according to the first embodiment of the present invention, the concave structure portion for arranging the cooling fan is provided on the upper portion of the sealed casing, and the cooling fan is provided in the recess of the concave shape structure portion. Even if the cooling fan is stored in the device volume space, the space utilization efficiency in the device volume can be increased compared to conventional devices, so that the height of the sealed housing is not exceeded. The size and weight can be reduced, and the performance of the radiator can be improved.

<Embodiment 2>
Hereinafter, an electronic device according to Embodiment 2 of the present invention will be described.
In the electronic device 2 according to the second embodiment of the present invention, a concave structure portion for disposing the cooling fan is provided on the upper portion of the hermetically sealed casing, and the cooling fan is attached to the recess of the concave shape structure portion, so that the device volume space is increased. Even if a cooling fan is housed in the housing, the height of the sealed housing should not be exceeded. Furthermore, by making the lateral width of the concave structure portion of the sealed casing sufficiently larger than the size of the cooling fan, a space for accommodating high heat-generating components is provided in the sealed casing on both sides of the cooling fan.

Further, in the electronic device 2, in order to cool components with heat generation in the sealed casing, lower radiating fins are provided on the lower side of both side walls (radiators) in the front-rear direction constituting the sealed casing, and the lower radiating fins are covered. A lower cover is provided for wrapping and allowing all of the cooling air flowing along the gap between the lower radiating fins to flow into the intake side of the cooling fan disposed at the upper part of the hermetic casing.
On the other hand, in order to protect the concave structure part of the sealed casing and the cooling fan attached to the recess of the concave structure part from the external environment, an upper cover arranged so as to cover the entire circumference of the concave structure part, including the cooling fan, is provided. Install in a sealed enclosure. In addition, in order to allow the cooling air exhausted from the cooling fan to flow into the upper radiating fin for the high heat-generating component provided at the upper stage of the radiator, a gap is provided between the upper cover and the sealed casing, The discharged cooling air collides with the inner surface of the top cover, reverses the flow direction, flows into the gap between the upper radiating fins, and is discharged to the outside from the lower end of the upper cover.

With the configuration described above, in the electronic device 2 of the present invention, the space utilization efficiency in the device volume can be increased, and the device volume can be kept small. Furthermore, the cooling performance of a radiator can be improved because the cooling air by a cooling fan flows into a lower radiation fin and an upper radiation fin. In addition, the flow of cooling air toward the ceiling through the gap between the lower radiating fins can hit the upper cover and the flow can be easily reversed, and the overall width of the upper radiating fin is narrower than the total width of the lower radiating fin. Therefore, the cooling wind speed is accelerated and the cooling efficiency is further improved.
In addition, since the flow path space necessary for the inflow and outflow of the cooling fan can be formed by the recessed part of the concave structure part of the sealed housing, the cooling fan can be installed without increasing the height of the apparatus compared to the conventional apparatus. Can be stored in the device.

[Configuration of Electronic Device 2]
Next, the configuration of the electronic device according to the second embodiment of the present invention will be described in detail with reference to FIGS.
FIG. 13 is a front perspective view of the electronic device according to the second embodiment of the present invention, as viewed from obliquely above. FIG. 14 is a right side view of the electronic apparatus according to the second embodiment of the present invention. FIG. 15 is an exploded perspective view of an electronic device according to Embodiment 2 of the present invention. FIG. 16 is a cross-sectional view taken along the line DD shown in FIG. In FIG. 16, black thick arrows indicate the flow path of the cooling air by the cooling fan 21.
The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment of the present invention in terms of a frame, a radiator (rear), a radiator (front), a top cover, and a transmission / reception duplexer (L). Since the configuration of the transmission / reception duplexer (R) is different, the same components are denoted by the same reference numerals, and the description thereof is omitted.

  The electronic device 2 according to Embodiment 2 of the present invention has the appearance shown in FIGS. In the present embodiment, a wireless transmission / reception apparatus used in a relay station (base station) of a mobile communication system such as a mobile phone or PHS (Personal Handy-phone System) will be described. However, the present invention can be applied to any sealed electronic device that is used outdoors.

  As shown in FIG. 15, the electronic device 2 according to the second embodiment of the present invention mainly includes a sealed casing composed of a frame 50, a radiator (rear) 51, and a radiator (front) 52, and a sealed casing. Two power amplification units 16, a power supply unit 17, a duplexer (L) 58, a duplexer (R) 59, a signal processing / radio transmission frequency conversion unit 20, and a concave structure of the frame 50 The cooling fan 21 is disposed in the recess of the portion 50 a, the rear cover 13, the front cover 14, and the top cover 55.

The frame 50 has a plurality of upper radiating fins (L) 50b extending from the upper and lower left and right sides of the concave structure 50a for disposing the cooling fan 21 to the upper and left and right sides of the recess of the concave structure 50a. And a plurality of upper radiating fins (R) 50c. The frame 50 is manufactured by, for example, performing additional processing on a member formed by die casting of an aluminum alloy or extrusion molding of an aluminum material.
As shown in FIGS. 15 and 16, the radiator (rear) 51 includes a base portion (rear) 51 c and a plurality of lower radiating fins (rear) arranged in the left-right direction on the lower rear side of the base portion (rear) 51 c. ) 51a. In addition, a continuous concave groove (not shown) is formed on the outer periphery of the front surface of the base (rear) 51c of the radiator (rear) 51, and when the radiator (rear) 51 is attached to the rear side of the frame 50, For example, a silicone rubber sealing member (see FIG. 9) having a circular or elliptical cross-sectional shape is inserted into the recess of the concave groove and fastened with screws. ) 51 is ensured.
As shown in FIG. 15, the radiator (front) 52 includes a base portion (front) 52c, and lower radiating fins (front) 52a erected on the front lower portion of the base portion (front) 52c in a horizontal direction. It is composed of A continuous concave groove (not shown) is formed in the outer periphery of the rear surface of the base portion (front) 52c of the radiator (front) 52, and when the radiator (front) 52 is attached to the front side of the frame 50, For example, a silicone rubber sealing member (see FIG. 9) having a circular or elliptical cross-sectional shape is inserted into the recess of the groove and fastened with screws. ) The sealing property with 52 is ensured.
That is, a hermetically sealed housing is formed by screwing the radiator (front) 52 and the radiator (rear) 51 to the front and rear frames of the frame 50.

  The transmission / reception duplexer (L) 58 and the transmission / reception duplexer (R) 59 process a signal amplified by the power amplification unit 16 to a not-shown antenna and process a reception signal input from the antenna to perform signal processing. It has a function of outputting to the radio transmission frequency conversion unit 20 and is a component that requires heat dissipation so as to keep the internal temperature within a predetermined temperature range in order to stabilize the operation. Further, as shown in FIG. 15, the transmission / reception duplexer (L) 58 and the transmission / reception duplexer (R) 59 are attached so as to be in contact with the upper left and right corners of the chassis 50, respectively. It is discharged to the outside through the upper radiating fin (L) 50b and the upper radiating fin (R) 50c provided in the frame 50.

  The top cover 55 is formed so as to cover the entire periphery of the concave structure portion 50a of the frame 50 including the cooling fan 21, and the cooling air discharged from the cooling fan 21 collides with the inner surface of the top cover 55 to reverse the flow direction. A predetermined space (see FIG. 16). As shown in FIGS. 8 and 9, the top cover 55 has a louver hole (1) 55a for exhausting the exhaust air from the cooling fan 21 to the outside of the rear and the exhaust air from the cooling fan 21 to the outside of the front. And a louver hole (2) 55b for exhausting air.

[Heat dissipation method of electronic device 2]
Next, a heat dissipation method for the electronic device 2 according to the second embodiment of the present invention will be described in detail with reference to FIGS. 8, 9, and 16.
In addition, the flow of the cooling air in FIGS. 8 and 9 (A-A cross section) in the electronic device 1 according to the first embodiment of the present invention is the same in the electronic device 2 according to the second embodiment of the present invention.

In the electronic device 2, when the cooling fan 21 is activated, as shown in FIGS. 8 and 16, the lower opening between the radiator (rear) 51 and the rear cover 13, the radiator (front) 52, the front cover 14, Cooling air flows from the lower opening between them as indicated by the channel 501 and the channel 511.
Cooling air that has flowed in from the flow path 501 and the flow path 511 enters a gap between the plurality of lower radiating fins (rear) 51 a of the radiator (rear) 51 and the plurality of lower radiating fins (front) 52 a of the radiator (front) 52. Along the flow path 502 and the flow path 512. Accordingly, the power supply unit 17 and the power amplification unit 16 attached to the base portion (rear) 51c of the radiator (rear) 51 via the heat conductive sheet (1) 31 and the heat conductive sheet (2) 32, and the heat radiator The heat generating component 20a mounted on the signal processing / radio transmission frequency conversion unit 20 attached to the base portion (front) 52c of the (front) 52 via the heat conductive sheet (3) 33 is cooled.
In addition, the cooling air that flows along the lower radiating fins on both the front and rear radiators flows along the inside of the convex portions of the rear cover 13 and the front cover 14, passes through the flow path 503 and the flow path 513, and the cooling fan 21. Sucked into.

  The cooling air discharged from the cooling fan 21 collides with the inside of the top surface of the top cover 55 and is dispersed in all directions and flows through the flow paths 504 and 514, and flows in the front-rear direction through the flow paths 504 and 514. As shown in FIGS. 8 and 9, at the center portion, the louver hole (1) 55a and the louver hole (2) 55b provided in the top cover 55 are discharged to the outside as a flow path 515 and a flow path 505. Further, the cooling air flowing in the left and right side directions through the flow paths 504 and 514, as shown in FIG. 16, includes a plurality of upper radiating fins (L) 50b and a plurality of upper radiating fins (R) provided in the chassis 50. It flows downward through the flow path 551 along the gap 50c, and is discharged as a flow path 552 from the openings on both the left and right sides provided in the top cover 55. As a result, the transmission / reception duplexer (L) 58 and the transmission / reception duplexer (R) 59 attached so as to be in contact with the chassis 50 are cooled.

  As described above, according to the electronic device 2 according to the second embodiment of the present invention, the concave structure portion for disposing the cooling fan is provided on the upper portion of the hermetic casing, and the cooling fan is provided in the recess of the concave shape structure portion. Even if the cooling fan is stored in the device volume space, the space utilization efficiency in the device volume can be increased compared to conventional devices, so that the height of the sealed housing is not exceeded. The size and weight can be reduced, and the performance of the radiator can be improved.

  In addition, in the electronic device of Embodiment 1 and Embodiment 2 of this invention, although the case where the radiator (rear) and the radiator (front) were provided with the radiation fin was demonstrated, the radiator (rear) or the radiation The same effect can be obtained even when some or all of the radiating fins are not provided in the container (front).

  In short, the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage. Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be deleted from all the components shown in each embodiment. Furthermore, you may combine suitably the component covering different embodiment.

1: electronic device, 2: electronic device, 10: frame, 10a: concave structure, 11: radiator (rear), 11a: lower radiating fin (rear), 11b: upper radiating fin (rear), 11c: base Part (rear), 12: radiator (front), 12a: lower radiating fin (front), 12b: upper radiating fin (front), 12c: base (front), 13: rear cover, 14: front cover, 15: Top cover, 15a: louver hole (1), 15b: louver hole (2), 15c: louver hole (3), 15d: louver hole (4), 16: power amplification unit, 17: power supply unit, 18: shared transmission and reception (L), 19: duplexer (R), 20: signal processing / radio transmission frequency conversion unit, 20a: heat generating component, 20b: circuit board, 21: cooling fan, 2 : Fan mounting bracket (1), 23: Fan mounting bracket (2), 31: Thermal conductive sheet (1), 32: Thermal conductive sheet (2), 33: Thermal conductive sheet (3), 50: Frame, 50a: Recessed structure part, 50b: upper radiating fin (L), 50c: upper radiating fin (R), 51: radiator (rear), 51a: lower radiating fin (rear), 51c: base part (rear), 52: Radiator (front), 52a: Lower radiating fin (front), 52c: Base part (front), 55: Top cover, 55a: Louver hole (1), 55b: Louver hole (2), 58: Transmitter / receiver duplexer ( L), 59: Transmission / reception duplexer (R), 501, 502, 503, 504, 505, 506, 507, 511, 512, 513, 514, 515, 516, 517, 551, 552: flow paths.

Claims (7)

A sealed housing having a concave structure at the top;
A cooling fan that is disposed in a recess of the concave-shaped structure portion of the hermetic casing and discharges air from below to above;
An upper cover disposed so as to cover the entire periphery of the concave structure portion of the sealed casing together with the cooling fan;
A lower cover that is disposed so as to cover and wrap around a lower portion of the side surface of the sealed casing having the recess of the concave structure portion, and that guides air that has passed through a gap provided between the sealed casing and the suction port of the cooling fan; ,
A first component with heat generation mounted on a lower portion in the sealed casing;
A second component with heat generation mounted in the concave structure portion of the sealed casing beside the cooling fan;
Comprising
The first component is cooled by the air sucked in by the cooling fan, and the second component is cooled by the air discharged from the cooling fan and returned to the top surface of the upper cover. An electronic device.   2. The electronic device according to claim 1, wherein the sealed casing includes a plurality of lower radiating fins erected side by side in a lateral direction at a lower portion of a side surface having the depression of the concave structure portion. apparatus.   3. The electronic device according to claim 1, wherein the hermetically sealed housing includes upper radiating fins that are erected side by side in a horizontal direction on an upper portion of a side surface having the depression of the concave structure portion. Electronic device characterized.   3. The electronic device according to claim 2, wherein the first component is attached so as to be in contact with an inner wall of a side surface of the sealed casing provided with the lower radiating fin.   The electronic device according to claim 3, wherein the second component is attached so as to be in contact with an inner wall of a side surface of the sealed casing provided with the upper radiating fin.   5. The electronic device according to claim 4, wherein the first component is attached to an inner wall of a side surface of the sealed casing having the lower radiating fin via a heat conductive sheet. The electronic device according to claim 5, wherein the second component is attached to an inner wall of a side surface of the hermetic housing having the upper radiating fin via a heat conductive sheet.