JP6785721B2 - Inverter device with integrated DCDC converter. - Google Patents

Description

The present invention relates to a DCDC converter integrated inverter device in which a DCDC converter circuit unit and an inverter circuit unit are integrated.

Hybrid vehicles and electric vehicles are provided with a DCDC converter device that converts DC voltage and an inverter device that converts DC power and AC power. There is a demand for miniaturization of hybrid vehicles and electric vehicles, and the DCDC converter device and the inverter device are housed in one case to further reduce the size.

For example, in Patent Document 1, a cooling water channel is provided between the condenser and the first heat generating circuit component, and heat is dissipated to the cooling water channel wall via a heat radiation member. Further, the second heat generating circuit component facing the condenser also dissipates heat to the cooling water channel wall via the heat radiating member in the same manner as described above.

However, due to miniaturization, parts such as capacitors whose heat resistant temperature is lower than that of surrounding parts are also integrated in one case, and the cost of parts increases due to the installation of cooling water channels, and the installation of cooling water channels increases the cost of parts. There was a risk that the increase in size would be promoted.

WO2016-159259 Gazette

An object of the present invention is to suppress an increase in cost and achieve both thermal protection of a capacitor.

The DCDC converter integrated inverter device according to the present invention is a DCDC converter integrated inverter including an inverter circuit unit that supplies an AC current to a vehicle drive motor and a DCDC converter circuit unit that converts a voltage supplied to the inverter circuit unit. In the device, the inverter circuit unit includes a power module that converts a DC current into an AC current, a capacitor that smoothes the DC current, a wall that forms a storage space for the capacitor, and heat dissipation that comes into contact with the wall. The DCDC converter circuit unit includes a first heat-generating circuit component that faces the capacitor across the wall, and a second heat-generating circuit component that faces the capacitor across the wall. The first heating circuit component is arranged at a position closer to the heat radiating member than the second heating circuit component, and the wall is provided with an air layer in a region sandwiched between the second heating circuit component and the condenser. Form a space for.

According to the present invention, it is possible to suppress an increase in cost and achieve both thermal protection of a capacitor.

It is an external perspective view of the DCDC converter integrated inverter device 1. It is an exploded perspective view of the DCDC converter integrated inverter device 1. It is sectional drawing which includes the 1st heating circuit component 210 of the DCDC converter integrated inverter device 1 seen from the arrow direction of the plane AA of FIG. It is an external perspective view of the substrate 200 on the DCDC converter side. It is sectional drawing which includes the 2nd heating circuit component 220 of the DCDC converter integrated inverter device 1 seen from the arrow direction of the plane BB of FIG. It is a top view enlarged view of the DCDC converter and the vicinity of the capacitor 40 in the inside of the DCDC converter integrated inverter device 1.

Hereinafter, examples of the present invention will be described with reference to the drawings.

FIG. 1 is an external perspective view of the DCDC converter integrated inverter device 1. FIG. 2 is an exploded perspective view of the DCDC converter integrated inverter device 1. FIG. 3 is a cross-sectional view including the first heat generating circuit component 210 of the DCDC converter integrated inverter device 1 as viewed from the arrow direction of the plane AA of FIG. 1 (however, the top cover 10 is excluded). FIG. 4 is an external perspective view of the substrate 200 on the DCDC converter side. FIG. 5 is a cross-sectional view including the second heat generating circuit component 220 of the DCDC converter integrated inverter device 1 as viewed from the arrow direction of the plane BB of FIG. 1 (however, the top cover 10 is excluded). FIG. 6 is an enlarged top view of the inside of the DCDC converter integrated inverter device 1 in the vicinity of the DCDC converter and the capacitor 40.

As shown in FIGS. 1 and 2, the DCDC converter integrated inverter device 1 includes an inverter circuit unit 60 that supplies an alternating current to a vehicle drive motor and a DCDC converter circuit unit that converts a voltage supplied to the inverter circuit unit. 70 and.

The case 90 functions as a housing for accommodating the inverter circuit and the DCDC converter circuit. The top cover 10 is an external component and a part of the housing, and closes the opening of the case 90. The water channel cover 100 is a cover that closes the opening of the cooling water channel provided in the case 90. The airtightness of the cooling water channel is maintained by crushing the gasket provided between the water channel cover 100 and the case 90.

The control circuit board 20 is a board having a circuit unit for controlling an inverter circuit and a DCDC converter circuit. The board holding member 30 is a metal component for fixing the control circuit board 20.

The power module 50 is a module containing a semiconductor for converting DC power and AC power into each other. The capacitor 40 smoothes the DC power supplied to the power module 50. The inverter circuit unit 60 is mainly composed of a power module 50 and a capacitor 40, and supplies an alternating current to a vehicle drive motor.

The DCDC converter circuit unit 70 converts the voltage supplied to the inverter circuit unit 60. The DCDC converter side board 200 is a circuit board that controls the high voltage circuit of the DCDC converter circuit unit 70.

The first heat-generating circuit component 210 shown in FIG. 3 is provided on the DCDC converter circuit unit 70 side, and is a component that generates heat during operation by performing switching for converting voltage.

The second flow path 600 is a space provided between the case 90 and the water channel cover 100, and is a flow path through which a cooling medium is passed and parts are cooled through the case 90.

The inverter circuit case 46 is a housing that houses the power module 50 and the capacitor 40, and is housed in the case 90.

The heat radiating member 230 is a member for conducting heat between the inverter circuit case 46 and the case 90, and is sandwiched between the inverter circuit case 46 and the case 90.

The accommodation space 48 is formed in the inverter circuit case 46 and is a space for accommodating the capacitor 40. The wall 47 is a part of a member for forming the accommodation space 48, and is formed between the first heating circuit component 210 and the capacitor 40.

The first heat generating circuit component 210 mounted on the DCDC converter side substrate 200 shown in FIG. 4 performs switching for converting voltage and generates heat during operation. The second heat generation circuit component 220 is an overcurrent protection component that detects the current flowing through the DCDC converter side substrate 200 and cuts off the current when there is an abnormality in the current.

The air layer 235 shown in FIG. 5 is a recess provided in the wall 47 of the inverter circuit case 46, and is a heat shield space that prevents heat generated from the second heat generation circuit component 220 from being transferred to the capacitor 40 side. is there.

As shown in FIGS. 3 and 5, the inverter circuit unit 60 includes a power module 50, a capacitor 40, a wall 47, and a heat radiating member 235 in contact with the wall 47. The DCDC converter circuit unit 70 includes a first heat-generating circuit component 210 that faces the capacitor 40 with the wall 47 interposed therebetween, and a second heat-generating circuit component 220 that faces the capacitor 40 across the wall 47.

The first heat generating circuit component 210 is arranged at a position closer to the heat radiating member 230 than the second heat generating circuit component 220, and the wall 47 has an air layer in a region sandwiched between the second heat generating circuit component 220 and the condenser 40. A space for providing the 235 is formed.

Since the capacitor 40 has a low heat resistant temperature, it is necessary to thermally protect the capacitor 40 from ambient high temperature members. Therefore, the capacitor 40 is arranged in the storage space 48 of the inverter circuit case 46, and has a wall 47 forming the storage space 48.

The first heat-generating circuit component 210 that faces the capacitor 40 with the wall 47 sandwiched between them and the second heat-generating circuit component 220 that faces the capacitor 40 across the wall 47 are electrically connected to the substrate 200.

The first heat generating circuit component 210 and the second heat generating circuit component 220 are both components that generate heat. The first heat generating circuit component 210 is arranged at a position closer to the heat radiating member 230 than the second heat generating circuit component 220.

The heat generated by the first heat generating circuit component 210 is dissipated to the second flow path 600 via the wall 47, the heat radiating member 230, and the case 90, so that heat transfer to the capacitor 40 can be suppressed.

At this time, the number of parts is increased by deleting the first flow path for flowing the liquid refrigerant on the wall 47 between the first heat generation circuit component 210 and the capacitor 40 and using it as a heat dissipation path to the second flow path 600. We are trying to reduce costs and reduce costs.

Since the heat generated from the second heating circuit component 220 is not transferred to the capacitor 40 due to the deletion of the first flow path, the heat generated from the second heating circuit component 220 is between the second heating circuit component 220 and the capacitor 40. An air layer 240 was provided on the wall 47. As a result, heat transfer to the capacitor 40 can be suppressed.

The heat generated by the first heat-generating circuit component 210 and the second heat-generating circuit component 220 thermally protects the capacitor 40 by using different heat dissipation methods.

The heat generated by the first heat-generating circuit component 210 and the second heat-generating circuit component 220 can be thermally protected by different heat dissipation methods even when there is no first flow path in the wall 47 portion.

The first heat generating circuit component 210 of the present embodiment is, for example, a switching element that converts a voltage. The second heat generating circuit component 220 of the present embodiment is, for example, a current sensor that detects the current flowing through the DCDC converter circuit unit 70.

The first heat generating circuit component 210 and the second heat generating circuit component 220 are both components that generate heat. The general power of the first heat-generating circuit component 210 is about 30 W, and the power of the second heat-generating circuit component 220 is about 3 W. The heat generation amount of the first heat generation circuit component 210 is larger than that of the second heat generation circuit component 220. The first heat generation circuit component 210 is a component that generates a large amount of heat because it performs a switching operation for power conversion. Therefore, the first heat generation circuit component 210 has a larger heat generation amount than the second heat generation circuit component 220, and requires more heat dissipation.

The first heat generating circuit component 210 is arranged at a position closer to the heat radiating member 230 than the second heat generating circuit component 220. The heat generated by the first heat generating circuit component 210 is dissipated to the second flow path 600 via the wall 47, the heat radiating member 230, and the case 90. Since the first heat-generating circuit component 210 has a larger heat generation amount than the second heat-generating circuit component 220, it has a heat-dissipating structure by heat transfer, whereby heat transfer to the capacitor 40 can be suppressed.

Further, the heat generated from the second heat generation circuit component 220, which generates less heat than the first heat generation circuit component 210, is provided with an air layer 240 on the wall 47 between the second heat generation circuit component 220 and the condenser 40. By shutting off the heat, heat transfer to the capacitor 40 can be suppressed.

The heat generated by the first heat-generating circuit component 210 and the second heat-generating circuit component 220 thermally protects the capacitor 40 by using different heat dissipation methods.

Further, since the heat resistant temperatures of the capacitor elements 40a to 40f shown in FIG. 6 are lower than those of other circuit components, it is necessary to thermally protect them from the surrounding high temperature members. Therefore, the capacitor 40 has a plurality of capacitor elements 40a to 40f arranged along the wall 47. The space forming the air layer 235 of the wall 47 is formed so as to face each of the plurality of condenser elements 40a to 40f.

As a result, the air layer 235 provided on the wall 47 is formed so as to face the plurality of capacitors 40, so that the position of the second heating circuit component 220 is not restricted by heat, and the capacitors 40 are thermally protected. It became possible.

Further, when the arrangement direction of the inverter circuit unit and the DCDC converter circuit unit is defined as the first row as shown in FIG. 5, the wall 47 has a first surface 250 formed in a direction crossing the first row. The DCDC converter side substrate 200 supports the first heat generation circuit component 210 and the second heat generation circuit component 220, and has electrical wiring. The DCDC converter side substrate 200 is arranged so that the surface on which the electrical wiring is arranged faces the first surface 250.

As a result, the electrical wiring of the DCDC converter side substrate 200 can be protected from noise by the wall 47. Further, as shown in FIG. 6, the projected area from the upper surface of the DCDC converter integrated inverter device 1 is reduced, and the product can be miniaturized.

1 ... DCDC converter integrated inverter device, 10 ... top cover, 20 ... control circuit board, 30 ... board holding member, 40 ... capacitor, 40a to 40f ... capacitor element, 46 ... inverter circuit case, 47 ... wall, 48 ... accommodation space , 50 ... Power module, 60 ... Inverter circuit section, 70 ... DCDC converter circuit section, 90 ... Case, 100 ... Water channel cover, 200 ... DCDC converter side board, 210 ... First heat generation circuit component, 220 ... Second heat generation circuit component , 230 ... Heat dissipation member, 235 ... Air layer, 250 ... First surface, 600 ... Second flow path

Claims (4)

Inverter circuit section that supplies alternating current to the vehicle drive motor,
A DCDC converter integrated inverter device including a DCDC converter circuit unit that converts a voltage supplied to the inverter circuit unit.
The inverter circuit unit includes a power module that converts a direct current into an alternating current, a capacitor that smoothes the direct current, a wall that forms a storage space for the capacitor, and a heat radiating member that contacts the wall. And
The wall is formed along a direction that crosses the arrangement direction of the inverter circuit portion and the DCDC converter circuit portion.
The DCDC converter circuit unit includes a first heat generating circuit components facing the arrangement direction and the capacitor across the wall, and a second heating circuit component opposed to the arrangement direction and the capacitor across the wall, the Have and
The first heat generating circuit component is arranged at a position closer to the heat radiating member than the second heat generating circuit component.
In the wall, a space for providing an air layer is not formed in the region sandwiched between the first heating circuit component and the capacitor, and an air layer is provided in the region sandwiched between the second heating circuit component and the condenser. DCDC converter integrated inverter device that forms a space for. The DCDC converter integrated inverter device according to claim 1.
The first heating circuit component is a switching element that converts the voltage.
The second heating circuit component is a DCDC converter integrated inverter device that is a current sensor that detects a current flowing through the DCDC converter circuit section. The DCDC converter integrated inverter device according to claim 1 or 2.
The capacitor has a plurality of capacitor elements arranged along the wall.
A DCDC converter integrated inverter device formed so that the space on the wall faces each of the plurality of capacitor elements. The DCDC converter integrated inverter device according to any one of claims 1 to 3.
A substrate that supports the first heat-generating circuit component and the second heat-generating circuit component and has electrical wiring is provided.
When the arrangement direction of the inverter circuit section and the DCDC converter circuit section is defined as the first column,
The wall has a first surface formed in a direction across the first row.
The substrate is a DCDC converter integrated inverter device in which the surface on which the electrical wiring is arranged is arranged so as to face the first surface.

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