JP2018207578A - Dc/dc converter integrated inverter device - Google Patents

Abstract

To suppress increase of cost and to make thermal protection of a capacitor compatible.SOLUTION: A DC/DC converter integrated inverter device according to the present invention comprises an inverter circuit part and a DC/DC converter circuit part. In the DC/DC converter integrated inverter device, the inverter circuit part includes: a power module which converts a DC current into an AC current; a capacitor which smooths the DC current; a wall forming an accommodation space for the capacitor; and a heat radiation member in contact with the wall. The DC/DC converter circuit part includes: a first heating circuit component facing the capacitor with the wall interposed therebetween; and a second heating circuit component facing the capacitor with the wall interposed therebetween. The first heating circuit component is disposed at a position closer to the heat radiation member than the second heating circuit component, and the wall forms a space for providing an air layer in an area that is held between the second heating circuit component and the capacitor.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a DCDC converter integrated inverter device in which a DCDC converter circuit unit and an inverter circuit unit are integrated.

  A hybrid vehicle or an electric vehicle is provided with a DCDC converter device that converts DC voltage and an inverter device that converts DC power and AC power. Miniaturization of hybrid vehicles and electric vehicles is required, and further miniaturization is achieved by housing the DCDC converter device and the inverter device in one case.

  For example, in Patent Document 1, a cooling water channel is provided between the capacitor and the first heat generating circuit component, and heat is radiated to the cooling water channel wall via the heat radiating member. The second heat generating circuit component facing the capacitor also radiated heat to the cooling water channel wall via the heat radiating member in the same manner as described above.

  However, in order to reduce the size, parts such as capacitors that have a lower heat resistance temperature than the surrounding parts will also be collected in one case. There is a possibility that the enlargement may be promoted.

WO2016-159259

  An object of the present invention is to suppress the increase in cost and achieve both thermal protection of the capacitor.

  A DCDC converter integrated inverter device according to the present invention includes an inverter circuit unit that supplies an alternating current to a vehicle driving motor, and a DCDC converter circuit unit that converts a voltage supplied to the inverter circuit unit. The inverter circuit unit includes a power module that converts a direct current into an alternating current, a capacitor that smoothes the direct current, a wall that forms a storage space for the capacitor, and a heat dissipation that contacts the wall. And the DCDC converter circuit section includes a first heat generating circuit component facing the capacitor across the wall and a second heat generating circuit component facing the capacitor across the wall. The first heat generating circuit component is disposed closer to the heat dissipation member than the second heat generating circuit component, Forms a space for providing the air layer in an area sandwiched between the capacitor and the second heat generating circuit components.

  According to the present invention, an increase in cost can be suppressed and thermal protection of the capacitor can be achieved at the same time.

1 is an external perspective view of a DCDC converter integrated inverter device 1. FIG. It is a disassembled perspective view of the DCDC converter integrated inverter apparatus. FIG. 2 is a cross-sectional view including a first heat generating circuit component 210 of the DCDC converter-integrated inverter device 1 as viewed from the direction of the arrow on the plane AA in FIG. 1. It is an external appearance perspective view of the board | substrate 200 by the side of a DCDC converter. FIG. 2 is a cross-sectional view including a second heating circuit component 220 of the DCDC converter-integrated inverter device 1 as seen from the direction of the arrow on the plane BB in FIG. FIG. 3 is an enlarged top view of the DCDC converter and the vicinity of the capacitor 40 in the DCDC converter integrated inverter device 1.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is an external perspective view of a DCDC converter integrated inverter device 1. FIG. 2 is an exploded perspective view of the DCDC converter integrated inverter device 1. FIG. 3 is a cross-sectional view including the first heat generating circuit component 210 of the DCDC converter-integrated inverter device 1 as viewed from the direction of the arrow on the plane AA in FIG. 1 (except for the top cover 10). FIG. 4 is an external perspective view of the substrate 200 on the DCDC converter side. FIG. 5 is a cross-sectional view including the second heating circuit component 220 of the DCDC converter-integrated inverter device 1 as seen from the direction of the arrow on the plane BB in FIG. 1 (except for the top cover 10). FIG. 6 is an enlarged top view of the vicinity of the DCDC converter and the capacitor 40 in the DCDC converter integrated inverter device 1.

  As shown in FIGS. 1 and 2, the DCDC converter integrated inverter device 1 includes an inverter circuit unit 60 that supplies an alternating current to a vehicle driving motor, and a DCDC converter circuit unit that converts a voltage supplied to the inverter circuit unit. 70.

  The case 90 functions as a housing that houses the inverter circuit and the DCDC converter circuit. The top cover 10 is an external part and is a part of the housing, and closes the opening of the case 90. The water channel cover 100 is a cover that closes the opening of the cooling water channel provided in the case 90. The cooling water channel maintains the water channel airtight performance by crushing a gasket provided between the water channel cover 100 and the case 90.

  The control circuit board 20 is a board having a circuit unit for controlling the inverter circuit and the DCDC converter circuit. The board holding member 30 is a metal part for fixing the control circuit board 20.

  The power module 50 is a module in which a semiconductor for converting DC power and AC power is stored. The capacitor 40 smoothes the DC power supplied to the power module 50. The inverter circuit unit 60 is mainly configured by the power module 50 and the capacitor 40, and supplies an alternating current to the vehicle drive motor.

  The DCDC converter circuit unit 70 converts the voltage supplied to the inverter circuit unit 60. The DCDC converter side substrate 200 is a circuit substrate that controls the high voltage circuit of the DCDC converter circuit unit 70.

  The first heat generating circuit component 210 shown in FIG. 3 is a component that is provided on the DCDC converter circuit unit 70 side and generates heat during operation by performing switching for converting a voltage.

  The second flow path 600 is a space provided between the case 90 and the water channel cover 100, and a cooling medium is passed through this space to cool the components via the case 90.

  The inverter circuit case 46 is a housing that houses the power module 50 and the capacitor 40, and is housed in the case 90.

  The heat dissipation member 230 is a member for conducting heat between the inverter circuit case 46 and the case 90, and is sandwiched between the inverter circuit case 46 and the case 90.

  The accommodation space 48 is formed in the inverter circuit case 46 and is a space for accommodating the capacitor 40. The wall 47 is a part of a member for forming the accommodation space 48 and is formed between the first heat generating circuit component 210 and the capacitor 40.

  The first heat generating circuit component 210 mounted on the DCDC converter side substrate 200 shown in FIG. 4 performs switching to convert voltage and generates heat during operation. The second heat generating circuit component 220 detects the current flowing through the DCDC converter side substrate 200, and performs overcurrent protection such as cutting off the current when the current is abnormal, and is a heat generating component.

  The air layer 235 shown in FIG. 5 is a recess provided in the wall 47 of the inverter circuit case 46, and is a heat shield space that prevents heat generated from the second heat generating circuit component 220 from being transferred to the capacitor 40 side. is there.

  As shown in FIGS. 3 and 5, the inverter circuit unit 60 includes a power module 50, a capacitor 40, a wall 47, and a heat radiating member 235 that contacts the wall 47. The DCDC converter circuit unit 70 includes a first heat generating circuit component 210 that faces the capacitor 40 across the wall 47 and a second heat generating circuit component 220 that faces the capacitor 40 across the wall 47.

  The first heat generating circuit component 210 is disposed closer to the heat dissipating member 230 than the second heat generating circuit component 220, and the wall 47 is an air layer in a region sandwiched between the second heat generating circuit component 220 and the capacitor 40. A space for providing 235 is formed.

  Since the heat resistant temperature is low, the capacitor 40 needs to be thermally protected from the surrounding high temperature member. Therefore, the capacitor 40 is disposed in the storage space 48 of the inverter circuit case 46 and has a wall 47 that forms the storage space 48.

  The first heat generating circuit component 210 facing the capacitor 40 across the wall 47 and the second heat generating circuit component 220 facing the capacitor 40 across the wall 47 are electrically connected to the substrate 200.

  Both the first heat generating circuit component 210 and the second heat generating circuit component 220 are heat generating components. The first heat generating circuit component 210 is disposed at a position closer to the heat radiating member 230 than the second heat generating circuit component 220.

  The heat generated by the first heat generating circuit component 210 is radiated to the second flow path 600 through the wall 47, the heat radiating member 230, and the case 90, thereby suppressing heat transfer to the capacitor 40.

  At this time, the first flow path for flowing the liquid refrigerant is deleted on the wall 47 between the first heat generating circuit component 210 and the capacitor 40 to provide a heat dissipation path to the second flow path 600, so that the number of parts can be reduced. Reduction and cost reduction.

  Since the heat generated from the second heat generating circuit component 220 is not transferred to the capacitor 40 due to the deletion of the first flow path, the heat generated from the second heat generating circuit component 220 is between the second heat generating circuit component 220 and the capacitor 40. An air layer 240 was provided on the wall 47. Thereby, heat transfer to the capacitor 40 can be suppressed.

  The heat generated by the first heat generating circuit component 210 and the second heat generating circuit component 220 is thermally protected by different heat dissipation methods.

  The heat generated by the first heat generating circuit component 210 and the second heat generating circuit component 220 can thermally protect the capacitor 40 even when there is no first flow path in the wall 47 portion by different heat dissipation methods.

  The first heat generating circuit component 210 of the present embodiment is a switching element that converts voltage, for example. The second heat generating circuit component 220 of the present embodiment is a current sensor that detects a current flowing through the DCDC converter circuit unit 70, for example.

  Both the first heat generating circuit component 210 and the second heat generating circuit component 220 are components that generate heat. The general power of the first heat generating circuit component 210 is about 30 W, and the power of the second heat generating circuit component 220 is about 3 W. The first heat generating circuit component 210 has a larger amount of heat generation than the second heat generating circuit component 220. The first heat generating circuit component 210 is a component that generates a large amount of heat because it performs a switching operation for power conversion. Therefore, the first heat generating circuit component 210 is a component that generates a larger amount of heat than the second heat generating circuit component 220 and requires more heat dissipation.

  The first heat generating circuit component 210 is disposed at a position closer to the heat radiating member 230 than the second heat generating circuit component 220. The heat generated by the first heating circuit component 210 is radiated to the second flow path 600 via the wall 47, the heat radiating member 230, and the case 90. The first heat generating circuit component 210 has a heat generation amount larger than that of the second heat generating circuit component 220, and thus has a heat dissipation structure by heat transfer, whereby heat transfer to the capacitor 40 can be suppressed.

  In addition, an air layer 240 is provided on the wall 47 between the second heat generating circuit component 220 and the capacitor 40 for the heat generated from the second heat generating circuit component 220 that generates less heat than the first heat generating circuit component 210. By interrupting the heat, heat transfer to the capacitor 40 can be suppressed.

  The heat generated by the first heat generating circuit component 210 and the second heat generating circuit component 220 is thermally protected by different heat dissipation methods.

  Further, since the heat resistance temperature of the capacitor elements 40a to 40f shown in FIG. 6 is lower than that of other circuit components, it is necessary to thermally protect them from surrounding high temperature members. Therefore, the capacitor 40 has a plurality of capacitor elements 40 a to 40 f arranged along the wall 47. And the space which forms the air layer 235 of the wall 47 is formed so that each of the several capacitor | condenser elements 40a thru | or 40f may be opposed.

  As a result, the air layer 235 provided with the wall 47 is formed so as to face the plurality of capacitors 40, so that the position of the second heat generating circuit component 220 is not restricted by heat and the capacitor 40 is thermally protected. It became possible.

  As shown in FIG. 5, when the arrangement direction of the inverter circuit portion and the DCDC converter circuit portion is defined as a first row, the wall 47 has a first surface 250 formed in a direction crossing the first row. The DCDC converter side substrate 200 supports the first heat generating circuit component 210 and the second heat generating circuit component 220 and has electric wiring. The DCDC converter side substrate 200 is disposed such that the surface on which the electrical wiring is disposed is opposed to the first surface 250.

  Thereby, the electric wiring of the DCDC converter side substrate 200 can be protected from noise by the wall 47. Further, as shown in FIG. 6, the projected area from the upper surface of the DCDC converter integrated inverter device 1 is reduced, and the product can be miniaturized.

DESCRIPTION OF SYMBOLS 1 ... DCDC converter integrated inverter apparatus, 10 ... Top cover, 20 ... Control circuit board, 30 ... Board holding member, 40 ... Capacitor, 40a thru | or 40f ... Capacitor element, 46 ... Inverter circuit case, 47 ... Wall, 48 ... Accommodating space DESCRIPTION OF SYMBOLS 50 ... Power module 60 ... Inverter circuit part 70 ... DCDC converter circuit part 90 ... Case 100 ... Water channel cover 200 ... DCDC converter side board | substrate 210 ... 1st heating circuit component 220 ... 2nd heating circuit component , 230 ... Heat dissipation member, 235 ... Air layer, 250 ... First surface, 600 ... Second flow path

Claims (4)

An inverter circuit for supplying an alternating current to the vehicle drive motor;
A DCDC converter integrated inverter device comprising: a DCDC converter circuit unit for converting a voltage supplied to the inverter circuit unit;
The inverter circuit unit includes a power module that converts a direct current into an alternating current, a capacitor that smoothes the direct current, a wall that forms a storage space for the capacitor, and a heat dissipation member that contacts the wall. And
The DCDC converter circuit unit includes a first heat generating circuit component facing the capacitor across the wall, and a second heat generating circuit component facing the capacitor across the wall,
The first heat generating circuit component is disposed at a position closer to the heat dissipation member than the second heat generating circuit component,
The DCDC converter integrated inverter device, wherein the wall forms a space for providing an air layer in a region sandwiched between the second heat generating circuit component and the capacitor. The DCDC converter integrated inverter device according to claim 1,
The first heat generating circuit component is a switching element that converts the voltage,
The DCDC converter integrated inverter device, wherein the second heat generating circuit component is a current sensor that detects a current flowing through the DCDC converter circuit unit. The DCDC converter integrated inverter device according to claim 1 or 2,
The capacitor has a plurality of capacitor elements disposed along the wall,
The DCDC converter integrated inverter device, wherein the space of the wall is formed to face each of the plurality of capacitor elements. The DCDC converter integrated inverter device according to any one of claims 1 to 3,
A substrate that supports the first heat generating circuit component and the second heat generating circuit component and has electrical wiring;
When the arrangement direction of the inverter circuit unit and the DCDC converter circuit unit is defined as a first row,
The wall has a first surface formed in a direction across the first row;
The DCDC converter integrated inverter device, wherein the substrate is disposed such that a surface on which the electrical wiring is disposed is opposed to the first surface.

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