JP2017163136A - ダブルゲートトランジスタ素子及び動作方法 - Google Patents
ダブルゲートトランジスタ素子及び動作方法 Download PDFInfo
- Publication number
- JP2017163136A JP2017163136A JP2017034999A JP2017034999A JP2017163136A JP 2017163136 A JP2017163136 A JP 2017163136A JP 2017034999 A JP2017034999 A JP 2017034999A JP 2017034999 A JP2017034999 A JP 2017034999A JP 2017163136 A JP2017163136 A JP 2017163136A
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- gate
- transistor element
- level
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000011017 operating method Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 106
- 239000004065 semiconductor Substances 0.000 claims description 135
- 210000000746 body region Anatomy 0.000 claims description 121
- 230000000903 blocking effect Effects 0.000 claims description 33
- 230000008859 change Effects 0.000 claims description 21
- 238000012544 monitoring process Methods 0.000 claims description 19
- 230000005669 field effect Effects 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 12
- 238000002955 isolation Methods 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 39
- 238000005259 measurement Methods 0.000 description 36
- 238000001514 detection method Methods 0.000 description 31
- 239000008186 active pharmaceutical agent Substances 0.000 description 22
- 230000007423 decrease Effects 0.000 description 22
- 230000003071 parasitic effect Effects 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 8
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 229910002601 GaN Inorganic materials 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000003213 activating effect Effects 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000000779 depleting effect Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000000415 inactivating effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/567—Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0895—Tunnel injectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/7606—Transistor-like structures, e.g. hot electron transistor [HET]; metal base transistor [MBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7788—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7831—Field effect transistors with field effect produced by an insulated gate with multiple gate structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1066—Gate region of field-effect devices with PN junction gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K2017/6878—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors using multi-gate field-effect transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Electronic Switches (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
51 第1のドライバ段
52 第2のドライバ段
6 検出回路
7 制御回路
11 ドリフト領域
12 ボディ領域
13 ソース領域
14 ドレイン領域
15 電界ストップ領域
16 接触領域
17 チャネル領域
21 第1のゲート電極
22 第1のゲート誘電体
23 分離層
24 追加分離層
31 第2のゲート電極
32 第2のゲート誘電体
33 誘電体層
511 第1のドライバ
512 第1のドライバ
521 第2のドライバ
522 第2のドライバ
531 制御回路
532 制御回路
61 電圧レギュレータ
62 スイッチ
63 電流測定及びフィルタ回路
64 評価回路
100 半導体ボディ
101 第1の表面
200 半導体ボディ
210 第1の半導体層
213 ソース電極
214 ドレイン電極
220 第2の半導体層
221 第1のゲート電極
222 ゲート誘電体
225 フィールド電極
230 第3の半導体層
2301 第1の部分
2302 第2の部分
231 第2のゲート電極
232 第2のゲート誘電体
240 パッシベーション層
5111 スイッチ
5112 スイッチ
5121 電流源
5122 電流源
5131 抵抗
5132 スイッチ
5141 クロスオーバスイッチ
5142 スイッチ
5151 電流源
5152 抵抗
5161 電流源
5162 抵抗
5172 抵抗
5211 スイッチ
5212 スイッチ
Claims (30)
- 第1のゲート電極を駆動することによって第1の伝導チャネルを生成し、且つ前記第1の伝導チャネルを生成する前に、第2のゲート電極を駆動することによって第2の伝導チャネルを生成することにより、トランジスタ素子をオンにすることを含む方法であって、
前記第2のゲート電極は、前記トランジスタ素子の電流方向において前記第1のゲート電極に隣接する、方法。 - 前記トランジスタ素子は電界効果制御型トランジスタ素子であり、
前記第1の伝導チャネルを生成することは、前記第1の伝導チャネルをボディ領域内に生成することを含み、
前記第2の伝導チャネルを生成することは、前記第2の伝導チャネルを前記ボディ領域内に生成することを含み、
前記第1のゲート電極は、第1のゲート誘電体によって前記ボディ領域から誘電的に絶縁されており、
前記第2のゲート電極は、第2のゲート誘電体によって前記ボディ領域から誘電的に絶縁されており、
前記第2のゲート電極は、分離層によって前記第1のゲート電極から隔てられており、
前記ボディ領域は、ソース領域とドリフト領域との間に配置されており、前記ドリフト領域は、前記ボディ領域とドレイン領域との間に配置されている、請求項1に記載の方法。 - 前記トランジスタ素子はHEMT素子である、請求項1に記載の方法。
- 前記トランジスタ素子はGIT素子である、請求項1に記載の方法。
- 前記GIT素子は、前記第1のゲート電極に隣接する第1の注入ゲートと、前記第2のゲート電極に隣接する第2の注入ゲートとを含む、請求項4に記載の方法。
- 前記GIT素子は1つのみの注入ゲートを含む、請求項4に記載の方法。
- 前記第1のゲート電極を駆動することは、第1の駆動信号を第1のオフレベルから第1のオンレベルまで上昇させることを含み、
前記第2のゲート電極を駆動することは、第2の駆動信号を第2のオフレベルから第2のオンレベルまで上昇させることを含む、請求項1に記載の方法。 - 前記第1のゲート電極を駆動することは、前記第2のゲート電極を前記第2のオンレベルにクランプすることを含む、請求項7に記載の方法。
- 前記第2のオフレベルは前記第1のオフレベルと異なる、請求項7に記載の方法。
- 前記第1のゲート電極及び前記第2のゲート電極を駆動することは、前記第2の駆動信号を前記第1の駆動信号より高速で上昇させることを含む、請求項7に記載の方法。
- 前記トランジスタ素子の動作状態の変化を検出することを更に含み、
前記動作状態を検出することは、前記第2のゲート電極の少なくとも1つの電気的パラメータを監視することを含む、請求項1に記載の方法。 - 第1のゲート電極を駆動することによって第1の伝導チャネルを遮断することにより、トランジスタ素子をオフにすることと、
前記第1の伝導チャネルを遮断した後、第2のゲート電極を駆動することによって第2の伝導チャネルを遮断することと
を含む方法であって、
前記第2のゲート電極は、前記トランジスタ素子の電流方向において前記第1のゲート電極に隣接して配置される、方法。 - 前記トランジスタ素子は電界効果制御型トランジスタ素子であり、
前記第1の伝導チャネルを遮断することは、前記第1の伝導チャネルをボディ領域内で遮断することを含み、
前記第2の伝導チャネルを遮断することは、前記第2の伝導チャネルを前記ボディ領域内で遮断することを含み、
前記第1のゲート電極は、第1のゲート誘電体によって前記ボディ領域から誘電的に絶縁されており、
前記第2のゲート電極は、第2のゲート誘電体によって前記ボディ領域から誘電的に絶縁されており、
前記第2のゲート電極は、分離層によって前記第1のゲート電極から隔てられており、
前記ボディ領域は、ソース領域とドリフト領域との間に配置されており、前記ドリフト領域は、前記ボディ領域とドレイン領域との間に配置されている、請求項12に記載の方法。 - 前記トランジスタ素子はHEMT素子である、請求項12に記載の方法。
- 前記トランジスタ素子はGIT素子である、請求項12に記載の方法。
- 前記GIT素子は、前記第1のゲート電極に隣接する第1の注入ゲートと、前記第2のゲート電極に隣接する第2の注入ゲートとを含む、請求項15に記載の方法。
- 前記GIT素子は1つのみの注入ゲートを含む、請求項15に記載の方法。
- 前記第1のゲート電極を駆動することは、第1の駆動信号を第1のオンレベルから第1のオフレベルまで低下させることを含み、
前記第2のゲート電極を駆動することは、前記第2のゲート電極と前記ソース領域との間の第2の駆動信号を第2のオンレベルから第2のオフレベルまで低下させることを含む、請求項13に記載の方法。 - 前記第1のゲート電極を駆動することは、前記第2のゲート電極を前記第2のオンレベルにクランプすることを含む、請求項18に記載の方法。
- 前記第2のオフレベルは前記第1のオフレベルと異なる、請求項18に記載の方法。
- 前記第1のゲート電極及び前記第2のゲート電極を駆動することは、前記第2の駆動信号を前記第1の駆動信号より高速で低下させることを含む、請求項18に記載の方法。
- 前記トランジスタ素子の動作状態の変化を検出することを更に含み、
前記動作状態を検出することは、前記第2のゲート電極の少なくとも1つの電気的パラメータを監視することを含む、請求項20に記載の方法。 - 少なくとも1つのトランジスタセルを含むトランジスタ素子であって、前記少なくとも1つのトランジスタセルは、
ドリフト領域、ボディ領域、ソース領域、及びドレイン領域であって、前記ボディ領域は前記ソース領域と前記ドリフト領域との間に配置されており、前記ドリフト領域は前記ボディ領域と前記ドレイン領域との間に配置されている、ドリフト領域、ボディ領域、ソース領域、及びドレイン領域と、
第1のゲート誘電体によって前記ボディ領域から誘電的に絶縁されている第1のゲート電極と、
第2のゲート電極と
を含み、
前記第2のゲート電極は、第2のゲート誘電体によって前記ボディ領域から誘電的に絶縁されており、前記第1のゲート電極に隣接して配置されており、且つ分離層によって前記第1のゲート電極から隔てられている、トランジスタ素子。 - 複数のトランジスタセルを更に含み、
前記複数のトランジスタセルのそれぞれは、前記複数のトランジスタセルに共通のソースノードに接続されたそのそれぞれのソース領域を有し、
前記複数のトランジスタセルのそれぞれは、前記複数のトランジスタセルに共通の第1のゲートノードに接続されたそのそれぞれの第1のゲート電極を有し、
前記複数のトランジスタセルのそれぞれは、前記複数のトランジスタセルに共通の第2のゲートノードに接続されたそのそれぞれの第2のゲート電極を有する、請求項23に記載のトランジスタ素子。 - トランジスタ素子であって、
第1のタイプのIII族窒化物を含む第1の半導体層と、前記第1の半導体層に隣接し、且つ第2のタイプのIII族窒化物を含む第2の半導体層とを有する半導体ボディと、
前記第1の半導体層及び前記第2の半導体層に接続されたソース電極と、
前記ソース電極から離間され、且つ前記第1の半導体層及び前記第2の半導体層に接続されたドレイン電極と、
前記トランジスタ素子の電流方向に離間されている第1のゲート電極及び第2のゲート電極と
を含む、トランジスタ素子。 - 前記半導体ボディは、前記第2の半導体層に隣接し、且つIII族窒化物を含む第3の半導体層を更に含み、
前記第1のゲート電極及び前記第2のゲート電極の少なくとも一方は、前記第3の半導体層に隣接し、且つ前記第3の半導体層によって前記第2の半導体層から隔てられている、請求項25に記載のトランジスタ素子。 - 前記第1のゲート電極及び前記第2のゲート電極の少なくとも一方は、前記第2の半導体層を貫通して前記第1の半導体層内へ延び、且つゲート誘電体によって前記第2の半導体層及び前記第1の半導体層から誘電的に絶縁されている、請求項25に記載のトランジスタ素子。
- 前記第1の半導体層及び前記第2の半導体層のそれぞれはドープ半導体層である、請求項25に記載のトランジスタ素子。
- 前記第1の半導体層及び前記第2の半導体層のそれぞれは真性半導体層である、請求項25に記載のトランジスタ素子。
- 前記第2のゲート電極は前記ソース電極と電気的に接続されている、請求項25に記載のトランジスタ素子。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/056,392 | 2016-02-29 | ||
US15/056,392 US10276681B2 (en) | 2016-02-29 | 2016-02-29 | Double gate transistor device and method of operating |
US15/439,706 US10530360B2 (en) | 2016-02-29 | 2017-02-22 | Double gate transistor device and method of operating |
US15/439,706 | 2017-02-22 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019088073A Division JP6997132B2 (ja) | 2016-02-29 | 2019-05-08 | ダブルゲートトランジスタ素子及び動作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017163136A true JP2017163136A (ja) | 2017-09-14 |
JP6567581B2 JP6567581B2 (ja) | 2019-08-28 |
Family
ID=59580138
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017034999A Active JP6567581B2 (ja) | 2016-02-29 | 2017-02-27 | ダブルゲートトランジスタ素子及び動作方法 |
JP2019088073A Active JP6997132B2 (ja) | 2016-02-29 | 2019-05-08 | ダブルゲートトランジスタ素子及び動作方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019088073A Active JP6997132B2 (ja) | 2016-02-29 | 2019-05-08 | ダブルゲートトランジスタ素子及び動作方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US10530360B2 (ja) |
JP (2) | JP6567581B2 (ja) |
DE (1) | DE102017103765B4 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020047756A (ja) * | 2018-09-19 | 2020-03-26 | 株式会社東芝 | 半導体装置 |
CN113437140A (zh) * | 2020-03-23 | 2021-09-24 | 株式会社东芝 | 半导体装置 |
WO2023223590A1 (ja) * | 2022-05-19 | 2023-11-23 | 住友電気工業株式会社 | 半導体チップ |
WO2023223589A1 (ja) * | 2022-05-19 | 2023-11-23 | 住友電気工業株式会社 | 半導体チップ |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10276681B2 (en) | 2016-02-29 | 2019-04-30 | Infineon Technologies Austria Ag | Double gate transistor device and method of operating |
CN109755309B (zh) * | 2017-11-01 | 2020-12-18 | 苏州东微半导体有限公司 | 一种功率晶体管 |
EP3531457B1 (en) * | 2018-02-26 | 2022-07-20 | Infineon Technologies Austria AG | Transistor device with gate resistor |
JP6864640B2 (ja) * | 2018-03-19 | 2021-04-28 | 株式会社東芝 | 半導体装置及びその制御方法 |
US11189702B2 (en) | 2019-01-30 | 2021-11-30 | Vishay SIliconix, LLC | Split gate semiconductor with non-uniform trench oxide |
CN110518058B (zh) * | 2019-08-29 | 2021-06-08 | 电子科技大学 | 一种横向沟槽型绝缘栅双极晶体管及其制备方法 |
US11218144B2 (en) * | 2019-09-12 | 2022-01-04 | Vishay-Siliconix, LLC | Semiconductor device with multiple independent gates |
CN114414977B (zh) * | 2019-10-30 | 2023-12-19 | 英诺赛科(珠海)科技有限公司 | 量测高电子移动率晶体管之装置 |
WO2021085316A1 (ja) * | 2019-10-31 | 2021-05-06 | パナソニックIpマネジメント株式会社 | スイッチシステム |
CN116388742B (zh) * | 2023-06-02 | 2023-08-29 | 东莞市长工微电子有限公司 | 功率半导体器件栅极驱动电路及驱动方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030173619A1 (en) * | 2002-03-15 | 2003-09-18 | Martin Feldtkeller | Circuit configuration and method for the switch-on/off control of a field-effect transistor |
US20090166728A1 (en) * | 2007-12-26 | 2009-07-02 | James Pan | Structure and Method for Forming Shielded Gate Trench FET with Multiple Channels |
JP2010186925A (ja) * | 2009-02-13 | 2010-08-26 | Panasonic Corp | 半導体装置 |
JP2012049499A (ja) * | 2010-07-27 | 2012-03-08 | Denso Corp | 半導体装置およびその制御方法 |
WO2012081237A1 (ja) * | 2010-12-14 | 2012-06-21 | パナソニック株式会社 | 半導体装置及びその制御方法 |
JP2012248752A (ja) * | 2011-05-30 | 2012-12-13 | Panasonic Corp | スイッチ装置 |
JP2012248753A (ja) * | 2011-05-30 | 2012-12-13 | Panasonic Corp | スイッチ装置 |
JP2013069785A (ja) * | 2011-09-21 | 2013-04-18 | Toshiba Corp | 窒化物半導体装置 |
JP2014187085A (ja) * | 2013-03-22 | 2014-10-02 | Toshiba Corp | 半導体装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5561393A (en) * | 1992-02-03 | 1996-10-01 | Fuji Electric Co., Ltd. | Control device of semiconductor power device |
JPH06351225A (ja) * | 1993-06-08 | 1994-12-22 | Fuji Electric Co Ltd | 絶縁ゲート型サイリスタの駆動方法 |
JP4398719B2 (ja) | 2003-12-25 | 2010-01-13 | 株式会社東芝 | 半導体装置 |
DE102011079747A1 (de) | 2010-07-27 | 2012-02-02 | Denso Corporation | Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür |
US8971364B2 (en) | 2011-01-19 | 2015-03-03 | Coherent, Inc. | Driving circuit for analog-modulated diode-laser |
JP5866782B2 (ja) | 2011-03-24 | 2016-02-17 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US8482036B2 (en) * | 2011-04-20 | 2013-07-09 | Infineon Technologies Austria Ag | Lateral high electron mobility transistor |
US9166028B2 (en) * | 2011-05-31 | 2015-10-20 | Infineon Technologies Austria Ag | Circuit configured to adjust the activation state of transistors based on load conditions |
US9595602B2 (en) * | 2012-09-07 | 2017-03-14 | Hitachi, Ltd. | Switching device for power conversion and power conversion device |
WO2014050740A1 (ja) * | 2012-09-28 | 2014-04-03 | シャープ株式会社 | スイッチング素子 |
US9455697B2 (en) * | 2012-09-28 | 2016-09-27 | Infineon Technologies Austria Ag | Switch circuit with a first transistor device and a second transistor device connected in series |
KR101946009B1 (ko) | 2012-10-11 | 2019-02-08 | 삼성전자주식회사 | 고전자이동도 트랜지스터 및 그 구동방법 |
US9525054B2 (en) * | 2013-01-04 | 2016-12-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | High electron mobility transistor and method of forming the same |
US9087718B2 (en) * | 2013-03-13 | 2015-07-21 | Transphorm Inc. | Enhancement-mode III-nitride devices |
US9324802B2 (en) * | 2013-10-31 | 2016-04-26 | Infineon Technologies Austria | Spacer supported lateral channel FET |
FR3013916B1 (fr) | 2013-11-27 | 2017-05-26 | Commissariat Energie Atomique | Circuit de commande pour convertisseur de puissance |
US9048303B1 (en) * | 2014-01-30 | 2015-06-02 | Infineon Technologies Austria Ag | Group III-nitride-based enhancement mode transistor |
FR3021823B1 (fr) | 2014-05-27 | 2017-10-20 | Renault Sas | Transistor a effet de champ et dispositif de detection de defaillance associe |
DE102014107560A1 (de) * | 2014-05-28 | 2015-12-03 | Infineon Technologies Austria Ag | Halbleiterbauelement und Verfahren |
US9653642B1 (en) * | 2014-12-23 | 2017-05-16 | Soraa Laser Diode, Inc. | Manufacturable RGB display based on thin film gallium and nitrogen containing light emitting diodes |
JP6413965B2 (ja) | 2015-07-20 | 2018-10-31 | 株式会社デンソー | 半導体装置 |
US9960157B2 (en) * | 2015-10-15 | 2018-05-01 | Infineon Technologies Austria Ag | Bidirectional normally-off III-V high electron mobility transistor (HEMT)devices and circuits |
-
2017
- 2017-02-22 US US15/439,706 patent/US10530360B2/en active Active
- 2017-02-23 DE DE102017103765.9A patent/DE102017103765B4/de active Active
- 2017-02-27 JP JP2017034999A patent/JP6567581B2/ja active Active
-
2019
- 2019-05-08 JP JP2019088073A patent/JP6997132B2/ja active Active
- 2019-12-20 US US16/722,809 patent/US12003231B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030173619A1 (en) * | 2002-03-15 | 2003-09-18 | Martin Feldtkeller | Circuit configuration and method for the switch-on/off control of a field-effect transistor |
US20090166728A1 (en) * | 2007-12-26 | 2009-07-02 | James Pan | Structure and Method for Forming Shielded Gate Trench FET with Multiple Channels |
JP2010186925A (ja) * | 2009-02-13 | 2010-08-26 | Panasonic Corp | 半導体装置 |
JP2012049499A (ja) * | 2010-07-27 | 2012-03-08 | Denso Corp | 半導体装置およびその制御方法 |
WO2012081237A1 (ja) * | 2010-12-14 | 2012-06-21 | パナソニック株式会社 | 半導体装置及びその制御方法 |
JP2012248752A (ja) * | 2011-05-30 | 2012-12-13 | Panasonic Corp | スイッチ装置 |
JP2012248753A (ja) * | 2011-05-30 | 2012-12-13 | Panasonic Corp | スイッチ装置 |
JP2013069785A (ja) * | 2011-09-21 | 2013-04-18 | Toshiba Corp | 窒化物半導体装置 |
JP2014187085A (ja) * | 2013-03-22 | 2014-10-02 | Toshiba Corp | 半導体装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020047756A (ja) * | 2018-09-19 | 2020-03-26 | 株式会社東芝 | 半導体装置 |
CN113437140A (zh) * | 2020-03-23 | 2021-09-24 | 株式会社东芝 | 半导体装置 |
JP2021150565A (ja) * | 2020-03-23 | 2021-09-27 | 株式会社東芝 | 半導体装置 |
US11437503B2 (en) | 2020-03-23 | 2022-09-06 | Kabushiki Kaisha Toshiba | Semiconductor device |
JP7335190B2 (ja) | 2020-03-23 | 2023-08-29 | 株式会社東芝 | 半導体装置 |
WO2023223590A1 (ja) * | 2022-05-19 | 2023-11-23 | 住友電気工業株式会社 | 半導体チップ |
WO2023223589A1 (ja) * | 2022-05-19 | 2023-11-23 | 住友電気工業株式会社 | 半導体チップ |
Also Published As
Publication number | Publication date |
---|---|
JP6567581B2 (ja) | 2019-08-28 |
US20170250685A1 (en) | 2017-08-31 |
JP2019176162A (ja) | 2019-10-10 |
JP6997132B2 (ja) | 2022-01-17 |
US20200136608A1 (en) | 2020-04-30 |
US12003231B2 (en) | 2024-06-04 |
US10530360B2 (en) | 2020-01-07 |
DE102017103765B4 (de) | 2022-09-01 |
DE102017103765A1 (de) | 2017-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6567581B2 (ja) | ダブルゲートトランジスタ素子及び動作方法 | |
US10903353B2 (en) | Double gate transistor device and method of operating | |
US9496364B2 (en) | Field effect semiconductor component and methods for operating and producing it | |
US9443849B2 (en) | Semiconductor electronic components with integrated current limiters | |
JP5385679B2 (ja) | 横方向半導体デバイスおよびその製造方法 | |
US9595602B2 (en) | Switching device for power conversion and power conversion device | |
KR101438283B1 (ko) | 반도체 스위치 및 전력 변환 장치 | |
US7986005B2 (en) | Short circuit limiting in power semiconductor devices | |
US9431392B2 (en) | Electronic circuit having adjustable transistor device | |
CN102769451A (zh) | 半导体装置及电子设备 | |
US8803205B2 (en) | Transistor with controllable compensation regions | |
CN110289842B (zh) | 半导体装置 | |
US10886909B2 (en) | Electric assembly including an insulated gate bipolar transistor device and a wide-bandgap transistor device | |
JP4803965B2 (ja) | 接合ゲート型静電誘導型サイリスタおよび当該接合ゲート型静電誘導型サイリスタを用いた高圧パルス発生装置 | |
US9509284B2 (en) | Electronic circuit and method for operating a transistor arrangement | |
JP2009239214A (ja) | スイッチング回路 | |
US11133391B2 (en) | Transistor device | |
US8638133B2 (en) | Method and circuit for driving an electronic switch | |
JP2007295543A (ja) | スイッチング回路 | |
US10027218B2 (en) | Power semiconductor element driving circuit | |
CN118117999A (zh) | 具有电压箝位电路的功率半导体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170302 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180227 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180525 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180723 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190508 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20190516 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190702 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190731 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6567581 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |