JP2017162474A - クロック生成回路 - Google Patents
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
- H03B5/1805—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a coaxial resonator
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B28/00—Generation of oscillations by methods not covered by groups H03B5/00 - H03B27/00, including modification of the waveform to produce sinusoidal oscillations
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
- H03B5/1841—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
- H03B5/1847—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator the active element in the amplifier being a semiconductor device
- H03B5/1852—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator the active element in the amplifier being a semiconductor device the semiconductor device being a field-effect device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
- H03B5/1841—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
- H03K3/03—Astable circuits
- H03K3/0315—Ring oscillators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/12—Analogue/digital converters
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/66—Digital/analogue converters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
- H01L2924/14211—Voltage-controlled oscillator [VCO]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/1425—Converter
- H01L2924/14253—Digital-to-analog converter [DAC]
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/0014—Structural aspects of oscillators
- H03B2200/0016—Structural aspects of oscillators including a ring, disk or loop shaped resonator
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Abstract
【解決手段】 本明細書には、クロック生成回路、特に回転型進行波の発振回路が開示される。そのような回路は、1対の信号線を具備する。1対の信号線は、閉ループを形成するように一緒に接続されており、かつ、当該対の第1の部分内の双方の線が、当該対の第2の部分内の双方の線の一方の側面から当該対の第2の部分内の双方の線の他方の側面に交差する、少なくとも1つの転移部を規定するように配置される。
【選択図】図3
Description
Claims (15)
- 回転型進行波の発振回路であって、
1対の信号線であって、閉ループを形成するように一緒に接続されており、かつ、当該対の第1の部分内の双方の線が、当該対の第2の部分内の双方の線の一方の側面から当該対の第2の部分内の双方の線の他方の側面に交差する、少なくとも1つの転移部を規定するように配置される、1対の信号線を具備する、
回転型進行波の発振回路。 - 前記転移部において、前記第1の部分の前記線は、これらの線の間の相互接続なしに、前記第2の部分内の前記線と交差する、
請求項1に記載の回転型進行波の発振回路。 - 前記1対の信号線は双方とも、前記転移部においてそれ自体が交差する連続経路に従う、
請求項1又は2に記載の回転型進行波の発振回路。 - 前記経路は、8の字型を示し、
前記転移部は、前記8の字型の交差部である、
請求項3に記載の回転型進行波の発振回路。 - 前記1対の信号線は一般に、並んで配置されるか相互に並行に配置される、
請求項1乃至4のいずれか1項に記載の回転型進行波の発振回路。 - 前記1対の信号線は、1組の差動伝送線である、
請求項1乃至5のいずれか1項に記載の回転型進行波の発振回路。 - 前記転移部において、前記第1の部分内の双方の線が、前記第2の部分内の双方の線に概ね垂直である、
請求項1乃至6のいずれか1項に記載の回転型進行波の発振回路。 - 前記転移部は、前記第1の部分内の各信号線が、前記第2の部分内の一方の信号線の上及び前記第2の部分内の他方の信号線の下で交差するように配置される、
請求項1乃至7のいずれか1項に記載の回転型進行波の発振回路。 - 前記1対の信号線は、前記閉ループの周囲を進む進行波が、前記転移部のいずれかの側で等しい時間を費やすことになるように、バランス調整された配置で構成される、
請求項1乃至8のいずれか1項に記載の回転型進行波の発振回路。 - 前記1対の信号線は、前記閉ループの周囲を進む進行波の0°、90°、180°及び270°という1組の相対位相が、仮想直線上にある前記信号線に沿った対応する仮想点で起こり得るよう、対称配置で構成される、
請求項1乃至9のいずれか1項に記載の回転型進行波の発振回路。 - 前記対称配置は、前記仮想点の複数のセットを提供し、前記仮想点の各セットは、それ自体の仮想直線上にあり、前記仮想直線は、一般に相互に並行であり、
任意選択で、対応する仮想点で並行な前記仮想直線を通過する前記信号線の部分は、相互に並列であり、かつこれらの仮想線と垂直に配置される、
請求項10に記載の回転型進行波の発振回路。 - 前記信号線は、その長さに沿って一様な特性を有するように構成され、バランス調整及び/又は対称配置は、前記信号線の長さ及びその相対的な空間レイアウトに基づいて規定される、
請求項9乃至11のいずれか1項に記載の回転型進行波の発振回路。 - 前記閉ループは、前記転移部の周囲に概ね対称である、
請求項1乃至12のいずれか1項に記載の回転型進行波の発振回路。 - 請求項1乃至13のいずれか1項に記載の回転型進行波の発振回路を備える、デジタル−アナログ変換回路又はアナログ−デジタル変換回路。
- 請求項1乃至13のいずれか1項に記載の回転型進行波の発振回路又は請求項14に記載のデジタル−アナログ変換回路又はアナログ−デジタル変換回路を備える、フリップチップのようなICチップ。
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EP16160039.0 | 2016-03-11 | ||
EP16160039.0A EP3217543B1 (en) | 2016-03-11 | 2016-03-11 | Clock generation circuitry |
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JP2022549242A (ja) * | 2019-11-13 | 2022-11-24 | ノースロップ グラマン システムズ コーポレーション | 容量性クロック分配システム |
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EP3514956B1 (en) * | 2018-01-19 | 2023-04-19 | Socionext Inc. | Clock distribution |
CN112087225B (zh) * | 2020-09-07 | 2023-05-09 | 海光信息技术股份有限公司 | 差分时钟矫正电路 |
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CN107181466B (zh) | 2022-05-27 |
EP3217543B1 (en) | 2018-05-09 |
CN107181466A (zh) | 2017-09-19 |
EP3217543A1 (en) | 2017-09-13 |
JP6950207B2 (ja) | 2021-10-13 |
US9887667B2 (en) | 2018-02-06 |
US20170264241A1 (en) | 2017-09-14 |
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