JP2017157579A5 - - Google Patents

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Publication number
JP2017157579A5
JP2017157579A5 JP2016036546A JP2016036546A JP2017157579A5 JP 2017157579 A5 JP2017157579 A5 JP 2017157579A5 JP 2016036546 A JP2016036546 A JP 2016036546A JP 2016036546 A JP2016036546 A JP 2016036546A JP 2017157579 A5 JP2017157579 A5 JP 2017157579A5
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JP
Japan
Prior art keywords
unit
controller
heat
heat radiating
assembly according
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Application number
JP2016036546A
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English (en)
Japanese (ja)
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JP6673546B2 (ja
JP2017157579A (ja
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Application filed filed Critical
Priority claimed from JP2016036546A external-priority patent/JP6673546B2/ja
Priority to JP2016036546A priority Critical patent/JP6673546B2/ja
Priority to TW106103962A priority patent/TWI701990B/zh
Priority to US15/426,505 priority patent/US10063004B2/en
Priority to DE102017103044.1A priority patent/DE102017103044A1/de
Priority to KR1020170026423A priority patent/KR102503472B1/ko
Priority to CN201710116548.6A priority patent/CN107135630B/zh
Publication of JP2017157579A publication Critical patent/JP2017157579A/ja
Publication of JP2017157579A5 publication Critical patent/JP2017157579A5/ja
Publication of JP6673546B2 publication Critical patent/JP6673546B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016036546A 2016-02-29 2016-02-29 コントローラ組立体 Active JP6673546B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016036546A JP6673546B2 (ja) 2016-02-29 2016-02-29 コントローラ組立体
TW106103962A TWI701990B (zh) 2016-02-29 2017-02-07 控制器總成
US15/426,505 US10063004B2 (en) 2016-02-29 2017-02-07 Controller assembly
DE102017103044.1A DE102017103044A1 (de) 2016-02-29 2017-02-15 Steuerungsanordnung
KR1020170026423A KR102503472B1 (ko) 2016-02-29 2017-02-28 콘트롤러 조립체
CN201710116548.6A CN107135630B (zh) 2016-02-29 2017-02-28 控制器组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016036546A JP6673546B2 (ja) 2016-02-29 2016-02-29 コントローラ組立体

Publications (3)

Publication Number Publication Date
JP2017157579A JP2017157579A (ja) 2017-09-07
JP2017157579A5 true JP2017157579A5 (enExample) 2019-02-28
JP6673546B2 JP6673546B2 (ja) 2020-03-25

Family

ID=59580161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016036546A Active JP6673546B2 (ja) 2016-02-29 2016-02-29 コントローラ組立体

Country Status (6)

Country Link
US (1) US10063004B2 (enExample)
JP (1) JP6673546B2 (enExample)
KR (1) KR102503472B1 (enExample)
CN (1) CN107135630B (enExample)
DE (1) DE102017103044A1 (enExample)
TW (1) TWI701990B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017108183B4 (de) * 2017-04-18 2025-02-20 Bürkert Werke GmbH & Co. KG Elektronikmodul zum Ankoppeln an eine Modulanordnung und Modulanordnung
KR102495137B1 (ko) 2018-04-10 2023-02-06 에스엠시 가부시키가이샤 액추에이터 제어 디바이스
JP1629151S (enExample) * 2018-08-06 2019-04-15
JP1641221S (enExample) * 2019-01-30 2019-09-17
USD1040802S1 (en) * 2020-03-20 2024-09-03 Mercury Mission Systems, Llc Information system housing
JP1693755S (enExample) * 2020-12-01 2021-08-30
US12080970B2 (en) 2020-12-23 2024-09-03 CACI, Inc.—Federal Configurable IOT apparatus and system for communicating with plugin cards
AU2022229718A1 (en) * 2021-03-01 2023-09-21 Moog Inc. Modular rugged cooled actuator control system
CN116231394A (zh) * 2023-04-14 2023-06-06 欧姆龙株式会社 连接器和电气单元

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Publication number Priority date Publication date Assignee Title
US6172875B1 (en) * 1998-11-17 2001-01-09 Rockwell Technologies, Llc Programmable logic controller module assembly and locking system
CN2395501Y (zh) * 1999-05-28 2000-09-06 富士康(昆山)电脑接插件有限公司 固持装置
JP4524872B2 (ja) * 2000-07-07 2010-08-18 Ｓｍｃ株式会社 信号入出力装置
JP3787518B2 (ja) * 2001-11-27 2006-06-21 ポリマテック株式会社 シーリングコネクタ及び小型情報通信機器の内部音響構造
US6975511B1 (en) * 2002-07-18 2005-12-13 Rockwell Collins Ruggedized electronic module cooling system
JP2006215882A (ja) * 2005-02-04 2006-08-17 Hitachi Ltd ディスクアレイ装置及びその液冷装置
JP4876730B2 (ja) 2005-11-29 2012-02-15 セイコーエプソン株式会社 ロボット制御装置
DE502006003331D1 (de) * 2006-08-30 2009-05-14 Siemens Ag Baugruppe für ein Automatisierungsgerät
US7480147B2 (en) * 2006-10-13 2009-01-20 Dell Products L.P. Heat dissipation apparatus utilizing empty component slot
CN101534619A (zh) * 2008-03-14 2009-09-16 李明烈 可增加工作面积的陶瓷板
TWM346844U (en) * 2008-05-12 2008-12-11 Comptake Technology Inc Improved heat-dissipating structure for memory device
CN101763149A (zh) * 2008-12-25 2010-06-30 研华股份有限公司 可扩充工业电脑系统及其主机
CN101925288A (zh) * 2009-06-16 2010-12-22 富准精密工业(深圳)有限公司 散热装置及其扣件
CN103814313B (zh) * 2011-09-29 2016-08-17 富士通株式会社 光模块
US9144178B2 (en) * 2013-03-01 2015-09-22 International Business Machines Corporation Selective clamping of electronics card to coolant-cooled structure
JP6125287B2 (ja) * 2013-03-21 2017-05-10 日本電産サンキョー株式会社 モータ駆動装置
US20160105991A1 (en) * 2013-06-26 2016-04-14 Molex Incorporated Thermal interposer suitable for electronic modules
CN103607159A (zh) * 2013-12-02 2014-02-26 周旺龙 电动车辆电机控制器及控制器总成模块化单元结构方式
JP6207409B2 (ja) * 2014-01-24 2017-10-04 ヤマハ発動機株式会社 コントローラ
US10085363B2 (en) * 2014-05-22 2018-09-25 General Electric Company Integrated compact impingement on extended heat surface

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