JP2017139456A - Light-emitting device and method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a light-emitting device which enables the adjustment to the unevenness in the light distribution and the chrominance; and a method for manufacturing a light-emitting device.SOLUTION: A light-emitting device comprises: a base 1; a light-emitting element 2 provided on the base 1; one or more translucent members 3 spaced apart from the light-emitting element 2 and disposed on the base 1 so that the light-emitting element 2 is located therebetween; and an encapsulation member 4 including a phosphor 5, covering the light-emitting element 2 disposed in a region located between the translucent members 3, and put in contact with at least part of a top face of each translucent member 3 and an inner side of the translucent member 3. The light-emitting device comprises: the light-emitting element 2; translucent members 3 spaced apart from the light-emitting element 2 and disposed so that the light-emitting element 2 is located therebetween; and the encapsulation member 4 including the phosphor 5, covering part of the light-emitting element 2 provided in a region between the translucent member 3 and the translucent member 3, and covering an inner side of each translucent member 3.SELECTED DRAWING: Figure 1B

Description

  The present disclosure relates to a light emitting device and a method for manufacturing the light emitting device.

  For example, Patent Document 1 discloses a method for manufacturing a light emitting device including a light emitting element and a fluorescent material arranged around the light emitting element so as to convert a part of light emitted from the light emitting element into a different wavelength. Forming a frame having an opening area opened to a predetermined size on a base on which the light emitting element is placed so that a position where the light emitting element is to be disposed is included in the opening area; and A step of placing the light emitting element at substantially the center of the opening region, and a space between the light emitting element and the sidewall of the opening region, so that a substantially constant gap is formed around the element; There is disclosed a method of manufacturing a light emitting device including a step of filling a gap with a curable composition containing the fluorescent material and covering the light emitting element (see claim 1).

JP 2006-49524 A

  An object of the embodiment according to the present disclosure is to provide a light emitting device that adjusts light distribution chromaticity unevenness and a method for manufacturing the light emitting device.

  A light-emitting device according to an embodiment of the present disclosure includes a base, a light-emitting element provided on the base, and one or two that are spaced apart from the light-emitting element and are disposed on the base with the light-emitting element interposed therebetween. The translucent member and the light emitting element disposed in the region sandwiched between the translucent members, and at least a part of the upper surface of the translucent member and the inner surface of the translucent member And a sealing member containing a phosphor.

  In addition, a light-emitting device according to an embodiment of the present disclosure includes a light-emitting element, one or two or more translucent members that are spaced apart from the light-emitting element and sandwich the light-emitting element, and the translucent member. A sealing member containing a phosphor that covers a part of the light-emitting element installed in the sandwiched region and covers at least a part of the upper surface of the translucent member and the inner surface of the translucent member And comprising.

  In addition, the method for manufacturing a light emitting device according to an embodiment of the present disclosure includes a step of providing a light emitting element on a base, and a translucency on the base so as to surround the light emitting element apart from the light emitting element. A step of providing one or two or more translucent members, a step of covering the base, the translucent member, and the light emitting element with a sealing member containing a phosphor, and the translucent member And cutting the base, the translucent member, and the sealing member along the position where the step is provided.

  In addition, the method for manufacturing a light emitting device according to an embodiment of the present disclosure includes a step of providing a light emitting element on a base, and a translucency on the base so as to surround the light emitting element apart from the light emitting element. A step of providing one or two or more translucent members, a step of covering the base, the translucent member, and the light emitting element with a sealing member containing a phosphor, and the base Removing the light-emitting element, and cutting the translucent member and the sealing member along a position where the translucent member is provided.

  According to the light emitting device and the method for manufacturing the light emitting device according to the embodiment of the present disclosure, it is possible to adjust light distribution chromaticity unevenness.

It is a schematic plan view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment, and shows the schematic cross section in the IB-IB line | wire of FIG. 1A. 1 is a schematic perspective sectional view showing a configuration of a light emitting device according to a first embodiment, and shows a schematic cross section taken along the line IC-IC in FIG. 1A. It is a flowchart which shows the procedure of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the base preparation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the light emitting element mounting process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the wiring process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the translucent member formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the sealing member formation process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the individualization process in the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the structure of the light-emitting device which concerns on the modification of 1st Embodiment. It is a schematic sectional drawing which shows the structure of the light-emitting device which concerns on the modification of 1st Embodiment, and shows the schematic cross section in the IVB-IVB line | wire of FIG. 4A. It is a schematic plan view explaining the parameter configuration of a light emitting device to be simulated. It is a schematic sectional drawing explaining the parameter structure of the light-emitting device of simulation object, and shows the schematic cross section in the VB-VB line | wire of FIG. 5A. It is a graph which shows the relationship between the azimuth angle and light distribution chromaticity in each light-emitting device from which the width | variety of a translucent member differs. It is a schematic plan view which shows the structure of the light-emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment, and shows the schematic cross section in the VIIB-VIIB line | wire of FIG. 7A. It is another schematic sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment, and shows the schematic cross section in the VIIC-VIIC line | wire of FIG. 7A. It is a schematic sectional drawing which shows the structure of the light-emitting device which concerns on 3rd Embodiment. It is a schematic sectional drawing which shows the structure of the light-emitting device which concerns on the modification of 3rd Embodiment. It is a schematic plan view which shows the structure of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the structure of the light-emitting device which concerns on 4th Embodiment, and shows the schematic cross section in the XB-XB line | wire of FIG. 1A. It is a flowchart which shows the procedure of the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the base preparation process in the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the light emitting element fixing process in the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the translucent member formation process in the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the sealing member formation process in the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the base removal process in the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the individualization process in the manufacturing method of the light-emitting device which concerns on 4th Embodiment.

  Hereinafter, a light emitting device and a method for manufacturing the light emitting device according to the embodiment will be described. The drawings referred to in the following description schematically show the present embodiment, and the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There may be. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and detailed description is abbreviate | omitted suitably.

  Using a concave package, a light emitting element that is disposed on the bottom surface of the concave shape and emits blue light, and a phosphor layer that is disposed in the concave shape and is contained in the resin and absorbs blue light and emits yellow light. There are light emitting devices that emit pseudo white light.

  Here, as the length (optical path length) from the light emitting element to the outer surface of the phosphor layer is longer, the blue light emitted from the light emitting element is absorbed by the phosphor before being emitted from the outer surface of the phosphor layer. The ratio increases. In other words, the rate at which yellow light is emitted from the light emitting device increases. For this reason, the longer the optical path length of the phosphor layer, the more yellow the emitted light.

  In addition, when a phosphor layer is formed so as to seal a light emitting element by potting a resin containing a phosphor on a light emitting element disposed on a concave bottom surface, the phosphor is generally better than the resin. However, since the specific gravity is large, the phosphor gradually sinks before the resin is cured, and in the phosphor layer after curing, the abundance ratio of the phosphor is higher on the lower side than on the upper side.

  For this reason, in a thin light emitting device whose height direction is shorter than the width direction, the emitted light emitted from the side surface and the vicinity of the side surface is yellow compared to the emitted light emitted from the vicinity of the center of the upper surface of the light emitting device. It becomes radiant light with a taste, and light distribution chromaticity unevenness occurs.

Further, when the light emitting element is mounted on the concave bottom surface, the distance between the concave side surfaces is increased so that the collet holding the light emitting element does not hit the concave package.
In addition, when the electrodes arranged in the concave shape and the light emitting element are connected by wire, the distance between the concave side surfaces is increased so that the wire bonding bonder does not hit the concave shape package. . As the distance between the side surfaces of the concave shape increases, the light distribution chromaticity unevenness as described above tends to occur.
The light emitting device manufacturing method according to the embodiment can adjust the light distribution chromaticity. In addition, a light-emitting device with adjusted light distribution chromaticity can be provided.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS. 1A and 1B. FIG. 1A is a schematic plan view showing the configuration of the light emitting device according to the first embodiment. FIG. 1B is a schematic cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a schematic cross section taken along the line IB-IB in FIG. 1A. FIG. 1C is a schematic perspective sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a schematic cross section taken along the line IC-IC in FIG. 1A. In FIG. 1A, the members disposed below the sealing member 4 containing the phosphor 5 are described with the sealing member 4 and the phosphor 5 seen through.

  The light emitting device 100 according to the first embodiment has a substantially rectangular parallelepiped shape as a whole, and includes a base 1, a light emitting element 2 provided on the base 1, and a light emitting element 2 on the base 1. The light-transmitting member 3 to be disposed, and the sealing member 4 containing the phosphor 5 by sealing the light-transmitting member 3 and the light emitting element 2 are mainly provided.

  The base 1 includes a support member 11 and an electrode 12 including a first electrode 121 and a second electrode 122, and is formed in a flat plate shape.

  The support member 11 is a member that supports the first electrode 121 and the second electrode 122 that are the two members of the electrode 12 in a predetermined arrangement. The support member 11 can be formed using an insulating resin material. Examples of the resin material used for the support member 11 include a thermoplastic resin and a thermosetting resin. In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, and the like can be used. In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used. Specifically, EMC (epoxy molding compound) can be preferably used.

  The electrode 12 includes a first electrode 121 and a second electrode 122, and can be formed by punching a sheet metal such as Cu or a Cu-based alloy. Note that the surfaces of the first electrode 121 and the second electrode 122 may be Ag-plated. Incidentally, the first electrode 121 and the second electrode 122 are insulated by the support member 11.

  The first electrode 121 is provided including the central portion of the base 1 and is used as a region for bonding (die bonding) the light emitting element 2. By joining the light emitting element 2 to the first electrode 121, it is possible to provide a path through which heat generated by the light emitting element 2 is transmitted to the outside through the first electrode 121.

  The electrode of one polarity of the light emitting element 2 and the upper surface of the first electrode 121 are electrically connected via the wire 6. The other polarity electrode of the light emitting element 2 and the upper surface of the second electrode 122 are electrically connected through another wire 6. Note that the lower surfaces of the first electrode 121 and the second electrode 122 are exposed from the support member 11.

  The light emitting element 2 is a light emitting diode (LED) that emits high-intensity blue light using a nitride semiconductor, and has positive and negative electrodes on the upper surface (the surface opposite to the surface bonded to the base 1). This is a face-up mounting type light emitting element arranged on the side. The electrode of the light emitting element 2 is electrically connected to the first electrode 121 and the second electrode 122 through the wire 6.

The translucent member 3 is provided in order to shorten the optical path length of the sealing member 4 in the horizontal direction (left and right direction when viewed in a cross section in a plane perpendicular to the longitudinal direction of the translucent member 3). The optical path length of the sealing member 4 refers to a length that passes through the sealing member 4 in an optical path through which light emitted from the light emitting element 2 in a substantially horizontal direction passes through the side surface of the light emitting device 100. The translucent member 3 transmits at least 50% (preferably 70%) of light from the light emitting element 2 and is disposed on the base 1.
The translucent member 3 consists of one or two or more. In plan view, the translucent member 3 is formed continuously, such as a quadrilateral shape, a polygonal shape such as a hexagonal shape, a frame shape, an annular shape, etc., or a linear shape, a rod shape, a partially bent or curved shape. The thing comprised from two or more like the shape which has been included is also included.
Although the light emitting element 2 is also provided on the base 1, the light emitting element 2 and the translucent member 3 are arranged apart from each other. In the light emitting device 100 according to the first embodiment, the translucent member 3 is disposed so as to sandwich the light emitting element 2 when viewed in a cross section in a plane perpendicular to the longitudinal direction. Here, the light-transmitting member 3 sandwiching the light-emitting element 2 means that the light-emitting element 2 is positioned between a pair of light-transmitting members extending in a predetermined direction. The translucent member 3 is disposed so as to surround the entire circumference of the light emitting element 2 when viewed in plan. In other words, the translucent member 3 has a frame-like structure with four side portions, and a first set of opposing surfaces in which two of the four side portions extend in a predetermined direction. The other two side portions are a second set of opposing portions extending perpendicularly to the predetermined direction. The light emitting element 2 is sandwiched between the first set of facing portions and further sandwiched between the second set of facing portions, so that the entire circumference is surrounded.

  Each of the four side portions of the translucent member 3 has an inner side surface 31. The inner side surface 31 is the side of the light emitting element 2 of the side surfaces of the side portion (the side of the surface in contact with the sealing member 4 to be described later), and is a sealing member when viewed in a cross section in a plane perpendicular to the longitudinal direction of the side portion. 4 is formed in an arcuate shape or curved so as to be convex. Further, each of the four side portions of the translucent member 3 has a horizontal width that is wider toward the lower side (the side of the base 1) when viewed in a cross section in a plane perpendicular to the longitudinal direction of the side portion, It is comprised so that the width | variety of a horizontal direction may become narrow, so that an upper side (side far from the base 1).

  On the other hand, the outer side surface 32 of the translucent member 3 is the side opposite to the light emitting element 2 among the side surfaces of the translucent member 3 and is exposed to the outside as a part of the side surface (vertical surface) of the light emitting device 100. Is formed. The term “exposed” means that the space between the outer surface 32 of the translucent member 3 and the outside air is not covered with the sealing member 4, and prevents moisture from entering the surface of the outer surface 32 of the translucent member 3. Even when a coating to be applied (for example, a silica coat) is applied, it should be included in the exposure.

  Examples of the material used for the translucent member 3 include thermosetting resins having good translucency such as silicone resin, epoxy resin, and urea resin, and translucent glass. Specifically, a silicone resin can be suitably used.

  The translucent member 3 may contain a light diffusing material. Moreover, when the translucent member 3 contains a light-diffusion material, it is desirable that the light-diffusion material is contained by 1 mass% or more and 20 mass% or less. If it is less than 1% by mass, suitable light diffusibility cannot be obtained, and if it exceeds 20% by mass, the transmittance of the translucent member 3 is unfavorable. For this reason, it is preferable to set it as 1 mass% or more and 20 mass% or less, It is more preferable to set it as 2 mass% or more and 10 mass% or less, It is further more preferable to set it as 2 mass% or more and 5 mass% or less.

  The sealing member 4 is provided to protect the light emitting element 2 and the like from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 2 and the like. The sealing member 4 transmits at least 50% (preferably 70%) of light from the light emitting element 2, and the inner surface 31 of the light transmissive member 3, the light emitting element 2, and the light transmissive member 3. And the light emitting element 2 are provided so as to cover the upper surface of the base 1. That is, the sealing member 4 is exposed on the upper surface of the light emitting device 100 according to the first embodiment. In addition, the side surface (vertical surface) of the light emitting device 100 has the side surface of the translucent member 3 exposed on the lower side, the side surface of the sealing member 4 exposed on the upper side, and the side surface of the translucent member 3 and the sealing member. 4 side surfaces are formed on the same surface. In addition, the case where the surface which the sealing member 4 and outside air touch is provided with the coating (for example, silica coat) which suppresses an invasion of moisture shall be included in exposure.

  Examples of the material used for the sealing member 4 include thermosetting resins having good translucency such as silicone resin, epoxy resin, urea resin, and glass having translucency. A silicone resin can be suitably used as the sealing member 4. As the silicone resin, phenyl resin, phenyl rubber, modified silicone, fluoro rubber, methyl rubber, phenyl gel, and the like can also be used. Further, as the silicone resin, phenyl silicone having a refractive index of 1.45 to 1.60, methylphenyl silicone having a refractive index of 1.40 to 1.50, methyl silicone having a refractive index of 1.35 to 1.50, etc. are also preferably used. can do. In addition, the material of the translucent member 3 and the material of the sealing member 4 may use the same material, and may use a different material. By using the same material as the material of the translucent member 3 and the material of the sealing member 4, light refraction at the boundary (inner side surface 31) between the translucent member 3 and the sealing member 4 can be prevented. convenient. On the other hand, by using different materials for the material of the translucent member 3 and the material of the sealing member 4, light is refracted at the boundary (inner side surface 31) between the translucent member 3 and the sealing member 4, for example, as desired. This is convenient because the illuminance distribution in the direction of can be increased.

  The sealing member 4 contains a phosphor 5, and the phosphor 5 is dispersed in the sealing member 4. The sealing member 4 can easily adjust the color tone of the light emitting device 100 by containing particles of the phosphor 5. In addition, as the fluorescent substance 5, what has a larger specific gravity than the material of the sealing member 4, absorbs the light from the light emitting element 2, and converts the wavelength can be used. If the specific gravity of the phosphor 5 is greater than that of the material of the sealing member 4, the phosphor 5 can be settled and disposed near the surface of the light emitting element 2.

Examples of the phosphor 5 contained in the sealing member 4 include yellow phosphors such as Y ₃ Al ₅ O 1 ₂ : Ce (YAG) and silicate, CaAlSiN ₃ : Eu (CASN), and (Sr, Ca). Examples include red phosphors such as AlSiN ₃ : Eu (SCASN) and K ₂ SiF ₆ : Mn (KSF).

  The wire 6 electrically connects the electrode of the light emitting element 2 and the electrode 12 of the base 1. The junction point between the electrode of the light emitting element 2 and one end of the wire 6 is covered with the sealing member 4. Further, the junction between the electrode 12 and one end of the wire 6 is covered with the sealing member 4.

  In the light emitting device 100 configured as described above, the wavelength of the light emitted from the light emitting element 2 is converted by the phosphor 5 contained in the sealing member 4, and the light is emitted from the top and side surfaces of the light emitting device 100. And the light-emitting device 100 can adjust light distribution chromaticity nonuniformity by providing the translucent member 3. FIG.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 100 according to the first embodiment will be described with reference to FIGS. 2 to 3F. FIG. 2 is a flowchart showing the procedure of the method for manufacturing the light emitting device according to the first embodiment. FIG. 3A is a schematic cross-sectional view showing a base preparation step in the method for manufacturing a light emitting device according to the first embodiment. FIG. 3B is a schematic cross-sectional view showing a light emitting element mounting step in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3C is a schematic cross-sectional view illustrating a wiring process in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3D is a schematic cross-sectional view illustrating a translucent member forming step in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3E is a schematic cross-sectional view illustrating a sealing member forming step in the method for manufacturing the light emitting device according to the first embodiment. FIG. 3F is a schematic cross-sectional view illustrating a singulation process in the method for manufacturing the light emitting device according to the first embodiment.

The light emitting device manufacturing method according to the present embodiment includes a base preparation step S11, a light emitting element mounting step S12, a wiring step S13, a translucent member forming step S14, a sealing member forming step S15, and individual pieces. Conversion step S16.
In addition, the manufacturing method of the light-emitting device which concerns on this embodiment is used in the state of the connection base 10 in which the several base 1 was continuously formed from base preparation process S11 to sealing member formation process S15. After the light emitting devices 100 corresponding to the respective bases 1 are manufactured, the light emitting devices 100 are separated into pieces in the individualization step S16, and light is emitted using only one piece or the separated bases 1. The apparatus 100 may be manufactured.

  The base preparation step S11 is a step of preparing a connection base 10 in which a plurality of bases 1 on which the light emitting elements 2 and the like are not arranged are connected. The connection base 10 (base 1) forms a lead frame on which the first electrode 121 and the second electrode 122 are formed by punching a sheet metal, and the lead frame corresponds to the shape of the support member 11. It can be formed by sandwiching between upper and lower molds having cavities, injecting resin into the mold cavities, and molding the resin. The connection base 10 (base 1) is a resin package, but a ceramic package may be formed by laminating and firing green sheets, which are raw materials for ceramics. It may be a substrate in which a conductive film is formed by sticking or plating a metal foil on a flat substrate, and a wiring pattern is formed by etching or the like. Moreover, you may make it prepare the connection base 10 (base 1) by purchasing.

  In the light-emitting element mounting step S12, the light-emitting element 2 is picked up using a collet or the like and disposed at a predetermined position, and the connection base 10 (base 1) on which the light-emitting element 2 is disposed is heated using a reflow furnace or the like. This is a step of joining the light emitting element 2 to the connection base 10 (base 1) by performing the treatment.

  The wiring step S <b> 13 is a step of electrically connecting the terminal of the light emitting element 2 to the first electrode 121 and the second electrode 122 that are external connection electrodes of the base 1 using the wire 6. The wire 6 can be wired using a bonder for wire bonding.

  Translucent member formation process S14 supplies a curable composition on the connection base 10 (base 1) using a dispenser, hardens | cures a curable composition after that, and the translucent member 3 of FIG. This is a process of forming the original translucent member base body 30. The translucent member base body 30 is provided so as to surround each light emitting element 2 in a lattice shape along the boundary 1 s of the base 1. In addition, a dispenser provides the translucent member base body 30 by carrying out line application etc. of a curable composition along the boundary 1s of the upper surface of the connection base 10 (base 1). In addition, the curable composition of the translucent member base body 30 has a curved shape by being set in advance and cured in a state where it is applied in a line from a dispenser. The translucent member base body 30 may be line-coated on only one row or column of the matrix.

  The sealing member forming step S15 uses a dispenser to connect the upper surface and the side surface of the light emitting element 2, the upper surface and the side surface of the translucent member base body 30, and the connection base between the light emitting element 2 and the translucent member base body 30. The curable composition containing the phosphor 5 is supplied to the upper surface of 10 (base 1), and then the curable composition is cured to form the sealing member base body 40 that is the basis of the sealing member 4. It is a process to do. Here, the sealing member base body 40 is made higher than the translucent member base body 30. Thereby, when supplying the curable composition containing the fluorescent substance 5, since it supplies beyond the lattice-shaped translucent member base body 30, productivity improves.

The singulation step S16 is a step of dicing the light emitting devices 100 that are connected to each other. The light emitting device 100 can be separated into pieces by cutting along a boundary 1 s of the base 1 using a cutter or the like. In other words, it is separated into pieces by cutting along the position where the translucent member base body 30 is disposed. The light emitting device 100 can be manufactured by performing each step as described above.
Thereby, the distance of the light emitting element 2 and the translucent member 3 can be shortened. That is, by performing the translucent member forming step S14 after the light emitting element mounting step S12 and the wiring step S13, the distance between the light emitting element 2 and the translucent member 3 and the distance between the wire 6 and the translucent member 3 are set. Can be close. By shortening the distance between the light emitting element 2 and the translucent member 3, the amount of the phosphor 5 arranged in the horizontal direction of the light emitting element 2 can be adjusted, and unevenness in light distribution chromaticity can be adjusted. it can.

The manufacturing method of the light emitting device 100 according to the first embodiment has been described above. However, the manufacturing method is not limited to this, and other processes may be included before or after each of the described processes.
In addition, in the translucent member forming step S14, the translucent member base body 30 is formed so as not to include the junction between the wire 6 and the electrode 12 (121, 122), and the wire 6 and the electrode 12 (121, 122) are formed. ) Is formed in the sealing member 4 (see FIGS. 1A and 1B), but is not limited thereto.

  FIG. 4A is a schematic plan view illustrating a configuration of a light emitting device according to a modification of the first embodiment. FIG. 4B is a schematic cross-sectional view showing a configuration of a light emitting device according to a modification of the first embodiment, and shows a schematic cross section taken along line IVB-IVB in FIG. 4A. In FIG. 4A, the members arranged below the sealing member 4 containing the phosphor 5 are described with the sealing member 4 and the phosphor 5 seen through.

  In the translucent member forming step S14, the translucent member base body 30 is formed so as to include the junction between the wire 6 and the electrode 12 (121, 122), and the wire 6 and the electrode 12 (121, 122) are connected. The junction point may be formed in the translucent member 3 (see FIGS. 4A and 4B).

  Thus, after wiring process S13, a curable composition is supplied on the connection base 10 (base 1) using a dispenser in translucent member formation process S14, and the origin of the translucent member 3 is obtained. By forming the translucent member base body 30 to be, the width when each of the four side portions of the translucent member 3 is viewed in a cross section in a plane perpendicular to the longitudinal direction can be widened. In other words, the distance between the side surface of the light emitting element 2 and the inner side surface 31 of the side portion of the translucent member 3 facing the side surface can be made shorter than the configuration shown in FIGS. 1A and 1B. . In other words, the optical path length of the sealing member 4 in the horizontal direction can be further shortened.

[Function and effect]
<Optical simulation>
A simulation was performed to explain the operational effects of the light emitting device 100 according to the first embodiment (and a modification of the first embodiment).
FIG. 5A is a schematic plan view illustrating a parameter configuration of a light emitting device to be simulated. FIG. 5B is a schematic cross-sectional view illustrating the parameter configuration of the light-emitting device to be simulated, and shows a schematic cross-section along line VB-VB in FIG. 5A. In FIG. 5A, the members disposed below the sealing member 4 containing the phosphor 5 are described with the sealing member 4 and the phosphor 5 seen through. FIG. 6 is a graph showing the relationship between the azimuth angle θ and the light distribution chromaticity (chromaticity coordinate x) in each light emitting device having a different width W3 of the translucent member. Here, the horizontal axis of the graph shown in FIG. 6 indicates the azimuth angle θ (range of ± 85 °), and the vertical axis indicates the light distribution chromaticity (chromaticity coordinate x). The azimuth angle θ is based on the optical axis of the light emitting element 2 (θ = 0 °). Here, only the chromaticity coordinate x is shown as the chromaticity, but other values (chromaticity coordinate y, Y value, etc.) are the same and are omitted.

Here, each parameter of the simulation will be described. When the light emitting device 100 to be simulated is viewed in plan, the light emitting device 100 and the light emitting element 2 are square, and the width of one side of the light emitting device 100 (in other words, the width of the base 1) W ₁ = 3000. [[mu] m] and then, the width W ₂ = 650 of one side of the light emitting element 2 [[mu] m], the light emitting element 2 in the center of the base 1 is intended to position.

The light emitting device 100 to be simulated has a thickness t ₁ = 200 [μm] of the base 1 and a thickness t ₂ = 150 [μm] of the light emitting element 2 when viewed in cross-section, and the translucent member 3. The thickness (defined by the height on the outer surface 32 and the height at which the translucent member 3 is exposed on the side surface of the light emitting device 100) is t ₃ = 300 [μm], and the sealing member 4 is a base Part of the upper surface of 1 was covered, and the thickness (defined by the height from the upper surface of the base 1 to the upper surface of the sealing member 4) was t ₄ = 450 [μm].

And each width of the four portions of the translucent member 3 (defined by the width where the base 1 and the translucent member 3 are in contact when viewed in a cross section in a plane perpendicular to the longitudinal direction of the side portion) W ₃ . The simulation was performed while changing the parameters to 0, 300, 500, and 700 [μm]. Note that W ₃ = 0 [μm] corresponds to the configuration of the light-emitting device that is not provided with the translucent member 3 and is sealed with the sealing member 4. Further, the distance between the light emitting element 2 and the translucent member 3 (defined by the minimum distance between the side surface of the light emitting element 2 and the inner side surface 31 of the translucent member 3 facing the side surface) is W ₂₃ (= W ₁ / 2-W ₂ / 2-W ₃ = 1175−W3).

As shown in FIG. 5B, the cross-sectional shape of the inner side surface 31 of the side portion of the translucent member 3 is an ellipse ¼ elliptical arc having t ₃ as the first radius and W ₃ as the second radius. It was. The light emitting element 2 was a single wavelength light source having a wavelength of 450 nm. Moreover, the material of the translucent member 3 uses phenyl silicone, and the material of the sealing member 4 uses a material in which Y ₃ Al ₅ O 1 ₂ : Ce (YAG) is dispersed as a phosphor 5 in phenyl silicone. It was. Further, each light emitting device 100 adjusted the number of phosphor particles in the sealing member so that the light distribution chromaticity (chromaticity coordinate x) at the azimuth angle θ = ± 60 ° was about 0.345.

  Incidentally, in the pseudo white light composed of blue light and yellow light, the chromaticity coordinate x increases as the ratio of yellow light increases. Further, the smaller the change in chromaticity (chromaticity coordinate x) with respect to the change in azimuth angle θ, in other words, the smaller the difference between the maximum value and the minimum value of chromaticity (chromaticity coordinate x), the light distribution. It can be said that the light emitting device 100 has little chromaticity unevenness.

As a result of the simulation, in the configuration of the light emitting device without the translucent member 3 (W ₃ = 0 [μm]), the difference between the maximum value and the minimum value of the chromaticity coordinates x is 0.06 (= 0.38−0). 32). On the other hand, in the structure of the light emitting device including the translucent member 3 having the width W ₃ = 300 [μm], the difference between the maximum value and the minimum value of the chromaticity coordinates x is 0.05 (= 0.37-0. 32). In the configuration of the light emitting device including the translucent member 3 having the width W ₃ = 500 [μm], the difference between the maximum value and the minimum value of the chromaticity coordinates x is 0.04 (= 0.36 to 0.32). It was. In the configuration of the light emitting device including the translucent member 3 having the width W ₃ = 700 [μm], the difference between the maximum value and the minimum value of the chromaticity coordinates x is 0.02 (= 0.35−0.33). It was. Thus, as the width W ₃ of the translucent member 3 increases, in other words, the result that the difference in chromaticity decreases as the distance W ₂₃ between the light emitting element 2 and the translucent member 3 decreases. It was.

As described above, the light emitting device 100 according to the first embodiment can adjust the light distribution chromaticity unevenness by including the translucent member 3. In particular, as shown in the translucent member forming step S <b> 14, after wiring the wire 6, the curable composition is supplied onto the base 1 by line coating or the like to transmit the translucent member base body 30 (the translucent member 3. ), The distance W ₂₃ between the light emitting element 2 and the translucent member 3 is set to 3/4 or less (more preferably about 1/4) of the width W ₂ of one side of the light emitting element 2. And chromaticity unevenness can be adjusted more suitably.

Note that the width W ₃ of the translucent member 3 is set to 50 μm or more and the height (thickness) t of the translucent member 3 in a cross-sectional view in a plane perpendicular to the longitudinal direction of the side portion of the translucent member 3. ₃ is preferably 50 μm or more. If it is less than these, the effect of adjusting the light distribution chromaticity unevenness cannot be obtained sufficiently.
Further, it is preferable that the thickness of the sealing member 4 is 50 μm or more above the light emitting element 2, that is, (t ₄ −t ₂ ) is 50 μm or more. This is because if it is less than these, a sufficient effect of protecting the light emitting element 2 and the like from external force, dust, moisture, and the like cannot be obtained.
The thickness (t ₄ -t ₃ ) of the sealing member 4 immediately above the translucent member 3 is preferably 30 μm or more and 3 mm or less, more preferably 50 μm or more and 1 mm or less, and 100 μm or more and 500 μm. More preferably, it is as follows.

Further, the ratio of the height (thickness) t ₃ of the translucent member 3 to the width W3 of the translucent member 3 is preferably 0.3 or more and 2.0 or less. With such a configuration, it is possible to prevent the light distribution chromaticity after adjustment from deteriorating than the light distribution chromaticity before adjustment.

Further, the distance W from the inner side surface 31 of the side of the translucent member 3 to the thickness (t ₄ -t ₂ ) of the sealing member 4 directly above the light emitting element 2 to the side surface of the light emitting element 2 facing the inner side surface. The ratio of ₂₃ is preferably 0.8 or more and 2.0 or less. With such a configuration, the optical path length of the sealing member 4 in the light emitted in the vertical direction and the light emitted in the horizontal direction can be approximately equal, or the optical path length in the vertical direction can be increased. Adjustment of light chromaticity becomes easier.

The height (thickness) t ₄ of the sealing member 4 to the light emitting element of the second height (thickness) t ₂ is 1.2 or more and 6.0 or less. With such a configuration, by increasing the optical path length in the vertical direction, W ₃ of the translucent member 3 can be reduced, so that the light distribution chromaticity can be adjusted more easily.

Second Embodiment
[Configuration of light emitting device]
The configuration of the light emitting device 100A according to the second embodiment will be described with reference to FIGS. 7A and 7B. FIG. 7A is a schematic plan view showing the configuration of the light emitting device according to the second embodiment. FIG. 7B is a schematic cross-sectional view showing the configuration of the light emitting device according to the second embodiment, and shows a schematic cross-section along the line VIIB-VIIB in FIG. 7A. FIG. 7C is another schematic cross-sectional view showing the configuration of the light emitting device according to the second embodiment, and shows a schematic cross-section along the VIIC-VIIC line in FIG. 7A. In FIG. 7A, the members disposed below the sealing member 4 containing the phosphor 5 are described with the sealing member 4 and the phosphor 5 seen through.

  In the light emitting device 100 according to the first embodiment, four side portions of the translucent member 3 are provided so as to surround the light emitting element 2. On the other hand, the light emitting device 100A according to the second embodiment is configured to include the two-side translucent member 3A. Specifically, in the translucent member forming step S14, when the translucent member base body 30 is formed by line coating or the like, the translucent member base bodies 30 are formed in parallel rather than in a lattice shape. That is, in the light emitting device 100A according to the second embodiment, the translucent member 3A is a set of translucent members extending in a predetermined direction, and when viewed in a cross section on a plane perpendicular to the predetermined direction, the light emitting element 2 are arranged so as to sandwich 2 therebetween. The set of translucent members 3A corresponds to a set of side portions of the translucent member 3 according to the first embodiment. Even with such a configuration, it is possible to adjust light distribution chromaticity unevenness in a plane perpendicular to the direction in which the translucent member 3A extends.

<Third Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting devices 100B and 100C according to the third embodiment will be described with reference to FIGS. FIG. 8 is a schematic cross-sectional view showing the configuration of the light emitting device according to the third embodiment. FIG. 9 is a schematic cross-sectional view illustrating a configuration of a light emitting device according to a modification of the third embodiment.

  When the light emitting device 100 according to the first embodiment is viewed in a cross-section in a plane perpendicular to the longitudinal direction of the side portion of the translucent member 3, the inner side surface 31 of the side portion is formed in an arc shape or a curved shape. . Similarly, in the light emitting device 100A according to the second embodiment, the inner side surface 31 of the translucent member 3A is arcuate or curved when viewed in a cross section in a plane perpendicular to the longitudinal direction of the side portion of the translucent member 3A. Is formed. In contrast, the light emitting device 100B according to the third embodiment includes the translucent member 3B having four side portions as in the first embodiment, but the side portions have a flat inner surface 311 and a flat upper surface 312. When the cross section is viewed in a plane perpendicular to the longitudinal direction of the side portion, the inner side surface 311 and the upper surface 312 of the side portion are linear, and the cross section of the side portion is trapezoidal. In the light emitting device 100C according to the modification of the third embodiment, each of the four side portions of the translucent member 3C has a flat inner side surface 313, and is a cross-sectional view in a plane perpendicular to the longitudinal direction of the side portion. At this time, the inner side surface 313 of the side portion is formed by a straight line extending from the side surface of the light emitting device 100C, and the cross section of the side portion of the translucent member 3C has a triangular shape. Specifically, in the translucent member forming step S14, the curable composition is supplied onto the connection base 10 (base 1) by line coating or the like, and before the curable composition is cured, You may shape | mold so that it may become a shape, and you may process so that it may become a predetermined shape, after the curable composition hardens | cures. Thereby, the light distribution chromaticity unevenness can be adjusted.

  Moreover, when the material (curable composition) of the translucent member 3, 3A, 3B, 3C and the material (curable composition) of the sealing member 4 are different, the translucent member 3, 3A, 3B, Although light is refracted at the boundary between 3C and the sealing member 4, the shape of the boundary between the translucent members 3, 3A, 3B, 3C and the sealing member 4, that is, the translucent members 3, 3A, 3B. , 3C, by appropriately designing the inner side surfaces of the four side portions, it is possible to control the refraction of light to obtain a desired illuminance distribution.

  Moreover, the shape of the inner surface of the translucent members 3, 3A, 3B, 3C is not limited to these. For example, the inner surface of the translucent member 3 may be cut or uneven.

<Fourth embodiment>
[Configuration of light emitting device]
The structure of the light emitting device 200 according to the fourth embodiment will be described with reference to FIGS. 10A and 10B. FIG. 10A is a schematic plan view showing the configuration of the light emitting device according to the fourth embodiment. FIG. 10B is a schematic cross-sectional view showing the configuration of the light emitting device according to the fourth embodiment, and shows a schematic cross section taken along line XB-XB of FIG. 10A. In FIG. 10A, the members arranged below the sealing member 4 containing the phosphor 5 are described with the sealing member 4 and the phosphor 5 seen through.

  The light emitting device 200 according to the fourth embodiment has a substantially rectangular parallelepiped shape as a whole, and the light emitting element 2 and the translucent member 3 disposed so as to surround the light emitting element 2 with a gap therebetween. The sealing member 4 that covers the light-transmitting member 3 and the light-emitting element 2 is mainly provided.

  The light-emitting element 2 of the light-emitting device 200 according to the fourth embodiment is a light-emitting diode that emits high-intensity blue light using a nitride semiconductor, and has positive and negative electrodes on the bottom surface (opposite to the surface covered with the sealing member 4). This is a face-down mounting type light-emitting element disposed on the (side) side. The power source is connected to the electrode of the light emitting element 2 so that the light emitting element 2 emits light.

  The translucent member 3 is disposed away from the light emitting element 2. In the light emitting device 200 according to the fourth embodiment, the translucent member 3 has a frame-like structure having four side portions, and two of the four side portions extend in a predetermined direction. It has a first set of facing portions, and the other two side portions have a second set of facing portions extending perpendicularly to the predetermined direction. The light emitting element 2 is sandwiched between the first set of facing portions and further sandwiched between the second set of facing portions, so that the entire periphery is surrounded. The structure provided with 3 A of translucent members of 2 sides like the light-emitting device 100A may be sufficient. The inner side surface 31 of the translucent member 3 is formed in an arc shape or a curved shape that is convex toward the sealing member 4 when viewed in cross section, but the light emitting devices 100B and 100C according to the third embodiment Thus, it may be formed in a straight line.

The sealing member 4 is formed so as to cover the inner side surfaces 31 of the four side portions of the translucent member 3 and the upper and side surfaces of the light emitting element 2. That is, the sealing member 4 is exposed on the upper surface of the light emitting device 200 according to the fourth embodiment. Further, the side surface (vertical surface) of the light emitting device 200 has the side surface of the translucent member 3 exposed on the lower side, the side surface of the sealing member 4 exposed on the upper side, and the side surface of the translucent member 3 and the sealing member 4 side surfaces are formed on the same surface. Further, the bottom surface of the light emitting device 200 is exposed at the outer peripheral portion of the bottom surface of the translucent member 3, and the bottom surface of the light emitting element 2 (surface on which the electrode is provided) is exposed at the central portion. 4, the bottom surface of the light emitting element 2, the bottom surface of the translucent member 3, and the bottom surface of the sealing member 4 are formed on the same surface.
Other configurations are the same as those of the light emitting device 100 according to the first embodiment, and redundant description is omitted.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 200 according to the fourth embodiment will be described with reference to FIGS. 11 to 12F. FIG. 11 is a flowchart illustrating a procedure of a method for manufacturing the light emitting device according to the fourth embodiment. FIG. 12A is a schematic cross-sectional view showing a base preparation step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 12B is a schematic cross-sectional view illustrating a light emitting element fixing step in the method for manufacturing the light emitting device according to the fourth embodiment. FIG. 12C is a schematic cross-sectional view showing a translucent member forming step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 12D is a schematic cross-sectional view illustrating a sealing member forming step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 12E is a schematic cross-sectional view showing a base removal step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 12F is a schematic cross-sectional view showing a singulation process in the method for manufacturing a light emitting device according to the fourth embodiment.

  The manufacturing method of the light emitting device according to the fourth embodiment includes a base preparation step S21, a light emitting element fixing step S22, a translucent member forming step S23, a sealing member forming step S24, and a base removing step S25. And singulation step S26.

  The base preparation step S21 is a step of preparing the base 15 on which the light emitting elements 2 and the like are not arranged. The base 15 uses a flexible sheet member (for example, polyimide) so that removal by peeling is easy in a base removal step S25 described later. Moreover, the adhesion layer for fixing the light emitting element 2 in the light emitting element fixing process S22 mentioned later is provided in the upper surface of the sheet | seat member.

  The light emitting element fixing step S22 is a process of picking up the light emitting element 2 using a collet or the like, arranging it at a predetermined position on the base 15, and fixing it. The base 15 and the light emitting element 2 are fixed by irradiating the adhesive layer of the base 15 with ultraviolet rays and curing it.

  Translucent member formation process S23 supplies a curable composition on the base 15 using a dispenser, and hardens | cures a curable composition after that, The translucency which becomes the origin of the translucent member 3 This is a process of forming the member base body 30. The translucent member base body 30 is formed on the base 15 so as to surround each light emitting element 2 in a lattice shape along the boundary 1 s of the light emitting device 200. The dispenser forms the translucent member base body 30 by applying a line of a curable composition in a grid pattern along the boundary 1 s of the light emitting device 200 on the upper surface of the base 15.

  In the sealing member forming step S24, a curable composition containing the phosphor 5 on the upper surface and side surfaces of the light emitting element 2, the upper surface and side surfaces of the translucent member base body 30, and the upper surface of the base 15 is formed using a dispenser. This is a step of forming the sealing member base body 40 which is supplied and then cured of the curable composition to be the basis of the sealing member 4.

  The base removal step S <b> 25 is a step of removing (peeling) the base 15 from the structure including the light emitting element 2, the translucent member base body 30, the sealing member base body 40, and the base 15.

  The singulation step S26 is a step of dicing the light emitting devices 200 that are connected to each other. The light emitting device 200 can be separated into pieces by cutting along a boundary 1 s using a cutter or the like. In other words, it is separated into pieces by cutting along the position where the translucent member basic body 30 is arranged. The light emitting device 200 can be manufactured by performing each process as described above.

As described above, similarly to the light emitting device 100 according to the first embodiment, the light emitting device 200 according to the fourth embodiment can adjust the light distribution chromaticity unevenness by including the translucent member 3.
In the first, third, and fourth embodiments described above, the light emitting device has a single translucent member, and the translucent member has a frame-like structure having four side portions, It was described as being formed continuously. Then, two of the four side portions are a first set of opposing portions extending in a predetermined direction, and the other two side portions are a second set of opposing portions extending perpendicularly to the predetermined direction. The light-emitting element is described as being surrounded by these two sets of facing portions. In this case, the four side portions are continuously formed in the frame-like structure. However, the four side portions do not necessarily have to be formed continuously. For example, the light-emitting device has four light-transmitting members instead of a single light-transmitting member, two of which correspond to the first set of opposing portions. The light transmitting member is constituted, and the other two constitute a second set of light transmitting members corresponding to the second set of facing portions, and the end portions of these two sets of light transmitting members are arranged with each other. It is good also as a structure which installs so that frame structure may be comprised by adjoining and the circumference | surroundings of a light emitting element may be enclosed.
More generally speaking, the number of translucent members is not limited to those described above, and one set of opposing portions or two sets of opposing portions are constituted by an arbitrary number of translucent members, The light emitting element may be configured to be sandwiched between the one set of facing portions or surrounded by the two sets of facing portions.
Furthermore, in the above-described first to fourth embodiments, the sealing member has been described as a configuration that covers the upper surface and the inner surface of the translucent member, but may be configured to cover a part of the upper surface of the translucent member. . That is, for example, the sealing member may be provided so as to cover a part of the upper surface of the translucent member from the inner side to the outer side of the translucent member and to expose the outer peripheral edge which is the outer side of the covered upper surface. Good. In the sealing member, when the phosphor is used by being settled, the phosphor at the position covering the upper surface of the translucent member does not exist when covering a part of the translucent member. The phosphor on the side of the light emitting device can be reduced from the other parts, and yellow light emitted from the side of the light emitting device can be suppressed to make it easier to adjust the alignment chromaticity unevenness.

100, 100A, 100B, 100C, 200 Light-emitting device 1 Base 15 Base 1s Boundary 10 Connection base 11 Support member 12 Electrode 121 First electrode 122 Second electrode 2 Light-emitting element 3, 3A, 3B, 3C Translucent member 30 Translucent member base bodies 31, 311, 312, 313 Inner side surface 32 Outer side surface 4 Sealing member 40 Sealing member base body 5 Phosphor 6 Wire

Claims (21)

The base,
A light emitting device provided on the base;
One or more translucent members spaced apart from the light emitting element and disposed on the base with the light emitting element interposed therebetween;
The phosphor contains a phosphor that covers the light-emitting element disposed in a region sandwiched between the translucent members and covers at least a part of the upper surface of the translucent member and the inner surface of the translucent member. And a sealing member. A light emitting element;
One or two or more translucent members disposed apart from the light emitting element and sandwiching the light emitting element;
A phosphor that covers a part of the light emitting element installed in a region sandwiched between the light transmissive members and covers at least a part of an upper surface of the light transmissive member and an inner surface of the light transmissive member. A light-emitting device comprising:   3. The light emitting device according to claim 1, wherein the inner surface of the translucent member in contact with the sealing member has an arc shape, a curved shape, or a straight line in a cross-sectional view in the vertical direction.   4. The light-emitting device according to claim 1, wherein an outer surface of the translucent member and an outer surface of the sealing member are exposed on a side surface of the light-emitting device.   The light emitting device according to claim 2, wherein a bottom surface of the light transmissive member and a bottom surface of the light transmissive member and a bottom surface of the sealing member are exposed. The base has a conductive part and an insulating part,
The light emitting element has an electrode on a surface opposite to a surface facing the base,
The light-emitting device according to claim 1, further comprising a wire that connects the conductive portion and the electrode so that energization is possible.   The light emitting device according to claim 6, wherein a connection portion between the conductive portion and the wire is covered with the sealing member.   The light emitting device according to claim 6, wherein a connection portion between the conductive portion and the wire is covered with the light transmissive member.   The light emitting device according to claim 1, wherein the base is formed in a flat plate shape.   The light emitting device according to claim 1, wherein the phosphor is dispersed in the sealing member.   The light emitting device according to any one of claims 1 to 10, wherein the light transmissive member contains a light diffusing material in an amount of 1% by mass or more and 20% by mass or less.   The translucent member has a width of at least 50 μm and a height of at least 50 μm in a vertical sectional view, and transmits 50% or more of light from the light emitting element. The light emitting device according to claim 1, wherein the light emitting device has a thickness of 50 μm or more above the translucent member.   The light emitting device according to any one of claims 1 to 12, wherein a ratio of a height of the light transmissive member to a width of the light transmissive member is 0.3 or more and 2.0 or less.   The ratio of the distance from the inner side surface of the translucent member to the side surface of the light emitting element with respect to the thickness of the sealing member immediately above the light emitting element is 0.8 or more and 2.0 or less. Item 14. The light emitting device according to any one of Item 13.   The said sealing member covers the upper surface of the said base, and the height of the said sealing member with respect to the height of the said light emitting element is 1.2 or more and 6.0 or less. The light emitting device according to any one of claims 1 to 14, excluding the cited claims.   The light emitting device according to claim 1, wherein the translucent member is disposed so as to surround the entire circumference of the light emitting element. Providing a light emitting element on the base;
Providing one or more translucent members having translucency on the base so as to surround the light-emitting element apart from the light-emitting element;
Covering the base, the translucent member, and the light emitting element with a sealing member containing a phosphor;
A step of cutting the base, the translucent member, and the sealing member along a position where the translucent member is provided. Providing a light emitting element on the base;
Providing one or more translucent members having translucency on the base so as to surround the light-emitting element apart from the light-emitting element;
Covering the base, the translucent member, and the light emitting element with a sealing member containing a phosphor;
Removing the base from the light emitting element;
And a step of cutting the translucent member and the sealing member along a position where the translucent member is provided. The base has a conductive part and an insulating part,
The light emitting element has an electrode on a surface opposite to a surface facing the base,
After the step of providing the light emitting element and before the step of providing the translucent member,
The light emitting device according to claim 17, further comprising: connecting an electrode formed on a surface opposite to the surface facing the base of the light emitting element and the conductive portion of the base with a wire so as to be energized. Device manufacturing method. The step of providing the translucent member includes
The method for manufacturing a light emitting device according to claim 17, wherein the light transmissive member is formed by supplying a curable composition to the base. The step of providing the translucent member includes
The light-emitting device according to claim 19, wherein the translucent member is formed by supplying a curable composition to the base so that a connection portion between the conductive portion and the wire is covered with the curable composition. Production method.

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