JP2017126735A - カバーレイフィルム - Google Patents
カバーレイフィルム Download PDFInfo
- Publication number
- JP2017126735A JP2017126735A JP2016200718A JP2016200718A JP2017126735A JP 2017126735 A JP2017126735 A JP 2017126735A JP 2016200718 A JP2016200718 A JP 2016200718A JP 2016200718 A JP2016200718 A JP 2016200718A JP 2017126735 A JP2017126735 A JP 2017126735A
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive layer
- black
- base material
- coverlay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016003409 | 2016-01-12 | ||
JP2016003409 | 2016-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017126735A true JP2017126735A (ja) | 2017-07-20 |
Family
ID=59365353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016200718A Pending JP2017126735A (ja) | 2016-01-12 | 2016-10-12 | カバーレイフィルム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2017126735A (zh) |
KR (3) | KR20170084672A (zh) |
CN (2) | CN115767876A (zh) |
TW (1) | TWI684392B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019102503A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP2019102501A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP2019102502A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
KR20190137248A (ko) * | 2018-06-01 | 2019-12-11 | 주식회사 잉크테크 | 절연필름 및 절연필름의 제조방법 |
JP2019214642A (ja) * | 2018-06-11 | 2019-12-19 | Imitex株式会社 | カバーレイフィルム用ポリイミドフィルムおよびその製造方法 |
WO2022230907A1 (ja) * | 2021-04-28 | 2022-11-03 | 藤森工業株式会社 | テープ |
WO2023235989A1 (en) * | 2022-06-09 | 2023-12-14 | Nicoya Lifesciences, Inc. | Colored coverlay dielectrics in digital microfluidics |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108285617A (zh) * | 2018-02-06 | 2018-07-17 | 合肥东恒锐电子科技有限公司 | 一种显示屏用导热耐候防辐射保护膜及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005238798A (ja) * | 2004-02-27 | 2005-09-08 | Toyobo Co Ltd | フレキシブルプリント配線基板 |
JP2005307152A (ja) * | 2004-04-19 | 2005-11-04 | Saehan Micronics Inc | 熱硬化性接着剤用組成物及びそれを用いた電子部品用接着テープ |
JP2009084507A (ja) * | 2007-10-02 | 2009-04-23 | Hitachi Kasei Polymer Co Ltd | 多層接着フィルム及びそれを用いたカバーレイフィルム、銅箔付き多層接着フィルム |
JP2012231021A (ja) * | 2011-04-26 | 2012-11-22 | Fujimori Kogyo Co Ltd | Fpc用電磁波シールド材 |
JP2015207656A (ja) * | 2014-04-21 | 2015-11-19 | 三井化学株式会社 | リジッドフレキ基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09135067A (ja) * | 1995-09-08 | 1997-05-20 | Shin Etsu Chem Co Ltd | 遮光性カバーレイフィルム |
JP2005068227A (ja) * | 2003-08-21 | 2005-03-17 | Suzuka Fuji Xerox Co Ltd | ポリイミドフィルムおよび該ポリイミドフィルムを使用した電子写真用転写・定着部材 |
JP2007051211A (ja) * | 2005-08-17 | 2007-03-01 | Shin Etsu Chem Co Ltd | 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート |
-
2016
- 2016-05-23 KR KR1020160062552A patent/KR20170084672A/ko active Application Filing
- 2016-05-24 CN CN202211425914.3A patent/CN115767876A/zh active Pending
- 2016-05-24 CN CN201610347728.0A patent/CN106961782A/zh active Pending
- 2016-06-03 TW TW105117517A patent/TWI684392B/zh active
- 2016-10-12 JP JP2016200718A patent/JP2017126735A/ja active Pending
-
2018
- 2018-07-23 KR KR1020180085214A patent/KR101987646B1/ko active IP Right Grant
-
2019
- 2019-06-04 KR KR1020190065667A patent/KR102066879B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005238798A (ja) * | 2004-02-27 | 2005-09-08 | Toyobo Co Ltd | フレキシブルプリント配線基板 |
JP2005307152A (ja) * | 2004-04-19 | 2005-11-04 | Saehan Micronics Inc | 熱硬化性接着剤用組成物及びそれを用いた電子部品用接着テープ |
JP2009084507A (ja) * | 2007-10-02 | 2009-04-23 | Hitachi Kasei Polymer Co Ltd | 多層接着フィルム及びそれを用いたカバーレイフィルム、銅箔付き多層接着フィルム |
JP2012231021A (ja) * | 2011-04-26 | 2012-11-22 | Fujimori Kogyo Co Ltd | Fpc用電磁波シールド材 |
JP2015207656A (ja) * | 2014-04-21 | 2015-11-19 | 三井化学株式会社 | リジッドフレキ基板 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019102503A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP2019102501A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP2019102502A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP7045173B2 (ja) | 2017-11-28 | 2022-03-31 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP7045172B2 (ja) | 2017-11-28 | 2022-03-31 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP7048277B2 (ja) | 2017-11-28 | 2022-04-05 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
KR20190137248A (ko) * | 2018-06-01 | 2019-12-11 | 주식회사 잉크테크 | 절연필름 및 절연필름의 제조방법 |
KR102240918B1 (ko) * | 2018-06-01 | 2021-04-16 | 주식회사 잉크테크 | 절연필름 및 절연필름의 제조방법 |
JP2019214642A (ja) * | 2018-06-11 | 2019-12-19 | Imitex株式会社 | カバーレイフィルム用ポリイミドフィルムおよびその製造方法 |
WO2022230907A1 (ja) * | 2021-04-28 | 2022-11-03 | 藤森工業株式会社 | テープ |
WO2023235989A1 (en) * | 2022-06-09 | 2023-12-14 | Nicoya Lifesciences, Inc. | Colored coverlay dielectrics in digital microfluidics |
Also Published As
Publication number | Publication date |
---|---|
KR20170084672A (ko) | 2017-07-20 |
CN106961782A (zh) | 2017-07-18 |
KR102066879B1 (ko) | 2020-01-16 |
KR20190065229A (ko) | 2019-06-11 |
CN115767876A (zh) | 2023-03-07 |
TWI684392B (zh) | 2020-02-01 |
KR20180086177A (ko) | 2018-07-30 |
TW201725949A (zh) | 2017-07-16 |
KR101987646B1 (ko) | 2019-06-11 |
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