JP2017117509A - メモリセル - Google Patents

メモリセル Download PDF

Info

Publication number
JP2017117509A
JP2017117509A JP2016246994A JP2016246994A JP2017117509A JP 2017117509 A JP2017117509 A JP 2017117509A JP 2016246994 A JP2016246994 A JP 2016246994A JP 2016246994 A JP2016246994 A JP 2016246994A JP 2017117509 A JP2017117509 A JP 2017117509A
Authority
JP
Japan
Prior art keywords
transistor
memory cell
gate
voltage
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016246994A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017117509A5 (enExample
Inventor
ヤン・ファン・ハウト
Van Houdt Jan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of JP2017117509A publication Critical patent/JP2017117509A/ja
Publication of JP2017117509A5 publication Critical patent/JP2017117509A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0441Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0441Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
    • G11C16/045Floating gate memory cells with both P and N channel memory transistors, usually sharing a common floating gate
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/26Sensing or reading circuits; Data output circuits
    • G11C16/28Sensing or reading circuits; Data output circuits using differential sensing or reference cells, e.g. dummy cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/701IGFETs having ferroelectric gate insulators, e.g. ferroelectric FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/68Floating-gate IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/69IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/689Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having ferroelectric layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Non-Volatile Memory (AREA)
JP2016246994A 2015-12-21 2016-12-20 メモリセル Pending JP2017117509A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15201495 2015-12-21
EP15201495.7 2015-12-21

Publications (2)

Publication Number Publication Date
JP2017117509A true JP2017117509A (ja) 2017-06-29
JP2017117509A5 JP2017117509A5 (enExample) 2019-12-12

Family

ID=54979498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016246994A Pending JP2017117509A (ja) 2015-12-21 2016-12-20 メモリセル

Country Status (2)

Country Link
US (1) US9847109B2 (enExample)
JP (1) JP2017117509A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10937783B2 (en) 2016-11-29 2021-03-02 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
US9966465B1 (en) * 2017-06-23 2018-05-08 United Microelectronics Corp. Non-volatile memory device
US10957373B2 (en) 2018-07-05 2021-03-23 Samsung Electronics Co., Ltd. Semiconductor memory device
US10839893B2 (en) * 2018-09-28 2020-11-17 Kneron (Taiwan) Co., Ltd. Memory cell with charge trap transistors and method thereof capable of storing data by trapping or detrapping charges
WO2021202575A1 (en) * 2020-03-31 2021-10-07 The Regents Of The University Of California Apparatus and method for changing the functionality of an integrated circuit using charge trap transistors
CN112349775B (zh) * 2020-09-16 2022-12-02 清华大学 超陡亚阈值摆幅器件及其制备方法
US12026605B2 (en) * 2020-12-03 2024-07-02 International Business Machines Corporation FeFET unit cells for neuromorphic computing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010038555A1 (en) * 2000-04-27 2001-11-08 Kiyoshi Kato Nonvolatile memory and semiconductor device
JP2002043447A (ja) * 2000-04-27 2002-02-08 Semiconductor Energy Lab Co Ltd 不揮発性メモリおよび半導体装置
JP2008042189A (ja) * 2006-07-14 2008-02-21 Semiconductor Energy Lab Co Ltd 不揮発性メモリ
US7596024B2 (en) * 2006-07-14 2009-09-29 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile memory

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581501A (en) * 1995-08-17 1996-12-03 Altera Corporation Nonvolatile SRAM cells and cell arrays
US5648930A (en) * 1996-06-28 1997-07-15 Symbios Logic Inc. Non-volatile memory which is programmable from a power source
JP3378879B2 (ja) * 1997-12-10 2003-02-17 松下電器産業株式会社 不揮発性半導体記憶装置及びその駆動方法
US6002610A (en) * 1998-04-30 1999-12-14 Lucent Technologies Inc. Non-volatile memory element for programmable logic applications and operational methods therefor
US7212438B2 (en) * 2005-02-25 2007-05-01 Infineon Technologies Ag Semiconductor device and method of operating a semiconductor device
US7301821B1 (en) * 2005-10-13 2007-11-27 Actel Corporation Volatile data storage in a non-volatile memory cell array
TW200812074A (en) * 2006-07-04 2008-03-01 Nxp Bv Non-volatile memory and-array

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010038555A1 (en) * 2000-04-27 2001-11-08 Kiyoshi Kato Nonvolatile memory and semiconductor device
JP2002043447A (ja) * 2000-04-27 2002-02-08 Semiconductor Energy Lab Co Ltd 不揮発性メモリおよび半導体装置
JP2008042189A (ja) * 2006-07-14 2008-02-21 Semiconductor Energy Lab Co Ltd 不揮発性メモリ
US7596024B2 (en) * 2006-07-14 2009-09-29 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile memory

Also Published As

Publication number Publication date
US20170178698A1 (en) 2017-06-22
US9847109B2 (en) 2017-12-19

Similar Documents

Publication Publication Date Title
JP2017117509A (ja) メモリセル
KR20240168900A (ko) 온-로직 칩 메모리에서 사용 가능한 강유전체 기반 메모리 셀
US7728369B2 (en) Nonvolatile ferroelectric memory device
TWI793973B (zh) 半導體元件記憶裝置
US7215567B2 (en) Ferroelectric memory device
JP2009540545A (ja) 従来のロジックプロセスで埋め込まれる不揮発性メモリ及びそのような不揮発性メモリの動作方法
US7859897B2 (en) Semiconductor memory device and driving method thereof
KR20070042585A (ko) 집적 dram-nvram 멀티-레벨 메모리
JP2009026448A (ja) メモリセル構造、メモリセルアレイ、メモリ装置、メモリ制御器、メモリシステム及びこれらを動作する方法
TW201721646A (zh) 用於非揮發性記憶體的非對稱傳輸型場效電晶體
US9214465B2 (en) Structures and operational methods of non-volatile dynamic random access memory devices
JP5059437B2 (ja) 不揮発性半導体記憶装置
CN100419910C (zh) 存储器
US9324430B2 (en) Method for defining a default state of a charge trap based memory cell
WO1999026252A1 (en) Semiconductor memory and method for accessing semiconductor memory
US7020007B2 (en) Non-volatile static random access memory
JP2018049674A (ja) 半導体装置
US20200388334A1 (en) Flash memory cell adapted for low voltage and/or non-volatile performance
KR100669558B1 (ko) 불휘발성 강유전체 메모리 장치
KR101395152B1 (ko) 비휘발성 메모리 셀, 비휘발성 메모리 장치 및 상기비휘발성 메모리 장치의 프로그래밍 방법
US7352605B2 (en) Nonvolatile ferroelectric memory device and method thereof
KR100682180B1 (ko) 불휘발성 강유전체 메모리 장치
KR100682212B1 (ko) 불휘발성 강유전체 메모리 장치
US7961539B2 (en) Method of operating semiconductor device
KR100636925B1 (ko) 불휘발성 강유전체 메모리 장치

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191025

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191025

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20191025

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20191101

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200204

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20200915