JP2017116311A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device that can supply electric power to heating units regardless of the installation number of the heating units, and an electronic component inspection device.SOLUTION: An electronic component conveyance device includes: a base part 171 mounted with a plurality of heating units 231 heating electronic components; a first connection part 3 that can supply electric power to ones of the plurality of heating units 231 (a first heating unit 231a to an eighth heating unit 231h); and a second connection part 4 that can supply electric power to the others of the plurality of heating units 231 (a ninth heating unit 231i to a twelfth heating unit 231L). Further, the first connection part 3 and the second connection part 4 are arranged at positions different from each other on the base part 171.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, there is known an electronic component inspection apparatus that inserts an electronic component such as a semiconductor element into an inspection socket and inspects (tests) the electrical characteristics of the electronic component (for example, see Patent Document 1). In the electronic component inspection apparatus described in Patent Document 1, when performing the inspection, the electronic component can be inspected while being pressed against the inspection socket by a pusher. A plurality of pushers are installed corresponding to the electronic components, and a heater for heating the electronic components to a temperature suitable for the inspection is incorporated.

JP 2003-28923 A

  In the electronic component inspection apparatus described in Patent Document 1, since a plurality of pushers are installed corresponding to the electronic components, the number of installed pushers increases or decreases. For this reason, for example, when an attempt is made to add a pusher, the connector for supplying power to the heater may be insufficient depending on the number of the pushers.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

A base on which a plurality of heating units for heating the electronic component of the present invention are mounted;
A first connection unit capable of supplying power to a heating unit belonging to one group of the plurality of heating units;
And a second connecting portion capable of supplying power to a heating portion belonging to another group different from the one group among the plurality of heating portions.

  Thereby, even when a heating part is added, electric power can be supplied to the added heating part.

  In the electronic component transport device of the present invention, it is preferable that the first connection portion and the second connection portion are arranged at different positions.

  As a result, the connection work to the first connection part and the connection work to the second connection part can each be performed accurately, and therefore erroneous connection can be reduced.

  In the electronic component transport device of the present invention, it is preferable that the first connection portion and the second connection portion are disposed on the base portion.

  Thereby, the connection work to each connection part of a 1st connection part and a 2nd connection part can be performed easily.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the first connection portion and the second connection portion are arranged on opposite sides of the base portion.

  As a result, the connection work to the first connection part and the connection work to the second connection part can each be performed accurately, and therefore erroneous connection can be reduced.

In the electronic component transport device of the present invention, a supply unit that supplies the electronic component toward the heating unit,
A recovery unit for recovering the electronic component from the heating unit;
It is preferable that the first connection part is disposed on the supply part side and the second connection part is disposed on the recovery part side.

  As a result, the connection work to the first connection part and the connection work to the second connection part can each be performed accurately, and therefore erroneous connection can be reduced.

In the electronic component transport device of the present invention, the base has a window portion that can be seen at the nearest position,
It is preferable that the first connection portion is disposed on one side toward the window portion, and the second connection portion is disposed on the other side.

  As a result, the connection work to the first connection part and the connection work to the second connection part can each be performed accurately, and therefore erroneous connection can be reduced. Moreover, each connection work can be performed while confirming through a window part.

  In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a heater that generates heat when energized and a temperature sensor that detects the temperature of the heating unit.

  Thereby, the heating part can heat an electronic component easily and rapidly. In addition, the temperature of each heating unit can be detected as accurately as possible, and the electronic component can be adjusted to a temperature suitable for inspection based on the detection result.

  In the electronic component transport device according to the present invention, each of the first connection portion and the second connection portion includes a first connector connected to the heater and a plurality of second connectors connected to the temperature sensor. It is preferable to have.

  Accordingly, the first connection portion and the second connection portion individually have the first connector and the second connector having different functions. Therefore, for example, the influence of noise generated in the first connector is affected by the second connector. Can be suppressed.

In the electronic component transport device of the present invention, it is preferable that the second connectors are arranged via the first connectors.
As a result, the arrangement balance is relatively good, which leads to, for example, reduction of erroneous connections.

  In the electronic component transport device of the present invention, it is preferable that the first connector and the second connectors are arranged in a horizontal direction.

  Here, assuming that the first connector and each second connector are aligned in the vertical direction, the connection work to the connector located at the lowest position is performed more than the connection work to other connectors. There is a concern that workability is likely to deteriorate. Therefore, since the first connector and each second connector are arranged in the horizontal direction, the workability of the connection work to each connector becomes substantially the same.

  In the electronic component transport device of the present invention, it is preferable that the first connection portion and the second connection portion each have a horizontal connection direction.

  Thereby, the connection work to the first connection part and the connection work to the second connection part can be confirmed, for example, from the back side of the electronic component transport device, and thus each connection work is easily and accurately performed. be able to.

  In the electronic component transport device of the present invention, it is preferable that the first connection portion and the second connection portion have connection directions opposite to each other.

  As a result, the connection work to the first connection part and the connection work to the second connection part can each be performed accurately, and therefore erroneous connection can be reduced.

In the electronic component transport device of the present invention, the heating unit is provided in a predetermined number,
It is preferable that the first connecting portion can supply power to the predetermined number of heating portions.

  Thereby, if the number of installed heating units is 1 to 8, the use of the second connection unit can be stopped, and the supply of electric power to the respective heating units can be performed only by the first connection unit.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the second connection unit can supply power to the heating unit exceeding the predetermined number.

  As a result, assuming that the number of heating units is further increased from eight, it is possible to supply power to the heating units corresponding to the additional number by the second connection unit.

In the electronic component conveying apparatus of the present invention, it is preferable that the predetermined number is eight.
Thereby, it becomes the number of installation of the heating part corresponding to a standard electronic component conveyance apparatus.

In the electronic component transport device of the present invention, it is preferable to have a detection unit that detects that the connection is not made in either the first connection unit or the second connection unit.
Thereby, it is possible to prevent forgetting to connect at the first connection part or the second connection part.

  In the electronic component transport device of the present invention, the detection unit is configured by serial wiring, and when the serial wiring is disconnected, the connection is not made in either the first connection unit or the second connection unit. Is preferably detected.

  Accordingly, the detection unit can be configured with a simple structure using serial wiring.

  In the electronic component conveying apparatus of the present invention, it is preferable to have a setting unit that can set whether or not to use the second connection unit and can display it.

  Thereby, the user who uses an electronic component conveyance apparatus needs the aspect which uses a 1st connection part and a 2nd connection part, and the aspect which uses only a 1st connection part and does not use a 2nd connection part. It can be changed accordingly.

In the electronic component transport device of the present invention, when the second connection portion is not used, it is possible to display on the screen that the first connection portion is used,
When the second connection portion is used, it is preferable that the first connection portion and the second connection portion can be displayed on the screen.

  Thereby, the temperature of each heating unit can be appropriately set individually regardless of the number of heating units installed.

The electronic component inspection apparatus of the present invention includes a base on which a plurality of heating units for heating electronic components are mounted,
A first connection unit capable of supplying power to a heating unit belonging to one group of the plurality of heating units;
A second connecting part capable of supplying power to a heating part belonging to another group different from the one group among the plurality of heating parts;
And an inspection unit for inspecting the electronic component.

  Thereby, even when a heating part is added, electric power can be supplied to the added heating part.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a perspective view of the device transport head arranged in the inspection area of the electronic component inspection apparatus shown in FIG. 2 as viewed from the back side. FIG. 4 is an exploded perspective view of the device transport head shown in FIG. FIG. 5 is an image diagram illustrating an electrical connection relationship between each heating unit, the first connection unit, and the second connection unit in the device transport head illustrated in FIG. 3. FIG. 6 is a conceptual diagram showing a signal flow through the serial wiring in the device transport head shown in FIG. FIG. 7 is an example of a screen displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 8 is an example of a screen displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 9 is an example of a screen displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 10 is a perspective view of the device transport head arranged in the inspection area of the electronic component inspection apparatus (second embodiment) of the present invention as seen from the back side. FIG. 11 is an example of a screen displayed on the monitor of the electronic component inspection apparatus (second embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction in which the arrow in each direction is directed is called “positive”, and the opposite direction is called “negative”. 1, 3 and 4 (the same applies to FIG. 10), the upper side may be referred to as “upper (or upper)” and the lower side may be referred to as “lower (or lower)”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 and FIG. 2 conveys electronic components such as an IC device that is a BGA (Ball Grid Array) package, and inspects and tests the electrical characteristics during the conveyance process. (Hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance device (handler) that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. . In addition, the inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700 (see FIG. 1).

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (mounting member) 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11 </ b> A is a moving unit that can move the tray 200 to the positive side in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1.

  In the supply area A2, a temperature adjusting unit 12, a device transport head 13, and a tray transport mechanism 15 are provided.

  The temperature adjustment unit 12 can collectively cool or heat the plurality of IC devices 90 and is sometimes referred to as a “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled or heated in advance and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

  The device transport head 13 is supported so as to be movable in the X and Y directions and further in the Z direction within the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports the empty tray 200 from which all IC devices 90 have been removed to the positive side in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transport head 17 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

  The device supply unit 14 is a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 12 is mounted and can transport (move) the IC device 90 to the vicinity of the inspection unit 16. Sometimes referred to as “shuttle plate”.

  The device supply unit 14 is supported so as to be movable in the horizontal direction along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14. The device supply unit 14 is configured to maintain the temperature adjusted state of the temperature-adjusted IC device 90. Thereby, the IC device 90 can be cooled or heated, and thus the temperature adjustment state of the IC device 90 can be maintained.

  The inspection unit 16 is a mounting unit that mounts the IC device 90 and inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminal unit of the IC device 90. Then, the terminal portion of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the Y direction and the Z direction within the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 can also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and the IC device 90 can be transported (moved) to the collection region A4. Sometimes called “shuttle plate”.

  The device collection unit 18 is supported so as to be movable in the horizontal direction along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

  The device transport head 20 is supported so as to be movable in the X and Y directions and further in the Z direction within the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, tray transport mechanisms 22A and 22B for transporting the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can move the tray 200 in the Y direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 800 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  The operator can set or confirm the operating conditions of the inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen (display unit) 301 configured by, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the inspection apparatus 1. As shown in FIG. 1, on the right side of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating a screen displayed on the monitor 300 is placed.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 commands the inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state or the like of the inspection apparatus 1 by a combination of colors that emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65.

  The outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74.

  By the way, in the inspection apparatus 1, for example, there are a plurality of types of inspection units 16 corresponding to various conditions such as the type of the IC device 90, and these are used interchangeably. In the present embodiment, as an example, the inspection unit 16 can arrange six IC devices 90 in the X direction and two in the Y direction. The device transport head 17 is used with a pressing unit 23 corresponding to the inspection unit 16 (see FIGS. 3 and 4).

  As shown in FIG. 4, the pressing unit 23 includes heating units 231 arranged in the X direction and two in the Y direction, and a support unit 232 that collectively supports the heating units 231. Yes.

  Each heating unit 231 includes a heater 233 and a temperature sensor 234. The heater 233 is composed of, for example, a bar heater that generates heat when energized. Thereby, each heating part 231 can individually heat the IC devices 90 one by one. Moreover, the temperature sensor 234 is comprised by the Pt sensor, for example. Thereby, the temperature of the heating unit 231 in which the temperature sensor 234 is incorporated can be detected as accurately as possible, and the IC device 90 can be adjusted to a temperature suitable for the inspection based on the detection result. .

  Each heating unit 231 has a function to heat the IC device 90 and also has a function to suck the IC device 90. Accordingly, the IC device 90 on the device supply unit 14 can be supplied (transferred) to the inspection unit 16. Further, the IC device 90 on the inspection unit 16 can be recovered (transferred) to the device recovery unit 18.

  Each heating unit 231 also has a function of pressing the IC device 90 on the inspection unit 16 against the inspection unit 16. Thereby, the electrical connection between the IC device 90 and the inspection unit 16 is achieved, so that the inspection of the IC device 90 can be performed accurately.

  Each heating unit 231 is numbered sequentially from “1” to “12”. Hereinafter, the heating part 231 with the number “1” is referred to as “first heating part 231a”, the heating part 231 with the number “2” is referred to as “second heating part 231b”, and the heating part with the number “3”. 231 is referred to as “third heating part 231c”, the heating part 231 with the number “4” is referred to as “fourth heating part 231d”, and the heating part 231 with the number “5” is referred to as “fifth heating part 231e”. The heating part 231 with the number “6” is referred to as “sixth heating part 231f”, the heating part 231 with the number “7” is referred to as “seventh heating part 231g”, and the heating part with the number “8”. 231 is referred to as “eighth heating part 231h”, the heating part 231 with the number “9” is referred to as “ninth heating part 231i”, and the heating part 231 with the number “10” is referred to as “tenth heating part 231j”. The heating unit 231 with the number “11” is referred to as the “11th heating unit 231k” and the number is “12”. The heating section 231 referred to as the "first 12 heating unit 231L". In the present embodiment, among the twelve heating units 231, the heating unit 231 is located closest to the front side (Y direction negative side) and closest to the supply region A2 side (X direction negative side). The heating part 231 closest to the origin side of 1 is defined as a first heating part 231a having a number “1”.

  Moreover, as shown in FIG. 5, among the first heating unit 231a to the twelfth heating unit 231L, the first heating unit 231a to the eighth heating unit 231h constitute the first group G1. The first heating unit 231a to the eighth heating unit 231h are electrically connected to the heating unit side first connection unit 24. On the other hand, the ninth heating unit 231i to the twelfth heating unit 231L constitute a second group G2 different from the first group G1, and are electrically connected to the heating unit side second connection unit 25.

  Such a heating unit 231 is attached to the device transport head 17 via the support unit 232. The support part 232 supports the heating part 231 on the lower side. As shown in FIG. 4, the pressing unit 23 (support portion 232) is slid (inserted) from the positive side in the X direction toward the negative side with respect to the device transport head 17, so that the device transport head at the movement limit position. 17 is attached. In addition, it is preferable that the support part 232 is comprised so that the insertion direction to the device conveyance head 17 may be controlled, ie, the reverse insertion with respect to the device conveyance head 17 may be prevented. As a result, the pressing unit 23 can be accurately attached to the device transport head 17.

  Note that the pressing unit 23 may have a function of cooling the IC device 90 in the same manner as the temperature adjustment unit 12 and the inspection unit 16 described above.

  As illustrated in FIGS. 3 and 4, the device transport head 17 includes a base 171, a first connection unit 3, and a second connection unit 4.

  The base 171 includes a base 172, a support column 173, a support member 174, and a support member 175.

  The base 172 is a portion to which the pressing unit 23 is attached, and is supported in a suspended state from above via a support column 173.

  The support member 174 supports the first connection portion 3 on the supply region A2 side on the base 172, and the support member 175 supports the second connection portion 4 on the collection region A4 side on the base 172. is there.

  As shown in FIG. 3, the rear cover 73 is provided with a window portion 731 through which the base portion 171 can be visually recognized at the closest position. Through this window portion 731, for example, it is possible to check the degree of attachment of the pressing unit 23 to the device transport head 17 or the like. Note that the window portion 731 is preferably openable and closable.

  As shown in FIG. 5, the first connection unit 3 is connected to the heating unit side first connection unit 24 of the pressing unit 23. In this connected state, the heating units 231 numbered from “1” to “8” among the twelve heating units 231, that is, the first heating unit 231 a to the eighth heating unit belonging to the first group G 1. Power from the external power supply 900 can be supplied to 231h. Thereby, the heating in the 1st heating part 231a-the 8th heating part 231h can be performed separately.

  The second connection unit 4 is connected to the heating unit side second connection unit 25 of the pressing unit 23. In this connection state, the power from the external power supply 900 is supplied to the heating units 231 numbered from “9” to “12”, that is, the ninth heating unit 231i to the twelfth heating unit 231L belonging to the second group G2. Can be supplied. Thereby, the heating in the 9th heating part 231i-the 12th heating part 231L can be performed individually.

  As described above, in the inspection apparatus 1, for example, there are a plurality of types of inspection units 16 according to various conditions such as the type of the IC device 90. Corresponding to the various inspection units 16, there are also pressing units 23. Therefore, although the pressing unit 23 has an example of the twelve heating units 231 in this embodiment, the number of the heating units 231 is not limited to this. The number of heating units 231 can be usually 1 to 16. And when the installation number of the heating parts 231 is 1-8, the 1st connection part 3 can bear the electric power supply to each heating part 231. In addition, when the number of installed heating units 231 exceeds 9, that is, 10 or more, it is assumed that the heating units 231 are further expanded from 8 (predetermined number), and power supply to the heating units 231 corresponding to the additional expansion is performed. It can be carried by the two connecting parts 4.

  As described above, in the inspection apparatus 1, the first connection unit 3 and the second connection unit 4 can allocate the power supply to each heating unit 231 regardless of the number of the heating units 231 installed. Thereby, the heating in each heating part 231 can be performed individually, and therefore the temperature adjustment for each IC device 90 during the heating inspection can be accurately performed.

  As shown in FIGS. 3 and 4, the first connection portion 3 is supported and fixed on the base 172 of the base portion 171 via a support member 174. Similarly, the second connection portion 4 is also supported and fixed on the base 172 of the base portion 171 via a support member 175. Since the first connection portion 3 and the second connection portion 4 are disposed on the common base 172, connection work to each connection portion can be easily performed.

  Moreover, the 1st connection part 3 and the 2nd connection part 4 are arrange | positioned in the mutually different position on the base 172, and are arrange | positioned in the other side through the support | pillar 173 of the base 171 in this embodiment. . In particular, as shown in FIG. 3, the first connection portion 3 is arranged on the supply region A2 side, that is, on the right side (one side) toward the window portion 731, and the second connection portion 4 is on the collection region A4 side, That is, it is arranged on the left side (the other side) toward the window portion 731. With such an arrangement, when the connecting operation of the pressing unit 23 to the heating part side first connection part 24 and the connection part to the heating part side second connection part 25 are performed, the heating part side first connection part 24 is mistaken. Thus, it is possible to reduce erroneous connections such as connecting to the second connection part 4 or connecting the heating part side second connection part 25 to the first connection part 3 by mistake. In addition, since each connection work can be confirmed through the window portion 731, the connection work can be easily performed.

  As shown in FIG. 4, when connecting the first connection portion 3 and the heating portion side first connection portion 24, the connection direction AR <b> 1 ′ of the heating portion side first connection portion 24 to the first connection portion 3 is set. The connection work is performed in alignment with the connection direction AR1 toward the first connection portion 3. Moreover, when performing the connection work of the 2nd connection part 4 and the heating part side 2nd connection part 25, connection direction AR2 'to the 2nd connection part 4 of the heating part side 2nd connection part 25 is set to 2nd connection part. The connection work is performed in alignment with the connection direction AR2 toward 4. The connection direction AR1 and the connection direction AR2 are both directed in the horizontal direction, but are directed in opposite directions toward each other. On the other hand, when the connection direction AR1 and the connection direction AR2 are directed inward, the support column 173 may interfere with each connection work. However, since the connection direction AR1 and the connection direction AR2 are directed outward as described above, the support column 173 can be prevented from interfering with each connection work.

  As shown in FIGS. 3 and 4, the first connecting portion 3 has one first connector 31 and two second connectors 32. Correspondingly, the heating part side first connection part 24 also has one heating part side first connector 241 and two heating part side second connectors 242. The first connector 31 is connected to the heaters 233 of the first heating unit 231a to the eighth heating unit 231h via the heating unit side first connector 241. Each second connector 32 is connected to the temperature sensor 234 of the first heating unit 231a to the eighth heating unit 231h via the heating unit side second connector 242. Thus, for example, wiring becomes easy because the 1st connection part 3 has the 1st connector 31 and the 2nd connector 32 from which a function differs separately.

  Further, the second connection portion 4 has one first connector 41 and two second connectors 42. Correspondingly, the heating part side second connection part 25 also has one heating part side first connector 251 and two heating part side second connectors 252. The first connector 41 is connected to the heaters 233 of the ninth heating unit 231i to the twelfth heating unit 231L via the heating unit side first connector 251. Each second connector 42 is connected to the temperature sensor 234 of the ninth heating unit 231i to the twelfth heating unit 231L via the heating unit side second connector 252. And like the 1st connection part 3, also in the 2nd connection part 4, wiring becomes easy, for example by having the 1st connector 41 and the 2nd connector 42 from which a function differs.

  As shown in FIGS. 3 and 4, the arrangement of the first connector 31 and the second connector 32 in the first connection part 3, and the arrangement of the first connector 41 and the second connector 42 in the second connection part 4. Is the same arrangement, and therefore, the arrangement at the first connecting portion 3 will be described below representatively.

  Each second connector 32 is disposed via the first connector 31. As a result, the arrangement balance is relatively good, which leads to, for example, reduction of erroneous connections.

  The first connector 31 and the second connectors 32 are arranged along the Y direction (in the horizontal direction). Assuming that the first connector 31 and the second connectors 32 are arranged along the Z direction (in the vertical direction), the connection work to the connector located at the lowest position is There is a tendency that it is difficult to perform the connection work to the connector, and workability is lowered. However, since the first connector 31 and each second connector 32 are arranged along the Y direction, the workability of the connection work to each connector becomes substantially the same.

  As shown in FIG. 6, in the device transport head 17 to which the pressing unit 23 is attached, serial wiring is used as a detection unit that detects that no connection is made in either the first connection unit 3 or the second connection unit 4. 26 is configured to perform its function.

  The serial wiring 26 can pass a signal for determining that the connection is not established in either the first connection portion 3 or the second connection portion 4. For example, as shown in FIG. 6, when the connection is made in either the first connection unit 3 or the second connection unit 4, the signal generated from the control unit 800 is transmitted from the first connection unit 3 and the second connection unit. The signal is returned to the control unit 800 again via the unit 4 in order, that is, the signal is received by the control unit 800. On the other hand, when the connection is not established in either the first connection unit 3 or the second connection unit 4, no signal is received by the control unit 800. In this case, it is determined that the serial wiring 26 is disconnected in the middle, and it is determined that the connection is not established in either the first connection unit 3 or the second connection unit 4, and that fact is notified by the monitor 300 or the speaker 500, for example. The

  Note that “the serial wiring 26 is disconnected” includes a state in which the serial wiring 26 itself is disconnected in addition to a state in which the connection is not performed by the first connection unit 3 and the second connection unit 4 connection.

  As described above, the inspection device 1 can prevent forgetting to connect at the first connection unit 3 and the second connection unit 4 with a simple configuration using the serial wiring 26.

  Next, a screen when using the first connection unit 3 and the second connection unit 4 will be described with reference to FIGS.

  When using the 1st connection part 3 and the 2nd connection part 4, the 1st form 51 shown in FIG. 7 is first displayed on the monitor 300 (display screen 301). The first form 51 includes “Handling Mode” as the first menu 511, “Shuttle Mode” as the second menu 512, “Compliance Unit” as the third menu 513, and “ "Test Site Assign" is included. Then, in the third menu 513, “40 mm Square (1 unit / 1 device)” or “40 mm Square (1 unit / 2 devices)” can be selected. When the first connection unit 3 and the second connection unit 4 are used, “40 mm Square (1 unit / 1 device)” is selected. When only the first connection unit 3 is used and the second connection unit 4 is not used, “40 mm Square (1 unit / 2 devices)” is selected. As described above, the third menu 513 is a setting unit that can display whether or not the second connection unit 4 is used. Thereby, the user who uses the inspection apparatus 1 uses the first connection part 3 and the second connection part 4, uses only the first connection part 3, and uses the second connection part 4. The second usage mode not to be used can be appropriately changed as necessary.

  After selecting “40 mm Square (1 unit / 1 device)” in the third menu 513, the second form 52 is displayed on the monitor 300. The second form 52 includes “Setup Files” as the first menu 521, “Test Site” as the second menu 522, “User Select” as the third menu 523, and “User Select” as the fourth menu 524. “Temperature”, “Tester” as the fifth menu 525, “Run Mode” as the sixth menu 526, “Start mode” as the seventh menu 527, “Bin Setting” as the eighth menu 528 "Input Shuttle" as the ninth menu 529, "Hotplate" as the tenth menu 530, "Arm2" as the eleventh menu 531, "Arm1" as the twelfth menu 532, and the thirteenth menu 533 “Socket Heat” and “Socket Air” as the fourteenth menu 534 are included. Then, in the twelfth menu 532, the temperature of the heating unit 231 with the number from “1” to “8” can be input and set, and within the eleventh menu 531, the heating unit 231 with the number “9” or later. The temperature can be input and set. Thus, the eleventh menu 531 and the twelfth menu 532 are screens corresponding to the state in which the first connection unit 3 and the second connection unit 4 are used. Thereby, the temperature of each heating part 231 can be set individually.

  Further, when another predetermined operation is performed on the monitor 300, the third form 54 shown in FIG. The third form 54 includes “Temperature Mode” as the first menu 541, “Priority Mode” as the second menu 542, “Ambient Mode Setting” as the third menu 543, and the fourth menu 544. "High / Cold / Ambient Control / Dehumidification Mode Setting", "Base-points" as the fifth menu 545, "Extra Offset" as the sixth menu 546, and "Temperature offset testing" as the seventh menu 547 "Socket Heater" as the eighth menu 548, "Temperature Offset Setting" as the ninth menu 549, "Arm2" as the tenth menu 550, and "Plate / Shattle / SocketHeater" as the eleventh menu 551 / AirBlow "and" Arm1 "as the twelfth menu 552. In the tenth menu 550, a correction value of the temperature of the heating unit 231 with the number “9” or later, that is, an offset value can be input and set. In the twelfth menu 552, the number starts from “1”. The correction value of the temperature of the heating unit 231 up to “8” can be input and set.

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 10 and 11. However, the differences from the above-described embodiment will be mainly described and the same matters will be described. Will not be described.

  This embodiment is the same as the first embodiment except that the number of heating units in the pressing unit is different.

  As shown in FIG. 10, in this embodiment, the pressing unit 23 includes heating units 231 that are arranged in the X direction and four in the Y direction. These eight heating units 231 are a first heating unit 231a to an eighth heating unit 231h, respectively. When such a pressing unit 23 is mounted on the device transport head 17, the first connection unit 3 is used and the second connection unit 4 is not used.

  In this case, “40 mm Square (1 unit / 2 devices)” is selected in the third menu 513 of the first form 51. Thereafter, the second form 52 ′ shown in FIG. 11 is displayed on the monitor 300. Unlike the second form 52 described in the first embodiment, the second form 52 ′ includes “Arm2” as the eleventh menu 531 ′ and “Arm1” as the twelfth menu 532 ′. . Then, in “Arm1” as the twelfth menu 532 ′, the temperature of the heating unit 231 with the numbers “1” to “4” can be input and set, and the “Arm2” as the eleventh menu 531 ′ can be input. Thus, the temperature of the heating unit 231 whose number is “5” or later can be input and set. As described above, the eleventh menu 531 ′ and the twelfth menu 532 ′ are screens corresponding to a state in which only the first connection unit 3 is used. Thereby, the temperature of the eight heating parts 231 can be set individually.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In addition, the connection direction to the first connection portion and the connection direction to the second connection portion are both horizontal in the above-described embodiments, but at least one of the connection directions may be a vertical direction. .

  In addition, the number of second connectors provided in the first connection portion and the second connection portion is two in each of the embodiments described above, but is not limited thereto, and may be three or more, for example.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus), 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 15 ... Tray conveyance mechanism, 16 ... Inspection 17: Device transport head, 171 ... Base, 172 ... Base, 173 ... Column, 174 ... Support member, 175 ... Support member, 18 ... Device collection unit, 19 ... Collection tray, 20 ... Device transport head, 21 ... Tray transport mechanism, 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 23 ... Pressing unit, 231 ... Heating unit, 231a ... First heating unit, 231b ... Second heating unit, 231c ... Third heating unit, 231d ... First 4th heating part, 231e ... 5th heating part, 231f ... 6th heating part, 231g ... 7th heating part, 231h ... 8th heating part, 231i ... 9th heating part, 23 j ... 10th heating part, 231k ... 11th heating part, 231L ... 12th heating part, 232 ... support part, 233 ... heater, 234 ... temperature sensor, 24 ... heating part side first connection part, 241 ... heating part side 1st connector, 242 ... heating part side second connector, 25 ... heating part side second connection part, 251 ... heating part side first connector, 252 ... heating part side second connector, 26 ... serial wiring, 3 ... first Connection part 31 ... first connector 32 ... second connector 4 ... second connection part 41 ... first connector 42 ... second connector 51 ... first form 511 ... first menu 512 ... second Menu 513 ... Third menu 514 ... Fourth menu 52 ... Second form 52 '... Second form 521 ... First menu 522 ... Second menu 523 ... Third menu 524 4th menu, 525 ... 5th menu, 526 ... 6th menu, 527 ... 7th menu, 528 ... 8th menu, 529 ... 9th menu, 530 ... 10th menu, 531 ... 11th menu, 531 '... 1st 11th menu, 532 ... 12th menu, 532 '... 12th menu, 533 ... 13th menu, 534 ... 14th menu, 54 ... 3rd form, 541 ... 1st menu, 542 ... 2nd menu, 543 ... 3rd Menu, 544 ... 4th menu, 545 ... 5th menu, 546 ... 6th menu, 547 ... 7th menu, 548 ... 8th menu, 549 ... 9th menu, 550 ... 10th menu, 551 ... 11th menu, 552 ... 12th menu, 61 ... 1st partition, 62 ... 2nd partition, 63 ... 3rd partition, 64 ... 4th partition, 65 ... 5th partition, 70 ... Front cover, 71 ... Side cover, 72 ... Side cover, 73 ... Rear cover, 731 ... Window, 74 ... Top cover, 90 ... IC device, 200 ... Tray (mounting member), 300 ... Monitor, 301 ... Display Screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Mouse table, 700 ... Operation panel, 800 ... Control unit, 900 ... External power supply, A1 ... Tray supply area, A2 ... Device supply area (supply area), A3 ... Inspection Area, A4 ... Device collection area (collection area), A5 ... Tray removal area, AR1 ... Connection direction, AR1 '... Connection direction, AR2 ... Connection direction, AR2' ... Connection direction, G1 ... First group, G2 ... Second group

Claims (20)

A base on which a plurality of heating units for heating electronic components are mounted;
A first connection unit capable of supplying power to a heating unit belonging to one group of the plurality of heating units;
An electronic component transport apparatus comprising: a second connection portion capable of supplying power to a heating portion belonging to another group different from the one group among the plurality of heating portions.   The electronic component transport apparatus according to claim 1, wherein the first connection portion and the second connection portion are arranged at different positions.   The electronic component transport apparatus according to claim 1, wherein the first connection portion and the second connection portion are disposed on the base portion.   The electronic component carrying device according to claim 3, wherein the first connection portion and the second connection portion are disposed on opposite sides of the base portion. A supply unit for supplying the electronic component toward the heating unit;
A recovery unit for recovering the electronic component from the heating unit;
5. The electronic component conveying apparatus according to claim 1, wherein the first connection portion is disposed on the supply portion side, and the second connection portion is disposed on the collection portion side. Having a window portion that is visible at the closest position to the base,
6. The electronic component carrying device according to claim 1, wherein the first connection portion is disposed on one side toward the window portion, and the second connection portion is disposed on the other side.   The electronic component conveying apparatus according to claim 1, wherein the heating unit includes a heater that generates heat when energized and a temperature sensor that detects a temperature of the heating unit.   The electronic component according to claim 7, wherein each of the first connection part and the second connection part includes a first connector connected to the heater and a plurality of second connectors connected to the temperature sensor. Conveying device.   The electronic component transport apparatus according to claim 8, wherein each of the second connectors is disposed via the first connector.   The electronic component transport apparatus according to claim 8 or 9, wherein the first connector and the second connectors are arranged in a horizontal direction.   The electronic component transport apparatus according to any one of claims 1 to 10, wherein a connection direction of each of the first connection portion and the second connection portion is a horizontal direction.   The electronic component transport apparatus according to any one of claims 1 to 11, wherein the first connection portion and the second connection portion are connected in directions opposite to each other. A predetermined number of the heating units are provided,
The electronic component transport apparatus according to claim 1, wherein the first connection unit is capable of supplying electric power to the predetermined number of heating units.   The electronic component conveying apparatus according to claim 13, wherein the second connecting unit is capable of supplying electric power to the heating unit exceeding the predetermined number.   The electronic component transport apparatus according to claim 13 or 14, wherein the predetermined number is eight.   The electronic component carrying device according to any one of claims 1 to 15, further comprising a detection unit that detects that the connection is not established in any of the first connection unit and the second connection unit.   17. The detection unit according to claim 16, wherein the detection unit is configured by serial wiring, and detects that the connection is not established in any of the first connection unit and the second connection unit when the serial wiring is disconnected. Electronic component transfer device.   The electronic component carrying apparatus according to any one of claims 1 to 16, further comprising a setting unit that can set and display whether or not the second connection unit is used. When the second connection part is not used, the fact that the first connection part is used can be displayed on the screen,
The electronic component conveyance according to any one of claims 1 to 17, wherein when the second connection portion is used, the fact that the first connection portion and the second connection portion are used can be displayed on a screen. apparatus. A base on which a plurality of heating units for heating electronic components are mounted;
A first connection unit capable of supplying power to a heating unit belonging to one group of the plurality of heating units;
A second connecting part capable of supplying power to a heating part belonging to another group different from the one group among the plurality of heating parts;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

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