JP2017113788A - 光加工装置 - Google Patents

光加工装置 Download PDF

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Publication number
JP2017113788A
JP2017113788A JP2015252195A JP2015252195A JP2017113788A JP 2017113788 A JP2017113788 A JP 2017113788A JP 2015252195 A JP2015252195 A JP 2015252195A JP 2015252195 A JP2015252195 A JP 2015252195A JP 2017113788 A JP2017113788 A JP 2017113788A
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JP
Japan
Prior art keywords
processing
workpiece
optical
light
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2015252195A
Other languages
English (en)
Japanese (ja)
Inventor
中島　智宏
Tomohiro Nakajima
智宏 中島
涼真 中村
Ryoma Nakamura
涼真 中村
杉浦　康一
Koichi Sugiura
康一 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP2015252195A priority Critical patent/JP2017113788A/ja
Priority to TW105138302A priority patent/TWI682823B/zh
Priority to CN201611186186.XA priority patent/CN106914703B/zh
Priority to CN201621403006.4U priority patent/CN206519655U/zh
Publication of JP2017113788A publication Critical patent/JP2017113788A/ja
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2015252195A 2015-12-24 2015-12-24 光加工装置 Ceased JP2017113788A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015252195A JP2017113788A (ja) 2015-12-24 2015-12-24 光加工装置
TW105138302A TWI682823B (zh) 2015-12-24 2016-11-22 光學加工裝置
CN201611186186.XA CN106914703B (zh) 2015-12-24 2016-12-20 光加工装置
CN201621403006.4U CN206519655U (zh) 2015-12-24 2016-12-20 光加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015252195A JP2017113788A (ja) 2015-12-24 2015-12-24 光加工装置

Publications (1)

Publication Number Publication Date
JP2017113788A true JP2017113788A (ja) 2017-06-29

Family

ID=59231275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015252195A Ceased JP2017113788A (ja) 2015-12-24 2015-12-24 光加工装置

Country Status (3)

Country Link
JP (1) JP2017113788A (zh)
CN (2) CN106914703B (zh)
TW (1) TWI682823B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107598382A (zh) * 2017-07-26 2018-01-19 苏州市长峰激光技术有限公司 具有分选功能的全自动pcb激光打码机、方法及系统
WO2022190426A1 (ja) * 2021-03-09 2022-09-15 オムロン株式会社 レーザマーカ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109848574A (zh) * 2017-11-29 2019-06-07 大族激光科技产业集团股份有限公司 进结速度与送料速度匹配的控制方法、装置以及存储介质
CN108391847A (zh) * 2018-03-16 2018-08-14 山西大学 一种基于图像处理的卷烟激光打标系统和方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0871780A (ja) * 1994-09-05 1996-03-19 Tdk Corp レーザ位置決め加工方法及び装置
JP2003225788A (ja) * 2002-01-31 2003-08-12 Toppan Printing Co Ltd 帯状包装材料のレーザー加工方法
JP2004090062A (ja) * 2002-09-02 2004-03-25 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
JP2005211979A (ja) * 2004-01-30 2005-08-11 Sunx Ltd レーザマーキング装置及びレーザマーキング方法
JP2011240403A (ja) * 2010-05-20 2011-12-01 Aflair Inc 自走式ガルバノスキャナを搭載したレーザ加工機

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2722626B2 (ja) * 1989-03-15 1998-03-04 日本電気株式会社 連続タイバー切断装置
JP2800600B2 (ja) * 1992-11-30 1998-09-21 株式会社日立製作所 レーザ加工装置
US7006237B2 (en) * 2002-03-26 2006-02-28 Mitsubishi Denki Kabushiki Kaisha Laser beam positioning device for laser processing equipment
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation
JP2011103431A (ja) * 2009-10-16 2011-05-26 Tomoo Matsushita パターン形成装置
WO2012029142A1 (ja) * 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
WO2013114593A1 (ja) * 2012-02-01 2013-08-08 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
JP5808267B2 (ja) * 2012-02-20 2015-11-10 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
CN103293865B (zh) * 2012-02-28 2015-05-13 上海微电子装备有限公司 工件台位置误差测量及预先补偿的方法
KR20130125438A (ko) * 2012-05-09 2013-11-19 주식회사 영우디에스피 극초단 펄스 레이저의 단일광자 흡수를 이용한 레이저 가공장치
WO2014158346A1 (en) * 2013-03-13 2014-10-02 Applied Materials, Inc. Laser ablation platform for solar cells
JP5728065B2 (ja) * 2013-11-12 2015-06-03 株式会社片岡製作所 レーザ加工機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0871780A (ja) * 1994-09-05 1996-03-19 Tdk Corp レーザ位置決め加工方法及び装置
JP2003225788A (ja) * 2002-01-31 2003-08-12 Toppan Printing Co Ltd 帯状包装材料のレーザー加工方法
JP2004090062A (ja) * 2002-09-02 2004-03-25 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
JP2005211979A (ja) * 2004-01-30 2005-08-11 Sunx Ltd レーザマーキング装置及びレーザマーキング方法
JP2011240403A (ja) * 2010-05-20 2011-12-01 Aflair Inc 自走式ガルバノスキャナを搭載したレーザ加工機

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107598382A (zh) * 2017-07-26 2018-01-19 苏州市长峰激光技术有限公司 具有分选功能的全自动pcb激光打码机、方法及系统
CN107598382B (zh) * 2017-07-26 2019-02-12 苏州市长峰激光技术有限公司 具有分选功能的全自动pcb激光打码机、方法及系统
WO2022190426A1 (ja) * 2021-03-09 2022-09-15 オムロン株式会社 レーザマーカ
JP7567568B2 (ja) 2021-03-09 2024-10-16 オムロン株式会社 レーザマーカ

Also Published As

Publication number Publication date
TWI682823B (zh) 2020-01-21
CN106914703B (zh) 2019-06-28
CN106914703A (zh) 2017-07-04
CN206519655U (zh) 2017-09-26
TW201722602A (zh) 2017-07-01

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