JP2017112199A5 - - Google Patents
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- Publication number
- JP2017112199A5 JP2017112199A5 JP2015244936A JP2015244936A JP2017112199A5 JP 2017112199 A5 JP2017112199 A5 JP 2017112199A5 JP 2015244936 A JP2015244936 A JP 2015244936A JP 2015244936 A JP2015244936 A JP 2015244936A JP 2017112199 A5 JP2017112199 A5 JP 2017112199A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- wiring
- wiring layer
- position recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 47
- 239000002356 single layer Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims 11
- 238000004381 surface treatment Methods 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015244936A JP6623056B2 (ja) | 2015-12-16 | 2015-12-16 | 配線基板、半導体装置 |
| US15/367,264 US10109580B2 (en) | 2015-12-16 | 2016-12-02 | Wiring board and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015244936A JP6623056B2 (ja) | 2015-12-16 | 2015-12-16 | 配線基板、半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017112199A JP2017112199A (ja) | 2017-06-22 |
| JP2017112199A5 true JP2017112199A5 (enExample) | 2018-12-13 |
| JP6623056B2 JP6623056B2 (ja) | 2019-12-18 |
Family
ID=59067134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015244936A Active JP6623056B2 (ja) | 2015-12-16 | 2015-12-16 | 配線基板、半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10109580B2 (enExample) |
| JP (1) | JP6623056B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112021005387T5 (de) * | 2020-11-19 | 2023-07-20 | Tdk Corporation | Montageplatte und leiterplatte |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001060602A (ja) * | 1999-08-23 | 2001-03-06 | Fuji Electric Co Ltd | フリップチップ実装構造及びその製造方法 |
| JP5117692B2 (ja) * | 2006-07-14 | 2013-01-16 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| KR20080042012A (ko) * | 2006-11-08 | 2008-05-14 | 산요덴키가부시키가이샤 | 소자 탑재용 기판, 그 제조 방법, 반도체 모듈 및 휴대기기 |
| JP5003812B2 (ja) * | 2009-12-10 | 2012-08-15 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| US9815149B2 (en) * | 2011-02-25 | 2017-11-14 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| US8923008B2 (en) * | 2011-03-08 | 2014-12-30 | Ibiden Co., Ltd. | Circuit board and method for manufacturing circuit board |
| TWI533424B (zh) | 2012-04-26 | 2016-05-11 | 旭德科技股份有限公司 | 封裝載板 |
| JP2014146638A (ja) * | 2013-01-28 | 2014-08-14 | Toray Ind Inc | 半導体装置の製造方法 |
| JP2015138820A (ja) * | 2014-01-21 | 2015-07-30 | イビデン株式会社 | プリント配線板とその製造方法 |
| JP6691451B2 (ja) * | 2015-08-06 | 2020-04-28 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置 |
-
2015
- 2015-12-16 JP JP2015244936A patent/JP6623056B2/ja active Active
-
2016
- 2016-12-02 US US15/367,264 patent/US10109580B2/en active Active
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