JP2017073456A - Connection member cutting device, cutting die, connection member cutting method and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection member cutting device capable of cutting off a connection member from a plate-like member at high productivity.SOLUTION: A connection member cutting device comprises: a lower die 110 having a lower insert 111 on which a connection member 40 can be placed in a state aligned along a predetermined direction; an upper die 120 having an upper insert 121 provided with a holding part 123; and a punch 130 movable in the vertical direction. The upper insert 121 shears a coupling portion CP having a fixed position adjustment part so as to cut off the connection member 40 from a plate-like member H. The fixed position adjustment part makes it possible to fix the upper insert 121 to an upper die plate 122 at a position displaced along a predetermined direction A or along a direction opposite thereto from a position corresponding to the lower insert 111.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a connecting member disconnecting device, a cutting die, a connecting member disconnecting method, and an electronic device manufacturing method.

  Conventionally, in a state in which an electronic component is fixed by a cutting die composed of a lower die and an upper die, the connecting portion between the flat plate member and the electronic component is sheared using a punch to remove the electronic component from the flat plate member. An electronic component separating apparatus for separating is known (for example, see Patent Document 1).

  As shown in FIG. 9, a conventional electronic component separating apparatus 900 is provided at a position opposite to the lower mold 910 on which the electronic component 800 can be placed, and a base 810 (electronic An upper mold 920 having a pressing portion 923 that presses a part 800 to be a lead of the component 800 from above, and a punch 930 provided at a position adjacent to the lower mold 910 and movable in the vertical direction.

  In the present specification, the “connecting portion” between the flat plate member and the electronic component (connecting member) refers to a portion corresponding to the boundary between the flat plate member and the base of the electronic component (connecting member). In addition, in this specification, the “base” of the electronic component (connecting member) refers to a portion on the flat member side of the electronic component (connecting member).

  When the electronic component 800 is separated from the flat plate member H using the conventional electronic component separation apparatus 900, the connecting portion CP between the flat plate member H and the electronic component 800 is moved by moving the punch 930 from the lower side to the upper side. The electronic component 800 is separated from the flat plate member H.

  According to the conventional electronic component separating apparatus 900, the lower mold 910 on which the electronic component 800 can be placed and the base 810 of the electronic component 800 (the leads of the electronic component 800 and the lower mold 910) are provided. The electronic component 800 can be fixed because the upper mold 920 having the pressing portion 923 that holds the portion) from above is provided. Accordingly, the electronic component 800 can be separated from the flat plate member H by moving the punch 930 in the vertical direction to shear the connecting portion CP between the flat plate member H and the electronic component 800.

JP-A-4-321263

  In general, when the connection between the flat plate member and the electronic component is repeatedly sheared by the electronic component separating apparatus, the outer surface (the flat plate member side) of the pressing portion (see the region surrounded by the broken line D in FIG. 9). ) Will be worn. If the connection part is sheared in such a state where wear has occurred, cutting burrs are likely to occur at the base of the electronic component, so replace the mold with a wear-free surface on the outside of the holding part. There is a need to.

  However, in the conventional electronic component separating apparatus, when wear occurs on the outer surface of the pressing portion 923, it is necessary to replace the entire upper mold 920, which takes time and labor to replace, which is high. There is a problem that it is difficult to separate the electronic component from the flat plate member for productivity. Such a problem is not a problem that occurs only when the electronic component is separated from the flat plate member, but is a problem that similarly occurs when the connection member for connecting the electronic component is separated from the flat plate member.

  Accordingly, the present invention has been made to solve the above-described problem, and a connecting member disconnecting device, a connecting member disconnecting method, and an electronic device manufacturing method capable of disconnecting a connecting member from a flat plate member with high productivity. It aims to provide a method. Moreover, it aims at providing the cutting die used for such a connection member cutting device.

  The inventors of the present invention have made extensive efforts to achieve the above object, and as a result, at least the upper mold has a nesting structure, and the upper nesting of the upper mold is worn before becoming unusable. By fixing the upper nesting at a position shifted from the position corresponding to the nesting in a predetermined direction or in the opposite direction, the above problem can be solved without replacing the entire upper mold. The present invention has been completed.

[1] A connecting member separating apparatus according to the present invention is a cutting die composed of a lower die and an upper die, and a plurality of connecting members for connecting electronic components connected along the outer edge of a flat plate member. A connecting member disconnecting device for shearing a connecting portion of the flat plate member and the connecting member with a punch in a fixed state to disconnect the connecting member from the flat plate member, wherein the connecting member is predetermined The lower mold having a lower insert that can be placed in a state of being aligned along the direction of the lower mold and a lower mold plate that fixes the lower insert; and a position facing the lower insert; and An upper mold having an upper insert having a pressing portion for pressing the base from above, an upper mold having an upper mold plate for fixing the upper insert, and the punch provided at a position adjacent to the lower insert and movable in the vertical direction. , Top nesting And a fixed position adjusting section that allows the upper insert to be fixed to the upper mold plate at a position shifted from the position corresponding to the lower insert along the predetermined direction or the opposite direction. It is characterized by.
It is characterized by that.

  In this specification, “adjacent position” means not only when one member is adjacent to the other member when viewed as a whole, but when one member is viewed as a whole, one member is the other member. However, when a part of the member is enlarged, one member is adjacent to the other member.

[2] In the connection member disconnecting device of the present invention, the fixed position adjusting portion is a screw hole for screwing the upper insert to the upper mold plate, and extends along the predetermined direction. It is preferable to have a long hole shape.

[3] In the connection member disconnecting device of the present invention, it is preferable that the pressing portion extends along the predetermined direction.

[4] In the connecting member separating apparatus according to the present invention, when the upper insert is fixed to the upper mold plate at a position shifted from the position corresponding to the lower insert along the predetermined direction or the opposite direction. It is preferable that the relationship of D <L is satisfied, where D is the amount of shift of the upper nesting and L is the distance between the connecting portions of the adjacent connecting members.

[5] In the connecting member separating apparatus according to the present invention, when the upper insert is fixed to the upper mold plate at a position shifted from the position corresponding to the lower insert along the predetermined direction or the opposite direction. It is preferable that the relationship of D> W is satisfied, where D is the amount of shift of the upper nesting, and W is the width in the axial direction parallel to the predetermined direction at the connecting portion of the connecting member.

[6] In the connecting member separating apparatus according to the present invention, the shape of the upper nest is a columnar shape having a cross-sectional shape corresponding to the shape of the connecting member and extending in the predetermined direction. It is preferable that

[7] A cutting die according to the present invention is a cutting die used for the connecting member cutting device according to any one of [1] to [6], and the connecting members are arranged in a predetermined direction. A lower mold having the lower insert that can be placed and a lower mold plate that fixes the lower insert; and a pressing portion that is provided at a position facing the lower insert and presses the base of the connection member from above. An upper mold having an upper mold plate and an upper mold plate for fixing the upper insert, and the upper insert is shifted from a position corresponding to the lower insert along the predetermined direction or a direction opposite thereto. It further has a fixed position adjusting part which makes it possible to fix the upper nest to the upper mold plate at a position.

[8] In the connecting member disconnecting method of the present invention, a plurality of connecting members for connecting electronic components connected along the outer edge of the flat plate member are fixed with a lower mold and an upper mold. A connecting member separating method for shearing a connecting portion between a flat plate member and the connecting member using a punch to separate the connecting member from the flat plate member, wherein a plurality of the connecting members are connected along an outer edge. A connecting member mounting step of transporting the flat plate member, and mounting the connecting member in a state of being aligned in a predetermined direction at a predetermined position of the lower insert of the lower mold; and the lower insert, A connecting member fixing step of fixing the connecting member by pressing a base portion of the connecting member from above with a pressing portion of an upper nest of the upper mold provided at an opposing position; the flat plate member and the connecting member; Before A connecting member disconnecting step for disconnecting the connecting member from the flat plate member in this order by shearing using the punch that is provided at a position adjacent to the lower insert and that is movable in the vertical direction. After repeating a predetermined number of times from the placing step to the connecting member separating step, the position of the upper nesting is shifted from the position corresponding to the lower nesting along the predetermined direction or the opposite direction, The steps from the connecting member placing step to the connecting member separating step are repeated.

[9] A semiconductor device manufacturing method of the present invention is a semiconductor device manufacturing method for manufacturing a semiconductor device in which a chip and a lead frame are connected via a connecting member for connecting an electronic component. A first step of separating the connection member; and joining the connection member separated from the flat plate member in the first step to the chip and the lead frame, respectively, and thereby connecting the chip and the chip via the connection member. A second step of connecting a lead frame, wherein the first step conveys the flat plate member in which a plurality of the connecting members are connected along an outer edge, and is used to set a lower insert of a lower mold. A connecting member mounting step for mounting the connecting members in a state aligned in a predetermined direction at a position, and a presser of an upper nest provided at a position facing the lower nest A connecting member fixing step for fixing the connecting member by pressing the base of the connecting member from above, and a connecting portion between the flat plate member and the connecting member is provided at a position adjacent to the lower insert, and And a connecting member disconnecting step for disconnecting the connecting member from the flat plate member in this order by shearing using a vertically movable punch, and a predetermined process from the connecting member placing step to the connecting member disconnecting step. After the number of repetitions of the above, in the state where the position of the upper nesting is shifted from the position corresponding to the lower nesting along the predetermined direction or the opposite direction, the connecting member separating step from the connecting member placing step The process is repeated.

  According to the connecting member disconnecting device and the cutting die of the present invention, the upper nest is fixed to the upper mold plate at a position shifted from the position corresponding to the lower nest along a predetermined direction or the opposite direction. Since the fixing position adjusting portion that enables the upper nesting plate is provided, the position where the upper nesting is fixed to the upper mold plate can be shifted from the position corresponding to the lower nesting. Therefore, if wear has occurred on the outer surface of the holding part (on the flat plate side), there is still wear of the holding part of the upper nest by adjusting the fixed position without replacing the upper nest. The connecting portion can be sheared by using a portion that is not. As a result, the number of times of exchanging the upper insert can be reduced, and the connecting member can be separated from the flat plate member with high productivity.

  Further, according to the connecting member disconnecting device and the cutting die of the present invention, since the upper die having the upper nesting is provided, the outer side of the pressing portion is also located at the position shifted from the position corresponding to the lower nesting by the fixed position adjusting portion. Even if the surface has worn, it is only necessary to replace the upper insert without replacing the entire upper mold, and it takes less time to replace parts than when replacing the entire upper mold. The connecting member can be separated from the flat plate member with higher productivity.

  According to the connecting member disconnecting method and the electronic device manufacturing method of the present invention, after repeating the connecting member placing step to the connecting member disconnecting step a predetermined number of times, the position of the upper nest is determined from the position corresponding to the lower nest. In order to repeat the process from the connecting member placing process to the connecting member disconnecting process while being shifted along the direction or the opposite direction, replace the upper nest when the outer surface of the holding part is worn. Even if it is not necessary, by adjusting the fixing position, it is possible to shear the connecting portion by using a portion of the pressing portion of the upper nest that has not yet been worn, and the number of times of exchanging the upper nest can be reduced. As a result, the connection member can be separated from the flat plate member with high productivity, and the electronic device can be manufactured with high productivity.

  Further, according to the connecting member disconnecting method and the electronic device manufacturing method of the present invention, since the upper insert is used, the outer surface of the pressing portion is worn even at a position shifted from the position corresponding to the lower insert. In this case, it is only necessary to replace the upper nesting without replacing the entire upper mold, and it takes less time to replace the parts than when replacing the entire upper mold. As a result, the connecting member can be separated from the flat plate member with higher productivity, and an electronic device can be manufactured with higher productivity.

It is a figure shown in order to demonstrate the semiconductor device 1 and the connection member 40 in embodiment. 1A is a plan view of the semiconductor device 1, FIG. 1B is a cross-sectional view taken along the line AA of FIG. 1A, and FIG. 1C is a cross-sectional view of the connection member 40. It is a figure shown in order to demonstrate the flat member H in embodiment. It is sectional drawing shown in order to demonstrate the connection member disconnection apparatus 100 which concerns on embodiment. It is a figure shown in order to demonstrate the lower metal mold | die 110, the upper metal mold | die 120, the lower insert 111, and the upper insert 121 in embodiment. 4A is a plan view of the lower mold 110, FIG. 4B is a plan view of the upper mold 120, and FIG. 4C is a perspective view of the lower insert 111 and the upper insert 121. . It is a figure shown in order to demonstrate a mode that the connection member 40 connected with the flat member H was mounted in the lower nest 111 in the state arranged along the predetermined direction. FIG. 5A is a plan view showing a state in which the connecting members 40 connected to the flat plate member H are placed on the lower insert 111 in a state of being arranged along a predetermined direction, and FIG. It is CC sectional drawing of 5 (a). It is a figure shown in order to demonstrate the connection member disconnection method which concerns on embodiment. 6A and 6B are process diagrams. FIGS. 6A and 6B correspond to FIG. 5B. It is a figure shown in order to demonstrate the connection member disconnection method which concerns on embodiment. 7A and 7B are process diagrams. FIGS. 7A and 7B correspond to FIG. 5B. It is a figure shown in order to demonstrate the fixed position adjustment part 125 in embodiment. FIG. 8A is a view for explaining a state when the upper nest 121 is fixed to the upper mold plate 122 at a position L corresponding to the lower nest 111, and FIG. 8B corresponds to the lower nest 111. FIG. 8C is a view for explaining a state when the upper nest 121 is fixed to the upper mold plate 122 at a position shifted along the predetermined direction A from the position L to be performed, and FIG. 8C corresponds to the lower nest 111. It is a figure shown in order to demonstrate a mode when the upper nest 121 is fixed to upper mold board 122 in the position shifted along the direction opposite to predetermined direction A from position L to do. In addition, each left figure of Fig.8 (a)-FIG.8 (c) is a figure corresponding to the area | region enclosed with the broken line B of FIG.4 (b). It is a figure which shows the conventional electronic component separation apparatus 900. FIG. In FIG. 9, reference numeral 940 indicates a shudder.

  Hereinafter, a connecting member cutting device, a cutting die, a connecting member cutting method, and an electronic device manufacturing method according to the present invention will be described based on the embodiments shown in the drawings. In addition, each drawing is a schematic diagram and does not necessarily reflect an actual dimension exactly.

[Embodiment]
The connection member cutting apparatus 100 according to the embodiment is configured by cutting a plurality of connection members 40 for connecting electronic components along the outer edge of the flat plate member H into a lower mold 110 and an upper mold 120. In the state fixed with the metal mold | die, it is the connection member disconnection apparatus for shearing the connection part CP of the flat member H and the connection member 40 using the punch 130, and disconnecting the connection member 40 from the flat member H (FIG. 3). The connection member 40 separated from the flat plate member H by the connection member separation apparatus 100 according to the embodiment is used for manufacturing the semiconductor device 1 (electronic device).

1. Semiconductor Device 1 and Connection Member 40 The semiconductor device 1 includes a die pad 10, a chip 20 mounted on the die pad 10, a lead frame 30 disposed at a position separated from the die pad 10, and the chip 20 and the lead frame 30. And a connection member 40 for connecting electronic components that are electrically connected (see FIG. 1).

  The connection member 40 is a metal connector for connecting the chip 20 and the lead frame 30. The connection member 40 includes a chip connection portion 42 for connecting to the chip 20 and a lead frame connection portion 44 for connecting to the lead frame 30, and the chip connection portion 42 and the lead frame connection portion 44 form a bridge. They are connected in a state where they are hung (see FIG. 1C). The connection member 40 is stepped, and the height position of the chip connection portion 42 and the height position of the lead frame connection portion 44 are different.

  A plurality of connecting members 40 are connected at predetermined pitches along the outer edges of both ends of the flat plate member H in the short direction (see FIG. 2). The connecting member 40 is connected to the flat plate member H on the lead frame connecting portion 44 side, and is disconnected from the flat plate member H by cutting the connecting portion CP between the connecting member 40 and the flat plate member H. The flat member H is a metal hoop material, but an appropriate flat member (for example, a lead frame) can be used.

2. As shown in FIG. 3, the connection member separating apparatus 100 according to the embodiment includes a lower mold 110, an upper mold 120, a punch 130, a shudder 140, and a punch plate. 150 and a die plate 160. In the connecting member separating apparatus 100, a plurality of connecting members 40 connected to the outer edges at both ends in the short direction of the flat plate member H by moving the punch up and down once (in one embodiment, at one end). 20 pieces, 40 pieces at both ends) can be collectively separated from the flat plate member H (see FIG. 5A).

  The lower mold 110 is a plate-like member provided with a hole for inserting the punch 130 near the center. The lower mold 110 fixes the lower insert 111 and the lower insert 111 that can be placed in a state where a plurality of connection members 40 are arranged along a predetermined direction A (the same direction as the x direction in FIG. 4A). The lower mold plate 112 is provided (see FIGS. 3, 4A, and 5A).

  The lower nest 111 has a screw hole (not shown), and is fixed to the lower mold plate 112 by screwing in a state where the screw is passed through the screw hole. As the material of the lower nest 111, an appropriate material can be used, but it is preferable to use super steel that hardly causes wear.

  The shape of the lower nest 111 is a cross-sectional shape corresponding to the shape of the connection member 40 and a columnar shape extending along a predetermined direction A (see FIG. 4C). . In the lower nest 111, suction holes (not shown) for sucking and fixing the connection member 40 along the predetermined direction A correspond to the pitch at which the connection member 40 in the flat plate member H is coupled. It is provided with a pitch.

  The lower mold plate 112 has a guide hole 113 (see FIG. 4A), and is screwed in a state in which a guide pin (not shown) of a punch plate 150 described later passes through the guide hole 113. Is connected to a punch plate 150 to be described later.

  The upper mold 120 is a plate-like member provided with a hole for inserting the shudder 140 near the center. The upper mold 120 has an upper insert 121 provided at a position facing the lower insert 111 and an upper mold plate 122 for fixing the upper insert 121 (see FIGS. 3 and 4B).

  The upper mold plate 122 has a guide hole 126, and is fixed to the die plate 160 by screwing in a state where a guide pin (not shown) of the die plate 160 described later passes through the guide hole 126. (See FIG. 3 and FIG. 4B.)

  The upper insert 121 includes a pressing portion 123 that presses the base portion of the connection member 40 (which becomes the lead frame connection portion 44 after being detached) from above, a concave portion 124, and a fixed position adjustment portion 125. The shape of the upper nest 121 is a columnar shape whose cross-sectional shape corresponds to the shape of the connection member 40 and extends in a predetermined direction A (see FIGS. 3 and 4C). ). As the material of the upper nest 121, any suitable material can be used, but it is preferable to use super steel that hardly causes wear.

  The pressing portion 123 is a convex portion provided on the punch 130 side (the flat plate member H side) of the upper insert 121. The pressing portion 123 extends along a predetermined direction, and the outer surface (A surface in FIG. 4C) on the punch 130 side (flat plate member H side) is a flat surface.

  The recess 124 is formed in a shape corresponding to the cross-sectional shape of the connection member 40. The concave portion 124 is formed so that a gap is formed between the connecting member 40 and the upper insert 121 when the connecting member 40 is accommodated in the concave portion 124 in order to facilitate the removal of the connecting member 40 separated from the flat plate member H. ing.

  The fixed position adjusting portion 125 is a screw hole for screwing the upper insert 121 to the upper mold plate 122 and has a long hole shape extending along a predetermined direction A (FIG. 4B). )reference.). In the fixing position adjusting unit 125, the upper insert 121 can be fixed to the upper mold plate 122 by screwing the screw 170 in a state of passing through the screw hole (see FIG. 5B). In the fixing position adjusting unit 125, the lower nest 111 is fixed by fixing the screwing position near the center of the screw hole, at a position shifted from the center in a predetermined direction, or at a position shifted in a direction opposite to the predetermined direction. It is possible to fix the upper insert 121 to the upper mold plate 122 at a position shifted along a predetermined direction A or a direction opposite thereto from a position corresponding to (see FIG. 8).

  The displacement amount when the upper insert 121 is fixed to the upper mold plate 122 at a position shifted from the position L corresponding to the lower insert 111 along the predetermined direction A or the opposite direction is D, and the adjacent connecting member When the interval between the connecting portions CP at 40 is L, the relationship of D <L is satisfied (see FIG. 8). In addition, when the upper insert 121 is fixed to the upper mold plate 122 at a position shifted from the position L corresponding to the lower insert 111 along the predetermined direction A or the opposite direction, D, When the width of the connecting portion CP in the axial direction parallel to the predetermined direction A is W, the relationship of D> W is satisfied (see FIG. 8).

  The punch 130 is formed near the center of the punch plate 150. The punch 130 is provided at a position adjacent to the lower insert 111 (a position surrounded by the lower insert 111 as a whole), and is movable in the vertical direction. The punch 130 is moved in an upward direction in a state where the connecting member 40 is fixed by a cutting die composed of the lower die 110 and the upper die 120, so that the pressing portion 123 of the upper insert 121 and the punch 130 are moved. The connecting portion CP between the flat plate member H and the connecting member 40 can be sheared. As the material of the punch 130, an appropriate material can be used, but it is preferable to use super steel which hardly causes wear.

  The shudder 140 is provided above the punch 130 to prevent the punch 130 from moving too much upward. The punch plate 150 is provided below the lower mold 110, a guide pin (not shown) is provided at a predetermined position, and a punch 130 is erected near the center. The punch plate 150 can move the punch 130 up and down by moving the punch plate 150 up and down. The die plate 160 is provided above the upper mold 120, and a guide pin (not shown) is provided at a predetermined position.

  The lower mold 110 and the upper mold 120 constitute a cutting mold. That is, the cutting mold according to the embodiment includes a lower mold 111 having a lower insert 111 that can be placed in a state in which the connection members 40 are arranged in a predetermined direction, and a lower mold plate 112 that fixes the lower insert 111. The upper insert 121 having a pressing portion 123 provided at a position facing the lower insert 111 and pressing the base portion (lead frame connecting portion 44) of the connecting member 40 from above and an upper mold plate 122 for fixing the upper insert 121 are provided. The upper insert 121 is fixed to the upper mold plate 122 at a position shifted from a position corresponding to the lower insert 111 along a predetermined direction A or the opposite direction. It further has a fixed position adjustment unit 125 that makes it possible.

3. About the connecting member separating method according to the embodiment The connecting member separating method according to the embodiment uses the connecting member separating apparatus 100 according to the embodiment to connect a plurality of electronic components connected along the outer edge of the flat plate member H. In the state where the connecting member 40 is fixed by the lower insert 111 of the lower mold 110 and the upper insert 121 of the upper mold 120, the connecting portion CP between the flat plate member H and the connecting member 40 is used with the punch 130. This is a connecting member disconnecting method in which the connecting member 40 is disconnected from the flat plate member H by shearing.

  In the connection member separating method according to the embodiment, first, the upper nest 121 is fixed to the upper mold plate 122 by screwing the screw 170 in a state where the screw 170 penetrates the vicinity of the center of the screw hole in the fixing position adjusting unit 125. (See FIG. 8A.) At this time, the position of the upper nest 121 is a position L corresponding to the lower nest 111. Next, the connecting member placing step, the connecting member fixing step, and the connecting member separating step are repeated in this order (see FIGS. 6 and 7). Hereinafter, the connection member separating method according to the embodiment will be described in the order of steps.

(1) Connecting member placement step First, a flat plate member H in which a plurality of connecting members 40 for connecting electronic components are connected along the outer edge is intermittently conveyed by a conveying device (not shown) to The connecting member 40 is placed at a predetermined position in a state aligned along a predetermined direction (see FIGS. 5A and 6A).

(2) Connection member fixing step Next, the upper mold 120 is lowered by a driving device (not shown), so that the base portion (lead frame connection portion 44) of the connection member 40 is pressed from above by the pressing portion 123 of the upper insert 121. The connection member 40 is fixed by (see FIG. 6B).

(3) Connecting member disconnecting step Next, a connecting portion CP between the flat plate member H and the connecting member 40 is provided at a position adjacent to the lower insert 111, and the punch 130 movable in the vertical direction is moved upward from below. The connection member 40 is separated from the flat plate member H by shearing with the punch 130 and the pressing portion 123 of the upper insert 121 (see FIG. 7A). Next, after moving the punch 130 downward, the upper insert 121 is moved upward to release the connection member 40 from the fixed state (see FIG. 7B). Next, the suction of the connection member 40 from the suction hole in the lower mold 110 is stopped. Next, the connecting member 40 is moved from above the lower insert 111. Thereby, the connection member 40 can be separated from the flat plate member H.

  When the above steps (1) to (3) are repeated a predetermined number of times, wear occurs on the outer surface (on the flat plate member H side) of the pressing portion 123 of the upper insert 121 (in the right diagram of FIG. 8A). (See wear surface C1.) At this time, in the fixed position adjustment unit 125, the upper insert 121 is screwed to the upper mold plate 122 with a screw 170 at a position shifted along the predetermined direction A. In other words, the upper insert 121 is fixed to the upper mold plate 122 by screwing the screw 170 in a state where the screw 170 is penetrated through a position moved by a predetermined width D along the predetermined direction A from near the center of the screw hole. (Refer to the left figure in FIG. 8B.) Therefore, the position of the upper nest 121 is a position moved by D along the predetermined direction A from the position L corresponding to the lower nest 111. Accordingly, the connection member 40 can be separated from the flat plate member H using a region of the outer surface (the flat plate member H side) of the pressing portion 123 where no wear has occurred.

  After changing the position where the upper insert 121 is fixed to the upper mold plate 122 as described above, the above steps (1) to (3) are repeated. When each of the above steps (1) to (3) is repeated a predetermined number of times, only D along the predetermined direction A with respect to the outer surface (the flat plate member H side) of the pressing portion 123 of the upper insert 121 (on the flat plate member H side). Wear occurs on the surface of the moved position (see the wear surface C2 in the right diagram of FIG. 8B). At this time, in the fixed position adjusting unit 125, the upper insert 121 is screwed to the upper mold plate 122 with a screw 170 at a position shifted along a direction opposite to the predetermined direction A. In other words, the upper nesting 121 is secured by screwing the screw 170 in a state in which the screw 170 is passed through a position moved by a predetermined width D from the central position along a direction opposite to the predetermined direction A from near the center of the screw hole. Is fixed to the upper mold plate 122 (see the left figure in FIG. 8C). Therefore, the position of the upper nest 121 is a position moved by D along the direction opposite to the predetermined direction A from the position L corresponding to the lower nest 111. Accordingly, the connection member 40 can be separated from the flat plate member H using a region of the outer surface (the flat plate member H side) of the pressing portion 123 where no wear has occurred.

  After changing the position where the upper insert 121 is fixed to the upper mold plate 122 as described above, the above steps (1) to (3) are repeated. When the above steps are repeated a predetermined number of times, the surface of the upper insert 121 on the outer side (the flat member H side) of the pressing portion 123 (the surface at the position moved by D along the predetermined direction A from the wear surface C1) is worn. (Refer to the wear surface C3 in the right figure of FIG. 8C). When this state is reached, the upper nest 121 is replaced.

4). Semiconductor Device Manufacturing Method According to Embodiment The semiconductor device manufacturing method according to the embodiment is a method of manufacturing a semiconductor device in which a chip and a lead frame are connected via a connecting member.

  The manufacturing method of the semiconductor device according to the embodiment includes a first step of separating the connection member from the flat plate member, and a connection member separated from the flat plate member in the first step by joining the chip and the lead frame, respectively. And a second step of connecting the chip and the lead frame via the member.

  Since the first step is a step of performing the same method as the above-described “connecting member disconnecting method according to the embodiment”, description thereof is omitted.

  In the second step, first, the chip 20 is placed on the die pad via a bonding member (for example, solder), and the lead frame 30 is placed at a position separated from the die pad 10. Next, the chip connection portion 42 of the connection member 40 is placed on the chip 20 via the joining member, and the lead frame connection portion 44 of the connection member 40 is placed on the lead frame 30 via the joining member. Next, the die pad 10, the chip 20, the lead frame 30 and the connection member 40 are reflowed to melt the bonding member, and the connection member 40 is bonded to the chip 20 and the lead frame 30, respectively. 20 and the lead frame 30 are connected.

  In this way, an electronic device (semiconductor device 1) can be manufactured.

5. According to the connection member separating apparatus 100 and the cutting mold according to the embodiment, the upper nest 121 is the bottom of the connection member separating apparatus 100, the cutting mold, the connection member separating method, and the manufacturing method of the electronic device according to the embodiment. Since it has a fixed position adjustment part which makes it possible to fix upper nest 121 to upper mold plate 122 in a position shifted along a predetermined direction or a direction opposite to this from a position corresponding to nest 111, the upper mold plate The position where the upper nest 121 is fixed to 122 can be a position shifted from the position corresponding to the lower nest 111. Accordingly, when wear has occurred on the outer surface (the flat plate member H side) of the pressing portion 123, the fixing position of the upper nesting 121 can be adjusted by adjusting the fixing position without replacing the upper nesting 121. The connecting portion CP can be sheared by using a portion where wear has not yet occurred. As a result, the number of times of replacing the upper nest 121 can be reduced, and the connection member 40 can be separated from the flat plate member H with high productivity.

  In addition, according to the connection member separating apparatus 100 and the cutting mold according to the embodiment, since the upper mold 120 having the upper insert 121 is provided, the fixed position adjusting unit is shifted from the position corresponding to the lower insert 111. Even if the outer surface of the pressing portion 123 is worn, it is only necessary to replace the upper insert 121 without exchanging the entire upper mold 120. The time required for replacement is short, and the connection member 40 can be separated from the flat plate member H with higher productivity.

  Further, according to the connection member separating apparatus 100 according to the embodiment, the fixed position adjusting unit is a screw hole for screwing the upper insert 121 to the upper mold plate 122 and extends along the predetermined direction A. Therefore, the position of fixing the upper nest 121 is shifted and screwed in a simple operation from the position corresponding to the lower nest 111 along a predetermined direction or the opposite direction. The upper insert 121 can be fixed to the upper mold plate 122 at the shifted position.

  Further, according to the connecting member separating apparatus 100 according to the embodiment, the pressing portion 123 extends along the predetermined direction A, and therefore the upper nest 121 is moved from the position corresponding to the lower nest 111 to the predetermined direction. Even when it is fixed to the upper mold plate 122 at a position shifted along the direction A or the opposite direction, a portion where the wear outside the pressing portion 123 does not occur is used to connect the flat plate member and the connection member. The connecting portion CP can be sheared.

  Further, according to the connecting member separating apparatus 100 according to the embodiment, the upper nest 121 is placed on the upper mold plate 122 at a position shifted from the position L corresponding to the lower nest 111 along the predetermined direction A or the opposite direction. In order to satisfy the relationship of D <L, where D is the amount of shift of the upper nest 121 when fixed, and L is the distance between the connecting portions CP of the adjacent connecting members 40, the position from the position L corresponding to the lower nest 111 An area used for shearing the “connecting portion CP of the flat plate member H and the connecting member 40” of the connecting member when the upper insert 121 is fixed to the upper mold plate 122 at the shifted position, and the adjacent connecting member before that. The region where wear has occurred due to the shearing of the “joint portion CP between the flat plate member H and the connecting member 40” in 40 does not overlap. Therefore, it is possible to prevent the wear from occurring in the shearing of the “connecting portion CP between the flat plate member H and the connecting member 40”.

  Further, according to the connection member separating apparatus 100 according to the embodiment, the upper nest 121 is placed on the upper mold plate 122 at a position shifted from the position L corresponding to the lower nest 111 along the predetermined direction A or the opposite direction. In order to satisfy the relationship of D> W, where D is the amount of shift of the upper nest 121 when fixed, and W is the width along the axis parallel to the predetermined direction A in the connecting portion CP of the connecting member 40, A region used for shearing the “connecting portion CP between the flat plate member H and the connecting member 40” of the connection member 40 when the upper insert 121 is fixed to the upper mold plate 122 at a position shifted from the position L corresponding to the insert 111; Before that, the region where wear has occurred due to the shearing of “the connecting portion CP between the flat plate member H and the connecting member 40” in the connecting member 40 does not overlap. Therefore, it is possible to prevent the wear from occurring in the shearing of the “connecting portion CP between the flat plate member H and the connecting member 40”.

  Further, according to the connection member separating apparatus 100 according to the embodiment, the shape of the upper nest 121 is a cross-sectional shape corresponding to the shape of the connection member 40 and extends in a predetermined direction A. Because of the columnar shape, even when the upper nest 121 is displaced from the position L corresponding to the lower nest 111 along the predetermined direction A or the opposite direction, the upper nest 121 causes the base of the connection member 40 to be moved from the upper side. I can hold it down.

  According to the connection member disconnecting method and the electronic device manufacturing method according to the embodiment, the position of the upper nest 121 corresponds to the lower nest 111 after repeating the connection member placing step to the connection member disconnecting step a predetermined number of times. When the outer surface of the holding part 123 has been worn in order to repeat the connecting member placing process to the connecting member disconnecting process in a state shifted from L along the predetermined direction A or the opposite direction, Even if the upper nest 121 is not replaced, the connection portion CP can be sheared using the portion of the presser 123 that has not yet been worn by adjusting the fixing position, and the number of times the upper nest 121 is replaced. Can be reduced. As a result, the connection member 40 can be separated from the flat plate member H with high productivity, and the electronic device can be manufactured with high productivity.

  In addition, according to the connection member separating method and the electronic device manufacturing method according to the embodiment, since the upper insert 121 is used, the outer side of the pressing portion 123 is also shifted from the position L corresponding to the lower insert 111. When wear has occurred on the surface, it is only necessary to replace the upper insert 121 without replacing the entire upper mold 120, and the time required for component replacement is shorter than when the entire upper mold 120 is replaced. That's it. As a result, the connection member 40 can be separated from the flat plate member H with higher productivity, and an electronic device can be manufactured with higher productivity.

  As mentioned above, although this invention was demonstrated based on said embodiment, this invention is not limited to said embodiment. The present invention can be implemented in various modes without departing from the spirit thereof, and for example, the following modifications are possible.

(1) The number, material, shape, position, size, and the like of the constituent elements described in the above embodiments are exemplifications, and can be changed within a range not impairing the effects of the present invention.

(2) In the above-described embodiment, the connection member disconnecting device that disconnects the connection member 40 connected along the outer edges of both ends of the flat plate member H at the same time is used. However, the present invention is limited to this. It is not a thing. A connection member disconnecting device that disconnects the connection members connected along the outer edge in the short direction of the flat plate member H one by one may be used.

(3) In the above embodiment, the flat plate member H in which the connecting members are coupled along the outer edges at both ends in the short side direction is used, but the present invention is not limited to this. You may use the flat member H to which the connection member is connected only along the outer edge of the one end of a transversal direction.

(4) Although the semiconductor device is used as the electronic device using the connection member in the above embodiment, the present invention is not limited to this. As the electronic device using the connection member, a capacitor, an inductor, or other appropriate electronic device may be used.

(5) In the above embodiment, the fixed position adjusting portion is a screw hole for screwing the upper nest into the upper mold plate and has a long hole shape extending along a predetermined direction. Although the fixed position adjustment unit is used, the present invention is not limited to this. The fixed position adjusting unit may be a fixed position adjusting unit having a mechanism for moving in a predetermined direction or the opposite direction. For example, as the fixed position adjusting unit, a fixed having a mechanism for moving the upper nest with a motor or the like. A position adjustment unit or a fixed position adjustment unit having a mechanism for moving the upper nest with a switch may be used.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 10 ... Die pad, 20 ... Chip, 30 ... Lead frame, 40 ... Connection member, 42 ... Chip connection part, 44 ... Lead frame connection part, 100 ... Connection member cutting device, 110 ... Lower metal mold, 111 ... Lower insert 112, Lower mold plate 113, 126 ... Guide hole 120 ... Upper mold 121 ... Upper insert 122 ... Upper mold plate 123 ... Pressing part 124 ... Recessed part 125 ... Fixed position adjusting part ( Screw hole), 130 ... punch, 140 ... shudder, 150 ... punch plate, 160 ... die plate, 170 ... screw, C1 ... wear region (when the upper nest is fixed at position L corresponding to the position of the lower nest), C2... (When the upper nest is fixed at a position shifted in the predetermined direction A from the position L corresponding to the position of the lower nest) C3... (The position of the lower nest ) Wear area in case of a position corresponding to L with a predetermined direction A in which the upper nest fixed at a position shifted in the opposite direction, H ... plate member, CP ... (the plate member and the connecting member) connecting portion

Claims (9)

In the state where a plurality of connecting members for connecting electronic components connected along the outer edge of the flat plate member are fixed by a cutting die composed of a lower die and an upper die, the flat plate member and the connection are connected. A connecting member separating device for shearing a connecting portion with a member using a punch to separate the connecting member from the flat plate member,
The lower mold having a lower insert that can be placed in a state in which the connection members are arranged in a predetermined direction, and a lower mold plate that fixes the lower insert;
An upper mold provided at a position facing the lower nest and having an upper nest having a pressing part for pressing the base of the connecting member from above and an upper mold plate for fixing the upper nest;
The punch is provided at a position adjacent to the lower nest and is movable in the vertical direction,
The upper nest is a fixed position adjusting unit that can fix the upper nest to the upper mold plate at a position shifted from the position corresponding to the lower nest along the predetermined direction or the opposite direction. It further has a connection member cutting device characterized by things.   The fixed position adjusting portion is a screw hole for screwing the upper insert to the upper mold plate, and has a long hole shape extending along the predetermined direction. The connecting member disconnecting device according to claim 1.   The connection member disconnecting device according to claim 1, wherein the pressing portion extends along the predetermined direction.   The amount of shift of the upper nesting when the upper nesting is fixed to the upper mold plate at a position shifted along the predetermined direction or the opposite direction from the position corresponding to the lower nesting is D, the adjacent The connection member disconnecting device according to claim 1, wherein a relationship of D <L is satisfied, where L is an interval between connecting portions in the connection member.   The amount of displacement of the upper nest when the upper nest is fixed to the upper mold plate at a position displaced along the predetermined direction or the opposite direction from the position corresponding to the lower nest is D, the connection member 5. The connection member disconnecting device according to claim 1, wherein a relationship of D> W is satisfied, where W is a width in an axial direction parallel to the predetermined direction in the connecting portion.   The shape of the upper nesting is a columnar shape having a cross-sectional shape corresponding to the shape of the connecting member and extending in the predetermined direction. The connection member disconnecting device according to any one of the above. A cutting die used for the connecting member separating apparatus according to any one of claims 1 to 6,
A lower mold having the lower insert that can be placed in a state in which the connecting members are arranged in a predetermined direction and a lower mold plate that fixes the lower insert;
An upper mold having an upper mold plate provided at a position facing the lower insert and having a pressing portion for pressing the base of the connection member from above and an upper mold plate for fixing the upper insert;
The upper nest is a fixed position adjusting unit that can fix the upper nest to the upper mold plate at a position shifted from the position corresponding to the lower nest along the predetermined direction or the opposite direction. A cutting die characterized by further comprising: In a state where a plurality of connecting members for connecting electronic components along the outer edge of the flat plate member are fixed by the lower mold and the upper mold, the connecting portion of the flat plate member and the connection member is A connecting member disconnecting method for shearing using a punch to disconnect the connecting member from the flat plate member,
A plurality of the connecting members connected along the outer edge are conveyed, and the connecting members are placed in a predetermined position on the lower insert of the lower mold in a predetermined direction. Connecting member placing step to be placed;
A connecting member fixing step of fixing the connecting member by pressing the base of the connecting member from above with a pressing portion of the upper insert of the upper mold provided at a position facing the lower insert;
A connecting portion between the flat plate member and the connection member is provided at a position adjacent to the lower nest, and is sheared by using the punch movable in the vertical direction so that the connection member is removed from the flat plate member. Including a connecting member disconnecting step for disconnecting in this order,
After repeating the connection member placing step to the connection member separating step a predetermined number of times, the position of the upper nest is shifted from the position corresponding to the lower nest along the predetermined direction or the opposite direction. In the state, the connecting member separating method is characterized by repeating the connecting member placing step to the connecting member separating step. A semiconductor device manufacturing method for manufacturing a semiconductor device in which a chip and a lead frame are connected via a connection member for connecting an electronic component,
A first step of separating the connecting member from the flat plate member;
A second step of connecting the chip and the lead frame via the connection member by bonding the connection member separated from the flat plate member in the first step to the chip and the lead frame, respectively; Including
The first step includes
A plurality of the plate-like members connected to each other along the outer edge are transported, and the connection members are placed in a predetermined position on the lower insert of the lower mold in a predetermined direction. A connecting member placing step,
A connecting member fixing step of fixing the connecting member by pressing the base of the connecting member from above with a pressing portion of an upper nest provided at a position facing the lower nest;
A connecting portion between the flat plate member and the connection member is provided at a position adjacent to the lower insert and is sheared by using a punch movable in the vertical direction to separate the connection member from the flat plate member. Connecting member disconnecting step in this order,
After repeating the connection member placing step to the connection member separating step a predetermined number of times, the position of the upper nest is shifted from the position corresponding to the lower nest along the predetermined direction or the opposite direction. In the state, the manufacturing method of the electronic device characterized by repeating from the connecting member placing step to the connecting member separating step.

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