JP2017069560A - 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート - Google Patents
加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート Download PDFInfo
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- JP2017069560A JP2017069560A JP2016184505A JP2016184505A JP2017069560A JP 2017069560 A JP2017069560 A JP 2017069560A JP 2016184505 A JP2016184505 A JP 2016184505A JP 2016184505 A JP2016184505 A JP 2016184505A JP 2017069560 A JP2017069560 A JP 2017069560A
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Abstract
Description
また、焼結層が脆弱であると、長期使用により剥離が起こる等、高い信頼性を得ることができないといった問題がある。
加熱により焼結層となる層を有し、
前記層は、下記加熱条件Aにより加熱した後の硬さが、ナノインデンターを用いた計測において、1.5GPa〜10GPaの範囲内であることを特徴とする。
<加熱条件A>
前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持する。
また、加熱により焼結層となる層を有し、前記層は、上記加熱条件Aにより加熱した後の硬さが、ナノインデンターを用いた計測において、1.5GPa〜10GPaの範囲内である。上記加熱条件Aは、前記層が加熱により焼結層となる条件を想定して規定した加熱条件である。前記硬さが1.5GPa以上であるため、前記層を加熱して得られる焼結層は、強固なものとなる。また、前記硬さが10GPa以下であるため、前記層を加熱して得られる焼結層は、適度な柔軟性を有することとなる。
加熱により焼結層となる層を有し、
前記層は、下記加熱条件Aにより加熱した後の弾性率が、ナノインデンターを用いた計測において、30GPa〜150GPaの範囲内であることを特徴とする。
<加熱条件A>
前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持する。
また、加熱により焼結層となる層を有し、前記層は、上記加熱条件Aにより加熱した後の弾性率が、ナノインデンターを用いた計測において、30GPa〜150GPaの範囲内である。上記加熱条件Aは、前記層が加熱により焼結層となる条件を想定して規定した加熱条件である。前記弾性率が30GPa以上であるため、前記層を加熱して得られる焼結層は、強固なものとなる。また、前記弾性率、150GPa以下であるため、前記層を加熱して得られる焼結層は、適度な柔軟性を有することとなる。
<変形量計測方法B>
(1)前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持し、変形量計測用の層を得る工程、
(2)前記変形量計測用の層を、ナノインデンターを用いて押し込み深さ2μmで押し込み、押し込みを解除した後の、押し込み前からの変形量を計測する工程。
ダイシングテープと、
前記ダイシングテープ上に積層された前記加熱接合用シートと
を有することを特徴とする。
本発明の一実施形態に係る加熱接合用シート、及び、ダイシングテープ付き加熱接合用シートについて、以下に説明する。本実施形態に係る加熱接合用シートは、以下に説明するダイシングテープ付き加熱接合用シートにおいて、ダイシングテープが貼り合わせられていない状態のものを挙げることができる。従って、以下では、ダイシングテープ付き加熱接合用シートについて説明し、加熱接合用シートについては、その中で説明することとする。図1は、本発明の一実施形態に係るダイシングテープ付き加熱接合用シートを示す断面模式図である。図2は、本発明の他の実施形態に係る他のダイシングテープ付き加熱接合用シートを示す断面模式図である。
加熱接合用シート3、3’は、シート状である。ペーストではなく、シートであるため、貼り付け時のはみ出しや貼り付け対象物表面への這い上がりを抑制できる。
また、本実施形態では、加熱接合用シートが、加熱により焼結層となる層からなる場合について説明するが、本発明はこの例に限定されない。本発明の加熱接合用シートは、2層以上であってもよい。例えば、加熱により焼結層となる層と、その他の層(加熱により焼結層とならない層)とが積層された構成であってもよい。
すなわち、本発明における加熱接合用シートは、加熱により焼結層となる層を有していればよく、その構成は特に限定されない。
加熱により焼結層となる層31(以下、「層31」ともいう)は、下記加熱条件Aにより加熱した後の硬さが、ナノインデンターを用いた計測において、1.5GPa〜10GPaの範囲内であることが好ましい。前記硬さは、2.0GPa〜8GPaの範囲内であることがより好ましく、2.5GPa〜7GPaの範囲内であることがさらに好ましい。下記加熱条件Aは、前記層が加熱により焼結層となる条件を想定して規定した加熱条件である。ナノインデンターを用いた硬さの計測方法は、実施例に記載の方法による。
層31を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持する。
前記硬さは、金属微粒子の種類、含有量、平均粒径、熱分解性バインダーの種類、含有量、低沸点バインダーの種類、含有量、加熱により焼結層を形成する際の加熱条件(例えば、温度、時間、昇温速度等)、焼結層を形成する際の雰囲気(大気雰囲気、窒素雰囲気、又は、還元ガス雰囲気等)によりコントロールすることができる。
層31を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持する。
前記弾性率は、金属微粒子の種類、含有量、平均粒径、熱分解性バインダーの種類、含有量、低沸点バインダーの種類、含有量、加熱により焼結層を形成する際の加熱条件(例えば、温度、時間、昇温速度等)、焼結層を形成する際の雰囲気(大気雰囲気、窒素雰囲気、又は、還元ガス雰囲気等)によりコントロールすることができる。
(1)前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持し、変形量計測用の層を得る工程、
(2)前記変形量計測用の層を、ナノインデンターを用いて押し込み深さ2μmで押し込み、押し込みを解除した後の、押し込み前からの変形量を計測する工程。
(1)試験試料として、厚さ200μm、幅10mm、長さ40mmの加熱接合用シート(引張試験用加熱接合用シート)を準備し、
(2)チャック間距離10mm、引張速度50mm/分、23℃の条件で引張試験を行い、
(3)得られた応力−ひずみ線図の直線部分の傾きを引張弾性率とする。
前記焼結性金属粒子の結晶子の平均径は、0.01nm以上60nm以下が好ましく、0.1nm以上50nm以下がより好ましく、0.5nm以上45nm以下がさらに好ましい。結晶子の平均径を上記範囲とすることで、焼結性金属粒子の焼結温度の過度の上昇を抑制することができる。
粘度測定の条件は、下記の通りである。
レオメータ:Thermo SCIENTFIC社製 MER III
治具:パラレルプレート20mmφ、ギャップ100μm、せん断速度 1/秒)
前記脂肪族ポリカーボネートとしては、ポリエチレンカーボネート、ポリプロピレンカーボネート等が挙げられる。なかでもシート形成のためのワニス作製における有機溶剤への溶解性の観点から、ポリプロピレンカーボネートが好ましい。
前記芳香族ポリカーボネートとしては、主鎖にビスフェノールA構造を含むもの等が挙げられる。
前記ポリカーボネートの重量平均分子量は、10,000〜1,000,000の範囲内であることが好適である。なお、重量平均分子量は、GPC(ゲル・パーミエーション・クロマトグラフィー)により測定し、ポリスチレン換算により算出された値である。
また、アクリル樹脂のなかでも、200℃〜400℃で熱分解するアクリル樹脂が好ましい。
ダイシングテープ11は基材1上に粘着剤層2を積層して構成されている。
まず、基材1は、従来公知の製膜方法により製膜することができる。当該製膜方法としては、例えばカレンダー製膜法、有機溶媒中でのキャスティング法、密閉系でのインフレーション押出法、Tダイ押出法、共押出し法、ドライラミネート法等が例示できる。
ダイシングテープ付き加熱接合用シート10においては、加熱接合用シート3がセパレータで覆われていることが好ましい。例えば、ダイシングテープ11と加熱接合用シート3とを貼り合わせた後、加熱接合用シート3に積層されていた前記基材セパレータを剥離し、前基材セパレータを剥離した後のダイシングテープ付き加熱接合用シート10の加熱接合用シート3の露出面に、セパレータを貼り付ける方法が挙げられる。すなわち、ダイシングテープ11、加熱接合用シート3、及び、前記セパレータがこの順で積層された形態とすることが好ましい。
加熱接合用シートは、ダイシングテープが貼り合わせられていない形態とする場合、2枚のセパレータに挟まれた両面セパレータ付き加熱接合用シートとすることが好ましい。すなわち、第1のセパレータ、加熱接合用シート、及び、第2のセパレータがこの順で積層された両面セパレータ付き加熱接合用シートとすることが好ましい。
図3は、両面セパレータ付き加熱接合用シートの一実施形態を示す断面模式図である。
図3に示す両面セパレータ付き加熱接合用シート30は、第1のセパレータ32、加熱接合用シート3、及び、第2のセパレータ34がこの順で積層された構成を有する。第1のセパレータ32、及び、第2のセパレータ34としては、前記基材セパレータと同一のものを使用することができる。
なお、加熱接合用シートは、ダイシングテープが貼り合わせられていない形態とする場合、加熱接合用シートの一方の面にのみセパレータが積層された形態であってもよい。
本実施形態に係る半導体装置の製造方法は、前記加熱接合用シートを準備する工程と、
前記加熱接合用シートを介して、半導体チップを被着体上に加熱接合する加熱接合工程とを含む(以下、第1実施形態ともいう)。
また、本実施形態に係る半導体装置の製造方法は、前記に記載のダイシングテープ付き加熱接合用シートを準備する工程と、
前記ダイシングテープ付き加熱接合用シートの加熱接合用シートと、半導体ウェハの裏面とを貼り合わせる貼り合わせ工程と、
前記半導体ウェハを前記加熱接合用シートと共にダイシングして、チップ状の半導体チップを形成するダイシング工程と、
前記半導体チップを、前記ダイシングテープ付き加熱接合用シートから前記加熱接合用シートと共にピックアップするピックアップ工程と、
前記加熱接合用シートを介して、前記半導体チップを被着体上に加熱接合する加熱接合工程とを含むものでもある(以下、第2実施形態ともいう)。
第1実施形態に係る半導体装置の製造方法は、第2の実施形態に係る半導体装置の製造方法が、ダイシングテープ付き加熱接合用シートを用いているのに対して、第1実施形態に係る半導体装置の製造方法では、加熱接合用シートを単体で用いている点で異なりその他の点で共通する。第1の実施形態に係る半導体装置の製造方法においては、加熱接合用シートを準備した後、これをダイシングテープと貼り合わせる工程を行なえば、その後は、第2実施形態に係る半導体装置の製造方法と同様とすることができる。そこで、以下では、第2実施形態に係る半導体装置の製造方法について説明することとする。
また、本発明の加熱接合用シート、及び、ダイシングテープ付き加熱接合用シートは、上記に例示した用途に限定されず、2つのものを加熱接合するのに利用することができる。
銅微粒子A:三井金属鉱業製 平均粒径200nm、結晶子の平均径31nmの銅微粒子
金属微粒子含有ペーストA:応用ナノ粒子研究所製のANP−1(ナノサイズの銀微粒子が低沸点バインダーに分散されたペースト)に含まれる低沸点バインダーの量を適宜調整したもの。
熱分解性バインダーA(ポリプロピレンカーボネート樹脂):Empower社製のQPAC40、23℃で固形
熱分解性バインダーB(アクリル樹脂):藤倉化成社製のMM−2002−1、23℃で固形
低沸点バインダーA(イソボルニルシクロヘキサノール):日本テルペン化学製 テルソルブMTPH、23℃で液状
有機溶剤A:メチルエチルケトン(MEK)
表1に記載の配合比に従い、表1に記載の各成分及び溶媒を、ハイブリッドミキサー(キーエンス製 HM−500)の攪拌釜に入れ、攪拌モード、3分で攪拌・混合した。
得られたワニスを、離型処理フィルム(三菱樹脂(株)製のMRA50)に塗布・乾燥させた。乾燥条件は、表1に記載の通りとした。これにより実施例、及び、比較例に係る厚み40μmの加熱接合用シートを得た。
裏面にTi層(厚さ50nm)とAg層(厚さ100nm)とがこの順で形成されたシリコンチップ(シリコンチップの厚さ350μm、縦5mm、横5mm)を準備した。準備したシリコンチップのAg層面に実施例、及び、比較例の加熱接合用シートをそれぞれ貼り合わせた。
貼り合わせ条件は、温度70℃、圧力0.3MPa、速度10mm/秒とした。
10MPaの加圧(平板プレス)下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持した。その後、170℃になるまで空冷し、その後、80℃になるまで水冷した。なお、水冷は、加圧板内に付設された水冷式冷却板によるものである。なお、実施例4は窒素環境下で接合させた。
<包埋条件>
SCANDIPLEX A:SCANDIPLEX B=9:4(体積比)
45℃で、1〜2時間放置
<粗研磨条件>
耐水研磨紙:Struers社、SiC Foil #220
円盤回転数:150rpm
<精密研磨条件>
耐水研磨紙:Struers社、SiC Foil #220, #1000
円盤回転数:100rpm
荷重:200〜500g
<イオンポリッシング条件>
加速電圧 5〜6kV
加工時間 8〜10時間
遮蔽板からの飛び出し量 25〜50μm
<押し込み条件>
使用圧子:Berkovich[三角錐型])
測定方法:単一押し込み測定モード
測定温度:25℃(室温)
押し込み深さ設定:2μm
ナノインデンターを用いた計測で作成した方法と同様の方法で、実施例、及び、比較例に係る評価用サンプルを作成した。
2 粘着剤層
3、3’ 加熱接合用シート
4 半導体ウェハ
5 半導体チップ
6 被着体
7 ボンディングワイヤー
8 封止樹脂
10、12 ダイシングテープ付き加熱接合用シート
11 ダイシングテープ
30 両面セパレータ付き加熱接合用シート
31 加熱により焼結層となる層
32 第1のセパレータ
34 第2のセパレータ
Claims (6)
- 加熱により焼結層となる層を有し、
前記層は、下記加熱条件Aにより加熱した後の硬さが、ナノインデンターを用いた計測において、1.5GPa〜10GPaの範囲内であることを特徴とする加熱接合用シート。
<加熱条件A>
前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持する。 - 加熱により焼結層となる層を有し、
前記層は、下記加熱条件Aにより加熱した後の弾性率が、ナノインデンターを用いた計測において、30GPa〜150GPaの範囲内であることを特徴とする加熱接合用シート。
<加熱条件A>
前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持する。 - 前記層は、下記変形量計測方法Bによる変形量が、1600nm〜1900nmの範囲内であることを特徴とする請求項1又は2に記載の加熱接合用シート。
<変形量計測方法B>
(1)前記層を、10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持し、変形量計測用の層を得る工程、
(2)前記変形量計測用の層を、ナノインデンターを用いて押し込み深さ2μmで押し込み、押し込みを解除した後の、押し込み前からの変形量を計測する工程。 - 前記層は、23℃で固形の熱分解性バインダーを含むことを特徴とする請求項1〜3のいずれか1に記載の加熱接合用シート。
- 前記層は、金属微粒子を含み、
前記金属微粒子が、銀、銅、酸化銀、酸化銅からなる群より選ばれる少なくとも1種であることを特徴とする請求項1〜4のいずれか1に記載の加熱接合用シート。 - ダイシングテープと、
前記ダイシングテープ上に積層された請求項1〜5のいずれか1に記載の加熱接合用シートと
を有することを特徴とするダイシングテープ付き加熱接合用シート。
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EP16851600.3A EP3358608A4 (en) | 2015-09-30 | 2016-09-28 | Thermal bonding sheet, and thermal bonding sheet with dicing tape |
CN201680058257.XA CN108174617B (zh) | 2015-09-30 | 2016-09-28 | 加热接合用片材及带有切割带的加热接合用片材 |
US15/762,070 US10707184B2 (en) | 2015-09-30 | 2016-09-28 | Thermal bonding sheet and thermal bonding sheet with dicing tape |
TW105131678A TWI695045B (zh) | 2015-09-30 | 2016-09-30 | 加熱接合用片材、以及附切晶帶加熱接合用片材 |
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JP6858520B2 (ja) | 2021-04-14 |
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