JP2020150188A - 焼結接合用シートおよび基材付き焼結接合用シート - Google Patents
焼結接合用シートおよび基材付き焼結接合用シート Download PDFInfo
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- JP2020150188A JP2020150188A JP2019047962A JP2019047962A JP2020150188A JP 2020150188 A JP2020150188 A JP 2020150188A JP 2019047962 A JP2019047962 A JP 2019047962A JP 2019047962 A JP2019047962 A JP 2019047962A JP 2020150188 A JP2020150188 A JP 2020150188A
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Abstract
Description
焼結性粒子P1としての銀粒子 56.25質量部と、高分子バインダー(熱分解性高分子バインダー)としてのポリカーボネート樹脂(商品名「QPAC40」,重量平均分子量は150000,常温で固体,Empower Materials社製)2.16質量部と、低分子バインダー(低沸点バインダー)としてのイソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,常温で液体,日本テルペン化学工業株式会社製)2.16質量部と、溶剤としてのメチルエチルケトン 39.43質量部とを、ハイブリッドミキサー(商品名「HM−500」,株式会社キーエンス製)をその撹拌モードで使用して混合し、ワニスを調製した。撹拌時間は3分間とした。焼結性粒子P1としての前記の銀粒子は、第1の銀粒子(平均粒径60nm,DOWAエレクトロニクス株式会社製)と第2の銀粒子(平均粒径1100nm,三井金属鉱業株式会社製)とを質量比9:1で含むものである。そして、得られたワニスを、基材としての離型処理フィルム(商品名「MRA38」,三菱ケミカル株式会社製)に塗布した後に乾燥させて、厚さ57μmの焼結接合用シートを形成した。乾燥温度は110℃とし、乾燥時間は3分間とした。焼結接合用シートにおける焼結性粒子含有割合は92.9質量%である。以上のようにして、焼結性粒子と高分子バインダーと低分子バインダーとを含む実施例1の焼結接合用シートを基材上に作製した。実施例1の焼結接合用シートに関する組成を表1に掲げる(後記の実施例および比較例についても同様である。また、表1において、組成を表す各数値の単位は、相対的な“質量部”である)。
焼結性粒子P1の配合量を56.25質量部に代えて56.98質量部としたこと、ポリカーボネート樹脂(商品名「QPAC40」,Empower Materials社製)の配合量を2.16質量部に代えて0.75質量部としたこと、イソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,日本テルペン化学工業株式会社製)の配合量を2.16質量部に代えて2.98質量部としたこと、およびメチルエチルケトンの使用量を39.4質量部に代えて39.29質量部としたこと、以外は実施例1の焼結接合用シートと同様にして、実施例2の焼結接合用シートを作製した。実施例2の焼結接合用シートにつき、焼結性粒子含有割合は93.9質量%であり、厚さは53μmである。
焼結性粒子P1の配合量を56.25質量部に代えて56.03質量部としたこと、ポリカーボネート樹脂(商品名「QPAC40」,Empower Materials社製)の配合量を2.16質量部に代えて0.9質量部としたこと、イソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,日本テルペン化学工業株式会社製)の配合量を2.16質量部に代えて3.6質量部としたこと、および、メチルエチルケトンの使用量を39.43質量部に代えて39.47質量部としたこと、以外は実施例1の焼結接合用シートと同様にして、実施例3の焼結接合用シートを作製した。実施例3の焼結接合用シートにつき、焼結性粒子含有割合は92.6質量%であり、厚さは54μmである。
焼結性粒子P156.25質量部に代えて焼結性粒子P2としての銅粒子(平均粒径200nm,三井金属鉱業株式会社製)66.11質量部を用いたこと、ポリカーボネート樹脂(商品名「QPAC40」,Empower Materials社製)の配合量を2.16質量部に代えて3.57質量部としたこと、イソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,日本テルペン化学工業株式会社製)の配合量を2.16質量部に代えて5.35質量部としたこと、および、メチルエチルケトンの使用量を39.43質量部に代えて24.97質量部としたこと、以外は実施例1の焼結接合用シートと同様にして、実施例4の焼結接合用シートを作製した。実施例4の焼結接合用シートにつき、焼結性粒子含有割合は88.1質量%であり、厚さは68μmである。
焼結性粒子P1の配合量を56.25質量部に代えて55.78質量部としたこと、ポリカーボネート樹脂(商品名「QPAC40」,Empower Materials社製)の配合量を2.16質量部に代えて4.72質量部としたこと、イソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,日本テルペン化学工業株式会社製)を用いなかったこと、および、メチルエチルケトンの使用量を39.43質量部に代えて39.5質量部としたこと、以外は実施例1の焼結接合用シートと同様にして、比較例1の焼結接合用シートを作製した。比較例1の焼結接合用シートにつき、焼結性粒子含有割合は92.2質量%であり、厚さは54μmである。
焼結性粒子P1の配合量を56.25質量部に代えて56.69質量部としたこと、ポリカーボネート樹脂を用いなかったこと、イソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,日本テルペン化学工業株式会社製)の配合量を2.16質量部に代えて3.98質量部としたこと、および、メチルエチルケトンの使用量を39.43質量部に代えて39.33質量部としたこと、以外は実施例1の焼結接合用シートと同様にして、比較例2の焼結接合用シートを作製した。比較例2の焼結接合用シートにつき、焼結性粒子含有割合は93.4質量%であり、厚さは55μmである。
焼結性粒子P1の配合量を56.25質量部に代えて64.73質量部としたこと、ポリカーボネート樹脂(商品名「QPAC40」,Empower Materials社製)の配合量を2.16質量部に代えて6.15質量部としたこと、イソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,日本テルペン化学工業株式会社製)の配合量を2.16質量部に代えて4.09質量部としたこと、および、メチルエチルケトンの使用量を39.43質量部に代えて25.04質量部としたこと、以外は実施例1の焼結接合用シートと同様にして、比較例3の焼結接合用シートを作製した。比較例3の焼結接合用シートにつき、焼結性粒子含有割合は86.3質量%であり、厚さは65μmである。
実施例1〜4および比較例1〜3の各焼結接合用シート(片面に基材を伴う)について、ナノインデンター(商品名「Triboindenter」,Hysitron社製)を使用して、ナノインデンテーション法による荷重−変位測定を行った。測定に供した試料片は、各焼結接合用シートから10mm角のサイズで切り出して用意したものである。本測定において、測定モードは単一押込み測定とし、測定温度は23℃とし、使用圧子はBerkovich(三角錐)型のダイヤモンド圧子とし、荷重印加過程で達する最大荷重(設定値)は500μNとし、荷重印加過程での圧子の押込み速度は100μN/秒とし、除荷過程での圧子の引抜き速度は100μN/秒とした。本測定によって求められた最小荷重F(μN)、最小荷重F(μN)と最大荷重F'(μN)の比率(F/F')、硬さH(GPa)、および、最小荷重F(μN)を硬さH(GPa)で除した値(F/H)を、表1に掲げる。
実施例1〜4および比較例1〜3の各焼結接合用シート(片面に基材を伴う)について、次のようにして密着性を調べた。まず、基材付き焼結接合用シートにおける焼結接合用シート上に5枚の5mm角のシリコンチップ(厚さ200μm,焼結接合用シート密着面側にAgメッキ膜が形成されている)を5mm間隔で一列に載置した。焼結接合用シートに伴う基材は、三菱ケミカル株式会社製の「MRA38」(厚さ38μm)である。そして、これらシリコンチップを伴う基材付き焼結接合用シートを、圧着ロールを備えるラミネータに通し、シリコンチップを焼結接合用シートに密着させた(圧着処理)。これにより、基材とその上の焼結接合用シートとその上のシリコンチップとの積層体を得た。この圧着処理において、圧着ロールによる圧力は0.5MPaであり、圧着ロール速度は10mm/秒であり、圧着温度は70℃(実施例1〜3と比較例1,2)または90℃(実施例4と比較例3)である。このような圧着処理の後、上記の積層体から基材を剥がした。そして、焼結接合用シートの密着性につき、基材剥離によっても5枚のシリコンチップ全部において焼結接合用シート由来の焼結接合材料層が残った場合を“良”と評価し、5枚のシリコンチップの全部または一部において焼結接合用シート由来の焼結接合材料層が残らなかった場合を“不良”と評価した。その評価結果を表1に掲げる。
ナノインデンテーション法による荷重−変位測定から求められる最小荷重Fが−100〜−30μNの範囲にある実施例1〜5の焼結接合用シートは、上述の密着性評価試験において良好な密着性を示した。
導電性金属含有の焼結性粒子およびバインダー成分を含み、
ナノインデンテーション法による荷重−変位測定における除荷過程で達する最小荷重が−100〜−30μNである、焼結接合用シート。
〔付記2〕
導電性金属含有の焼結性粒子およびバインダー成分を含み、
ナノインデンテーション法による荷重−変位測定における荷重印加過程で達する最大荷重に対する、前記荷重印加過程より後の除荷過程で達する最小荷重の比率が、−0.2〜−0.06である、焼結接合用シート。
〔付記3〕
前記最小荷重は−100〜−30μNである、付記2に記載の焼結接合用シート。
〔付記4〕
ナノインデンテーション法による前記荷重−変位測定から求められる硬さH(GPa)および前記最小荷重F(μN)は、−6000≦F/H≦−200を充たす、付記1から3のいずれか一つに記載の焼結接合用シート。
〔付記5〕
ナノインデンテーション法による前記荷重−変位測定から求められる硬さが0.02〜0.1GPaである、付記1から4のいずれか一つに記載の焼結接合用シート。
〔付記6〕
前記バインダー成分は、高分子バインダーおよび/または低分子バインダーを含む、付記1から5のいずれか一つに記載の焼結接合用シート。
〔付記7〕
前記高分子バインダーは、熱分解性高分子バインダーを含む、付記6に記載の焼結接合用シート。
〔付記8〕
前記高分子バインダーの重量平均分子量は10000以上である、付記6または7に記載の焼結接合用シート。
〔付記9〕
前記高分子バインダーは、ポリカーボネート樹脂および/またはアクリル樹脂を含む、付記6から8のいずれか一つに記載の焼結接合用シート。
〔付記10〕
前記低分子バインダーは、前記高分子バインダーの熱分解開始温度よりも沸点が低い低沸点バインダーを含む、付記6から9のいずれか一つに記載の焼結接合用シート。
〔付記11〕
前記焼結性粒子は、銀粒子、銅粒子、酸化銀粒子、および酸化銅粒子からなる群より選択される少なくとも一種を含む、付記1から10のいずれか一つに記載の焼結接合用シート。
〔付記12〕
前記焼結性粒子の含有割合が、60〜99質量%であり、好ましくは65〜98質量%、より好ましくは70〜97質量%である、付記1から11のいずれか一つに記載の焼結接合用シート。
〔付記13〕
基材と、付記1から12のいずれか一つに記載の焼結接合用シートと、を含む積層構造を有する基材付き焼結接合用シート。
B 基材
10 焼結接合用シート
11 焼結接合用材料層
12 焼結層
T1,T2 加工用テープ
C チップ(半導体チップ)
S 支持基板(基板)
Claims (6)
- 導電性金属含有の焼結性粒子およびバインダー成分を含み、
ナノインデンテーション法による荷重−変位測定における除荷過程で達する最小荷重が−100〜−30μNである、焼結接合用シート。 - 導電性金属含有の焼結性粒子およびバインダー成分を含み、
ナノインデンテーション法による荷重−変位測定における荷重印加過程で達する最大荷重に対する、前記荷重印加過程より後の除荷過程で達する最小荷重の比率が、−0.2〜−0.06である、焼結接合用シート。 - 前記最小荷重は−100〜−30μNである、請求項2に記載の焼結接合用シート。
- ナノインデンテーション法による前記荷重−変位測定から求められる硬さH(GPa)および前記最小荷重F(μN)は、−6000≦F/H≦−200を充たす、請求項1から3のいずれか一つに記載の焼結接合用シート。
- ナノインデンテーション法による前記荷重−変位測定から求められる硬さが0.02〜0.1GPaである、請求項1から4のいずれか一つに記載の焼結接合用シート。
- 基材と、請求項1から5のいずれか一つに記載の焼結接合用シートと、を含む積層構造を有する基材付き焼結接合用シート。
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