JP2017050335A - Snubber module - Google Patents

Snubber module Download PDF

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JP2017050335A
JP2017050335A JP2015170796A JP2015170796A JP2017050335A JP 2017050335 A JP2017050335 A JP 2017050335A JP 2015170796 A JP2015170796 A JP 2015170796A JP 2015170796 A JP2015170796 A JP 2015170796A JP 2017050335 A JP2017050335 A JP 2017050335A
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electrode plate
capacitor element
electrode
circuits
snubber module
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JP6684062B2 (en
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高橋　誠
Makoto Takahashi
誠 高橋
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a snubber module capable of dealing with two circuits while achieving a low inductance.SOLUTION: A snubber module comprises: a capacitor element 2; and two circuits each consisting of a pair of electrode plates 3 and 4 connected with electrodes 2c and 2d of the capacitor element 2. One electrode plate 4 of the pair of electrode plates 3 and 4 that configure these circuits is formed by a common one electrode plate, and one electrode plate 4 and the other electrode plate 3 are overlapped with each other via an insulating layer 8.SELECTED DRAWING: Figure 2

Description

この発明は、パワーモジュールなどに接続されるスナバモジュールに関する。   The present invention relates to a snubber module connected to a power module or the like.

図４及び図５は、一般的なスナバモジュール１０を示している。このスナバモジュール１０は、図に示すように、コンデンサ素子１１の電極部１１ａ、１１ａにそれぞれ電極板１２、１３を接続し、これら一体となったコンデンサ素子１１と電極板１２、１３とをケース１４に収納し樹脂を充填することで構成されているが、このような構成は一般的にインダクタンスが大きく、サージ電圧の跳ね上がりが大きいといった欠点がある。そこで、例えば特許文献１では、電極板同士を互いに近接配置し磁界を相殺させることで低インダクタンス化を図っている。   4 and 5 show a general snubber module 10. As shown in the figure, the snubber module 10 has electrode plates 12 and 13 connected to the electrode portions 11a and 11a of the capacitor element 11, respectively. However, such a structure generally has a large inductance and a large surge voltage jump. Therefore, in Patent Document 1, for example, the inductance is reduced by arranging the electrode plates close to each other to cancel the magnetic field.

特開２００５−３０２８５９号公報JP 2005-302859 A

ところで、上記特許文献１に開示されているスナバモジュールは１回路用であり、２回路に対応するにはモジュールを２個用意しなければならない。ただ、予め２回路分必要であると分かっている場合に、１回路毎にモジュールを製造するのは効率的とは言えない。また、それぞれをケースに収納し樹脂モールドすれば、その分嵩張ることにもなる。   By the way, the snubber module disclosed in Patent Document 1 is for one circuit, and two modules must be prepared to deal with two circuits. However, when it is known that two circuits are necessary in advance, it is not efficient to manufacture a module for each circuit. Moreover, if each is accommodated in a case and resin-molded, it will also become bulky.

そこで、本発明は、上記課題を解決するためになされたものであって、低インダクタンス化を図りながらも２回路に対応することのできるスナバモジュールの提供を目的とする。   Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a snubber module that can handle two circuits while reducing inductance.

上記課題を解決するため、本発明のスナバモジュール１は、コンデンサ素子２と、コンデンサ素子２の電極２ｃ、２ｄに接続される一対の電極板３、４とからなる回路を２個備え、これら回路を構成する一対の電極板３、４のうち、一方の電極板４を共通の１の電極板で形成しているとともに、一方の電極板４と他方の電極板３とを絶縁層８を介して重ね合わせていることを特徴としている。   In order to solve the above problems, the snubber module 1 of the present invention includes two circuits each including a capacitor element 2 and a pair of electrode plates 3 and 4 connected to the electrodes 2c and 2d of the capacitor element 2. Among the pair of electrode plates 3 and 4, one electrode plate 4 is formed by one common electrode plate, and one electrode plate 4 and the other electrode plate 3 are connected via an insulating layer 8. It is characterized by overlapping.

本発明のスナバモジュールは、コンデンサ素子と、コンデンサ素子の電極に接続される一対の電極板とからなる回路を２個備えているため、２回路に対応することができる。また、一対の電極板のうち、一方の電極板を共通の１の電極板で形成している、すなわち、一方の電極板を２個の回路で兼用しているため、モジュールの小型化や軽量化を図ることができ、さらに外部機器と接続が簡単になる。加えて、一方の電極板と他方の電極板とを重ね合わせているため、磁界を相殺させることができ、低インダクタンス化を図ることができる。   Since the snubber module of the present invention includes two circuits each including a capacitor element and a pair of electrode plates connected to the electrodes of the capacitor element, the snubber module can support two circuits. In addition, one electrode plate of the pair of electrode plates is formed by one common electrode plate, that is, since one electrode plate is shared by two circuits, the module can be reduced in size and weight. And can be easily connected to external devices. In addition, since one electrode plate and the other electrode plate are overlapped, the magnetic field can be canceled and the inductance can be reduced.

この発明の一実施形態に係るスナバモジュールの回路図である。1 is a circuit diagram of a snubber module according to an embodiment of the present invention. 同じくそのスナバモジュールを示す斜視図である。It is a perspective view which similarly shows the snubber module. 同じくそのスナバモジュールの分解斜視図である。It is an exploded perspective view of the same snubber module. 従来のスナバモジュールを示す斜視図である。It is a perspective view which shows the conventional snubber module. 従来のスナバモジュールの回路図である。It is a circuit diagram of the conventional snubber module.

次に、この発明のスナバモジュール１の一実施形態を図面に基づいて詳細に説明する。この発明のスナバモジュール１は、図１に示すように、Ｐ−Ｃ間、Ｃ−Ｎ間の２回路を備えるスナバモジュールであって、図２及び図３に示すように、複数のコンデンサ素子２と、これらコンデンサ素子２に接続される一対の電極板３、４と、コンデンサ素子２及び一対の電極板３、４を収納するケース５と、ケース５内に充填される樹脂（図示していない）とから構成されている。以下、各構成部品について説明する。   Next, an embodiment of the snubber module 1 of the present invention will be described in detail with reference to the drawings. A snubber module 1 according to the present invention is a snubber module having two circuits between P-C and C-N as shown in FIG. 1, and includes a plurality of capacitor elements 2 as shown in FIGS. A pair of electrode plates 3 and 4 connected to the capacitor element 2, a case 5 for housing the capacitor element 2 and the pair of electrode plates 3 and 4, and a resin (not shown) filled in the case 5 ). Hereinafter, each component will be described.

コンデンサ素子２は、例えば絶縁性のフィルム上に金属を蒸着した金属化フィルムを巻回するとともに、断面形状を円形から略楕円形になるように押圧することで形成されたフィルムコンデンサであって、図２及び図３に示すように、その側面には、巻回による湾曲部２ａと押圧による平坦部２ｂが形成されている。また、軸方向両端部には、メタリコンを溶射してなる電極部２ｃ、２ｄが形成されている。さらに、これら電極部２ｃ、２ｄには、例えば軟銅線からなるリード端子６Ａ、６Ｂがスポット溶接や半田付けによってそれぞれ接続されている。そして、コンデンサ素子２を２個、平坦部２ｂ、２ｂ同士を対向させるようにして並設することでコンデンサ素子群７を形成している。なお、このコンデンサ素子群７は１回路用であり、２回路用である本発明のスナバモジュール１では、コンデンサ素子群７を２個用いる。２個のコンデンサ素子群７、７は、図２及び図３に示すように、コンデンサ素子２の電極部２ｄ、２ｄ同士を対向させるようにして、軸方向に並設される。   The capacitor element 2 is a film capacitor formed by, for example, winding a metallized film obtained by vapor-depositing a metal on an insulating film and pressing the cross-sectional shape from a circular shape to a substantially elliptical shape, As shown in FIGS. 2 and 3, a curved portion 2a by winding and a flat portion 2b by pressing are formed on the side surface. Further, electrode portions 2c and 2d formed by spraying metallicon are formed at both ends in the axial direction. Furthermore, lead terminals 6A and 6B made of, for example, an annealed copper wire are connected to these electrode portions 2c and 2d, respectively, by spot welding or soldering. The capacitor element group 7 is formed by arranging two capacitor elements 2 in parallel so that the flat portions 2b and 2b face each other. The capacitor element group 7 is for one circuit. In the snubber module 1 of the present invention for two circuits, two capacitor element groups 7 are used. As shown in FIGS. 2 and 3, the two capacitor element groups 7 and 7 are arranged in parallel in the axial direction so that the electrode portions 2d and 2d of the capacitor element 2 face each other.

一対の電極板３、４は、コンデンサ素子２の一方端部の電極部２ｃ、具体的には、２個のコンデンサ素子群７を並設した状態において両側（外側）に位置する電極部２ｃとリード端子６Ａを介して接続される第１の電極板３と、コンデンサ素子２の他方端部の電極部２ｄ、具体的には、２個のコンデンサ素子群７を並設した状態において中央（内側）に位置する電極部２ｄとリード端子６Ｂを介して接続される第２の電極板４とから構成されている。ところで、本発明のスナバモジュール１は上記の通り、Ｐ−Ｃ間、Ｃ−Ｎ間の２回路を備えているため、本来、第１の電極板３と第２の電極板４がそれぞれ２枚ずつ、計４枚の電極板が必要となるが、本実施形態では、第２の電極板４を共通の１枚の電極板で形成している、すなわち、第２の電極板４を２回路で兼用しているため、電極板の枚数は、第１の電極板３が２枚、第２の電極板４が１枚の計３枚となる。   The pair of electrode plates 3 and 4 includes an electrode portion 2c at one end of the capacitor element 2, specifically, an electrode portion 2c located on both sides (outside) in a state where two capacitor element groups 7 are arranged in parallel. In the state where the first electrode plate 3 connected via the lead terminal 6A and the electrode portion 2d at the other end of the capacitor element 2, specifically, two capacitor element groups 7 are arranged side by side (inside ) And the second electrode plate 4 connected via the lead terminal 6B. By the way, as described above, the snubber module 1 of the present invention has two circuits between P-C and C-N, so that originally there are two first electrode plates 3 and two second electrode plates 4 respectively. In total, four electrode plates are required, but in this embodiment, the second electrode plate 4 is formed by a single common electrode plate, that is, the second electrode plate 4 is composed of two circuits. Therefore, the number of electrode plates is three in total: two for the first electrode plate 3 and one for the second electrode plate 4.

第１の電極板３は、例えば銅板をプレス成型することでなり、コンデンサ素子２の湾曲部２ａに重ねられる基板部３ａと、基板部３ａから略Ｌ字状に延出されてなる外部接続部３ｂとから構成されている。基板部３ａには、リード端子６Ａとの接続に供するための接続孔３ｃが穿設されている。また、基板部３ａの略中央部には、樹脂充填を円滑に行うための孔３ｄが穿設されている。また、外部接続部３ｂには、図示しない外部機器との接続に供するための接続孔３ｅが穿設されている。   The first electrode plate 3 is formed by press-molding a copper plate, for example, and includes a substrate portion 3a overlaid on the curved portion 2a of the capacitor element 2 and an external connection portion extending from the substrate portion 3a in a substantially L shape. 3b. The board portion 3a is provided with a connection hole 3c for connection to the lead terminal 6A. Further, a hole 3d for smoothly filling the resin is formed in a substantially central portion of the substrate portion 3a. Further, the external connection portion 3b is provided with a connection hole 3e for connection to an external device (not shown).

第２の電極板４は、第１の電極板３と同様、例えば銅板をプレス成型することでなり、コンデンサ素子２の湾曲部２ａに重ねられる基板部４ａと、基板部４ａから略Ｌ字状に延出されてなる外部接続部４ｂとから構成されている。基板部４ａは、その幅が第１の電極板３の基板部３ａの凡そ２．０〜２．５倍程度と、第１の電極板３の基板部３ａに比べて幅広に形成されている。また、その幅方向の中央部近傍には、リード端子６Ｂとの接続に供するための接続孔４ｃが穿設されている。さらに、この接続孔４ｃを囲むようにして切り込み４ｄが形成されている。この切り込み４ｄは、電極板４とリード端子６Ｂとを半田付けする際、半田鏝の熱が電極板全体に広がることを防ぐためのものである。また、基板
部４ａの略中央部とその両側には、樹脂充填を円滑に行うための孔４ｅが穿設されている。また、外部接続部４ｂには、図示しない外部機器との接続に供するための接続孔４ｆが穿設されている。 Similarly to the first electrode plate 3, the second electrode plate 4 is formed by press-molding a copper plate, for example, and a substrate portion 4a that is superimposed on the curved portion 2a of the capacitor element 2 and a substantially L-shape from the substrate portion 4a. It is comprised from the external connection part 4b extended in this. The width of the substrate portion 4 a is approximately 2.0 to 2.5 times that of the substrate portion 3 a of the first electrode plate 3 and is wider than the substrate portion 3 a of the first electrode plate 3. . Further, a connection hole 4c is provided near the center in the width direction for connection with the lead terminal 6B. Further, a cut 4d is formed so as to surround the connection hole 4c. This notch 4d is for preventing the heat of the soldering iron from spreading over the entire electrode plate when the electrode plate 4 and the lead terminal 6B are soldered. Further, a hole 4e for smoothly filling the resin is formed in the substantially central portion of the substrate portion 4a and on both sides thereof. The external connection portion 4b is provided with a connection hole 4f for use in connection with an external device (not shown).

ケース５は、例えば樹脂製であって、図２に示すように、略長方形状の底部５ａと、その底部５ａの４辺からそれぞれ立ち上がる側壁部５ｂとから構成された有底箱型であり、上面（底部５ａと対向する面）に開口部５ｃが設けられている。   The case 5 is made of, for example, resin, and has a bottomed box shape including a substantially rectangular bottom 5a and side walls 5b respectively rising from four sides of the bottom 5a, as shown in FIG. An opening 5c is provided on the upper surface (the surface facing the bottom 5a).

そして、上記各構成部品は、以下の工程を経てスナバモジュール１となる。スナバモジュール１の製造にあたっては、まず、コンデンサ素子群７と第１、第２の電極板３、４を重ね合わせていく。具体的には、コンデンサ素子群７と第１の電極板３とを、コンデンサ素子２の湾曲部２ａと第１の電極板３の基板部３ａとを対向させるようにして重ね合わせるとともに、第１の電極板３と第２の電極板４とを、基板部３ａ、４ａ同士を対向させるようにしてノーメックス（登録商標）等の絶縁層８を介しながら重ね合わせる。また、重ね合わせると同時に、コンデンサ素子２の一方端部の電極部２ｃに接続されたリード端子６Ａの先端を第１の電極板３の接続孔３ｃに挿通し、コンデンサ素子２の他方端部の電極部２ｄに接続されたリード端子６Ｂの先端を第２の電極板４の接続孔４ｃにそれぞれ挿通する。なお、絶縁層８には、図３に示すように、４ｃと対向する位置に適宜開口８ａが設けられており、リード端子６Ｂの先端の、接続孔４ｃへの挿通にあたって障害になることはない。また、樹脂充填用の孔３ｄ、４ｅに対向する位置にも開口８ｂが設けられており、円滑な樹脂充填が行えるようになっている。この状態において、第１の電極板３の基板部３ａは、第２の電極板４の基板部４ａに略覆われた状態となる。   And each said component becomes the snubber module 1 through the following processes. In manufacturing the snubber module 1, first, the capacitor element group 7 and the first and second electrode plates 3 and 4 are overlapped. Specifically, the capacitor element group 7 and the first electrode plate 3 are overlapped so that the curved portion 2a of the capacitor element 2 and the substrate portion 3a of the first electrode plate 3 face each other, and the first The electrode plate 3 and the second electrode plate 4 are overlapped with an insulating layer 8 such as Nomex (registered trademark) so that the substrate portions 3a and 4a face each other. Simultaneously, the tip of the lead terminal 6A connected to the electrode portion 2c at one end of the capacitor element 2 is inserted into the connection hole 3c of the first electrode plate 3 at the same time, and the other end of the capacitor element 2 is inserted. The tips of the lead terminals 6B connected to the electrode portion 2d are inserted into the connection holes 4c of the second electrode plate 4, respectively. In addition, as shown in FIG. 3, the insulating layer 8 is appropriately provided with an opening 8a at a position facing the 4c, so that there is no obstacle when the tip of the lead terminal 6B is inserted into the connection hole 4c. . An opening 8b is also provided at a position facing the resin filling holes 3d and 4e so that the resin can be filled smoothly. In this state, the substrate portion 3 a of the first electrode plate 3 is substantially covered with the substrate portion 4 a of the second electrode plate 4.

コンデンサ素子群７と第１、第２の電極板３、４とを重ね合わせた後、接続孔３ｃ、４ｃを介して上方に突出したリード端子６Ａ、６Ｂと第１、第２の電極板３、４とを半田等で接続し、コンデンサ素子群７と第１、第２の電極板３、４とを一体化する。これにより、コンデンサ素子２の一方の電極部２ｃと第１の電極板３とがリード端子６Ａを介して電気的に接続され、コンデンサ素子２の他方の電極部２ｄと第２の電極板４とがリード端子６Ｂを介して電気的に接続される。   After the capacitor element group 7 and the first and second electrode plates 3 and 4 are overlapped, the lead terminals 6A and 6B protruding upward through the connection holes 3c and 4c and the first and second electrode plates 3 are overlapped. 4 are connected by solder or the like, and the capacitor element group 7 and the first and second electrode plates 3 and 4 are integrated. Thereby, one electrode portion 2c of the capacitor element 2 and the first electrode plate 3 are electrically connected via the lead terminal 6A, and the other electrode portion 2d of the capacitor element 2 and the second electrode plate 4 are electrically connected. Are electrically connected via the lead terminal 6B.

そして、一体化されたコンデンサ素子群７と第１、第２の電極板３、４とを、外部接続部３ｂ、４ｂがケース５外に延出されるようにしてケース５に収納する。収納に際しては、コンデンサ素子群７がケース底部５ａ側に、第１、第２の電極板３、４がケース開口部５ｃ側に位置するように、換言すれば、コンデンサ素子群７の上面を第１、第２の電極板３、４で覆うようにして収納する。このように収納することで、第２の電極板４はケース５内で最も上方に位置することになる。   Then, the integrated capacitor element group 7 and the first and second electrode plates 3 and 4 are accommodated in the case 5 such that the external connection portions 3 b and 4 b extend outside the case 5. In storing, the capacitor element group 7 is positioned on the case bottom 5a side, and the first and second electrode plates 3 and 4 are positioned on the case opening 5c side. 1. Covered with first and second electrode plates 3 and 4 and housed. By storing in this way, the second electrode plate 4 is located in the uppermost position in the case 5.

その後、ケース５内にエポキシ樹脂を充填し、第１、第２の電極板３、４やコンデンサ素子２（コンデンサ素子群７）を封止することによりスナバモジュール１の製造を完了する。   Thereafter, the case 5 is filled with epoxy resin, and the first and second electrode plates 3 and 4 and the capacitor element 2 (capacitor element group 7) are sealed to complete the manufacture of the snubber module 1.

上記構成のスナバモジュール１は、２回路を１個のケース５内に収納している（２回路を一体化している）ことから、回路毎にケース５内に収納して２個のスナバモジュール１を形成する場合に比べて軽量化や小型化を図ることができる。特に、第２の電極板４が２回路に跨っている、すなわち、２回路で兼用されているため、その効果は顕著である。さらに外部機器との接続にあたっては、Ｐ、Ｃ、Ｎの３箇所を接続するだけで良いため、Ｐ、Ｃそれぞれ２箇所、計４箇所を接続しなければならない従来品に比べて取付作業も簡単となる。   Since the snubber module 1 having the above-described configuration accommodates two circuits in one case 5 (two circuits are integrated), each circuit accommodates two circuits in the case 5 and two snubber modules 1. As compared with the case of forming, the weight can be reduced and the size can be reduced. In particular, since the second electrode plate 4 extends over two circuits, that is, is shared by two circuits, the effect is remarkable. Furthermore, since it is only necessary to connect three locations P, C, and N when connecting to an external device, installation work is easier compared to conventional products that require two locations for P and C, and a total of four locations. It becomes.

また、第１の電極板３と第２の電極板４とが絶縁層８を介して重なり合っているため、
磁界を相殺させることができ、低インダクタンス化を図ることができる。具体的には、本発明のスナバモジュール１の場合、周波数１ＭＨｚの電流を印加した場合のインダクタンスが８．５ｎＨと、インダクタンスが２０ｎＨ程度である図４のスナバモジュールに比べて大幅な低減効果が得られる。従って、サージ電圧の跳ね上がりを抑えることができる。なお、スナバレスの場合に比べた場合には、サージ電圧を３０Ｖ低減することができる。 Further, since the first electrode plate 3 and the second electrode plate 4 overlap with each other through the insulating layer 8,
The magnetic field can be canceled and the inductance can be reduced. Specifically, in the case of the snubber module 1 of the present invention, the inductance when the current of 1 MHz is applied is 8.5 nH, which is a significant reduction effect compared to the snubber module of FIG. 4 where the inductance is about 20 nH. It is done. Therefore, the surge voltage jump can be suppressed. Note that the surge voltage can be reduced by 30 V compared to the case of snubberless.

以上に、この発明の実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、上記実施形態では、絶縁層８としてノーメックス（登録商標）を用いていたが、これに限らず、公知の種々の絶縁紙などを用いても良い。さらに、絶縁層８としては、第１の電極板３と第２の電極板４との間に隙間を設けるだけでも良い。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, although Nomex (registered trademark) is used as the insulating layer 8 in the above embodiment, the present invention is not limited to this, and various known insulating papers may be used. Furthermore, as the insulating layer 8, only a gap may be provided between the first electrode plate 3 and the second electrode plate 4.

１・・スナバモジュール、２・・コンデンサ素子、２ａ・・湾曲部、２ｂ・・平坦部、２ｃ、２ｄ・・電極部、３・・第１の電極板、３ａ・・基板部、３ｂ・・外部接続部、３ｃ・・接続孔、３ｄ・・樹脂充填用の孔、３ｅ・・接続孔、４・・第２の電極板、４ａ・・基板部、４ｂ・・外部接続部、４ｃ・・接続孔、４ｄ・・切り込み、４ｅ・・樹脂充填用の孔、４ｆ・・接続孔、５・・ケース、５ａ・・底部、５ｂ・・側壁部、５ｃ・・開口部、６Ａ、６Ｂ・・リード端子、７・・コンデンサ素子群、８・・絶縁層、８ａ、８ｂ・・開口 1 ... Snubber module, 2 ... Capacitor element, 2a ... Curved part, 2b ... Flat part, 2c, 2d ... Electrode part, 3 ... First electrode plate, 3a ... Substrate part, 3b ... External connection part, 3c ... Connection hole, 3d ... Resin filling hole, 3e ... Connection hole, 4 ... Second electrode plate, 4a ... Substrate part, 4b ... External connection part, 4c ... Connection hole, 4d, notch, 4e, resin filling hole, 4f, connection hole, 5 case, 5a, bottom, 5b, side wall, 5c, opening, 6A, 6B,. Lead terminal, 7 ... Capacitor element group, 8 ... Insulating layer, 8a, 8b ... Opening

Claims (1)

コンデンサ素子（２）と、コンデンサ素子（２）の電極（２ｃ、２ｄ）に接続される一対の電極板（３、４）とからなる回路を２個備え、
これら回路を構成する一対の電極板（３、４）のうち、一方の電極板（４）を共通の１の電極板で形成しているとともに、
一方の電極板（４）と他方の電極板（３）とを絶縁層（８）を介して重ね合わせていることを特徴とするスナバモジュール。 Two circuits comprising a capacitor element (2) and a pair of electrode plates (3, 4) connected to the electrodes (2c, 2d) of the capacitor element (2);
Of the pair of electrode plates (3, 4) constituting these circuits, one electrode plate (4) is formed by a common one electrode plate,
A snubber module, wherein one electrode plate (4) and the other electrode plate (3) are superposed via an insulating layer (8).
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JP2007299888A (en) * 2006-04-28 2007-11-15 Shizuki Electric Co Inc Capacitor
JP2008295227A (en) * 2007-05-25 2008-12-04 Toyota Motor Corp Manufacturing method of capacitor integrated bus bar, and power conversion apparatus
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JPS61192436U (en) * 1985-05-23 1986-11-29
JPH03289346A (en) * 1990-04-03 1991-12-19 Mitsubishi Electric Corp Conductor arranging method for inverter
US20060104006A1 (en) * 2004-11-17 2006-05-18 Matsushita Electric Industrial Co., Ltd. Film capacitor and method of manufacturing the same
JP2007299888A (en) * 2006-04-28 2007-11-15 Shizuki Electric Co Inc Capacitor
JP2008295227A (en) * 2007-05-25 2008-12-04 Toyota Motor Corp Manufacturing method of capacitor integrated bus bar, and power conversion apparatus
WO2010067514A1 (en) * 2008-12-10 2010-06-17 パナソニック株式会社 Case mold type capacitor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020098834A (en) * 2018-12-17 2020-06-25 株式会社指月電機製作所 Low ESL conductor structure capacitor

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