JP5045343B2 - Capacitor - Google Patents
Capacitor Download PDFInfo
- Publication number
- JP5045343B2 JP5045343B2 JP2007254927A JP2007254927A JP5045343B2 JP 5045343 B2 JP5045343 B2 JP 5045343B2 JP 2007254927 A JP2007254927 A JP 2007254927A JP 2007254927 A JP2007254927 A JP 2007254927A JP 5045343 B2 JP5045343 B2 JP 5045343B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- lead wire
- capacitor
- electrode
- wire connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 title claims description 69
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 60
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 239000012212 insulator Substances 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
この発明は、コンデンサ素子をケースに収納し、樹脂を充填したコンデンサに関するものである。 The present invention relates to a capacitor in which a capacitor element is housed in a case and filled with resin.
電力変換装置等で用いられるフィルタ用コンデンサやスナバコンデンサでは、大容量であることが要求される。このような要請に応えるコンデンサとしては、図７及び図８に示すように、複数のコンデンサ素子５１を銅等からなる一対の金属電極板５２、５３で接続してケース５４に収納し、樹脂５５を充填、硬化したコンデンサを挙げることができる（例えば、特許文献１参照）。 A capacitor for a filter or a snubber capacitor used in a power converter or the like is required to have a large capacity. As shown in FIGS. 7 and 8, as a capacitor that meets such a demand, a plurality of capacitor elements 51 are connected by a pair of metal electrode plates 52 and 53 made of copper or the like and housed in a case 54, and resin 55 (For example, refer to Patent Document 1).
しかしながら、ＩＧＢＴなどに接続されるフィルタ用コンデンサやスナバコンデンサにおいては、スイッチングロスを低減するために、インダクタンスをできるだけ小さくする必要があるが、上記のコンデンサでは、その要請に充分に応えているとは言い難いのが実情である。 However, in a filter capacitor or a snubber capacitor connected to an IGBT or the like, it is necessary to reduce the inductance as much as possible in order to reduce the switching loss. The situation is hard to say.
また、上記のようなコンデンサは、複数の電極板を折曲して構成されているため、コンデンサ本体の構造が複雑になるだけでなく、複数のコンデンサ素子の電極部に対して金属電極板を接続する際に、金属電極板への半田付けを各コンデンサ素子の全ての電極部毎に行う必要が生じ、そのため作業性が良好であるとはいえなかった。 In addition, since the capacitor as described above is formed by bending a plurality of electrode plates, not only the structure of the capacitor body is complicated, but also a metal electrode plate is attached to the electrode portions of the plurality of capacitor elements. When connecting, it is necessary to perform soldering to the metal electrode plate for every electrode portion of each capacitor element, and thus it cannot be said that the workability is good.
そこで、この発明は、上記の問題点を解消して、低インダクタンス化を図ると共に、簡単な構造で、容易に製造することが可能なコンデンサを提供することを目的としている。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a capacitor that can solve the above-described problems, reduce the inductance, and can be easily manufactured with a simple structure.
上記課題を解決するために、この発明のコンデンサは、両端面に電極部１１を有し、ケース１内に収納される複数のコンデンサ素子２と、ケース開口部７側で絶縁体５を介して重ねられる第１電極板３及び第２電極板４とを有し、隣接するコンデンサ素子２で同一面側にある一方の電極部１１をリード線９を介して第１電極板３に接続し、隣接するコンデンサ素子２で同一面側にある他方の電極部１１をリード線９を介して第２電極板４に接続するとともに、互いに対向する電極部１１が同電位になるように配置してケース１内に樹脂６を充填したコンデンサであって、前記第１電極板３及び第２電極板４に設けられたリード線接続孔２３、３３の周囲に溝２６、３６が配置されていることを特徴とする。 In order to solve the above problems, the capacitor of the present invention includes an electrode portion 11 on both end surfaces, and a plurality of capacitor elements 2 that will be accommodated in the case 1, via an insulator 5 in case the opening 7 side have a first electrode plate 3 and the second electrode plate 4 that is superimposed, connect one of the electrodes 11 on the same side in the capacitor element 2 adjacent to the first electrode plate 3 through the lead wires 9 The other electrode part 11 on the same surface side in the adjacent capacitor element 2 is connected to the second electrode plate 4 via the lead wire 9 and the electrode parts 11 facing each other are arranged so as to have the same potential. A capacitor in which a resin 6 is filled in a case 1, and grooves 26 and 36 are arranged around lead wire connection holes 23 and 33 provided in the first electrode plate 3 and the second electrode plate 4. It is characterized by.
また、前記溝２６、３６は、リード線接続孔２３、３３の周囲に不連続に、且つ略環状に配置されている。 The grooves 26 and 36 are discontinuously arranged around the lead wire connection holes 23 and 33 in a substantially annular shape.
さらに、前記第１電極板３及び第２電極板４に設けられたリード線接続孔２３、３３に前記リード線９が挿通されて、前記第１電極板３と第２電極板４とに接続される。 Further, the lead wire 9 is inserted into lead wire connection holes 23 and 33 provided in the first electrode plate 3 and the second electrode plate 4, and connected to the first electrode plate 3 and the second electrode plate 4. Is done.
さらにまた、前記リード線９は、前記コンデンサ素子２の電極部１１に溶接により接続される。Furthermore, the lead wire 9 is connected to the electrode portion 11 of the capacitor element 2 by welding.
この発明のコンデンサによれば、両端面に電極部を有し、ケース内に収納された複数のコンデンサ素子と、ケース開口部側で絶縁体を介して重ねられ、コンデンサ素子の電極部と接続された第１電極板及び第２電極板とを有するコンデンサであることから、第１電極板と第２電極板を重ねるだけの簡単な構造でありながら、電極板全面を重ねることにより、各電極板に発生する磁束を打ち消しあう効果を最大限活用して低インダクタンス化を図ることが可能になる。また、この発明のコンデンサは、２枚の電極板が平板状に構成されており、従来のように、コンデンサ素子の電極部との接続用端子部を一体的に形成してこれを折曲する必要がないので、電極板の使用量も低減することも可能になる。 According to the capacitor of the present invention, there are electrode portions on both end faces, the capacitor elements housed in the case are overlapped via the insulator on the case opening side, and are connected to the electrode portions of the capacitor element. In addition, since the capacitor has the first electrode plate and the second electrode plate, each electrode plate can be obtained by overlapping the entire surface of the electrode plate while having a simple structure in which the first electrode plate and the second electrode plate are simply stacked. It is possible to reduce the inductance by maximizing the effect of canceling out the magnetic flux generated in the magnetic field. In the capacitor of the present invention, the two electrode plates are formed in a flat plate shape. As in the prior art, the connecting terminal portion with the electrode portion of the capacitor element is integrally formed and bent. Since it is not necessary, the amount of the electrode plate used can be reduced.
さらに、第１電極板及び第２電極板に設けられたリード線接続孔にリード線が挿通され、第１電極板と第２電極板に接続されることから、電極板への半田付け又は溶接が一面だけになり、作業性の向上を図ることが可能になると共に、半田付け又は溶接工程の自動化にも対応することが可能になる。 Furthermore, since the lead wire is inserted into the lead wire connection hole provided in the first electrode plate and the second electrode plate and connected to the first electrode plate and the second electrode plate, soldering or welding to the electrode plate As a result, the workability can be improved, and the soldering or welding process can be automated.
また、リード線がコンデンサ素子の電極部に溶接により接続されていることから、コンデンサ素子へのダメージが少なくなり、耐電流性の向上を図ることが可能になる。 Further, since the lead wire is connected to the electrode portion of the capacitor element by welding, the damage to the capacitor element is reduced, and the current resistance can be improved.
さらに、第１電極板及び第２電極板に設けられたリード線接続孔の周辺に溝が設けられていることから、半田付けにおける半田ごての熱が各電極板に分散されず、熱を局部的に集中させることが可能となり、半田付け性の向上を図ることが可能になる。 Further, since the grooves are provided around the lead wire connection holes provided in the first electrode plate and the second electrode plate, the heat of the soldering iron in the soldering is not distributed to each electrode plate, It becomes possible to concentrate locally and to improve solderability.
以下、この発明の実施形態について図面に基づいて詳細に説明する。この発明の一実施形態に係るコンデンサは、図１及び図２に示すように、絶縁体５を介して重ね合わされた第１電極板３と第２電極板４とを有し、これら電極板３、４に複数のコンデンサ素子２を接続すると共に、これをケース１内に収納し、ケース１内に樹脂６を充填、硬化することにより形成される。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The capacitor according to an embodiment of the present invention, as shown in FIGS. 1 and 2 has a first electrode plate 3 superimposed via an insulator 5 and the second electrode plate 4, these electrode plates 3 4, a plurality of capacitor elements 2 are connected, and the capacitor elements 2 are accommodated in the case 1, and the resin 1 is filled and cured in the case 1.
ケース１は、図１に示すように、箱型のもので、底部と側部とを有し、上方へと開口するケース開口部７を有している。 As shown in FIG. 1, the case 1 is of a box shape, has a bottom portion and side portions, and has a case opening 7 that opens upward.
コンデンサ素子２は、図１に示すように、その両端面に電極部１１が設けられている。このコンデンサ素子２は、図６のように、横方向に対し、相隣接する電極部１１、１１同士を相互に対向させて４個のコンデンサ素子２を並設することによってコンデンサ素子列を構成し、縦方向に３列のコンデンサ素子列を並設した状態で、ケース１の底部８側において同一面上に配置されている。相隣接するコンデンサ素子列においては、縦方向に隣接するコンデンサ素子２の電極部１１、１１同士が略同一面上に隣接するように配置され、これら電極部１１が同電位とされている。 As shown in FIG. 1, the capacitor element 2 is provided with electrode portions 11 on both end faces. As shown in FIG. 6, this capacitor element 2 forms a capacitor element array by arranging four capacitor elements 2 in parallel with the electrode portions 11, 11 adjacent to each other facing each other in the lateral direction. In the state where three capacitor element rows are arranged in parallel in the vertical direction, they are arranged on the same surface on the bottom 8 side of the case 1. In the capacitor element rows adjacent to each other, the electrode parts 11 and 11 of the capacitor elements 2 adjacent in the vertical direction are arranged so as to be adjacent to each other on substantially the same plane, and these electrode parts 11 are at the same potential.
第１電極板３は、図３及び図５に示すように、金属板からなる平板状の本体部２１と、本体部２１から突設され、略Ｌ字状に折曲された端子部２２とからなる。この第１電極板３の本体部２１には、略楕円形を有する長穴状のリード線接続孔２３と、これよりも大きい寸法のリード線逃し孔２４と、樹脂充填孔２５が設けられている。また、リード線接続孔２３の周囲には、半田付けにおける熱を局部に集中させるための複数の溝２６が不連続に、且つ略環状に配置されている。リード線接続孔２３とリード線逃し孔２４とは、合計横５列に配置されており、リード線接続孔２３は、本体部２１の略中心と両端部に略等間隔に配置され、リード線逃し孔２４は、リード線接続孔２３との間に略等間隔に配置されている。また、樹脂充填孔２５は、リード線接続孔２３とリード線逃し孔２４の間に横４列に配置されている。なお、第１電極板３の端子部２２と反対側の端部にあるリード線逃し孔２４、２４は、切欠かれて形成されている。 As shown in FIGS. 3 and 5, the first electrode plate 3 includes a flat plate-like main body portion 21 made of a metal plate, a terminal portion 22 protruding from the main body portion 21 and bent into a substantially L shape. Consists of. The main body portion 21 of the first electrode plate 3 is provided with a lead wire connecting hole 23 having a substantially elliptical shape, a lead wire escape hole 24 having a larger dimension, and a resin filling hole 25. Yes. Around the lead wire connection hole 23, a plurality of grooves 26 for concentrating heat in soldering locally are disposed discontinuously and in a substantially annular shape. The lead wire connection holes 23 and the lead wire escape holes 24 are arranged in a total of five horizontal rows, and the lead wire connection holes 23 are arranged at substantially equal intervals at substantially the center and both ends of the main body 21. The escape holes 24 are arranged at substantially equal intervals between the lead wire connection holes 23. Further, the resin filling hole 25 is placed next four rows between the lead wire connection hole 2 3 and the lead wire escape hole 24. In addition, the lead wire escape holes 24 and 24 in the edge part on the opposite side to the terminal part 22 of the 1st electrode plate 3 are notched and formed.
第２電極板４は、図４に示すように、第１電極板３よりも幅狭に形成され、金属板からなる平板状の本体部３１と、本体部３１から突設され、略Ｌ字状に折曲された端子部３２とからなる。この第２電極板４の本体部３１には、略楕円形を有する長穴状のリード線接続孔３３と、これよりも大きい寸法のリード線逃し孔３４と、樹脂充填孔３５が設けられている。また、リード線接続孔３３の周囲には、半田付けにおける熱を局部に集中させるための複数の溝３６が不連続に、且つ略環状に配置されている。リード線接続孔３３とリード線逃し孔３４とは、合計横３列に配置されており、リード線逃し孔３４は本体部３１の略真中に等間隔に配置されており、リード線接続孔３３はリード線逃し孔３４の両側に配置されている。また、樹脂充填孔３５は、リード線接続孔３３とリード線逃し孔３４の間と端部に横４列に配置されている。なお、第２電極板４の端子部３２とは反対側の端部にあるリード線逃し孔３４は、切欠かれて形成されている。なお、樹脂充填孔３５は、第１電極板３と略同位置に合計８個設けられている。 As shown in FIG. 4, the second electrode plate 4 is formed to be narrower than the first electrode plate 3, and is provided with a flat plate-like main body portion 31 made of a metal plate, and protrudes from the main body portion 31. Terminal portion 32 bent in a shape. The main body 31 of the second electrode plate 4 is provided with a long hole-like lead wire connection hole 33 having a substantially elliptical shape, a lead wire escape hole 34 having a larger dimension, and a resin filling hole 35. Yes. Around the lead wire connection hole 33, a plurality of grooves 36 for concentrating heat in soldering locally are disposed discontinuously and in a substantially annular shape. The lead wire connection holes 33 and the lead wire escape holes 34 are arranged in a total of three horizontal rows, and the lead wire escape holes 34 are arranged at substantially equal intervals in the main body 31, and the lead wire connection holes 33. Are arranged on both sides of the lead wire escape hole 34. Further, the resin filling holes 35 are arranged in four horizontal rows between the lead wire connection holes 33 and the lead wire escape holes 34 and at the end portions. In addition, the lead wire escape hole 34 in the edge part on the opposite side to the terminal part 32 of the 2nd electrode board 4 is notched and formed. A total of eight resin filling holes 35 are provided at substantially the same position as the first electrode plate 3 .
絶縁体５は、図１及び図２、図５に示すように、第２電極板４よりも幅広に形成され、リード線の半田付け作業に耐える耐熱性及び絶縁性を有するシート状の絶縁紙からなる。この絶縁紙にも、第１電極板３及び第２電極板４と同様に、略楕円形のリード線逃し孔４２と、樹脂充填孔４３とが設けられている。リード線逃し孔４２は、横３列に配置されており、樹脂充填孔４３は、リード線逃し孔４２の間及び絶縁紙の端部に横４列に配置されている。なお、樹脂充填孔４３は、第２電極板４と略同位置に合計８個設けられている。また、絶縁体５は、絶縁紙でなくてもよい。 As shown in FIGS. 1, 2, and 5, the insulator 5 is formed wider than the second electrode plate 4, and is a sheet-like insulating paper having heat resistance and insulation properties that can withstand soldering work of lead wires. Consists of. Similar to the first electrode plate 3 and the second electrode plate 4, the insulating paper is also provided with a substantially elliptic lead wire escape hole 42 and a resin filling hole 43 . Hole 42 relief lead wire is arranged in three horizontal rows, the resin charging hole 43 is placed next four rows to the ends of and between the insulating paper of the hole 42 relief lead wire. A total of eight resin filling holes 43 are provided at substantially the same position as the second electrode plate 4. The insulator 5 may not be insulating paper.
上記のように構成された第１電極板３と第２電極板４及び絶縁体５は、第１電極板３と第２電極板４との間に絶縁体５を介在させて、第２電極板４をケース開口部７側に面した状態で重ね合わせられる。なお、第１電極板３は、第２電極板４よりも幅広に形成されており、第１電極板３と第２電極板４を重ね合わせた状態において、第１電極板３の端部にあるリード線接続孔２３と溝２６の一部は露出した状態となる。また、第１電極板３のリード線接続孔２３と第２電極板４のリード線逃し孔３４の位置が略同一になるように、且つ、第１電極板３のリード線逃し孔２４と第２電極板４のリード線接続孔３３の位置が略同一になるようにして重ね合わされると共に、各電極板３、４と絶縁体５の樹脂充填孔２５、３５、４３の位置が略同一になるようにして重ね合わされる。そして、各リード線接続孔２３、３３にリード線９を介してコンデンサ素子２と電気的に接続される。このとき、隣接するコンデンサ素子２で同一面側にある電極部１１が同電位になり、且つ、隣接するコンデンサ素子２で互いに対向する電極部１１が同電位になるように接続する。なお、上記のように各電極板３、４のリード線接続孔２３、３３、リード線逃し孔２４、３４が互いに重なるような関係に配置されることから、各リード線逃し孔２４、３４は、半田付け性と絶縁距離とを考慮した寸法としている。 The first electrode plate 3, the second electrode plate 4, and the insulator 5 configured as described above have the insulator 5 interposed between the first electrode plate 3 and the second electrode plate 4, so that the second electrode The plates 4 are superposed with the plate 4 facing the case opening 7 side. The first electrode plate 3 is formed wider than the second electrode plate 4, and the first electrode plate 3 is placed at the end of the first electrode plate 3 in a state where the first electrode plate 3 and the second electrode plate 4 are overlapped. A certain lead wire connection hole 23 and a part of the groove 26 are exposed. Further, the lead wire connection hole 23 of the first electrode plate 3 and the lead wire escape hole 34 of the second electrode plate 4 are substantially in the same position, and the lead wire escape hole 24 of the first electrode plate 3 and the first electrode plate 3 The two electrode plates 4 are superposed so that the positions of the lead wire connection holes 33 are substantially the same, and the positions of the resin filling holes 25, 35, 43 of the electrode plates 3, 4 and the insulator 5 are substantially the same. In this way, they are superimposed. The lead wire connection holes 23 and 33 are electrically connected to the capacitor element 2 via the lead wires 9. At this time, the adjacent capacitor elements 2 are connected so that the electrode portions 11 on the same plane side have the same potential, and the adjacent capacitor elements 2 have the electrode portions 11 facing each other at the same potential. Since the lead wire connection holes 23 and 33 and the lead wire escape holes 24 and 34 of the electrode plates 3 and 4 are arranged so as to overlap each other as described above, the lead wire escape holes 24 and 34 are The dimensions are determined in consideration of solderability and insulation distance.
リード線９は、より線、ＣＰ線、銅箔等により形成され、一端がコンデンサ素子２の電極部１１にスポット溶接によって接続され、他端が第１電極板３に半田付け等によって接続される。このように、リード線９をスポット溶接したことにより、半田付けに比較して、コンデンサ素子２のダメージが少なく、耐電流性が向上する。また、図においては、コンデンサ素子２の各電極部１１に対して２本のリード線９を接続しているが、コンデンサ素子２の容量に合わせて配置本数を変更することが可能である。なお、図５に示すように、リード線接続孔２３、３３にリード線９、９を挿通させた場合、隣り合うコンデンサ素子２の極性が同一となり、リード線９・・同士の密接が可能になるので省スペースを図ることができる。 The lead wire 9 is formed of a stranded wire, CP wire, copper foil or the like, one end is connected to the electrode portion 11 of the capacitor element 2 by spot welding, and the other end is connected to the first electrode plate 3 by soldering or the like. . As described above, spot welding of the lead wire 9 causes less damage to the capacitor element 2 and improves current resistance compared to soldering. Further, in the figure, two lead wires 9 are connected to each electrode portion 11 of the capacitor element 2, but the number of arrangement can be changed according to the capacity of the capacitor element 2. As shown in FIG. 5, when the lead wires 9 and 9 are inserted into the lead wire connection holes 23 and 33 , the polarities of the adjacent capacitor elements 2 are the same, and the lead wires 9 can be in close contact with each other. Therefore, space can be saved.
そして、リード線９を介して接続された複数のコンデンサ素子２と第１電極板３と第２電極板４及び絶縁体５を第２電極板４がケース開口部７側になるようにしてケース１内に収納すると共に、第１電極板３及び第２電極板４の端子部２２、３２が露出した状態で樹脂６を充填、硬化することによってコンデンサを得ることができる。樹脂６が硬化した状態において、樹脂充填孔内にも樹脂６が充填されていることになるので、各電極板３、４が樹脂６によって拘束され、この結果、耐ヒートショック性を改善できる。 The plurality of capacitor elements 2, the first electrode plate 3, the second electrode plate 4, and the insulator 5 connected via the lead wires 9 are arranged so that the second electrode plate 4 is on the case opening 7 side. The capacitor can be obtained by storing the resin 6 and filling and curing the resin 6 with the terminal portions 22 and 32 of the first electrode plate 3 and the second electrode plate 4 exposed. In a state where the resin 6 is cured, the resin filling hole is also filled with the resin 6, so that the electrode plates 3 and 4 are restrained by the resin 6, and as a result, heat shock resistance can be improved.
したがって、上記構成のコンデンサにおいて、第１電極板３と第２電極板４を重ね合わせるだけの簡単な構造でありながら、第１電極板３と第２電極板４との間に絶縁体５を介在させて、絶縁を保ちながら、近接させることにより、各電極板３、４に発生する磁束を打ち消し合うことができ、低インダクタンス化を図ることができる。また、配線長が最短となると共に、各電極板３、４が簡素な構成となるためコストダウンを図ることが可能となる。さらに、各電極板３、４へリード線９を接続する作業が一方の側（開口部７側）から行えるため接続作業性が改善され、また自動化も行い易い。 Therefore, in the capacitor configured as described above, the insulator 5 is provided between the first electrode plate 3 and the second electrode plate 4 while having a simple structure in which the first electrode plate 3 and the second electrode plate 4 are simply overlapped. By interposing them and keeping them in contact with each other while maintaining insulation, the magnetic fluxes generated in the electrode plates 3 and 4 can be canceled out, and the inductance can be reduced. In addition, the wiring length becomes the shortest and the electrode plates 3 and 4 have a simple configuration, so that the cost can be reduced. Furthermore, since the operation of connecting the lead wire 9 to each electrode plate 3 and 4 can be performed from one side (opening 7 side), the connection workability is improved and automation is easy.
なお、この発明は、上記実施形態に限定されるものではなく、この発明の範囲内で多くの変更及び修正を加え得ることは勿論である。例えば、コンデンサ素子は巻回型コンデンサや積層型コンデンサ等を用いて構成しても良い。 In addition, this invention is not limited to the said embodiment, Of course, many changes and corrections can be added within the scope of this invention. For example, the capacitor element may be configured using a wound capacitor, a multilayer capacitor, or the like.
１・・ケース、２・・コンデンサ素子、３・・第１電極板、４・・第２電極板、５・・絶縁体、６・・樹脂、７・・ケース開口部、８・・ケース底部、９・・リード線、１１・・電極部、２３、３３・・リード線接続孔、２６、３６・・溝 1 .. Case 2.. Capacitor element 3.. First electrode plate 4.. Second electrode plate 5.. Insulator, 6 .. Resin, 7 .. Case opening, 8. , 9 .. Lead wire, 11 .. Electrode section, 23, 33 .. Lead wire connection hole, 26, 36.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007254927A JP5045343B2 (en) | 2007-09-28 | 2007-09-28 | Capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007254927A JP5045343B2 (en) | 2007-09-28 | 2007-09-28 | Capacitor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009088174A JP2009088174A (en) | 2009-04-23 |
| JP2009088174A5 JP2009088174A5 (en) | 2010-11-25 |
| JP5045343B2 true JP5045343B2 (en) | 2012-10-10 |
Family
ID=40661224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007254927A Active JP5045343B2 (en) | 2007-09-28 | 2007-09-28 | Capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5045343B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258343A (en) * | 2009-04-28 | 2010-11-11 | Shizuki Electric Co Inc | Capacitor |
| JP5421686B2 (en) * | 2009-08-04 | 2014-02-19 | 株式会社指月電機製作所 | Capacitor |
| JP5424030B2 (en) * | 2009-08-31 | 2014-02-26 | 株式会社指月電機製作所 | Capacitor |
| JP5319559B2 (en) * | 2010-01-08 | 2013-10-16 | ニチコン株式会社 | Metallized film capacitor and power converter using the same |
| JP5897918B2 (en) * | 2012-02-02 | 2016-04-06 | 株式会社指月電機製作所 | Capacitor |
| JP6041425B2 (en) * | 2012-07-10 | 2016-12-07 | 株式会社指月電機製作所 | Capacitor |
| JP6144132B2 (en) * | 2013-07-05 | 2017-06-07 | 株式会社指月電機製作所 | Capacitor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004079708A (en) * | 2002-08-14 | 2004-03-11 | Murata Mfg Co Ltd | Capacitor module and inverter |
| JP4702597B2 (en) * | 2005-03-02 | 2011-06-15 | 株式会社指月電機製作所 | Capacitor |
-
2007
- 2007-09-28 JP JP2007254927A patent/JP5045343B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009088174A (en) | 2009-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5045343B2 (en) | Capacitor | |
| JP5897918B2 (en) | Capacitor | |
| US9209447B2 (en) | Secondary battery module | |
| JP6246764B2 (en) | Bus bar and battery module | |
| JP6425024B2 (en) | Capacitor and inverter | |
| JP6764692B2 (en) | Shunt resistor and shunt resistor mounting structure | |
| JP2007299888A (en) | Capacitor | |
| JP6215358B2 (en) | Busbar module and battery pack | |
| JP5203310B2 (en) | Metallized film capacitors | |
| WO2018198527A1 (en) | Capacitor | |
| JP2014036214A (en) | Multilayer capacitor | |
| JP2008277474A (en) | Capacitor housed in case | |
| JP2010258343A (en) | Capacitor | |
| JP7122657B2 (en) | capacitor | |
| JP5029293B2 (en) | Cased capacitor | |
| JP5045058B2 (en) | π-type filter | |
| JP6575869B2 (en) | Film capacitor | |
| US10984952B2 (en) | Capacitor | |
| JP5861531B2 (en) | Multilayer capacitor | |
| KR102620522B1 (en) | Electronic component and board having the same mounted thereon | |
| JP2008103447A (en) | Chip type solid-state electrolytic capacitor | |
| JP5989533B2 (en) | Capacitor | |
| JPWO2019124109A1 (en) | Busbar and battery laminate | |
| JP6041425B2 (en) | Capacitor | |
| JP7088124B2 (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100927 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100927 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120224 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120327 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120518 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120605 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120702 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150727 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5045343 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |