JP6144132B2 - Capacitor - Google Patents
Capacitor Download PDFInfo
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- JP6144132B2 JP6144132B2 JP2013141576A JP2013141576A JP6144132B2 JP 6144132 B2 JP6144132 B2 JP 6144132B2 JP 2013141576 A JP2013141576 A JP 2013141576A JP 2013141576 A JP2013141576 A JP 2013141576A JP 6144132 B2 JP6144132 B2 JP 6144132B2
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- 239000003990 capacitor Substances 0.000 title claims description 49
- 239000012212 insulator Substances 0.000 claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000003780 insertion Methods 0.000 description 14
- 230000037431 insertion Effects 0.000 description 14
- 239000002184 metal Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
この発明は、コンデンサ素子を電極板で接続したコンデンサに関する。 The present invention relates to a capacitor in which capacitor elements are connected by electrode plates.
産業用インバータ等に用いられるコンデンサは、半導体素子のスイッチング時に生じる急峻な電流を吸収するため、低インダクタンス化を図る必要がある。そこで、特許文献１に開示されているコンデンサでは、図５に示すように、コンデンサ素子２に接続された電極板３、４同士を重ね合わせ、電極板３、４に発生する磁束を互いに打ち消し合わせることで、低インダクタンス化を図っている。 A capacitor used in an industrial inverter or the like needs to have a low inductance in order to absorb a steep current generated when the semiconductor element is switched. Therefore, in the capacitor disclosed in Patent Document 1, as shown in FIG. 5, the electrode plates 3 and 4 connected to the capacitor element 2 are overlapped, and the magnetic fluxes generated on the electrode plates 3 and 4 cancel each other. In this way, low inductance is achieved.
また、特許文献１のコンデンサでは、図５に示すように、重ね合わされた一対の電極板のうち、外側に位置する電極板３にコンデンサ素子２側に向かって陥没する凹部３５を設け、この凹部３５をリード端子６の接続箇所として用いることで、リード端子６の上方への突出量を減少させ、コンデンサ１の低背化を図ることも行われている。なお、重ね合わされた一対の電極板のうち、内側に位置する電極板４には、図６（ａ）、（ｂ）に示すように、凹部３５と対向する位置に開口部４４が設けられており、この開口部４４に没入した凹部３５と開口部４４の内周縁端との間に十分な隙間Ｇを設けることで絶縁を確保している。 Moreover, in the capacitor | condenser of patent document 1, as shown in FIG. 5, the recessed part 35 dented toward the capacitor | condenser element 2 side is provided in the electrode plate 3 located outside among a pair of electrode plates piled up, and this recessed part is provided. By using 35 as a connection location of the lead terminal 6, the amount of protrusion upward of the lead terminal 6 is reduced and the height of the capacitor 1 is reduced. Of the pair of electrode plates stacked, the electrode plate 4 located on the inner side is provided with an opening 44 at a position facing the recess 35 as shown in FIGS. 6 (a) and 6 (b). Insulation is ensured by providing a sufficient gap G between the recess 35 immersed in the opening 44 and the inner peripheral edge of the opening 44.
ところで、特許文献１のコンデンサでは、図６（ｂ）に示すように、凹部３５と他の部分との段差部３６に貫通孔３７を設け、凹部３５と他の部分とを部分的に切り離して（分断して）いる。この構成は、凹部３５とリード端子６とを接続する際の半田熱が電極板３全体に拡散してしまうのを抑制し、半田付けにかかる時間を短縮するといった目的でなされているが、以下のような問題を引き起こす虞があった。 By the way, in the capacitor | condenser of patent document 1, as shown in FIG.6 (b), the through-hole 37 is provided in the level | step-difference part 36 of the recessed part 35 and another part, and the recessed part 35 and another part are partially cut away. (Divided). This configuration is made for the purpose of suppressing the diffusion of the solder heat when connecting the recess 35 and the lead terminal 6 to the entire electrode plate 3 and reducing the time required for soldering. There was a risk of causing such problems.
すなわち、電極板３とリード端子６との接続作業において、半田ボール等の金属異物Ａが生じることがあるが、この金属異物Ａが貫通孔３７を通じて、凹部３５と開口部４４の内周縁端との間の隙間Ｇに入り込み、電極板３、４同士を接続したり、電極板３、４同士を接続しないまでも絶縁距離（Ｇ）を短くしたりと、電極板３、４間での短絡を招く虞があった。なお、電極板３、４間には、図６（ａ）、（ｂ）に示すように、シート状の絶縁体５が介在しているが、凹部３５を挿通するための挿通孔５１の幅が凹部３５の幅よりも大とされ、凹部３５と挿通孔５１との間に金属異物Ａが入り込むに十分な隙間が形成されているため、上記問題の発生を防ぐことは困難であった。 That is, in the connection work between the electrode plate 3 and the lead terminal 6, a metal foreign matter A such as a solder ball may be generated. The metal foreign matter A passes through the through hole 37 and the inner peripheral edge of the recess 35 and the opening 44. Between the electrode plates 3 and 4 by connecting the electrode plates 3 and 4 or shortening the insulation distance (G) even if the electrode plates 3 and 4 are not connected to each other. There was a risk of inviting. 6A and 6B, the sheet-like insulator 5 is interposed between the electrode plates 3 and 4, but the width of the insertion hole 51 through which the recess 35 is inserted. Is larger than the width of the recess 35, and a sufficient gap is formed between the recess 35 and the insertion hole 51 to allow the metal foreign matter A to enter. Therefore, it is difficult to prevent the occurrence of the above problem.
そこで、この発明は、上記課題を解決するためになされたものであって、電極板に凹部や半田熱拡散抑制用の貫通孔を設けた場合であっても、金属異物による短絡故障の発生を防止することのできるコンデンサの提供を目的とする。 Therefore, the present invention has been made to solve the above-described problems, and even when a recess or a through hole for suppressing solder thermal diffusion is provided in an electrode plate, a short circuit failure due to a metal foreign object is generated. The object is to provide a capacitor that can be prevented.
上記課題を解決するため、本発明のコンデンサは、コンデンサ素子２と、上記コンデンサ素子２の一方の電極部２１と第１リード端子６を介して接続される第１電極板３と、上記コンデンサ素子２の他方の電極部２２と第２リード端子７を介して接続される第２電極板４とを備え、上記第１電極板３及び第２電極板４を、シート状の絶縁体５を介して重ね合わせるとともに、第２電極板４が第１電極板３と上記コンデンサ素子２との間に位置するようにして配置したコンデンサ１であって、上記第２電極板４には、上記第１リード端子６を挿通させる開口部４４が形成され、上記第１電極板３には、上記開口部４４内に没入し、第１リード端子６との接続に供される凹部３５と、この凹部３５と他の部分との段差部３６に、凹部３５と他の部分とを部分的に切り離す貫通孔３７が形成されており、上記絶縁体５には、上記凹部３５と対向する部分から外方に向かって延びるスリット５３が複数形成され、スリット５３、５３間に位置する絶縁体５が、第２電極板４側に折り込まれ、上記凹部３５と上記開口部４４の内周縁端との間に介在していることを特徴としている。 In order to solve the above problems, the capacitor according to the present invention includes a capacitor element 2, a first electrode plate 3 connected to one electrode portion 21 of the capacitor element 2 via a first lead terminal 6, and the capacitor element. 2 and the second electrode plate 4 connected via the second lead terminal 7, and the first electrode plate 3 and the second electrode plate 4 are connected via the sheet-like insulator 5. The capacitor 1 is arranged such that the second electrode plate 4 is positioned between the first electrode plate 3 and the capacitor element 2, and the second electrode plate 4 includes the first electrode An opening 44 through which the lead terminal 6 is inserted is formed. The first electrode plate 3 is recessed in the opening 44 and used for connection to the first lead terminal 6, and the recess 35. And the step portion 36 between the concave portion 35 and the other portion. Are formed, and a plurality of slits 53 extending outward from a portion facing the recess 35 are formed in the insulator 5, and are positioned between the slits 53, 53. The insulator 5 is folded into the second electrode plate 4 and is interposed between the recess 35 and the inner peripheral edge of the opening 44.
この発明のコンデンサでは、凹部と対向する部分から外方に向かって延びるスリットを複数形成し、スリット間の絶縁体を第２電極板側に折り込み、凹部と開口部の内周縁端との間に介在させているため、貫通孔からの金属異物の侵入を防いだり、たとえ侵入を許したとしても、金属異物による凹部と開口部の内周縁端との接続や絶縁距離の短縮を防ぐことができ、短絡故障の発生を防止することができる。 In the capacitor of the present invention, a plurality of slits extending outward from the portion facing the recess are formed, the insulator between the slits is folded to the second electrode plate side, and between the recess and the inner peripheral edge of the opening Because it is interposed, it can prevent the intrusion of metal foreign matter from the through-hole, and even if it allows entry, it can prevent the connection between the recess and the inner peripheral edge of the opening and the shortening of the insulation distance due to the metal foreign matter. The occurrence of short-circuit failure can be prevented.
次に、この発明のコンデンサ１の一実施形態を図面に基づいて詳細に説明する。この発明のコンデンサ１は、図１及び図５に示すように、コンデンサ素子２と、第１電極板３と、第２電極板４と、絶縁体５とを備えており、第１電極板３及び第２電極板４を、絶縁体５を介して重ね合わせるとともに、第２電極板４が第１電極板３とコンデンサ素子２との間に位置するようにして配置することで構成されている。以下、上記構成部品について説明していく。 Next, an embodiment of the capacitor 1 of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 and 5, the capacitor 1 of the present invention includes a capacitor element 2, a first electrode plate 3, a second electrode plate 4, and an insulator 5, and the first electrode plate 3 In addition, the second electrode plate 4 is overlapped with the insulator 5 interposed therebetween, and the second electrode plate 4 is disposed so as to be positioned between the first electrode plate 3 and the capacitor element 2. . Hereinafter, the component parts will be described.
コンデンサ素子２は、図１に示すように、その両端面にメタリコンを溶射してなる電極部２１、２２が設けられたフィルムコンデンサであり、一方の電極部２１には第１リード端子６が、他方の電極部２２には第２リード端子７がそれぞれ接続されている。また、コンデンサ素子２は、コンデンサ素子２の軸方向及びそれと直交する方向に複数個並設され、コンデンサ素子群を形成している。 As shown in FIG. 1, the capacitor element 2 is a film capacitor in which electrode portions 21 and 22 are formed by spraying metallicon on both end faces, and the first lead terminal 6 is provided on one electrode portion 21. The second lead terminal 7 is connected to the other electrode portion 22. In addition, a plurality of capacitor elements 2 are arranged in parallel in the axial direction of the capacitor element 2 and in a direction orthogonal thereto, thereby forming a capacitor element group.
第１電極板３は、図１に示すように、基板部３１と、この基板部３１から延設された外部接続部３２とから構成されている。基板部３１には、コンデンサ素子２の一方の電極部２１と対向する位置に、第１リード端子６と接続するための接続孔３３が設けられ、コンデンサ素子２の他方の電極部２２と対向する位置には、第２リード端子７との接続を避けるための開口部３４が設けられている。また、基板部３１には、図２（ａ）及び図３（ａ）、（ｂ）に示すように、接続孔３３の周りを略四角形状に、コンデンサ素子２側に向かって陥没させてなる凹部３５が設けられている。さらに、この凹部３５と他の部分との段差部３６であって互いに対向する２辺に貫通孔３７が設けられており、凹部３５と他の部分とが部分的に切り離された状態となっている。 As shown in FIG. 1, the first electrode plate 3 includes a substrate part 31 and an external connection part 32 extending from the substrate part 31. The substrate portion 31 is provided with a connection hole 33 for connecting to the first lead terminal 6 at a position facing one electrode portion 21 of the capacitor element 2, and facing the other electrode portion 22 of the capacitor element 2. An opening 34 for avoiding connection with the second lead terminal 7 is provided at the position. Further, as shown in FIG. 2A, FIG. 3A, and FIG. 3B, the periphery of the connection hole 33 is formed in a substantially quadrangular shape toward the capacitor element 2 side. A recess 35 is provided. Furthermore, a through hole 37 is provided on two sides of the step portion 36 between the concave portion 35 and another portion and facing each other, and the concave portion 35 and the other portion are partially separated. Yes.
第２電極板４は、図１に示すように、基板部４１と、この基板部４１から延設された外部接続部４２とから構成されており、第１電極板３と概略同形状である。しかし、基板部４１に凹部が設けられておらず、また、コンデンサ素子２の他方の電極部２２と対向する位置に、第２リード端子７と接続するための接続孔４３が設けられ、コンデンサ素子２の一方の電極部２１と対向する位置に、第１リード端子６や凹部３５との接続を避けるための開口部４４が設けられている点、第１電極板３とは相違している。 As shown in FIG. 1, the second electrode plate 4 includes a substrate portion 41 and an external connection portion 42 extending from the substrate portion 41, and has substantially the same shape as the first electrode plate 3. . However, the substrate portion 41 is not provided with a recess, and a connection hole 43 for connecting to the second lead terminal 7 is provided at a position facing the other electrode portion 22 of the capacitor element 2. The first electrode plate 3 is different from the first electrode plate 3 in that an opening 44 for avoiding connection with the first lead terminal 6 and the recess 35 is provided at a position facing one of the two electrode portions 21.
絶縁体５は、図１に示すようにシート状であって、例えば絶縁紙や絶縁フィルムから構成される。この絶縁体５には、コンデンサ素子２の電極部２１、２２と対向する位置に、第１リード端子６や第２リード端子７を挿通するための挿通孔５１、５２が設けられている。 The insulator 5 has a sheet shape as shown in FIG. 1 and is made of, for example, insulating paper or an insulating film. The insulator 5 is provided with insertion holes 51 and 52 for inserting the first lead terminal 6 and the second lead terminal 7 at positions facing the electrode portions 21 and 22 of the capacitor element 2.
ところで、凹部３５と対向する位置に設けられた挿通孔５１は、図２（ａ）、（ｂ）に示すように、その幅Ｗ２、Ｄ２が第１電極板３の凹部３５の幅Ｗ１、Ｄ１より小とされた略四角形状とされ、さらにコーナー部から外方に向かって延びるスリット５３が設けられている。 By the way, as shown in FIGS. 2A and 2B, the insertion holes 51 provided at positions facing the recesses 35 have widths W2 and D2 that are the widths W1 and D1 of the recesses 35 of the first electrode plate 3, respectively. The slit 53 is formed in a substantially rectangular shape which is smaller than the corner portion and extends outward from the corner portion.
従って、第１電極板３と第２電極板４との間に絶縁体５を介在させた状態で、第１電極板３の凹部３５を第２電極板４の開口部４４に没入させると、図３（ａ）、（ｂ）に示すように、絶縁体５の、挿通孔５１の幅Ｗ２、Ｄ２と凹部３５の幅Ｗ１、Ｄ１との差分（スリット５３、５３間の絶縁体５：以下、余剰部分５４と称す）が、凹部３５によって第２電極板４側に折り込まれる。この際、余剰部分５４が凹部３５に当接し続けるように、挿通孔５１の幅Ｗ２、Ｄ２（余剰部分５４の長さ）を調整していることから、余剰部分５４が自ずと凹部３５と開口部４４の内周縁端との間に介在することになる。 Therefore, when the recess 35 of the first electrode plate 3 is immersed in the opening 44 of the second electrode plate 4 with the insulator 5 interposed between the first electrode plate 3 and the second electrode plate 4, 3A and 3B, the difference between the widths W2 and D2 of the insertion holes 51 and the widths W1 and D1 of the recesses 35 of the insulator 5 (insulator 5 between the slits 53 and 53: below) , Referred to as an excessive portion 54) is folded into the second electrode plate 4 side by the recess 35. At this time, since the widths W2 and D2 of the insertion holes 51 (the length of the surplus portion 54) are adjusted so that the surplus portion 54 continues to contact the recess 35, the surplus portion 54 naturally has the recess 35 and the opening. 44 between the inner peripheral edge of 44.
そのため、貫通孔３７から、電極板３、４とリード端子６、７との接続作業において、万一、半田ボール等の金属異物Ａが入り込んだとしても、絶縁体５の余剰部分５４によって遮られ、凹部３５と開口部４４の内周縁端とが金属異物Ａによって接続されたり、絶縁距離Ｇが短くなったりすることはなく、短絡故障の発生を防ぐことができる。 Therefore, even if a metal foreign matter A such as a solder ball enters from the through hole 37 in the connection work between the electrode plates 3 and 4 and the lead terminals 6 and 7, it is blocked by the surplus portion 54 of the insulator 5. The recess 35 and the inner peripheral edge of the opening 44 are not connected to each other by the metal foreign matter A, and the insulation distance G is not shortened, so that a short circuit failure can be prevented.
また、凹部３５によって下方（第２電極板４側）に付勢された余剰部分５４は、絶縁体５が持つ弾性により、上方（第１電極板３側）に向かって反発しようとするため、凹部３５に当接した状態を維持することになる。そのため、金属異物Ａの第２電極板４側への落ち込みを確実に防ぐことができる。特に、図４（ａ）、（ｂ）に示すように、絶縁体５と第１電極板３の基板部３１とを面で当接させるようにすれば、余剰部分５４により貫通孔３７を塞ぐことができるため、より効果的である。なお、面で当接させる方法としては、第１電極板３と第２電極板４とをより近接させることが考えられる。この場合、絶縁体５が電極板３、４によって挟まれた状態となるため、電極板３、４との位置関係にズレが生じることも無くなり、絶縁をより良好に維持することができる。また、絶縁体５表面に粘性物質を設けることでも面での当接やズレの防止を実現できるが、この場合、貫通孔３７から侵入してきた金属異物Ａを捕捉することもできるため、例えば製造過程において金属異物Ａが移動し、それにより短絡が生じるといったことも防ぐことができる。なお、余剰部分５４があまり長いと、組立に支障をきたす可能性があることから、段差部３６を覆い、貫通孔３７を閉塞できる程度の長さとすることが好ましい。 Further, the surplus portion 54 urged downward (second electrode plate 4 side) by the recess 35 tends to repel upward (first electrode plate 3 side) due to the elasticity of the insulator 5. The state in contact with the recess 35 is maintained. For this reason, it is possible to reliably prevent the metal foreign matter A from falling to the second electrode plate 4 side. In particular, as shown in FIGS. 4A and 4B, if the insulator 5 and the substrate portion 31 of the first electrode plate 3 are brought into contact with each other on the surface, the through hole 37 is blocked by the surplus portion 54. Can be more effective. In addition, as a method of abutting on the surface, it is conceivable to bring the first electrode plate 3 and the second electrode plate 4 closer. In this case, since the insulator 5 is sandwiched between the electrode plates 3 and 4, there is no deviation in the positional relationship with the electrode plates 3 and 4, and insulation can be maintained better. In addition, it is possible to prevent contact and displacement on the surface by providing a viscous substance on the surface of the insulator 5, but in this case, the metal foreign matter A that has entered from the through hole 37 can also be captured. It is also possible to prevent the metallic foreign matter A from moving in the process and thereby causing a short circuit. In addition, since the assembly may be hindered if the surplus portion 54 is too long, it is preferable to set the length so as to cover the step portion 36 and close the through hole 37.
このように、この発明のコンデンサ１では、第１電極板３と第２電極板４とを重ね合わせたことによる低インダクタンス化、凹部３５を設けたことによるコンデンサ１の低背化や、貫通孔３７を設けたことによる半田付け作業の迅速化を図りながらも、絶縁体５の挿通孔５１の幅Ｗ２、Ｄ２を凹部３５の幅Ｗ１、Ｄ１よりも小さくし、スリット５３を設けるといった簡単な構成で、金属異物Ａによる短絡故障の発生を防止することができる。 Thus, in the capacitor 1 of the present invention, the inductance is reduced by superimposing the first electrode plate 3 and the second electrode plate 4, the profile of the capacitor 1 is reduced by providing the recess 35, and the through hole is provided. A simple configuration in which the width W2 and D2 of the insertion hole 51 of the insulator 5 are made smaller than the widths W1 and D1 of the recess 35 and the slit 53 is provided, while speeding up the soldering operation by providing 37. Thus, it is possible to prevent the occurrence of a short circuit failure due to the metal foreign object A.
以上にこの発明の具体的な実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、上記実施例においては、挿通孔５１の幅Ｗ２、Ｄ２を、凹部３５の幅Ｗ１、Ｄ１より小としていたが、必ずしも幅Ｗ１、Ｄ１より小とする必要はなく、例えば、開口部４４の幅から、第２電極板４の板厚や、絶縁体５と第２電極板４との間隔を除いた幅とすれば、余剰部分５４を開口部４４側に折り込んだ際に、凹部３５と開口部４４の内周縁端との間に余剰部分５４を介在させることができる、換言すれば、少なくとも余剰部分５４によって開口部４４の内周縁端を覆うことができるため、金属異物Ａによる短絡故障を防止することができる。また、挿通孔５１の幅Ｄ２と凹部３５の幅Ｄ１との差分による余剰部分５４によって貫通孔３７を閉塞できるのであれば、挿通孔５１の幅Ｗ２については、必ずしも凹部３５や開口部４４の幅より小さくしなくても良い。 Although specific embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, in the above-described embodiment, the widths W2 and D2 of the insertion holes 51 are smaller than the widths W1 and D1 of the recesses 35. However, the widths W2 and D1 are not necessarily smaller than the widths W1 and D1, for example, If the width is the width excluding the thickness of the second electrode plate 4 or the distance between the insulator 5 and the second electrode plate 4, when the surplus portion 54 is folded toward the opening 44, The surplus portion 54 can be interposed between the inner peripheral edge of the opening 44, in other words, the inner peripheral edge of the opening 44 can be covered by at least the surplus portion 54, so that a short circuit failure due to the metal foreign matter A Can be prevented. Further, if the through hole 37 can be closed by the surplus portion 54 due to the difference between the width D2 of the insertion hole 51 and the width D1 of the recess 35, the width W2 of the insertion hole 51 is not necessarily the width of the recess 35 or the opening 44. It is not necessary to make it smaller.
また、凹部３５の形状は、略四角形状である必要は無く、円形等種々の形状であって良い。貫通孔３７の設ける位置や形状についても、対向する２辺に限らず、凹部３５を囲むようにして設ける等、種々変更可能である。絶縁体５の挿通孔５１も、それらに合わせて適宜形状を変更可能である。また、上記実施例では、スリット５３が挿通孔５１のコーナー部の４箇所から外方に向かって放射状に設けられていたが、スリット５３の位置や数はこれに限らず、適宜変更可能である。また、上記実施例では、余剰部分５４を凹部３５によって第２電極板４側に折り込んでいたが、予め折り込んでおいても良い。特に余剰部分５４の長さが短く、凹部３５による付勢を期待できない場合には有効である。また、コンデンサ素子２と第２電極板４との間に別途、絶縁体を設け、この絶縁体に余剰部分５４を当接させることで、金属異物Ａの侵入を防止するようにしても良い。また、挿通孔５１は予め設けられている必要はなく、余剰部分５４を第２電極板４側に折り込むことで、挿通孔５１が形成されるようにしても良い。この場合、スリット５３としては、例えば、凹部３５の中心と対向する位置を中心に、そこから外方に向かって４本のスリット５３をＸ字状となるように設けることが考えられるが、形状としてはＸ字状に限らず、凹部３５等の形状に合わせて適宜変更可能である。また、コンデンサ１を、ケースに収納し樹脂や絶縁油等で封止しても良い。 Moreover, the shape of the recessed part 35 does not need to be substantially square shape, and may be various shapes, such as circular shape. The position and shape of the through-hole 37 are not limited to the two opposing sides, and can be variously changed such as being provided so as to surround the recess 35. The shape of the insertion hole 51 of the insulator 5 can be changed as appropriate in accordance with them. Moreover, in the said Example, although the slit 53 was provided radially outward from four places of the corner part of the penetration hole 51, the position and number of the slit 53 are not restricted to this, It can change suitably. . Moreover, in the said Example, although the excess part 54 was folded in the 2nd electrode plate 4 side by the recessed part 35, you may fold beforehand. This is particularly effective when the length of the surplus portion 54 is short and urging by the recess 35 cannot be expected. Further, an additional insulator may be provided between the capacitor element 2 and the second electrode plate 4, and the surplus portion 54 may be brought into contact with the insulator to prevent the entry of the foreign metal A. Moreover, the insertion hole 51 does not need to be provided in advance, and the insertion hole 51 may be formed by folding the surplus portion 54 toward the second electrode plate 4 side. In this case, as the slits 53, for example, it is conceivable to provide four slits 53 in an X shape from the center facing the center of the concave portion 35 toward the outside. However, the shape is not limited to the X shape, and can be changed as appropriate according to the shape of the recess 35 or the like. The capacitor 1 may be housed in a case and sealed with resin, insulating oil, or the like.
１・・コンデンサ、２・・コンデンサ素子、２１・・コンデンサ素子の一方の電極部、２２・・コンデンサ素子の他方の電極部、３・・第１電極板、３５・・凹部、３６・・段差部、３７・・貫通孔、４・・第２電極板、４４・・開口部、５・・絶縁体、５１・・挿通孔、５３・・スリット、６・・第１リード端子、７・・第２リード端子 1 .. Capacitor 2.. Capacitor element 21.. One electrode part of the capacitor element 22.. The other electrode part of the capacitor element 3... First electrode plate 35.. Recessed part 36. 37, through-hole, 4 ... second electrode plate, 44 ... opening, 5 ... insulator, 51 ... insertion hole, 53 ... slit, 6 ... first lead terminal, 7 ... Second lead terminal
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