JP2018182066A - Case-mold film capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for secure prevention of lift of a capacitor main part even without using a large-scale lift prevention jig that greatly affects productivity and manufacturing cost, the lift occurring when a mold resin is injected and filled into an exterior case.SOLUTION: A case-mold film capacitor comprises: a capacitor main part A comprised of a film capacitor element 10 and an external pull-out terminal 17; an exterior case 18 that houses the capacitor main part A; and a mold resin 19 that is filled in the exterior case and covers the capacitor main part except for a part of an external connection terminal part. The exterior case is provided with a pedestal part 18c receiving the external pull-out terminal and a support pin 18d protruding from the pedestal part. A plurality of holding tongue pieces 17f engaging with the support pins and sandwiching the support pins are formed in the external pull-out terminal.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a film capacitor used for smoothing or the like of an inverter circuit. Specifically, a main portion of a capacitor including an external lead terminal electrically connected to each of the film capacitor element in which a pair of metal electrodes for electrode lead-out are formed on both end faces and the pair of metal electrodes, and an opening An external case for accommodating the main part of the capacitor except a part of the external connection terminal on the free end side of the external lead terminal, and a part of the external connection terminal filled in the external case and solidified And a mold resin that covers the main part of the capacitor except for

  In the case mold type film capacitor having the above configuration, it is required to prevent the floating of the main part of the capacitor when the main part of the capacitor is accommodated in the outer case and the mold resin is injected and filled in the outer case. If the main part of the capacitor floats up in the outer case due to the buoyancy of the mold resin, the thickness of the mold resin covering the upper and lower portions of the outer periphery of the film capacitor element inside will be insufficient. In addition, if the positioning of the main part of the capacitor in the horizontal direction with respect to the outer case is unstable, the thickness of the mold resin covering the lateral side portion of the outer periphery of the film capacitor element may be insufficient. Such excess or deficiency of the thickness of the mold resin leads to the deterioration of the moistureproof performance to the film capacitor element.

  In recent years, while there is a demand for increasing the capacity of a film capacitor element, the demand for miniaturizing a case mold type film capacitor is increasing more and more. Therefore, the thickness of the mold resin becomes thin, and there is no margin in the mold resin thickness in order to secure the reliability, and the positioning of the main part of the capacitor at the time of resin curing is more important than ever.

  Conventionally, a part of the vertical side plate of the exterior case is cut out and cut off as a measure for preventing the floating of the main part of the capacitor in the exterior case at the time of injection and filling of the mold resin and for positioning in the horizontal direction. There is one in which a corresponding sealing plate is fitted in the notch of the vertical side plate to hold the external connection terminal part extending from the film capacitor element (see, for example, Patent Document 1). In Patent Document 1, there are two cases inside and outside, the inner resin case is referred to as an interior case, the outer metal case is referred to as an exterior case, and the interior case is an internal case. It should be noted that this corresponds to the exterior case referred to in the specification.

  In this case, a positioning pin protruding upward from the bottom of the notch is fitted in the positioning hole of the external connection terminal, and the same positioning pin is fitted in the positioning hole of the bottom of the sealing plate. Match. At the same time, a positioning pin projecting upward from the rising portion at the center of the notch is fitted in the positioning hole at the center of the bottom of the sealing plate.

JP, 2010-182914, A

In the conventional case mold type film capacitor of the above-mentioned configuration, the outer case is cut out to be separated into the case main body with the notch and the sealing plate, and both are fitted. And the positioning pin is protrudingly provided by the side of a notch part, and the hole for positioning is formed in the side of a sealing plate. Therefore, the structure of the outer case is complicated, and if the mating interface between the notch portion and the sealing plate is not processed with high accuracy, there is a possibility that the problem of mold resin leakage may occur.

  Also, in order to reliably prevent the floating of the main part of the capacitor when the mold resin is injected and filled in the outer case, conventionally, a floating prevention jig as shown below has been used. That is, in the main part (consisting of a film capacitor element and an external lead terminal connected to a pair of metal electrodes of the element) of the capacitor to be accommodated in the outer case, the outer lead terminal prevents floating on the external connection terminal part on the free end side. Connect the jig. Then, the outer case is placed and fixed on the horizontal base, and further, the floating prevention jig connecting the main part of the capacitor is fixed to the horizontal base. When fixing the floating prevention jig to the horizontal support, the main part of the capacitor is accommodated in the outer case.

  However, in a countermeasure using such an anti-lifting jig, the anti-lifting jig requires not only a connection between the external lead terminal at the main part of the capacitor and the external connection terminal but also a connection with the horizontal base. The lifting prevention jig itself becomes very large. As a result, the productivity has been deteriorated and the manufacturing cost has been increased.

  The present invention has been made in view of such circumstances, and the structure of the main part of the capacitor when the mold resin is injected and filled into the outer case is simplified while improving the productivity and reducing the manufacturing cost. The purpose is to ensure that it can be prevented.

  The present invention solves the above-mentioned problems by taking the following measures.

The case mold type film capacitor according to the present invention is
A film capacitor element in which a pair of metal electrodes for drawing out electrodes are formed on both end faces, and a capacitor main part consisting of an external drawing terminal electrically connected to each of the pair of metal electrodes;
An external case having an opening and containing the main part of the capacitor except a part of the external connection terminal on the free end side of the external lead terminal;
And a mold resin for filling the inside of the outer case and covering the main part of the capacitor except for a part of the external connection terminal by solidification.
The outer case is provided with a pedestal portion on which the external lead terminal is placed and received, and a support pin projecting from the pedestal portion.
The external lead-out terminal is provided with a plurality of holding tongues which engage with the support pin to hold the outer peripheral surface of the support pin.

  According to the above-mentioned composition of the present invention, there are the following effects.

  When housing the main part of the capacitor in the outer case, the upper external lead-out terminal in the main part of the capacitor is placed on and supported by the base of the outer case. At this time, the holding tongues provided on the external lead terminals are engaged with the support pins provided protruding from the pedestal portion. Thus, the plurality of holding tongues hold the outer peripheral surface of the support pin. As a result, the external lead-out terminal on the upper side of the main part of the capacitor is fixed to the outer case in a strong floating-preventing state, and the positioning in the horizontal direction is surely performed.

Here, with respect to the buoyancy that the main part of the capacitor receives from the mold resin to be injected and filled, a mechanism (anti-lifting mechanism) that has a function to prevent the floating is provided with a plurality of support pins projecting from the pedestal of the outer case. It comprises a clamping tongue piece provided on the external lead-out terminal so as to be engaged with the supporting pin in a clamping state, and has a very simple structure of the floating preventing mechanism. That is, it is possible to improve the productivity of the case mold type film capacitor and to achieve a significant cost reduction of the manufacturing cost, since the large scale uplift prevention jig used conventionally is unnecessary.

  Such an anti-lifting mechanism does not only prevent lifting of the main part of the capacitor due to mold resin buoyancy in the outer case, but strictly restricts the height position of the external lead terminal in the outer case to the specified height position. Demonstrate the function to match. As a result, it becomes possible to make the resin thickness covering the main part of the capacitor constant, and it becomes possible to suppress the variation of the moisture resistance performance and to improve the moisture resistance. In addition, the manufacturing tolerance of the resin thickness is sufficiently reduced, and as a result, the size of the capacitor is advantageously reduced.

  The case mold type film capacitor of the present invention having the above-described configuration has the following several preferable aspects, changes and modifications.

  [1] The exterior case is opened upward, and the pedestal portion extends perpendicularly to the surface direction of the longitudinal side plate from the upper portion of the longitudinal side plate constituting the opening circumferential surface of the exterior case The support pin is projected from the pedestal surface upward, which is the opening direction of the outer case, and the lower surface of the external lead terminal is mounted and supported on the pedestal surface. There is an aspect of

  This configuration more specifically defines each configuration of the outer case, the pedestal and the support pin. That is, in the bottomed box-like exterior case, the top surface portion facing the bottom portion is in the open state. Further, a pedestal portion extending perpendicularly to the surface direction of the longitudinal side plate is formed from the upper portion of the longitudinal side plate constituting the bottomed box-like peripheral surface portion, and the support pin is the upper surface of the pedestal portion. Is projected upward. That is, the support pin is in the attitude toward the opening direction of the outer case. According to this, when the main part of the capacitor is accommodated from the upper part to the outer case through the opening and the external lead terminal in the main part of the capacitor is brought close to the pedestal, the clamping tongue piece provided on the external lead terminal is supported It will engage with the pin. Then, immediately after the engagement, the external lead terminal is placed on and supported by the pedestal surface.

  [2] Further, the external lead terminal is a tongue-like extending plate portion in which a plate portion placed and supported on the pedestal surface is integrally extended outward in the plane direction of the main body plate portion. According to another aspect of the present invention, the holding tongue is configured to be movable by cutting out around the holding tongue in the tongue-like extension plate portion.

  In this case, a plurality of holding tongues are movably formed by cutting out in the tongue-like extending plate portion integrally extended outward in the surface direction of the main body plate portion from the main body plate portion of the external lead terminal Each clamping tongue is deformable relative to the tongue-like extension plate. That is, in addition to the deformation of itself, the plurality of holding tongues per one support pin exerts the deformation of the tongue-like extension plate portion on which they are erected, in other words, the double deformation It has a function. Therefore, it is possible to more reliably prevent the floating of the main part of the capacitor due to the resin buoyancy in the outer case.

  [3] Further, there is a mode in which the plurality of holding tongues are configured as at least one pair in a state of facing each other while being separated from each other to such an extent that the support pins can be held. In this case, since the support pins are held by the holding tongues facing each other, the external lead terminals can be reliably positioned and fixed to the outer case. .

[4] Further, the plurality of holding tongues may be configured such that two sets of the pair of holding tongues are orthogonal to each other. In this case, four holding tongues are formed so as to face each other from four directions orthogonal to each other toward the support pins, and the fixation of the external lead terminals to the support pins and the base portion is further strengthened.

  According to the present invention, when the external lead terminal is placed on and supported by the base portion of the outer case, the plurality of holding tongues formed on the outer lead terminal are engaged with the support pins protruding from the base portion. By clamping the support pin, the external lead-out terminal is fixed in a strong floating prevention state with a simple configuration, thereby eliminating the need for a large-scale floating prevention jig conventionally used to improve productivity and reduce cost. it can. And, by reliably preventing the floating of the main part of the capacitor when the mold resin is injected and filled in the outer case, the resin thickness covering the main part of the capacitor is made uniform to suppress the variation of the moisture resistance performance and improve the moisture resistance. Can be In addition, it is possible to improve the quality and reduce the size of the capacitor by sufficiently reducing the manufacturing tolerance of the resin thickness.

The perspective view which shows the metallized film which is the origin of the metallized film winding body in 1st Example of this invention The perspective view which shows the middle of preparation of the cylindrical metallized film winding body in the 1st example of the present invention Sectional drawing (a) of the film capacitor element in the 1st Example of this invention, and the perspective view of a film capacitor element (b) A perspective view showing a film capacitor element unit in a first embodiment of the present invention The perspective view of the divided state which shows the film capacitor element unit and lower external lead-out terminal in the 1st Example of this invention The perspective view of the split state which shows the film capacitor element unit and the upper external lead-out terminal in the 1st example of the present invention The perspective view which shows the capacitor | condenser main part of the assembled state in 1st Example of this invention The perspective view which expands and shows the tongue-piece-like extension board part and clamping tongue piece in the external lead-out terminal in the 1st Example of this invention The perspective view which shows the state which accommodated the capacitor | condenser main part in the 1st Example of this invention in the exterior case The perspective view which shows the state which accommodated the capacitor | condenser main part in 1st Example of this invention in the exterior case (the visual recognition direction differs from FIG. 9) The perspective view which shows the fixed state of the support pin on the base part in the exterior case in the 1st Example of this invention, and the clamping tongue piece in an external lead-out terminal The perspective view which shows the state which mold resin solidified in the exterior case which accommodated the capacitor | condenser main part in 1st Example of this invention The perspective view which expands and shows the tongue-piece-like extension board part and clamping tongue piece in the external lead-out terminal in the 2nd Example of this invention

  Hereinafter, the embodiment of the case mold type film capacitor of the present invention of the above-mentioned composition is explained in detail on the level of a concrete example.

First Embodiment
FIGS. 1 to 12 relate to a case mold type film capacitor according to a first embodiment of the present invention, and FIG. 1 is a perspective view showing a metallized film, and FIG. 2 shows a manufacturing process of a metallized film wound body. 3 is a cross-sectional view of the film capacitor element (a) and a perspective view of the film capacitor element (b), FIG. 4 is a perspective view showing the film capacitor element unit, and FIG. 6 is a perspective view of the film capacitor element unit and the upper external lead terminal in the divided state, FIG. 7 is a perspective view of the main part of the capacitor in the assembled state, and FIG. FIG. 9 is an enlarged perspective view showing a tongue-like extension plate portion and a clamping tongue piece in the terminal, and FIG. 9 and FIG. 10 show a state where the main part of the capacitor is housed in the outer case. 9, and FIG. 11 is a perspective view showing the fixed state of the support pin on the pedestal of the exterior case and the clamping tongue of the external lead terminal, and FIG. 12 is a capacitor. It is a perspective view which shows the state which mold resin solidified in the exterior case which accommodated the main part.

  In these figures, A is a main part of the capacitor, 10 is a film capacitor element, 10A is a film capacitor element unit, 11 is a pre-rolled film, 12 is a metalized film wound body constituting the main portion of the film capacitor element 10, 12A. Is a metallized film, 13 is a dielectric film, 14 is a metal thin film electrode, 15 is an exterior film, 16 is a metal electrode (metallikon) for electrode drawing, 17 is a plate-like external lead terminal (bus bar), 17A is an external lead The main body plate portion of the terminal 17, 17B is a tongue-shaped extension plate portion, 17a is an external connection terminal portion of the external lead terminal 17, 17b is a small projection for connection, 17c is a cutout hole, 17d is an air vent hole, and 17e is Depressions, 17f are clamping tongues, 17g are cutouts 17g, 18 is an outer case, 18a is an opening of the outer case 18, 18 The vertical side plates, 18c pedestal portion, 18 d the support pin, 19 is a molding resin such as epoxy resin.

  FIG. 1 shows a metallized film 12A which is the basis of the metallized film wound body 12 shown in FIGS. As shown in FIG. 1, the metallized film 12A is configured by depositing metal on one side (or both sides) of the dielectric film 13 to form a metal thin film electrode 14. An edge region on one side of the dielectric film 13 is left as an insulation margin 13a (white portion), and the other region is a metal thin film electrode 14 (hatched portion). Two metallized films 12A and 12A are disposed opposite to each other so that the insulation margins 13a and 13a are opposite to each other in the width direction, and are overlapped in the film width direction as indicated by the double arrows Y1 and Y2. . At this time, in the two metallized films 12A, 12A, the metal thin film electrodes 14, 14 with respect to the film surface are superimposed in the same direction (upward in the illustrated example).

  FIG. 2 shows a production process of a cylindrical metallized film wound body 12. The two metallized films 12A and 12A stacked as shown in FIG. 1 are wound around the pre-wound film 11 in the form of a roll as shown in FIG. The moisture resistant exterior film 15 is bonded to the winding end portion of one of the metallized films 12A, and the exterior film 15 is subsequently wound multiple times on the outer peripheral surface of the winding end portion of the metallized film winding body 12.

  As shown in FIG. 3, the metallized film wound body 12 is configured by winding the metallized film 12 </ b> A in multiple layers around the pre-wound film 11. The metal thin film electrode 14 is interposed between the film overlapping portions. As shown in the partial enlarged view (a1), metal thin film electrodes 14 are interposed between a pair of adjacent dielectric films 13 and 13 which overlap in the radial direction, and conversely, a pair which overlap in the radial direction and overlap The dielectric film 13 is interposed between the metal thin film electrodes 14 adjacent to each other. That is, the dielectric film 13 and the metal thin film electrode 14 are in a laminated state which is alternately repeated. The structure in which the dielectric film 13 is sandwiched between the pair of metal thin film electrodes 14 is a capacitor (storage) structure. The moisture resistant exterior film 15 is wound around the outer periphery of the metalized film winding body 12 a plurality of times, and is fixed by heat welding using a heat seal or the like. The heat welding is performed on the film 15 itself.

  In addition, you may comprise as the metallized film winding body 12 in the laminated body which laminated | stacked many sheets of rectangular metallized films other than said winding body.

  Next, as shown in FIG. 3, the cylindrical metallized film wound body 12 is formed into a columnar body having an oval cross section. Then, metal electrodes (metallikons) 16 and 16 are formed by metal spraying or the like in a state where they are connected to metal thin film electrodes 14 and 14 between overlapping portions of dielectric film 13 on both axial end surfaces of metallized film winding body 12. The film capacitor element 10 is formed. As shown in FIG. 4, a plurality of film capacitor elements 10 configured in this manner are arranged parallel to each other in both longitudinal and longitudinal directions with their axial directions parallel to each other to constitute a film capacitor element unit 10A.

  As shown in FIG. 5, FIG. 6, and FIG. 7, in the film capacitor element unit 10A, the external lead terminals 17 are formed on the metal electrodes 16, 16 formed on both end surfaces in the axial direction (vertical direction) of each film capacitor element 10. , 17 are electrically connected. The main body portions of the external lead terminals 17, 17 have a substantially rectangular shape, and the external connection terminal portions 17a, 17a are integrally formed in a state of being bent substantially at right angles from one of the short side edges on the free end side of the rectangle. It is connected. The external connection terminal portion 17a integral with the lower external lead terminal 17 is formed longer in the vertical direction than the external connection terminal portion 17a integral with the upper external lead terminal 17, and each end edge (upper end edge) is substantially It is in the same position. In the case of the illustrated example, there are nine film capacitor elements 10 in the film capacitor element unit 10A, which are arranged in parallel in three rows and three columns. The external lead terminals 17, 17 are collectively connected to a total of nine film capacitor elements 10 in three rows and three columns.

  The electrical connection between the external lead terminal 17 and the metal electrode 16 will be described. Here, the upper external lead terminal 17 will be described. Connection holes 17c which are cut out in a penetrating state with connection small protruding pieces 17b are formed in an arrangement state in both vertical and horizontal directions corresponding to positions of the respective film capacitor elements 10 on the upper external lead terminals 17 . At the position of the connection hole 17 c, the small connection piece 17 b is electrically connected to the metal electrode 16 of the film capacitor element 10 by resistance welding, soldering or the like. The same processing is applied to the lower external lead terminal 17 as well, and the connection small protrusion 17b and the connection hole 17c are present.

  Next, the air vent hole 17 d formed in the external lead terminal 17 will be described. Here, the upper external lead terminal 17 will be described. In the upper external lead-out terminal 17, a resin-filled space 10B (a cross-sectional shape in which four sides of a rhombus are arc-shaped inside) is generated between adjacent ones of a plurality of film capacitor elements 10 arranged in parallel in both vertical and horizontal directions. A plurality of air vent holes 17 d for escaping the air remaining inside the resin to the outside are formed at positions substantially corresponding to the central portion of the columnar body of FIG. The same processing is applied to the lower external lead terminal 17 as well, and the air vent hole 17 d is also present.

  In the plurality of film capacitor elements 10, the metal electrodes 16 on the upper end sides are located in the same plane, and the metal electrodes 16 on the lower end side are also located in the same other plane. These two planes are parallel to one another. The upper external lead terminal 17 is joined to the group of metal electrodes 16 in the upper one plane of the film capacitor element unit 10A, while the lower external lead terminal 17 is the lower side of the film capacitor element unit 10A. Are bonded to the metal electrodes 16 in one plane.

As described above, as shown in FIG. 7, a plurality of film capacitor elements 10 in which a pair of metal electrodes 16 and 16 for electrode drawing are formed on both end faces, that is, a film capacitor element unit 10 A and a pair of metal electrodes 16. , 16 and the external lead terminals 17, 17 electrically connected to each of the capacitor main portions A. The number of the film capacitor elements 10 is arbitrary for the capacitor main portion A, and any plural number or single number is included.

  As shown in FIG. 9, the main part A of the capacitor comprising the film capacitor element unit 10A and the pair of external lead terminals 17 and 17 is accommodated in the outer case 18 and is injected and filled from the opening 18a of the outer case 18 It is coated with a resin 19 (see FIG. 12). The coating of the capacitor main portion A by the solidification of the mold resin 19 is a coating in a state in which a part of the external connection terminal portions 17a, 17a on the free end side of the external lead terminals 17, 17 is removed.

  In the present embodiment, a structure for fixing the capacitor main portion A to the outer case 18 at the time of resin molding is configured as follows. As shown in FIGS. 9 and 10, in the vertical side plate 18b constituting the peripheral wall portion of the exterior case 18, the upper portion close to the opening 18a of the exterior case 18 is integrally formed in a bowl shape toward the lateral direction outside And the base 18 c is formed. The pedestal portion 18c is symmetrically provided at the same position of the pair of opposing vertical side plates 18b and 18b forming the long side of the exterior case 18, and one vertical side plate 18b forming the short side extends from one corner It is provided in a series of lines across the entire width to the other corner. The pedestal portion 18 c is an element for placing and supporting the upper external lead terminal 17 out of the pair of upper and lower external lead terminals 17 and 17.

  Further, as shown in FIG. 11, a support pin 18d is provided on the pedestal portion 18c so as to protrude upward in the posture perpendicular to the pedestal surface which is the upper surface thereof, that is, the opening direction of the outer case 18. The pedestal 18 c and the support pin 18 d are integrally connected to the vertical side plates 18 b and 18 b which are the main body of the exterior case 18. The exterior case 18 is made of synthetic resin such as polyphenylene sulfide (PPS), and the whole including the pedestal portion 18c and the support pin 18d is integrally formed.

  On the other hand, as shown in FIG. 8, a tongue-like extension plate for mounting on and supporting the pedestal surface of the pedestal portion 18 c of the outer case 18 on the rectangular main body plate portion 17 A of the upper external lead terminal 17. The portion 17B is integrally extended outward in the lateral direction (the direction of the surface of the main body plate). Concave portions 17e and 17e recessed toward the central portion of the main body plate portion 17A are formed on both sides of the root portion of the tongue-like extension plate portion 17B, and the deformation of the extension plate portion 17B in the vertical direction is made I am raising sex. A total of four tongue-shaped extension plates 17B are provided (see FIG. 6, FIG. 7, FIG. 9, and FIG. 10).

  Then, as shown in FIGS. 8 and 11, in each of the extension plate portions 17B, the direction in which the support pins 18d are provided with respect to the support pins 18d protruding from the pedestal portion 18c (vertical direction in this embodiment) There are provided a pair of sandwiching tongues 17f, 17f which engage in sliding contact with each other. The pair of holding tongues 17f and 17f are formed symmetrically by cutting out the extension plate portion 17B so as to be separated from each other to such an extent that the support pin 18d can be sandwiched. The pinching tongues 17f and 17f are configured to be movable by cutting out the pinching tongues 17f and 17f in the extension plate portion 17B. An H-shaped cutout hole 17g penetrating in a direction perpendicular to the plate surface is formed in a row from the opposing portion of the pair of holding tongues 17f, 17f and the both side portions of each holding tongue 17f. . A pair of sandwiching tongues 17f and 17f are formed by forming the cutout hole 17g in the shape of H, and the configuration is simple.

When housing the capacitor main portion A from the upper side to the outer case 18 through the opening 18a, the plurality of extending plate portions 17B of the upper external lead terminal 17 are made to approach the pedestal surface of the corresponding pedestal 18c. The pedestal surface is extended perpendicularly to the surface direction of the vertical side plate 18 b from the upper portion of the vertical side plate 18 b constituting the circumferential surface of the opening 18 a of the outer case 18. Then, in the extension plate portion 17B, the pair of holding tongues 17f and 17f facing each other rise up while slidingly contacting with the support pin 18d, and are engaged with the support pin 18d in a straight manner (see FIG. 11). That is, the pair of holding tongues 17f and 17f slide on the outer peripheral surface of the support pin 18d, and are deformed by the reaction force at that time to hold the outer peripheral surface of the support pin 18d. Then, immediately after this engagement, the lower surface of the extension plate portion 17B of the external lead terminal 17 is stably placed and supported on the pedestal surface of the pedestal portion 18c. As a result, the upper external lead-out terminal 17 and hence the entire capacitor main part A are fixed to the outer case 18 in a strong floating prevention state.

  Thus, the capacitor main part A is stably fixed in a state where floating is prevented in the outer case 18, and the mold resin 19 is injected and filled in the outer case 18 from that state (see FIG. 12). That is, a case mold type in which the main part A of the capacitor is covered with the mold resin 19 in the outer case 18 in a state where a part of the external connection terminal parts 17a 17a on the free end side in the upper and lower external lead terminals 17 17 is removed. A film capacitor is obtained.

  Then, the floating preventing mechanism of the main part A of the capacitor against the buoyancy due to the injection molding resin 19 cuts out the pedestal portion 18c provided on the outer case 18, the support pin 18d projecting from the pedestal portion 18c, and the external lead terminal 17 The structure is very simple compared to the conventional large-scale holding jigs 17f and 17f, which are formed as above, and is very advantageous in improving the productivity of the case mold type film capacitor. In addition to the above, significant cost reduction of manufacturing costs can be achieved.

  Further, the pair of holding tongues 17f, 17f per one support pin 18d is extended not outward from the main body plate portion 17A of the external lead terminal 17, but from the main body plate portion 17A to the main body plate portion 17A. It is formed in the tongue-shaped extension board part 17B which is excellent in mobility. The presence of the depressions 17e, 17e formed on both sides of the tongue-like extension plate 17B makes the extension plate 17B easy to displace in the vertical direction with respect to the main plate 17A. In addition, the holding tongues 17f and 17f are formed by cutting out the tongue-like extension plate portion 17B. The double deformation function possessed by the sandwiching tongues 17f, 17f ensures that the capacitor main part A is prevented from rising due to the resin buoyancy in the outer case 18.

  Furthermore, the above floating prevention mechanism for reliably preventing floating of the main part A of the capacitor in the outer case 18 has the function of precisely aligning the height position of the external lead terminal 17 in the outer case 18 with the specified height position. It is effective to make the resin thickness covering the capacitor main part A uniform. As a result, the variation in the moisture resistance performance is suppressed, the moisture resistance is improved, and the manufacturing tolerance of the resin thickness is sufficiently reduced, which contributes to the miniaturization of the capacitor.

  It is said that the external lead terminal 17 is stably fixed to the outer case 18 by being placed on the pedestal portion 18c in the tongue-like extension plate portion 17B for the double deformation function to ensure the floating prevention. It also has a function. This also works to simplify the structure.

  In the above embodiment, the film capacitor element unit 10A in which a plurality of film capacitor elements 10 are arranged in parallel is described, but the number of film capacitor elements 10 may be one, and the main component of the capacitor The number of units in part A may be one or two or more.

Second Embodiment
FIG. 13 relates to the case mold type film capacitor of the second embodiment of the present invention, and shows another aspect of the sandwiching tongue piece 17f.

  Four clamping tongues 17f are formed to form the clamping tongues 17f with the cutout holes 17g. That is, two pairs of the pair of sandwiching tongues 17f and 17f formed in a state of facing each other are configured to be orthogonal to each other, and the opposing locations of these two pairs of sandwiching tongues and the two side locations of each sandwiching tongue A cutout hole 17g penetrating in a direction perpendicular to the plate surface is formed on the entire surface. In this case, four holding tongues 17f are formed so as to face each other from four directions orthogonal to the support pin 18d, and the fixation of the external lead terminal 17 to the support pin 18d and the pedestal portion 18c is further strengthened. It has become.

  Other configurations and effects are the same as in the first embodiment.

  The present invention is not limited to the above embodiment, and various modifications can be made other than the above without departing from the gist of the invention.

  For example, although the pedestal portion 18 c is formed extending outward from the vertical side plate 18 b of the outer case 18, the pedestal portion 18 c may be formed extending inwardly from the vertical side plate 18 b of the outer case 18. .

  Further, the positions and the number of the pedestals 18c are not limited to the above embodiment, and can be appropriately changed from the viewpoint of ensuring the positioning of the external lead terminals 17 on the outer case 18 and preventing the capacitor main part A from floating.

  In the case of the case mold type film capacitor according to the present invention, the resin thickness covering the main part of the capacitor is made constant to suppress the variation of the moisture resistance performance, and when improving the moisture resistance, the large scale lifting prevention jig conventionally used is unnecessary. To improve productivity and reduce costs.

A Main part of capacitor 10 Film capacitor element 16 Metal electrode 17 for electrode extraction 17 External lead terminal 17A Main body plate portion 17B Extension plate portion 17a External connection terminal portion 17f Clamping tongue piece 17g Cutout hole 18 Outer case 18a Opening 18b Vertical side plate 18c Pedestal 18d support pin 19 mold resin

Claims (5)

A film capacitor element in which a pair of metal electrodes for drawing out electrodes are formed on both end faces, and a capacitor main part consisting of an external drawing terminal electrically connected to each of the pair of metal electrodes;
An external case having an opening and containing the main part of the capacitor except a part of the external connection terminal on the free end side of the external lead terminal;
And a mold resin for filling the inside of the outer case and covering the main part of the capacitor except for a part of the external connection terminal by solidification.
The outer case is provided with a pedestal portion on which the external lead terminal is placed and received, and a support pin projecting from the pedestal portion.
The case mold type film capacitor characterized in that the external lead-out terminal is provided with a plurality of holding tongues which engage with the support pin and hold the outer peripheral surface of the support pin.   The exterior case is opened upward, and the pedestal portion is extended perpendicularly to the surface direction of the longitudinal side plate from the upper portion of the longitudinal side plate which constitutes the opening circumferential surface of the exterior case. The pedestal has a pedestal surface, and the support pin protrudes upward from the pedestal surface, which is the opening direction of the outer case, and the external lead terminal has its lower surface placed and supported on the pedestal surface. The case mold type film capacitor according to 1.   The external lead terminal is formed in a tongue-like extension plate portion in which a plate portion mounted and supported on the pedestal surface is integrally extended outward in the plane direction of the main body plate portion, and the tongue The case mold type film capacitor according to claim 1 or 2, wherein the sandwiching tongue piece is configured to be movable by cutting out around the sandwiching tongue piece in the strip-like extension plate portion.   The plurality of holding tongues according to any one of claims 1 to 3, wherein the plurality of holding tongues are configured as at least one pair in a state of facing each other while being separated from each other to such an extent that the support pins can be held. Case mold type film capacitor.   5. The case mold type film capacitor according to claim 4, wherein the plurality of holding tongues are configured such that two sets of the pair of holding tongues are orthogonal to each other.

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