JP2019033133A - Capacitor - Google Patents

Capacitor Download PDF

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JP2019033133A
JP2019033133A JP2017151910A JP2017151910A JP2019033133A JP 2019033133 A JP2019033133 A JP 2019033133A JP 2017151910 A JP2017151910 A JP 2017151910A JP 2017151910 A JP2017151910 A JP 2017151910A JP 2019033133 A JP2019033133 A JP 2019033133A
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capacitor
external connection
electrode plates
portions
electrode plate
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JP6934175B2 (en
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信人 佐々木
Nobuto Sasaki
信人 佐々木
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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Abstract

To provide a capacitor capable of pulling an external connection part out of the vicinity of a center of a case.SOLUTION: The present invention relates to a capacitor in which a capacitor element 2 including electrode parts 2a and 2b in both ends and a pair of positive and negative electrode plates 5 and 6 for external connection including external connection parts 5b and 6b are accommodated in a case 7. Multiple capacitor elements 2 are arranged side by side in a state where the electrode parts 2a and 2b are directed outwards, and connected with the electrode plates 5 and 6 for external connection via electrode plates 3 and 4 for element which connect the capacitor elements 2 in common. The pair of positive and negative electrode plates 5 and 6 for external connection include main body parts 5a and 6a which are overlapped in a vertical direction at an upper side of the capacitor element 2 and connected with the electrode plates 3 and 4 for element, and the external connection parts 5b and 6b extend from outer edges of the main body parts 5a and 6a.SELECTED DRAWING: Figure 1

Description

この発明は、コンデンサ素子と電極板とをケースに収納したコンデンサに関する。   The present invention relates to a capacitor in which a capacitor element and an electrode plate are housed in a case.

特許文献1には、複数のコンデンサ素子と電極板とをケースに収納したコンデンサが開示されている。このコンデンサでは、平面状に並べ置かれた各コンデンサ素子からそれぞれリード線が立ち上げられており、これらリード線を介して各コンデンサ素子と電極板とが接続されている。また、正負一対の電極板がコンデンサ素子の上方で互いに重ね合わせられており、低インダクタンス化が図られている。   Patent Document 1 discloses a capacitor in which a plurality of capacitor elements and electrode plates are housed in a case. In this capacitor, lead wires are raised from the capacitor elements arranged in a plane, and the capacitor elements and the electrode plates are connected via the lead wires. In addition, a pair of positive and negative electrode plates are superposed on each other above the capacitor element, thereby reducing the inductance.

特開2010−258343号公報JP 2010-258343 A

ところで、各電極板は、外部機器と接続するための外部接続部をそれぞれ備えている。ところが、上記構成のコンデンサの場合、外部接続部の引き出し位置を自由に設定することができなかった。すなわち、電極板と各コンデンサ素子とを接続するためには、電極板が、平面視、少なくとも各リード線を全て覆うことができる幅(広さ)を持った本体部を備える必要があるが、コンデンサ素子は通常、ケース底面のほぼ全面に亘って並べ置かれることから、本体部の幅はケースの幅と略等しく、本体部を避けて(すなわち本体部の外縁から)延設される外部接続部は、自ずとケース側壁近傍に位置することとなっていた。そしてこの場合、外部機器との位置関係によっては接続距離が長くなったり、外部接続部の形状が複雑になったりと不具合を生じることがあった。   By the way, each electrode plate is provided with the external connection part for connecting with an external apparatus, respectively. However, in the case of the capacitor having the above configuration, the drawing position of the external connection portion cannot be set freely. That is, in order to connect the electrode plate and each capacitor element, the electrode plate needs to have a main body having a width (wideness) that can cover at least each lead wire in plan view, Capacitor elements are usually arranged over almost the entire bottom surface of the case, so the width of the main body is approximately equal to the width of the case, and external connections that extend away from the main body (that is, from the outer edge of the main body). The part was naturally located near the case side wall. In this case, depending on the positional relationship with the external device, there may be a problem that the connection distance becomes long or the shape of the external connection portion becomes complicated.

そこで本発明は、ケース中央付近からの外部接続部の引き出しが可能なコンデンサの提供を目的とする。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a capacitor capable of pulling out an external connection portion from the vicinity of the center of the case.

本発明のコンデンサは、両端に電極部2a、2bを有するコンデンサ素子2と、外部接続部5b、6bを備えた正負一対の外部接続用電極板5、6とをケース7に収容したコンデンサであって、コンデンサ素子2は、電極部2a、2bを外側に向けた状態で複数並べられ、これらコンデンサ素子2を共通接続する素子用電極板3、4を介して外部接続用電極板5、6と接続されており、正負一対の外部接続用電極板5、6は、コンデンサ素子2の上方で上下方向に重なり合うとともに素子用電極板3、4と接続される本体部5a、6aをそれぞれ有し、外部接続部5b、6bが本体部5a、6aの外縁からそれぞれ延設されていることを特徴とする。   The capacitor of the present invention is a capacitor in which a capacitor element 2 having electrode portions 2a and 2b at both ends and a pair of positive and negative external connection electrode plates 5 and 6 having external connection portions 5b and 6b are accommodated in a case 7. Thus, a plurality of capacitor elements 2 are arranged with the electrode portions 2a and 2b facing outward, and external connection electrode plates 5 and 6 are connected via element electrode plates 3 and 4 that connect the capacitor elements 2 in common. A pair of positive and negative external connection electrode plates 5 and 6 are connected to the element electrode plates 3 and 4 and overlap with each other in the vertical direction above the capacitor element 2. The external connection parts 5b and 6b are respectively extended from the outer edges of the main body parts 5a and 6a.

本発明のコンデンサは、複数のコンデンサ素子を素子用電極板で共通接続しているため、外部接続用電極板は、素子用電極板と少なくとも1ヶ所で接続されていれば各コンデンサ素子と接続されることになる。そのため、コンデンサ素子と接続するために外部接続用電極板の本体部の幅を大きくする必要が無く、本体部の幅を小さくすることができ、外部接続部をケース中央付近から引き出すことが可能となる。   In the capacitor of the present invention, a plurality of capacitor elements are commonly connected by the element electrode plate. Therefore, the external connection electrode plate is connected to each capacitor element as long as it is connected to the element electrode plate in at least one place. Will be. Therefore, it is not necessary to increase the width of the body part of the electrode plate for external connection in order to connect to the capacitor element, the width of the body part can be reduced, and the external connection part can be pulled out from the vicinity of the center of the case. Become.

この発明の一実施形態に係るコンデンサを示す分解斜視図である。It is a disassembled perspective view which shows the capacitor | condenser which concerns on one Embodiment of this invention. コンデンサ素子と素子用電極板と外部接続用電極板とを組み合わせた状態を示す斜視図である。It is a perspective view which shows the state which combined the capacitor | condenser element, the electrode plate for elements, and the electrode plate for external connection. コンデンサの斜視図である。It is a perspective view of a capacitor.

次に、この発明のコンデンサ1の一実施形態を図面に基づいて詳細に説明する。この発明のコンデンサ1は、図1〜図3に示すように、複数のコンデンサ素子2と、これら複数のコンデンサ素子2を共通接続する素子用電極板3、4と、素子用電極板3、4と接続する外部接続用電極板5、6と、コンデンサ素子2、素子用電極板3、4、外部接続用電極板5、6を収容するケース7と、ケース7内に充填され、コンデンサ素子2を封止する樹脂8とを備えている。以下、各構成部品について詳細に説明する。なお、説明において「上下」の概念は、製造時、より具体的には樹脂充填時におけるものであって、必ずしも使用時の上下を規定するものではない。   Next, an embodiment of the capacitor 1 of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 to 3, the capacitor 1 of the present invention includes a plurality of capacitor elements 2, element electrode plates 3 and 4 for commonly connecting the plurality of capacitor elements 2, and element electrode plates 3 and 4. External connection electrode plates 5 and 6 to be connected to the capacitor element 2, the element electrode plates 3 and 4, the case 7 for housing the external connection electrode plates 5 and 6, and the case 7 filled with the capacitor element 2 And a resin 8 for sealing. Hereinafter, each component will be described in detail. In the description, the concept of “upper and lower” is at the time of manufacturing, more specifically, at the time of resin filling, and does not necessarily define the upper and lower at the time of use.

コンデンサ素子2は、例えば絶縁性のフィルム上に金属を蒸着した金属化フィルムを巻回することでなるフィルムコンデンサであって、図1に示すように、軸方向両端面に金属を溶射してなる電極部2a、2bがそれぞれ形成されている。このコンデンサ素子2を軸方向から見ると扁平状、具体的には略トラック状(2本の平行線とその両端を半円でつないだ形状)であり、軸方向外周に平坦部2cと曲面部2dとを有している。   The capacitor element 2 is a film capacitor formed by winding a metallized film in which a metal is vapor-deposited on an insulating film, for example, and is formed by spraying metal on both end surfaces in the axial direction as shown in FIG. Electrode portions 2a and 2b are respectively formed. When the capacitor element 2 is viewed from the axial direction, the capacitor element 2 has a flat shape, specifically, a substantially track shape (a shape in which two parallel lines and both ends thereof are connected by a semicircle), and a flat portion 2c and a curved surface portion on the outer periphery in the axial direction. 2d.

上記構成のコンデンサ素子2は、電極部2a、2bを外側に向けた状態で複数並べられる、より具体的には、曲面部2d、2dを上下方向に向けつつ、平坦部2c、2cを互いに対向させるようにして複数(4個)並べられることでコンデンサ素子群を構成している。   A plurality of capacitor elements 2 having the above-described configuration are arranged with the electrode portions 2a and 2b facing outward. More specifically, the flat portions 2c and 2c are opposed to each other while the curved surface portions 2d and 2d are directed vertically. A plurality (four) of capacitor elements are arranged in such a manner to constitute a capacitor element group.

正負一対の素子用電極板3、4は、それぞれ、略短冊状の基板部3a、4aと、コンデンサ素子2の電極部2a、2bと接続するための素子用接続片3b、4bと、外部接続用電極板5、6と接続するための電極板用接続片3c、4cとを備えている。なお、素子用電極板3、4は正負で同じ形状であることから、一方の素子用電極板3について説明し、他方の素子用電極板4については同添え字を付し、詳細な説明は省略する。   The pair of positive and negative element electrode plates 3, 4 are substantially strip-shaped substrate portions 3 a, 4 a, element connection pieces 3 b, 4 b for connecting to the electrode portions 2 a, 2 b of the capacitor element 2, and external connection, respectively. Electrode plate connection pieces 3c and 4c for connection to the electrode plates 5 and 6 for use. Since the element electrode plates 3 and 4 are positive and negative and have the same shape, only one element electrode plate 3 will be described, and the other element electrode plate 4 will be denoted by the same subscript. Omitted.

素子用電極板3の基板部3aの水平方向の長さは、コンデンサ素子群を構成する複数(4個)のコンデンサ素子2全ての電極部2aに跨ることができる長さを有している。素子用接続片3bは、水平方向に長い基板部3aの下辺から下方に向かって延設されている。また、各コンデンサ素子2の電極部2aに対応する位置にそれぞれ設けられている。電極板用接続片3cは、基板部3aの上辺から上方に向かって延設されている。また、基板部3aの水平方向の両端のいずれか一方の端部に片寄るようにして設けられている。なお、この実施形態では、紙面において手前側の端部に片寄って2つ設けられている。この電極板用接続片3cは、素子用電極板3をコンデンサ素子2と接続した状態において、側面視、コンデンサ素子2の上端よりも上に突出する。このような素子用電極板3は、例えば銅やアルミなどの導電性の板材(金属板)をプレス加工(打ち抜き加工)することで形成されている。なお、板厚方向への折曲加工は無く平板状である。   The horizontal length of the substrate portion 3a of the element electrode plate 3 has a length that can extend over all the electrode portions 2a of a plurality (four) of capacitor elements 2 constituting the capacitor element group. The element connection piece 3b is extended downward from the lower side of the substrate portion 3a which is long in the horizontal direction. Further, each capacitor element 2 is provided at a position corresponding to the electrode portion 2a. The electrode plate connection piece 3c extends upward from the upper side of the substrate portion 3a. Further, it is provided so as to be offset toward one of the both ends in the horizontal direction of the substrate portion 3a. In this embodiment, two of the two are provided so as to be offset toward the front end on the paper surface. The electrode plate connection piece 3 c protrudes above the upper end of the capacitor element 2 in a side view when the element electrode plate 3 is connected to the capacitor element 2. Such an element electrode plate 3 is formed by, for example, pressing (punching) a conductive plate material (metal plate) such as copper or aluminum. In addition, there is no bending process to a plate | board thickness direction, and it is flat form.

そして、正負一対の素子用電極板3、4によってコンデンサ素子群を両側から挟み込むとともに、コンデンサ素子2の一方の電極部2aに一方の素子用電極板3を、コンデンサ素子2の他方の電極部2bに他方の素子用電極板4をはんだや溶接によって接続することでモジュールが構成される。なお、このモジュールを、複数(4個)、コンデンサ素子2の同極の電極部2a、2a(2b、2b)同士を互いに対向させるようにして並べることでモジュール群が構成される。   The capacitor element group is sandwiched from both sides by a pair of positive and negative element electrode plates 3 and 4, and one element electrode plate 3 is connected to one electrode portion 2 a of the capacitor element 2 and the other electrode portion 2 b of the capacitor element 2. The other element electrode plate 4 is connected by soldering or welding to form a module. A module group is configured by arranging a plurality (four) of the modules such that the electrode parts 2a, 2a (2b, 2b) having the same polarity of the capacitor element 2 face each other.

正負一対の外部接続用電極板5、6は、それぞれ、コンデンサ素子2の上方に位置する本体部5a、6aと、本体部5a、6aの外縁から延設される外部接続部5b、6bとを備えている。なお、一対の外部接続用電極板5、6は互いに形状が異なることから、まず一方の外部接続用電極板5(紙面において上方の外部接続用電極板)について説明する。   A pair of positive and negative external connection electrode plates 5 and 6 includes main body portions 5a and 6a located above the capacitor element 2, and external connection portions 5b and 6b extending from the outer edges of the main body portions 5a and 6a, respectively. I have. Since the pair of external connection electrode plates 5 and 6 are different in shape from each other, one external connection electrode plate 5 (the upper external connection electrode plate in the drawing) will be described first.

本体部5aは、平面視、素子用電極板3、4の長手方向と直交する方向の長さL1が、モジュール群の長手方向(コンデンサ素子2の軸方向)の長さL2とほぼ同じとされている。その一方で、素子用電極板3、4の長手方向と平行な方向の幅W1が、モジュール群の短手方向(コンデンサ素子2の軸方向と直交する方向)の幅W2よりも小、より具体的には2/3程度とされている(図2参照)。   The main body 5a has a length L1 in a direction orthogonal to the longitudinal direction of the element electrode plates 3 and 4 in plan view, and is substantially the same as the length L2 in the longitudinal direction of the module group (the axial direction of the capacitor element 2). ing. On the other hand, the width W1 in the direction parallel to the longitudinal direction of the element electrode plates 3 and 4 is smaller than the width W2 in the short direction of the module group (the direction perpendicular to the axial direction of the capacitor element 2). Specifically, it is about 2/3 (see FIG. 2).

この本体部5aには、同極となる一方の素子用電極板3の電極板用接続片3cと対向する位置に、これら電極板用接続片3cと接続するための接続部5cが設けられている。そして接続部5cには、電極板用接続片3cを挿通するための挿通孔5dが設けられている。また、はんだ付けや溶接による熱が接続部5cから周辺に伝播するのを抑制するため、接続部5cの周囲は切り欠かれているか若しくは接続部5cが突出している。さらに、接続部5cは他の部分よりも高さ位置が低くなっている。これは、下方に位置する他方の極性の電極板の接続部5cと高さ位置を合わせるための工夫である。また、本体部5aには、異極となる他方の素子用電極板4の電極板用接続片4cとの接続を避けるために、電極板用接続片4cと対向する位置に回避部5e(切欠き)が設けられている。また、樹脂モールドする際の樹脂8の通り道を確保するとともに、本体部5aの下面に気泡が溜まらないようにするために貫通孔5fが設けられている。この貫通孔5fは、モジュール間に位置するように設けられることが好ましい。   The main body part 5a is provided with a connection part 5c for connecting to the electrode plate connection piece 3c at a position facing the electrode plate connection piece 3c of one element electrode plate 3 having the same polarity. Yes. The connection portion 5c is provided with an insertion hole 5d for inserting the electrode plate connection piece 3c. Moreover, in order to suppress the heat | fever by soldering or welding from propagating from the connection part 5c to the periphery, the circumference | surroundings of the connection part 5c are notched or the connection part 5c protrudes. Furthermore, the height of the connecting portion 5c is lower than the other portions. This is a device for aligning the height position with the connecting portion 5c of the other polarity electrode plate located below. Further, in order to avoid the connection with the electrode plate connection piece 4c of the other element electrode plate 4 having a different polarity, the main body portion 5a has an avoidance portion 5e (cut-off portion) at a position facing the electrode plate connection piece 4c. Notch) is provided. In addition, a through hole 5f is provided in order to secure the passage of the resin 8 when resin molding is performed and to prevent bubbles from accumulating on the lower surface of the main body 5a. The through holes 5f are preferably provided so as to be located between the modules.

外部接続部5bは、本体部5aの接続部5cや回避部5eが設けられた側とは反対側の辺(外縁)から上方に向かって延設されている。この外部接続部5bは、等間隔に複数(3個)設けられているが1つでも良い。図において5gは、電源に接続される入力部である。この入力部5gは、後述するケース側壁部7bを跨ぐようにしてケース7外に延出される。   The external connection portion 5b extends upward from the side (outer edge) opposite to the side where the connection portion 5c and the avoidance portion 5e of the main body portion 5a are provided. A plurality (three) of the external connection portions 5b are provided at equal intervals, but one may be provided. In the figure, 5g is an input unit connected to a power source. The input portion 5g extends outside the case 7 so as to straddle a case side wall portion 7b described later.

他方の外部接続用電極板6は、接続部6cと回避部6eの位置関係が一方の外部接続用電極板5とは反対になっている。また、異極となる外部接続部5b、6b同士、入力部5g、6g同士が重ならないようにずれて設けられている。さらに、接続部6cの高さ位置が他の部分と同じである。その他の点については一方の外部接続用電極板5と略同様の構成であり、例えば本体部6aの長さL1や幅W1も略同等であることから、同添え字を付し、具体的な説明は省略する。なお、外部接続用電極板5、6についても、例えば銅やアルミなどの導電性の板材(金属板)をプレス加工(打ち抜き及び折り曲げ加工)することで形成されている。   The other external connection electrode plate 6 is opposite to the external connection electrode plate 5 in the positional relationship between the connection portion 6c and the avoidance portion 6e. Further, the external connection parts 5b and 6b having different polarities and the input parts 5g and 6g are provided so as not to overlap each other. Furthermore, the height position of the connecting portion 6c is the same as the other portions. In other respects, the configuration is substantially the same as that of one of the external connection electrode plates 5, and for example, the length L1 and the width W1 of the main body 6a are substantially the same. Description is omitted. The external connection electrode plates 5 and 6 are also formed by pressing (punching and bending) a conductive plate material (metal plate) such as copper or aluminum.

ケース7は中空直方体状であって、平面視矩形状のケース底部7aと、このケース底部7aの四辺からそれぞれ立設されたケース側壁部7bとから構成されている。なお、ケース底部7aと対向する面(上面側)には開口部7cが設けられている。このようなケース7は、例えば合成樹脂を一体成型することで製造される。ただ、金属板を加工して製造しても良い。ケース7内に充填される樹脂8は、例えばエポキシ樹脂である。ただ、これに限らず、ウレタン樹脂等、公知の種々の樹脂を使用可能である。   The case 7 has a hollow rectangular parallelepiped shape, and includes a case bottom portion 7a having a rectangular shape in plan view and case side wall portions 7b erected from four sides of the case bottom portion 7a. An opening 7c is provided on the surface (upper surface side) facing the case bottom 7a. Such a case 7 is manufactured, for example, by integrally molding a synthetic resin. However, the metal plate may be processed and manufactured. The resin 8 filled in the case 7 is, for example, an epoxy resin. However, the present invention is not limited to this, and various known resins such as urethane resins can be used.

次に、コンデンサ1の製造方法について説明する。まず、上記の通り、4個のコンデンサ素子2を、平坦部2c、2c同士が互いに対向するようにして一列に並べてコンデンサ素子群を構成するとともに、コンデンサ素子群を正負一対の素子用電極板3、4で挟み込み、各コンデンサ素子2と素子用電極板3、4とをはんだ付けや溶接によって接続することでモジュールを構成する。そして、4個のモジュールを、コンデンサ素子2の電極部2a、2a(2b、2b)同士が互いに対向するように、また、素子用電極板3、3(4、4)同士が互いに対向するようにして並べてモジュール群を構成する。なお、モジュールやモジュール群を構成する場合には、各素子用電極板3、4の電極板用接続片3c、4cを一方に片寄らせるようにし、両端に位置するものを除き、1ヶ所に4個の電極板用接続片3c(4c)が集まるようにする。   Next, a method for manufacturing the capacitor 1 will be described. First, as described above, four capacitor elements 2 are arranged in a line so that the flat portions 2c and 2c face each other to form a capacitor element group, and the capacitor element group is made up of a pair of positive and negative element electrode plates 3. 4, the module is configured by connecting each capacitor element 2 and the element electrode plates 3 and 4 by soldering or welding. The four modules are arranged so that the electrode portions 2a, 2a (2b, 2b) of the capacitor element 2 face each other, and the element electrode plates 3, 3 (4, 4) face each other. Are arranged side by side to form a module group. When constituting a module or a module group, the electrode plate connection pieces 3c, 4c of the element electrode plates 3, 4 are shifted to one side, except for those located at both ends. The electrode plate connection pieces 3c (4c) are gathered.

次に、外部接続用電極板5、6の本体部5a、6aをモジュール群の上に重ねるようにして、外部接続用電極板5(6)の挿通孔5d(6d)に対して、素子用電極板3(4)の電極板用接続片3c(4c)を挿入するとともに、はんだ付けや溶接などを行って素子用電極板3、4を介してコンデンサ素子2と外部接続用電極板5、6とを接続する。接続部5c(6c)には、両端に位置するものを除き、4個の挿通孔5d(6d)が設けられており、1ヶ所に集まった4個の電極板用接続片3c(4c)は同じ外部接続用電極板5(6)に接続される。そのため、互いに対向する電極部2a、2a(2b、2b)同士や素子用電極板3、3(4、4)同士が同極性となる。また、この状態において、正負一対の外部接続用電極板5、6の本体部5a、6a同士が、コンデンサ素子2の上方で、絶縁を確保した状態で上下方向に重なり合う。さらに、幅W1がモジュール群の幅W2よりも小とされているため、外部接続部5b、6bがモジュール群の上方、より具体的には、素子用電極板3、4の長手方向において最も外側に位置するコンデンサ素子2よりも内側のコンデンサ素子2の上方に位置する。   Next, the main body portions 5a and 6a of the external connection electrode plates 5 and 6 are overlapped on the module group so that the insertion holes 5d (6d) of the external connection electrode plate 5 (6) are used for elements. The electrode plate connection piece 3c (4c) of the electrode plate 3 (4) is inserted, and the capacitor element 2 and the external connection electrode plate 5 are connected via the element electrode plates 3 and 4 by soldering or welding. 6 is connected. The connection portion 5c (6c) is provided with four insertion holes 5d (6d) except those located at both ends, and the four electrode plate connection pieces 3c (4c) gathered at one place are provided. It is connected to the same external connection electrode plate 5 (6). Therefore, the electrode portions 2a, 2a (2b, 2b) facing each other and the element electrode plates 3, 3 (4, 4) have the same polarity. In this state, the main body portions 5a and 6a of the pair of positive and negative external connection electrode plates 5 and 6 overlap with each other in the vertical direction above the capacitor element 2 while ensuring insulation. Furthermore, since the width W1 is smaller than the width W2 of the module group, the external connection portions 5b and 6b are located on the outermost side above the module group, more specifically in the longitudinal direction of the element electrode plates 3 and 4. It is located above the capacitor element 2 on the inner side of the capacitor element 2 positioned at the position.

そして、これら一体となったコンデンサ素子2、素子用電極板3、4、外部接続用電極板5、6を、外部接続部5b、6bと入力部5g、6gを開口部7cから上方に突出させるようにしてケース7に収容し、ケース7内に樹脂8を充填し、外部接続部5b、6bと入力部5g、6gを除いて樹脂封止することでコンデンサ1の製造を完了する。   Then, the capacitor element 2, the element electrode plates 3, 4 and the external connection electrode plates 5, 6 integrated with each other are made to protrude upward from the opening 7c with the external connection portions 5b, 6b and the input portions 5g, 6g. In this way, the case 1 is accommodated, the case 7 is filled with the resin 8, and the external connection portions 5b and 6b and the input portions 5g and 6g are removed and sealed with the resin, thereby completing the manufacture of the capacitor 1.

上記構成のコンデンサ1は、各コンデンサ素子2からそれぞれリード線を立ち上げるのではなく、複数のコンデンサ素子2を素子用電極板3、4によって共通接続していることから、各コンデンサ素子2と接続するために本体部5a、6aの幅を広げる必要が無く、本体部5a、6aの幅W1を小さくすることができる。そのため、外部接続部5b、6bが本体部5a、6aの外縁から延出されているにもかかわらず、平面視、素子用電極板3、4の長手方向と平行な方向において、外部接続部5b、6bをモジュール群の中央寄りに位置させることが可能となり、その結果、外部接続部5b、6bをケース7の中央付近から外部に延出することが可能となる。   Capacitor 1 having the above configuration is connected to each capacitor element 2 because a plurality of capacitor elements 2 are connected in common by element electrode plates 3 and 4, instead of starting up a lead wire from each capacitor element 2. Therefore, it is not necessary to increase the width of the main body portions 5a and 6a, and the width W1 of the main body portions 5a and 6a can be reduced. Therefore, although the external connection portions 5b and 6b are extended from the outer edges of the main body portions 5a and 6a, the external connection portion 5b is seen in a plan view and in a direction parallel to the longitudinal direction of the element electrode plates 3 and 4. , 6b can be positioned closer to the center of the module group, and as a result, the external connection portions 5b, 6b can be extended from the vicinity of the center of the case 7 to the outside.

また、外部接続用電極板5、6の幅W1を変えることにより、素子用電極板3、4の形状を変えることなく外部接続部5b、6bの引き出し位置を変えることができるため、部材の共通化を図れ、コスト削減を図ることができる。なお、外部接続用電極板5、6の幅W1を変えるのではなく、素子用電極板3、4の電極板用接続片3c、4cの位置を基板部3a、4aに沿って水平方向にずらして設けても良い。この場合でも同様の効果が得られる。   Further, by changing the width W1 of the external connection electrode plates 5 and 6, it is possible to change the lead-out positions of the external connection portions 5b and 6b without changing the shape of the element electrode plates 3 and 4. Cost reduction. Instead of changing the width W1 of the external connection electrode plates 5 and 6, the positions of the electrode plate connection pieces 3c and 4c of the element electrode plates 3 and 4 are shifted in the horizontal direction along the substrate portions 3a and 4a. May be provided. Even in this case, the same effect can be obtained.

さらに、正負一対の外部接続用電極板5、6の本体部5a、6aを互いに重ね合わせているため、低インダクタンス化を図ることができる。また、外部接続部5b、6bの引き出し位置を変えるにあたって、電極板用接続片3c、4cの位置を水平方向にずらす場合は、本体部5a、6a同士の重なり合う面積が変わらないため、外部接続部5b、6bの引き出し位置を変えつつも、等価直列インダクタンス(ESL)の変動を軽微なものとすることができる。外部接続用電極板5、6の幅W1を変える場合は、本体部5a、6a同士の重なり合う面積が変わることになるが、外部接続部5b、6b直下の重なり合う面積比率を変えない設計配慮により、ESLの変動は小さなものとなる。   Furthermore, since the main body portions 5a and 6a of the pair of positive and negative external connection electrode plates 5 and 6 are overlapped with each other, the inductance can be reduced. Further, when the positions of the electrode plate connection pieces 3c and 4c are shifted in the horizontal direction when changing the drawing positions of the external connection portions 5b and 6b, the overlapping area of the main body portions 5a and 6a does not change. While changing the drawing positions of 5b and 6b, the variation of the equivalent series inductance (ESL) can be made small. When changing the width W1 of the external connection electrode plates 5, 6, the overlapping area of the main body parts 5a, 6a will change, but due to design considerations that do not change the overlapping area ratio directly under the external connection parts 5b, 6b, ESL fluctuations are small.

以上に、この発明の実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、コンデンサ素子群におけるコンデンサ素子2の数や、モジュール群におけるモジュールの数については適宜変更可能である。また、コンデンサ素子2としてはフィルムコンデンサに限らず、セラミックコンデンサなど種々のコンデンサ素子を用いても良い。形状についても、円柱状や角柱状など種々の形状を採用し得る。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, the number of capacitor elements 2 in the capacitor element group and the number of modules in the module group can be changed as appropriate. Further, the capacitor element 2 is not limited to a film capacitor, and various capacitor elements such as a ceramic capacitor may be used. Regarding the shape, various shapes such as a columnar shape and a prismatic shape can be adopted.

1 コンデンサ
2 コンデンサ素子
2a、2b 電極部
2c 平坦部
2d 曲面部
3 素子用電極板(一方の極性)
3a 基板部
3b 素子用接続片
3c 電極板用接続片
4 素子用電極板(他方の極性)
4a 基板部
4b 素子用接続片
4c 電極板用接続片
5 外部接続用電極板(一方の極性)
5a 本体部
5b 外部接続部
5c 接続部
5d 挿通孔
5e 回避部
5f 貫通孔
5g 入力部
6 外部接続用電極板(他方の極性)
6a 本体部
6b 外部接続部
6c 接続部
6d 挿通孔
6e 回避部
6f 貫通孔
6g 入力部
7 ケース
7a ケース底部
7b ケース側壁部
7c 開口部
8 充填樹脂
L1 外部接続用電極板の本体部の長さ
L2 モジュール群の長さ
W1 外部接続用電極板の本体部の幅
W2 モジュール群の幅
DESCRIPTION OF SYMBOLS 1 Capacitor 2 Capacitor element 2a, 2b Electrode part 2c Flat part 2d Curved part 3 Element electrode plate (one polarity)
3a Substrate 3b Element connection piece 3c Electrode plate connection piece 4 Element electrode plate (the other polarity)
4a Substrate 4b Element connection piece 4c Electrode plate connection piece 5 External connection electrode plate (one polarity)
5a Body 5b External connection 5c Connection 5d Insertion hole 5e Avoidance 5f Through-hole 5g Input 6 External connection electrode plate (the other polarity)
6a body portion 6b external connection portion 6c connection portion 6d insertion hole 6e avoidance portion 6f through hole 6g input portion 7 case 7a case bottom portion 7b case side wall portion 7c opening 8 filling resin L1 length L2 of the body portion of the electrode plate for external connection Module group length W1 External connection electrode plate body width W2 Module group width

Claims (1)

両端に電極部(2a、2b)を有するコンデンサ素子(2)と、外部接続部(5b、6b)を備えた正負一対の外部接続用電極板(5、6)とをケース(7)に収容したコンデンサであって、
コンデンサ素子(2)は、電極部(2a、2b)を外側に向けた状態で複数並べられ、これらコンデンサ素子(2)を共通接続する素子用電極板(3、4)を介して外部接続用電極板(5、6)と接続されており、
正負一対の外部接続用電極板(5、6)は、コンデンサ素子(2)の上方で上下方向に重なり合うとともに素子用電極板(3、4)と接続される本体部(5a、6a)をそれぞれ有し、外部接続部(5b、6b)が本体部(5a、6a)の外縁からそれぞれ延設されていることを特徴とするコンデンサ。
A case (7) accommodates a capacitor element (2) having electrode portions (2a, 2b) at both ends and a pair of positive and negative electrode plates (5, 6) having external connection portions (5b, 6b). Capacitor,
A plurality of capacitor elements (2) are arranged with the electrode portions (2a, 2b) facing outward, and are connected for external connection via element electrode plates (3, 4) that commonly connect the capacitor elements (2). Connected to the electrode plates (5, 6),
The pair of positive and negative electrode plates for external connection (5, 6) are vertically overlapped above the capacitor element (2) and are connected to the element electrode plates (3, 4) with the main body portions (5a, 6a) respectively. The capacitor is characterized in that the external connection portions (5b, 6b) are respectively extended from the outer edges of the main body portions (5a, 6a).
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111048304A (en) * 2019-12-31 2020-04-21 西安西电电力电容器有限责任公司 Cylindrical capacitor and electrode structure for same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012940A (en) * 2003-06-19 2005-01-13 Toshiba Corp Inverter device
JP2013115279A (en) * 2011-11-29 2013-06-10 Nichicon Corp Capacitor unit
JP2013161864A (en) * 2012-02-02 2013-08-19 Shizuki Electric Co Inc Capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012940A (en) * 2003-06-19 2005-01-13 Toshiba Corp Inverter device
JP2013115279A (en) * 2011-11-29 2013-06-10 Nichicon Corp Capacitor unit
JP2013161864A (en) * 2012-02-02 2013-08-19 Shizuki Electric Co Inc Capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111048304A (en) * 2019-12-31 2020-04-21 西安西电电力电容器有限责任公司 Cylindrical capacitor and electrode structure for same

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