JP6985681B2 - Surface-mounted capacitors and seat plates used for them - Google Patents

Surface-mounted capacitors and seat plates used for them Download PDF

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JP6985681B2
JP6985681B2 JP2017230734A JP2017230734A JP6985681B2 JP 6985681 B2 JP6985681 B2 JP 6985681B2 JP 2017230734 A JP2017230734 A JP 2017230734A JP 2017230734 A JP2017230734 A JP 2017230734A JP 6985681 B2 JP6985681 B2 JP 6985681B2
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seat plate
sealing material
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孝也 酒井
昌治 片桐
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Nichicon Capacitor Ltd
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Description

本発明は、面実装型コンデンサおよびこれに用いられる座板に関する。 The present invention relates to a surface mount type capacitor and a seat plate used therein.

従来、面実装型アルミニウム電解コンデンサは、基板実装時にリフロー工程による表面実装が行われる。このリフロー実装では、配線基板自体をはんだ溶融温度以上の高温下にさらしてはんだ付けを行う。 Conventionally, a surface mount type aluminum electrolytic capacitor is surface mounted by a reflow process at the time of substrate mounting. In this reflow mounting, the wiring board itself is exposed to a high temperature equal to or higher than the solder melting temperature for soldering.

このリフロー実装工程においては、基板に搭載される面実装型アルミニウム電解コンデンサ自体が高温下にさらされることにより、内部に含まれる電解液や未反応モノマー、溶媒の気化が起こり、コンデンサ本体の内部圧力が上昇する。この内部圧力の上昇により、コンデンサ本体を構成する封口材の膨張が引き起こされる。これに起因して封口材に隣接する座板へ封口材が干渉し、その圧力により座板の変形が起こり、はんだ付け不良を起こしてしまう可能性がある。 In this reflow mounting process, the surface-mounted aluminum electrolytic capacitor itself mounted on the substrate is exposed to a high temperature, so that the electrolytic solution, unreacted monomer, and solvent contained therein are vaporized, and the internal pressure of the capacitor body is increased. Rise. This increase in internal pressure causes expansion of the sealing material that constitutes the capacitor body. Due to this, the sealing material interferes with the seat plate adjacent to the sealing material, and the pressure causes the seat plate to be deformed, which may cause soldering failure.

そこで特許文献1では、座板の封口材に面する側に凹部を設けることで、封口材の膨張によって引き起こされる座板への圧力を低減している。 Therefore, in Patent Document 1, by providing a recess on the side of the seat plate facing the sealing material, the pressure on the seat plate caused by the expansion of the sealing material is reduced.

特開2008―270338号公報Japanese Unexamined Patent Publication No. 2008-270338

しかし特許文献1の座板(絶縁板)表面の凹部は、中心部側と端縁部側の深さが一定に形成されているため、以下のような不具合があった。すなわち、特許文献1の座板(絶縁板)は凹部を形成しつつも座板自体の強度を確保するために、凹部の深さを座板の厚みに対して30%程度に抑えられていた。このため、リフロー時に封口材が大きく膨張した場合には、封口材の膨張中心部(封口材の膨張による変形が大きい領域)と座板との接触を確実に回避できないおそれがあった。一方で、封口材との接触を確実に回避するために凹部深さを深くしながら、座板の厚み自体を十分に厚くして座板の強度を確保することも考えられるが、この場合には部材のコストアップを招くとともにコンデンサの低背化に支障を来す結果となってしまう。 However, the recess on the surface of the seat plate (insulating plate) of Patent Document 1 has the following problems because the depths on the central portion side and the edge portion side are formed to be constant. That is, in the seat plate (insulating plate) of Patent Document 1, the depth of the recess is suppressed to about 30% with respect to the thickness of the seat plate in order to secure the strength of the seat plate itself while forming the recess. .. Therefore, when the sealing material expands significantly during reflow, there is a possibility that contact between the expansion center of the sealing material (the region where the deformation due to the expansion of the sealing material is large) and the seat plate cannot be reliably avoided. On the other hand, it is conceivable to increase the thickness of the seat plate itself sufficiently to secure the strength of the seat plate while increasing the depth of the recess in order to surely avoid contact with the sealing material. Will increase the cost of the member and will hinder the reduction of the height of the capacitor.

そこで、この発明は上記のような課題を解決するためになされたもので、座板厚みの増加を抑えながら、封口材の膨張による封口材と座板との接触を回避できる面実装型コンデンサおよびこれに用いられる座板を提供することを目的とする。 Therefore, the present invention has been made to solve the above-mentioned problems, and is a surface-mounted capacitor capable of avoiding contact between the sealing material and the seat plate due to expansion of the sealing material while suppressing an increase in the thickness of the seat plate. It is an object of the present invention to provide a seat plate used for this.

本発明に係る面実装型コンデンサは、コンデンサ素子と、前記コンデンサ素子を収容する有底筒状の収容容器と、前記収容容器の開口端を封口する封口材とを有するコンデンサ本体と、前記コンデンサ本体を保持する座板と、を備え、前記座板は、その表面が前記コンデンサ本体の封口材と対向し、前記表面に前記コンデンサ本体が配置される基板を有し、
前記基板の表面の中心部側には、端面部側に対し前記基板の厚み方向の深さが深い凹部が形成されており、前記凹部が、前記基板の端縁部側から前記中心部側に向かって段階的に深くなる領域を有することを特徴とする。
The surface-mounted capacitor according to the present invention has a capacitor body having a capacitor element, a bottomed tubular storage container for accommodating the capacitor element, and a sealing material for sealing the open end of the storage container, and the capacitor body. The seat plate has a substrate whose surface faces the sealing material of the capacitor body and the capacitor body is arranged on the surface.
On the central portion side of the surface of the substrate, a recess having a depth in the thickness direction of the substrate is formed with respect to the end face portion side, and the recess is formed from the edge portion side of the substrate to the central portion side. toward characterized Rukoto to have a deeper a region in stages.

また、本発明にかかる座板は、コンデンサ素子を収容し、封口材で封口されたコンデンサ本体を保持する座板であって、その表面が前記コンデンサ本体の封口材と対向し、前記表面に前記コンデンサ本体が載置される基板を有し、前記基板の表面の中心部側には、端縁部側に対し前記基板の厚み方向の深さが深い凹部が形成されており、前記凹部が、前記基板の端縁部側から前記中心部側に向かって段階的に深くなる領域を有することを特徴とする。 Further, the seat plate according to the present invention is a seat plate that accommodates a capacitor element and holds a capacitor body sealed with a sealing material, the surface of which faces the sealing material of the capacitor body, and the surface thereof is the surface. It has a substrate on which a capacitor body is placed, and a recess is formed on the central portion side of the surface of the substrate, which is deeper in the thickness direction of the substrate with respect to the edge portion side . It characterized Rukoto to have a stepwise deeper a region from the edge portion side of the substrate toward the central portion.

このような構成(面実装型コンデンサおよび座板)によれば、封口材が大きく膨張しても、座板の基板表面の中心部側には端縁部側に対し基板厚み方向の深さが深い凹部が形成されているので、封口材と座板との接触を回避することができる。しかも、封口材の膨張中心部と対向しない基板の端縁部側は中心部側に比較し凹部の深さは浅いため、基板の厚みが比較的確保されている。これにより、座板厚みの増加を抑えながら、封口材の膨張による座板の変形を抑制することができる。また、凹部が、基板の端縁部側から中心部側に向かって段階的に深くなる領域を有することで、封口材の膨張具合に合わせて凹部の深さを調整し、封口材の膨張による封口材と座板との接触を回避できる。 According to such a configuration (surface mount type capacitor and seat plate), even if the sealing material expands significantly, the depth in the substrate thickness direction is increased on the center side of the substrate surface of the seat plate with respect to the edge portion side. Since the deep recess is formed, it is possible to avoid contact between the sealing material and the seat plate. Moreover, since the depth of the recesses on the edge side of the substrate that does not face the expansion center of the sealing material is shallower than that on the center side, the thickness of the substrate is relatively secured. As a result, it is possible to suppress the deformation of the seat plate due to the expansion of the sealing material while suppressing the increase in the thickness of the seat plate. Further, since the concave portion has a region that gradually becomes deeper from the edge portion side to the central portion side of the substrate, the depth of the concave portion is adjusted according to the degree of expansion of the sealing material, and the expansion of the sealing material causes the recess. It is possible to avoid contact between the sealing material and the seat plate.

この面実装型コンデンサおよび座板では、封口材が大きく膨張しても、座板の基板表面の中心部側には端縁部側に対し基板厚み方向深さが深い凹部が形成されているので、封口材と座板との接触を極力回避することができる。しかも、封口材の膨張中心部と対向しない基板の端縁部側は中心部側に比較し凹部の深さは浅いため、基板の厚みが比較的確保されている。これにより、座板厚みの増加を抑えながら、封口材の膨張による座板の変形を抑制することができる。また、凹部が、基板の端縁部側から中心部側に向かって段階的に深くなる領域を有することで、封口材の膨張具合に合わせて凹部の深さを調整し、封口材の膨張による封口材と座板との接触を回避できる。 In this surface-mounted capacitor and seat plate, even if the sealing material expands significantly, a recess is formed on the central portion side of the substrate surface of the seat plate, which is deeper in the substrate thickness direction with respect to the edge portion side. , Contact between the sealing material and the seat plate can be avoided as much as possible. Moreover, since the depth of the recesses on the edge side of the substrate that does not face the expansion center of the sealing material is shallower than that on the center side, the thickness of the substrate is relatively secured. As a result, it is possible to suppress the deformation of the seat plate due to the expansion of the sealing material while suppressing the increase in the thickness of the seat plate. Further, since the concave portion has a region that gradually becomes deeper from the edge portion side to the central portion side of the substrate, the depth of the concave portion is adjusted according to the degree of expansion of the sealing material, and the expansion of the sealing material causes the recess. It is possible to avoid contact between the sealing material and the seat plate.

本発明の実施形態に係るコンデンサ本体と座板とを示す上方斜視図である。It is an upper perspective view which shows the capacitor main body and a seat plate which concerns on embodiment of this invention. 本発明の実施形態に係るコンデンサ本体と座板とを示す下方斜視図である。It is a lower perspective view which shows the capacitor main body and a seat plate which concerns on embodiment of this invention. 図1の座板を示す拡大斜視図である。It is an enlarged perspective view which shows the seat plate of FIG. 図1の座板を示す平面図である。It is a top view which shows the seat plate of FIG. 図4のV-V線断面図である。FIG. 6 is a sectional view taken along line VV of FIG. 図5の凹部を示す拡大断面図である。It is an enlarged sectional view which shows the concave part of FIG. 変形例1に係る凹部を示す拡大断面図である。It is an enlarged sectional view which shows the concave part which concerns on the modification 1. 変形例2に係る凹部を示す拡大断面図である。It is an enlarged sectional view which shows the concave part which concerns on the modification 2.

以下、本発明の実施形態を添付図面に従って説明する。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

本実施形態に係る面実装型コンデンサ1は、図1および図2に示すように、略円柱形状を有するコンデンサ本体10と、コンデンサ本体10を保持する座板20とを有する。コンデンサ本体10は、巻回されたコンデンサ素子(不図示)と、コンデンサ素子を内部に収容する有底筒状の収容容器11と、収容容器11の開口端を封口する封口材12とから構成されている。また、座板20は、2つの挿通孔21が形成され、かつコンデンサ本体10の底面が当接する基板22と、コンデンサ本体10の外周面を取り囲むように、コンデンサ本体10の中心軸Cに沿って延びる4つの側壁35とから構成されている。 As shown in FIGS. 1 and 2, the surface-mounted capacitor 1 according to the present embodiment has a capacitor body 10 having a substantially cylindrical shape and a seat plate 20 for holding the capacitor body 10. The capacitor main body 10 is composed of a wound capacitor element (not shown), a bottomed cylindrical storage container 11 for accommodating the capacitor element, and a sealing material 12 for sealing the open end of the storage container 11. ing. Further, the seat plate 20 is formed along the central axis C of the capacitor body 10 so as to surround the substrate 22 on which the two insertion holes 21 are formed and the bottom surface of the capacitor body 10 abuts and the outer peripheral surface of the capacitor body 10. It is composed of four extending side walls 35.

円柱形状を有するコンデンサ本体10は、略円筒状の収容容器11の内部にコンデンサ素子を収納し、その開放端部に封口材12を挿着した後、外周側面の下部近傍に溝部13が形成されるように加締めることで、封口材12により収容容器11が封止されるようになっている。この封口材12は、例えばリフロー実装工程において高温下にさらされることにより、座板20に向かって膨張する。コンデンサ本体10には、封口材12を貫通するように2つのリード端子14が設けられている。各リード端子14は、コンデンサ素子より導出されたタブ(不図示)に、例えば、溶接によって接続されている。 The capacitor body 10 having a cylindrical shape accommodates a capacitor element inside a substantially cylindrical storage container 11, and after inserting a sealing material 12 at the open end thereof, a groove portion 13 is formed near the lower portion of the outer peripheral side surface. By crimping in this way, the accommodating container 11 is sealed by the sealing material 12. The sealing material 12 expands toward the seat plate 20 by being exposed to a high temperature, for example, in a reflow mounting process. The capacitor body 10 is provided with two lead terminals 14 so as to penetrate the sealing material 12. Each lead terminal 14 is connected to a tab (not shown) derived from a capacitor element, for example, by welding.

なお、コンデンサ素子としては、アルミニウム等の弁金属からなる陽極箔と陰極箔との間にセパレータを介在させて、巻回して形成され、電解液が含浸されたものや、電解質として固体の導電性高分子をアルミニウム等の弁金属からなる陽極箔と陰極箔との間に形成した、固体電解コンデンサ素子等を用いることができる。 The condenser element may be formed by winding an anode foil made of a valve metal such as aluminum with a separator interposed therebetween and impregnated with an electrolytic solution, or may be a solid conductive element as an electrolyte. A solid electrolytic capacitor element or the like in which a polymer is formed between an anode foil and a cathode foil made of a valve metal such as aluminum can be used.

座板20は、電気絶縁性を有する材料からなる。本実施形態において、座板20の材質は、樹脂である。上述したように、座板20は、表面がコンデンサ本体10の封口材12と対向し、前記表面にコンデンサ本体10が配置される基板22と、コンデンサ本体10の収容容器11を挟持する4つの側壁35とから構成されている(図3参照)。 The seat plate 20 is made of a material having electrical insulation. In the present embodiment, the material of the seat plate 20 is resin. As described above, the surface of the seat plate 20 faces the sealing material 12 of the capacitor body 10, and the substrate 22 on which the capacitor body 10 is arranged on the surface and the four side walls sandwiching the storage container 11 of the capacitor body 10 are sandwiched. It is composed of 35 (see FIG. 3).

基板22は、所定の肉厚を有するとともに、図4に示すように、その上方から見て、略正方形状をなしている。基板22は、コンデンサ本体10の封口材12と対向する側に、コンデンサ本体10との当接面22aを中心軸Cの回りに陥凹させた凹部24が形成されている。凹部24は、基板22の表面の中心部側に、端面部側に対し基板22の厚み方向の深さが深くなるように形成されている。なお、コンデンサ本体10を座板20が保持した状態では、コンデンサ本体10の中心軸Cと基板22(凹部24)の中心軸Cとが一致する。 The substrate 22 has a predetermined wall thickness and, as shown in FIG. 4, has a substantially square shape when viewed from above. The substrate 22 is formed with a recess 24 having a contact surface 22a with the capacitor body 10 recessed around the central axis C on the side of the capacitor body 10 facing the sealing material 12. The recess 24 is formed on the central portion side of the surface of the substrate 22 so that the depth of the substrate 22 in the thickness direction is deeper than that of the end face portion side. In the state where the seat plate 20 holds the capacitor main body 10, the central axis C of the capacitor main body 10 and the central axis C of the substrate 22 (recessed portion 24) coincide with each other.

凹部24は、その上方から見て円形であり、基板22の端縁部側から中心部側に向かって深くなる領域を有する。凹部24が、端縁部側から中心部側に向かって深くなるとは、凹部24が中心部側に向かって連続的に深くなる本実施形態の構成に加えて、凹部24が中心部側に向かって段階的に深くなる後述する変形例1の構成を包含する。これにより、封口材12の膨張具合に合わせて凹部24の深さを調整し、封口材12の膨張による封口材12と座板20との接触を回避できる。図5に示す様に、凹部24を画定する領域(外周面)である2つの傾斜面31,32は、傾斜角度が異なる。具体的には凹部24は、基板22表面の中心部に形成された底面25と、底面25の外周縁から立ち上がる第1傾斜面31と、第1傾斜面31より径方向外側に形成された第2傾斜面32とから画定されている。 The recess 24 is circular when viewed from above, and has a region that becomes deeper from the edge portion side of the substrate 22 toward the center portion side. The fact that the concave portion 24 becomes deeper from the edge portion side toward the central portion means that the concave portion 24 faces the central portion side in addition to the configuration of the present embodiment in which the concave portion 24 continuously deepens toward the central portion side. It includes the configuration of the modified example 1 described later, which gradually becomes deeper. As a result, the depth of the recess 24 can be adjusted according to the degree of expansion of the sealing material 12, and contact between the sealing material 12 and the seat plate 20 due to the expansion of the sealing material 12 can be avoided. As shown in FIG. 5, the two inclined surfaces 31 and 32, which are regions (outer peripheral surfaces) defining the recess 24, have different inclination angles. Specifically, the recess 24 is formed on the bottom surface 25 formed in the central portion of the surface of the substrate 22, the first inclined surface 31 rising from the outer peripheral edge of the bottom surface 25, and the first inclined surface 31 formed radially outside the first inclined surface 31. It is defined from the two inclined surfaces 32.

底面25は、上面視が円形であり、その中心部に形成された突出部26と、突出部26の径方向外方に形成された挿通孔21とを有する。突出部26は、上面視が凹部24と同心円であり、コンデンサ本体10に向かって突出している。図6に示す様に、底面25と、基板22の裏面22b(当接面22aの反対側の面)との間の肉厚は、第1傾斜面31と裏面22bとの間の肉厚および第2傾斜面32と裏面22bとの間の肉厚よりも薄くなっている。 The bottom surface 25 has a circular top view, and has a protrusion 26 formed at the center thereof and an insertion hole 21 formed radially outward of the protrusion 26. The protruding portion 26 has a concentric circle with the concave portion 24 when viewed from above, and protrudes toward the capacitor main body 10. As shown in FIG. 6, the wall thickness between the bottom surface 25 and the back surface 22b (the surface opposite to the contact surface 22a) of the substrate 22 is the wall thickness between the first inclined surface 31 and the back surface 22b. It is thinner than the wall thickness between the second inclined surface 32 and the back surface 22b.

第1傾斜面31は、上面視が輪形状であり、底面25と第2傾斜面32との間、すなわち底面25より径方向外方かつ第2傾斜面32より径方向内方に形成されている。第1傾斜面31は、底面25の外周縁からコンデンサ本体10に向かって基板22の端縁部側に傾斜して延びている。つまり第1傾斜面31は、径方向外方に向かって径が大きくなる円錐台の側面を構成している。底面25に対する第1傾斜面31の傾斜角度はθ1である。従って、第1傾斜面31の深さは、径方向外側から中心部側に向かって連続的に深くなり、第1傾斜面31と裏面22bとの間の肉厚は、中心部側に向かって連続的に薄くなる。 The first inclined surface 31 has a ring shape when viewed from above, and is formed between the bottom surface 25 and the second inclined surface 32, that is, radially outward from the bottom surface 25 and radially inward from the second inclined surface 32. There is. The first inclined surface 31 extends from the outer peripheral edge of the bottom surface 25 toward the capacitor main body 10 so as to be inclined toward the edge portion side of the substrate 22. That is, the first inclined surface 31 constitutes a side surface of a truncated cone whose diameter increases outward in the radial direction. The inclination angle of the first inclined surface 31 with respect to the bottom surface 25 is θ1. Therefore, the depth of the first inclined surface 31 is continuously deepened from the radial outer side toward the central portion, and the wall thickness between the first inclined surface 31 and the back surface 22b is toward the central portion side. It becomes thinner continuously.

第2傾斜面32は、第1傾斜面31と同様に上面視が輪形状であり、底面25および第1傾斜面31より径方向外方に形成されている。第2傾斜面32は、第1傾斜面31の外周縁からコンデンサ本体10に向かって基板22の端縁部側に傾斜して延びている。つまり第2傾斜面32は、径方向外方に向かって径が大きくなる円錐台の側面を構成している。底面25に対する第2傾斜面32の傾斜角度はθ2である。従って、第2傾斜面32の深さは、径方向外側から中心部側に向かって連続的に深くなり、第2傾斜面32と裏面22bとの間の肉厚は、中心部側に向かって連続的に薄くなる。傾斜角度θ2は、第1傾斜面31の傾斜角度をθ1よりも小さい。 Like the first inclined surface 31, the second inclined surface 32 has a ring shape when viewed from the top surface, and is formed radially outward from the bottom surface 25 and the first inclined surface 31. The second inclined surface 32 extends from the outer peripheral edge of the first inclined surface 31 toward the capacitor main body 10 so as to be inclined toward the edge portion side of the substrate 22. That is, the second inclined surface 32 constitutes a side surface of a truncated cone whose diameter increases outward in the radial direction. The inclination angle of the second inclined surface 32 with respect to the bottom surface 25 is θ2. Therefore, the depth of the second inclined surface 32 is continuously deepened from the radial outer side toward the central portion, and the wall thickness between the second inclined surface 32 and the back surface 22b is toward the central portion side. It becomes thinner continuously. The inclination angle θ2 makes the inclination angle of the first inclined surface 31 smaller than θ1.

凹部24の底面25に形成された2つの挿通孔21は、当接面22aからその裏面22bに貫通している。2つの挿通孔21は、上方から見て、基板22の中央部付近に形成されている。この2つの挿通孔21には、コンデンサ本体10に設けられた2つのリード端子14が挿通される。基板22の裏面22bには、2つの挿通孔21から外側端部にかけてリード端子14を収納可能なように、リード端子14の肉厚分にほぼ等しい深さを有する2つの溝部29(図2参照)が形成されている。2つの溝部29は、中心軸Cから径方向外方に向かって延びている。 The two insertion holes 21 formed in the bottom surface 25 of the recess 24 penetrate from the contact surface 22a to the back surface 22b. The two insertion holes 21 are formed near the central portion of the substrate 22 when viewed from above. Two lead terminals 14 provided in the capacitor main body 10 are inserted into the two insertion holes 21. The back surface 22b of the substrate 22 has two groove portions 29 (see FIG. 2) having a depth substantially equal to the wall thickness of the lead terminal 14 so that the lead terminal 14 can be accommodated from the two insertion holes 21 to the outer end portion. ) Is formed. The two groove portions 29 extend radially outward from the central axis C.

上述したように、2つの挿通孔21には、コンデンサ本体10の封口材12から引き出された2つのリード端子14が挿通され、各溝部29に沿って外方に折曲げ加工される。これにより、基板22は、コンデンサ本体10と折曲げられたリード端子14との間に挟持され、コンデンサ本体10と一体化されるようになっている。このとき、2つのリード端子14は、基板22の裏面22bに露出している部分が溝部29内に収容され、飛び出していない。従って、面実装型コンデンサ1は裏面22bを載置面として自立可能である。 As described above, the two lead terminals 14 drawn from the sealing material 12 of the capacitor main body 10 are inserted into the two insertion holes 21 and bent outward along each groove 29. As a result, the substrate 22 is sandwiched between the capacitor main body 10 and the bent lead terminal 14, and is integrated with the capacitor main body 10. At this time, in the two lead terminals 14, the portion exposed on the back surface 22b of the substrate 22 is housed in the groove portion 29 and does not protrude. Therefore, the surface-mounted capacitor 1 can stand on its own with the back surface 22b as the mounting surface.

側壁35は、基板22の四隅付近(基板22表面の端縁部)にそれぞれ立設されている。4つの側壁35は互いに同じ形状を有している。また、4つの側壁35は、コンデンサ本体10の中心軸Cからの距離が、互いに等しくなるように配置されている。また、中心軸Cに対して4つの側壁35が周方向に等角度間隔で配置されている。4つの側壁35は、コンデンサ本体10の中心軸Cを中心とし、かつコンデンサ本体10よりも半径が大きい第1円周の一部である第1円弧面を内側面に有している。さらに、4つの側壁35は、第1円周と同心円であって第1円周よりも半径が大きい第2円周の一部である第2円弧面を外側面に有している。各側壁35において、これら2つの円弧面に挟まれた部分の肉厚は均一となっている。コンデンサ本体10を座板20が保持した状態では、各側壁35の内側面の全体がコンデンサ本体10の外周面と接触している。 The side walls 35 are erected near the four corners of the substrate 22 (edges on the surface of the substrate 22). The four side walls 35 have the same shape as each other. Further, the four side walls 35 are arranged so that the distances from the central axis C of the capacitor main body 10 are equal to each other. Further, four side walls 35 are arranged at equal angular intervals in the circumferential direction with respect to the central axis C. The four side walls 35 have a first arc plane which is a part of a first circumference having a center axis C of the capacitor main body 10 and a radius larger than that of the capacitor main body 10 on the inner side surface. Further, the four side walls 35 have a second arc surface on the outer surface, which is a part of the second circumference which is concentric with the first circumference and has a radius larger than the first circumference. In each side wall 35, the wall thickness of the portion sandwiched between these two arc surfaces is uniform. When the seat plate 20 holds the capacitor body 10, the entire inner surface of each side wall 35 is in contact with the outer peripheral surface of the capacitor body 10.

上述したような座板20は、一般的に、射出成型によって製造される。そのため、本実施形態のように、側壁35の肉厚が均一であることによって歪みや反りなどの発生をより防止することができる。なお、4つの側壁35は、肉厚が均一の部分を有していなくてもよい。 The seat plate 20 as described above is generally manufactured by injection molding. Therefore, as in the present embodiment, the uniform wall thickness of the side wall 35 can further prevent the occurrence of distortion and warpage. The four side walls 35 do not have to have a portion having a uniform wall thickness.

コンデンサ本体10を座板20に保持させるには、図1に示す状態から、コンデンサ本体10を下方に向けてさらに押し込む。このとき、樹脂からなる側壁35は、コンデンサ本体10によって径方向外側に押されることによってコンデンサ本体10の外周面に沿うように径方向外側へと弾性変形する。 In order to hold the capacitor body 10 on the seat plate 20, the capacitor body 10 is further pushed downward from the state shown in FIG. At this time, the side wall 35 made of resin is elastically deformed outward along the outer peripheral surface of the capacitor body 10 by being pushed outward in the radial direction by the capacitor body 10.

コンデンサ本体10を座板20が保持した状態では、コンデンサ本体10は、その中心軸Cに向かう方向に、4つの側壁35の内側面によって押圧されている。これにより、コンデンサ本体10は、座板20によって強固に挟持される。 In the state where the seat plate 20 holds the capacitor main body 10, the capacitor main body 10 is pressed by the inner side surfaces of the four side walls 35 in the direction toward the central axis C thereof. As a result, the capacitor body 10 is firmly sandwiched by the seat plate 20.

また、樹脂からなる側壁35は、コンデンサ本体10に対して離接する方向に弾性変形可能となっているので、たとえコンデンサ本体10の外形および/または側壁35が歪みなどで所定範囲以下の変形量で変形していた場合であっても、側壁35がその変形に追従して径方向の内外どちらの方向にも弾性変形する。そのため、本実施形態では、各側壁35の内側面がコンデンサ本体10の外周面に接触することが担保されている。 Further, since the side wall 35 made of resin can be elastically deformed in the direction of contact with the capacitor body 10, even if the outer shape of the capacitor body 10 and / or the side wall 35 is distorted, the amount of deformation is less than a predetermined range. Even if it is deformed, the side wall 35 elastically deforms in both the radial direction and the inside and outside following the deformation. Therefore, in the present embodiment, it is guaranteed that the inner side surface of each side wall 35 is in contact with the outer peripheral surface of the capacitor body 10.

[本実施形態の面実装型コンデンサ1の特徴]
本実施形態の面実装型コンデンサ1には以下の特徴がある。
[Characteristics of the surface-mounted capacitor 1 of this embodiment]
The surface-mounted capacitor 1 of the present embodiment has the following features.

本実施形態の面実装型コンデンサ1では、封口材12が大きく膨張しても、座板20の基板22表面の中心部側には、端縁部側に対し基板22の厚み方向の深さが深い凹部24が形成されているので、確実に封口材12と座板20との接触を極力回避することができる。しかも、封口材12の膨張中心部と対向しない基板22の端縁部側は中心部に比較し凹部24の深さは浅いため、基板22の厚みが比較的確保されている。これにより、座板20の厚みの増加を抑えながら、封口材12の膨張による座板20の変形を抑制することができる。従って、はんだ付け不良を確実に防止できる。座板20の薄肉部分が少ないこと、および凹部24において座板20が中心部側に向かって薄くなる構造であるため、射出成形による成形不良のリスクを低減できる。 In the surface-mounted capacitor 1 of the present embodiment, even if the sealing material 12 expands significantly, the depth of the substrate 22 in the thickness direction with respect to the edge portion side on the central portion side of the surface of the substrate 22 of the seat plate 20 Since the deep recess 24 is formed, contact between the sealing material 12 and the seat plate 20 can be reliably avoided as much as possible. Moreover, since the depth of the recess 24 is shallower on the edge side of the substrate 22 that does not face the expansion center of the sealing material 12 than in the center, the thickness of the substrate 22 is relatively secured. As a result, it is possible to suppress the deformation of the seat plate 20 due to the expansion of the sealing material 12 while suppressing the increase in the thickness of the seat plate 20. Therefore, soldering defects can be reliably prevented. Since the seat plate 20 has a small thin portion and the recess 24 has a structure in which the seat plate 20 becomes thinner toward the center, the risk of molding defects due to injection molding can be reduced.

本実施形態の面実装型コンデンサ1では、凹部24を画定する領域が、凹部24の中心部から端縁部まで延び、傾斜角度が異なる複数の傾斜面31,32で形成された。これにより、簡単な構成で凹部24を形成できる。 In the surface-mounted capacitor 1 of the present embodiment, the region defining the concave portion 24 extends from the central portion of the concave portion 24 to the edge portion, and is formed by a plurality of inclined surfaces 31 and 32 having different inclination angles. Thereby, the recess 24 can be formed with a simple structure.

本実施形態の面実装型コンデンサ1では、底面25に対する第1傾斜面31の傾斜角度θ1より、底面25に対する第2傾斜面32の傾斜角度θ2の方が小さい。これにより、第2傾斜面32が形成された部分の基板22の肉厚が薄くなるのを抑えて座板20の強度を確保しつつ、封口材12の膨張による封口材12と座板20との接触を回避できる。 In the surface-mounted capacitor 1 of the present embodiment, the inclination angle θ2 of the second inclined surface 32 with respect to the bottom surface 25 is smaller than the inclination angle θ1 of the first inclined surface 31 with respect to the bottom surface 25. As a result, while suppressing the thinning of the wall thickness of the substrate 22 in the portion where the second inclined surface 32 is formed and ensuring the strength of the seat plate 20, the sealing material 12 and the seat plate 20 due to the expansion of the sealing material 12 Contact can be avoided.

本実施形態の面実装型コンデンサ1では、凹部24の中心部に、コンデンサ本体10に向かって突出する突出部26が形成された。これにより、座板20の強度を高くすることができる。 In the surface-mounted capacitor 1 of the present embodiment, a protruding portion 26 projecting toward the capacitor body 10 is formed at the center of the recess 24. Thereby, the strength of the seat plate 20 can be increased.

次に、前記実施形態の面実装型コンデンサ1に係る変形例について説明する。なお、変形例において、コンデンサ本体10の形状は前記実施形態と同様であるので説明を省略する。また座板20の形状に関して前記実施形態と異なる部分についてのみ説明し、その他の部分の形状は前記実施形態と同様であるので同じ符号を付して説明を省略する。 Next, a modification of the surface-mounted capacitor 1 of the embodiment will be described. In the modified example, the shape of the capacitor main body 10 is the same as that of the above embodiment, so the description thereof will be omitted. Further, only the portion different from the above embodiment with respect to the shape of the seat plate 20 will be described, and since the shapes of the other portions are the same as those of the above embodiment, the same reference numerals are given and the description thereof will be omitted.

<変形例1>
前記実施形態では凹部24が、傾斜角度が異なる第1傾斜面31と第2傾斜面32とにより画定された。しかし図7に示す変形例1では、凹部40を画定する外周面の、中心軸Cに沿った基板22の厚み方向の断面形状が階段状である。
<Modification 1>
In the above embodiment, the recess 24 is defined by the first inclined surface 31 and the second inclined surface 32 having different inclination angles. However, in the modified example 1 shown in FIG. 7, the cross-sectional shape of the outer peripheral surface defining the recess 40 in the thickness direction along the central axis C is stepped.

変形例1に係る凹部40は、底面25と、底面25から立ち上がる第1段部41と、第1段部41より径方向外側に形成された第2段部45とから画定されている。これら第1段部41と第2段部45とが、凹部40の外周面を構成している。第1段部41は、底面25の外周縁からコンデンサ本体10に向かって上方に延びる第1側面42と、第1側面42の上端から径方向外方に底面25と平行に延びる第1座面43とからなる。第2段部45は、第1座面43の外周縁からコンデンサ本体10に向かって上方に延びる第2側面46と、第2側面46の上端から径方向外方に底面25と平行に延びる第2座面47と、第2座面47の外周縁からコンデンサ本体10に向かって上方に延びる第3側面48とからなる。この構成により、凹部40は、径方向外側から中心部側に向かって段階的に深くなり、簡単な構成で凹部を形成できる。 The recess 40 according to the first modification is defined by a bottom surface 25, a first step portion 41 rising from the bottom surface 25, and a second step portion 45 formed radially outside the first step portion 41. The first-stage portion 41 and the second-stage portion 45 form the outer peripheral surface of the recess 40. The first step portion 41 has a first side surface 42 extending upward from the outer peripheral edge of the bottom surface 25 toward the capacitor main body 10, and a first bearing surface extending radially outward from the upper end of the first side surface 42 in parallel with the bottom surface 25. It consists of 43. The second step portion 45 has a second side surface 46 extending upward from the outer peripheral edge of the first seat surface 43 toward the capacitor main body 10, and a second side surface 46 extending radially outward from the upper end of the second side surface 46 in parallel with the bottom surface 25. It is composed of two seat surfaces 47 and a third side surface 48 extending upward from the outer peripheral edge of the second seat surface 47 toward the capacitor main body 10. With this configuration, the recess 40 gradually becomes deeper from the radial outer side toward the central portion side, and the recess can be formed with a simple configuration.

<変形例2>
図8に示す変形例2では、凹部50が凹部50の縁から底まで延びる1つの傾斜面51で画定されている。変形例2に係る凹部50は、底面25と、底面25の外周縁からコンデンサ本体10に向かって径方向外方に傾斜して延びる傾斜面51とを有する。傾斜面51は、径方向外方に向かって径が大きくなる円錐台の側面を構成している。これにより、凹部50は、径方向外側から中心部側に向かって連続的に深くなり、簡単な構成で凹部50を形成できる。
<Modification 2>
In the second modification shown in FIG. 8, the recess 50 is defined by one inclined surface 51 extending from the edge of the recess 50 to the bottom. The recess 50 according to the second modification has a bottom surface 25 and an inclined surface 51 extending radially outward from the outer peripheral edge of the bottom surface 25 toward the capacitor main body 10. The inclined surface 51 constitutes a side surface of a truncated cone whose diameter increases outward in the radial direction. As a result, the concave portion 50 becomes continuously deeper from the radial outer side toward the central portion side, and the concave portion 50 can be formed with a simple configuration.

以上、本発明の実施形態について図面に基づいて説明したが、具体的な構成は、これらの実施形態に限定されるものでないと考えられるべきである。本発明の範囲は、上記した実施形態の説明だけではなく特許請求の範囲によって示され、さらに特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 Although the embodiments of the present invention have been described above with reference to the drawings, it should be considered that the specific configuration is not limited to these embodiments. The scope of the present invention is shown not only by the description of the above-described embodiment but also by the scope of claims, and further includes all modifications within the meaning and scope equivalent to the scope of claims.

前記実施形態では、凹部24を1つ、または複数の傾斜面により画定したがこれに限定されず、例えばおわん形状の湾曲面で凹部24を画定しても良い。 In the above embodiment, the recess 24 is defined by one or a plurality of inclined surfaces, but the present invention is not limited to this, and the recess 24 may be defined by, for example, a bowl-shaped curved surface.

前記実施形態では、凹部24の中心部分に突出部26を設けたが、突出部26を設けなくても良い。これにより封口材12が膨張したとしても、封口材12と座板20との干渉を確実に回避できる。また、凹部24を画定する外周面の傾斜角度は特に限定されない。 In the above embodiment, the protrusion 26 is provided at the center of the recess 24, but the protrusion 26 may not be provided. As a result, even if the sealing material 12 expands, interference between the sealing material 12 and the seat plate 20 can be reliably avoided. Further, the inclination angle of the outer peripheral surface defining the recess 24 is not particularly limited.

1 面実装型コンデンサ
10 コンデンサ本体
11 収容容器
12 封口材
20 座板
22 基板
24 凹部
25 底面
26 突出部
31 第1傾斜面
32 第2傾斜面
35 側壁
40 凹部(変形例1)
41 第1段部
45 第2段部
50 凹部(変形例2)
51 傾斜面
C 中心軸
1-side mount type capacitor 10 Capacitor body 11 Containing container 12 Sealing material 20 Seat plate 22 Board 24 Recess 25 Bottom surface 26 Protruding part 31 1st inclined surface 32 2nd inclined surface 35 Side wall 40 Recess (deformation example 1)
41 1st step 45 2nd step 50 Recessed part (deformation example 2)
51 Inclined surface C Central axis

Claims (7)

コンデンサ素子と、前記コンデンサ素子を収容する有底筒状の収容容器と、前記収容容器の開口端を封口する封口材とを有するコンデンサ本体と、
前記コンデンサ本体を保持する座板と、
を備え、
前記座板は、その表面が前記コンデンサ本体の封口材と対向し、前記表面に前記コンデンサ本体が配置される基板を有し、
前記基板表面の中心部側には、端縁部側に対し前記基板の厚み方向の深さが深い凹部が形成されており、
前記凹部が、前記基板の端縁部側から前記中心部側に向かって段階的に深くなる領域を有することを特徴とする面実装型コンデンサ。
A capacitor body having a capacitor element, a bottomed cylindrical storage container for accommodating the capacitor element, and a sealing material for sealing the open end of the storage container.
The seat plate that holds the capacitor body and
Equipped with
The seat plate has a substrate whose surface faces the sealing material of the capacitor body and the capacitor body is arranged on the surface.
A recess having a depth in the thickness direction of the substrate is formed on the central portion side of the substrate surface with respect to the edge portion side .
The recess, surface mount capacitors, wherein Rukoto to have a region consisting stepwise deeper toward the center side from the edge portion of the substrate.
前記座板は、前記基板表面の端縁部に立設され、前記コンデンサ本体の収容容器を挟持する複数の側壁を有することを特徴とする請求項1に記載の面実装型コンデンサ。 The surface-mounted capacitor according to claim 1, wherein the seat plate is erected on an edge portion of the surface of the substrate and has a plurality of side walls that sandwich the accommodating container of the capacitor body. 前記凹部を画定する前記領域の、前記基板厚み方向の断面形状が階段状であることを特徴とする請求項1または2に記載の面実装型コンデンサ。 The surface-mounted capacitor according to claim 1 or 2 , wherein the region defining the recess has a stepped cross-sectional shape in the thickness direction of the substrate. 前記凹部を画定する前記領域が、前記凹部の中心部から端縁部まで延びる1つの傾斜面で形成されていることを特徴とする請求項1または2に記載の面実装型コンデンサ。 The surface-mounted capacitor according to claim 1 or 2 , wherein the region defining the recess is formed by one inclined surface extending from the center portion of the recess to the edge portion. 前記凹部を画定する前記領域が、前記凹部の中心部から端縁部まで延びる、傾斜角度が異なる複数の傾斜面で形成されていることを特徴とする請求項1または2に記載の面実装型コンデンサ。 The surface mount type according to claim 1 or 2 , wherein the region defining the recess is formed by a plurality of inclined surfaces having different inclination angles extending from the center portion of the recess to the edge portion. Capacitor. 前記凹部が、前記基板表面の中心部側に形成された円形の底面と、前記底面の外周縁から前記基板の端縁部側に向けて傾斜して延びる第1傾斜面と、前記第1傾斜面の外周縁から前記基板の端縁部側に向けて傾斜して延びる第2傾斜面とを有し、
前記底面に対する第1傾斜面の傾斜角度より、前記底面に対する第2傾斜面の傾斜角度が小さいことを特徴とする請求項に記載の面実装型コンデンサ。
The concave surface has a circular bottom surface formed on the central portion side of the substrate surface, a first inclined surface extending inclined from the outer peripheral edge of the bottom surface toward the edge portion side of the substrate, and the first inclined surface. It has a second inclined surface extending inclined from the outer peripheral edge of the surface toward the edge portion side of the substrate.
The surface-mounted capacitor according to claim 5 , wherein the inclination angle of the second inclined surface with respect to the bottom surface is smaller than the inclination angle of the first inclined surface with respect to the bottom surface.
コンデンサ素子を収容し、封口材で封口されたコンデンサ本体を保持する座板であって、
その表面が前記コンデンサ本体の封口材と対向し、前記表面に前記コンデンサ本体が載置される基板を有し、
前記基板表面の中心部側には、端縁部側に対し前記基板の厚み方向の深さが深い凹部が形成されており、
前記凹部が、前記基板の端縁部側から前記中心部側に向かって段階的に深くなる領域を有することを特徴とする座板。
A seat plate that houses a capacitor element and holds the capacitor body sealed with a sealing material.
The surface of the capacitor faces the sealing material of the capacitor body, and the surface has a substrate on which the capacitor body is placed.
A recess having a depth in the thickness direction of the substrate is formed on the central portion side of the substrate surface with respect to the edge portion side .
The recess, the seat plate, characterized in Rukoto to have a stepwise deeper a region from the edge portion side of the substrate toward the central portion.
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