JP2017031227A - 接着剤組成物及びそれを用いた半導体装置 - Google Patents

接着剤組成物及びそれを用いた半導体装置 Download PDF

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Publication number
JP2017031227A
JP2017031227A JP2013257865A JP2013257865A JP2017031227A JP 2017031227 A JP2017031227 A JP 2017031227A JP 2013257865 A JP2013257865 A JP 2013257865A JP 2013257865 A JP2013257865 A JP 2013257865A JP 2017031227 A JP2017031227 A JP 2017031227A
Authority
JP
Japan
Prior art keywords
adhesive composition
mass
zinc
silver
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013257865A
Other languages
English (en)
Japanese (ja)
Inventor
名取　美智子
Michiko Natori
美智子 名取
田中　俊明
Toshiaki Tanaka
俊明 田中
偉夫 中子
Takeo Nakako
偉夫 中子
石川　大
Masaru Ishikawa
大 石川
山田　和彦
Kazuhiko Yamada
和彦 山田
賢 藤田
Masaru Fujita
賢 藤田
千秋 岡田
Chiaki Okada
千秋 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2013257865A priority Critical patent/JP2017031227A/ja
Priority to PCT/JP2014/082839 priority patent/WO2015087971A1/ja
Priority to TW103143517A priority patent/TWI669361B/zh
Publication of JP2017031227A publication Critical patent/JP2017031227A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0893—Zinc
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
JP2013257865A 2013-12-13 2013-12-13 接着剤組成物及びそれを用いた半導体装置 Pending JP2017031227A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013257865A JP2017031227A (ja) 2013-12-13 2013-12-13 接着剤組成物及びそれを用いた半導体装置
PCT/JP2014/082839 WO2015087971A1 (ja) 2013-12-13 2014-12-11 接着剤組成物及びそれを用いた半導体装置
TW103143517A TWI669361B (zh) 2013-12-13 2014-12-12 Adhesive composition and semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013257865A JP2017031227A (ja) 2013-12-13 2013-12-13 接着剤組成物及びそれを用いた半導体装置

Publications (1)

Publication Number Publication Date
JP2017031227A true JP2017031227A (ja) 2017-02-09

Family

ID=53371270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013257865A Pending JP2017031227A (ja) 2013-12-13 2013-12-13 接着剤組成物及びそれを用いた半導体装置

Country Status (3)

Country Link
JP (1) JP2017031227A (zh)
TW (1) TWI669361B (zh)
WO (1) WO2015087971A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018131513A (ja) * 2017-02-14 2018-08-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
US10759753B2 (en) 2017-06-19 2020-09-01 Unitika Ltd. Bismaleimide modified product and method for producing the same
CN112778694A (zh) * 2019-11-08 2021-05-11 日东电工株式会社 热固性片材及切割芯片接合薄膜
CN112778943A (zh) * 2019-11-08 2021-05-11 日东电工株式会社 热固性片材及切割芯片接合薄膜
US20210403784A1 (en) * 2020-06-24 2021-12-30 Nitto Denko Corporation Thermosetting sheet and dicing die bonding film
US20220130790A1 (en) * 2020-10-26 2022-04-28 Nitto Denko Corporation Thermosetting sheet, dicing die bonding film, and semiconductor apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6616201B2 (ja) * 2016-01-27 2019-12-04 京セラ株式会社 半導体接着用樹脂組成物及び半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06329960A (ja) * 1993-05-21 1994-11-29 Hitachi Chem Co Ltd 導電ペースト
JP3450839B2 (ja) * 2000-08-31 2003-09-29 松下電器産業株式会社 導電性接着剤を用いた実装構造体
US6524721B2 (en) * 2000-08-31 2003-02-25 Matsushita Electric Industrial Co., Ltd. Conductive adhesive and packaging structure using the same
JP4593123B2 (ja) * 2004-02-13 2010-12-08 ハリマ化成株式会社 導電性接着剤
JP2008106145A (ja) * 2006-10-25 2008-05-08 Sekisui Chem Co Ltd 焼結性導電ペースト
CN102109646B (zh) * 2007-05-14 2013-10-23 株式会社藤仓 光收发装置
US20130183535A1 (en) * 2010-09-29 2013-07-18 Kaoru Konno Adhesive composition and semiconductor device using the same
JP2015042696A (ja) * 2011-12-22 2015-03-05 味の素株式会社 導電性接着剤
JP5880300B2 (ja) * 2012-06-14 2016-03-08 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018131513A (ja) * 2017-02-14 2018-08-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
US10759753B2 (en) 2017-06-19 2020-09-01 Unitika Ltd. Bismaleimide modified product and method for producing the same
US11104643B2 (en) 2017-06-19 2021-08-31 Unitika Ltd. Bismaleimide modified product and method for producing the same
CN112778694A (zh) * 2019-11-08 2021-05-11 日东电工株式会社 热固性片材及切割芯片接合薄膜
CN112778943A (zh) * 2019-11-08 2021-05-11 日东电工株式会社 热固性片材及切割芯片接合薄膜
EP3819348A1 (en) * 2019-11-08 2021-05-12 Nitto Denko Corporation Thermosetting sheet and dicing die bonding film
EP3819349A1 (en) * 2019-11-08 2021-05-12 Nitto Denko Corporation Thermosetting sheet and dicing die bonding film
JP2021077766A (ja) * 2019-11-08 2021-05-20 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
JP7190418B2 (ja) 2019-11-08 2022-12-15 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
US20210403784A1 (en) * 2020-06-24 2021-12-30 Nitto Denko Corporation Thermosetting sheet and dicing die bonding film
US20220130790A1 (en) * 2020-10-26 2022-04-28 Nitto Denko Corporation Thermosetting sheet, dicing die bonding film, and semiconductor apparatus
US11791302B2 (en) * 2020-10-26 2023-10-17 Nitto Denko Corporation Thermosetting sheet, dicing die bonding film, and semiconductor apparatus

Also Published As

Publication number Publication date
TWI669361B (zh) 2019-08-21
WO2015087971A1 (ja) 2015-06-18
TW201529772A (zh) 2015-08-01

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