JP2017028599A - Crystal vibration element aggregation wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal vibration element aggregation wafer capable of suppressing occurrence of burrs in a folded crystal vibration element, even if a force is applied to a coupling part from any principal surface of the crystal vibration element aggregation wafer.SOLUTION: A crystal vibration element aggregation wafer includes a frame 160, a crystal vibration element 110, a first coupling part 120 and a second coupling part 130 connecting the frame 160 and individual crystal vibration elements 110, a first through hole 140, a first bridge 121 and a second bridge 122 and a second through hole 123 provided in the first coupling part 120, and a third bridge 131 and a fourth bridge 132 and a third through hole 133 provided in the second coupling part 130. The upper surface and lower surface of the first bridge 121, second bridge 122, third bridge 131 and fourth bridge 132 have the same shape, in the plan view. The upper surface opening and lower surface opening of the second through hole 123 have the same shape, and the upper surface opening and lower surface opening of the third through hole 133 have the same shape.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a crystal vibration element assembly wafer in which crystal vibration elements are integrated and configured integrally.

  A crystal resonator element is mounted inside a crystal resonator or crystal oscillator, which is one of electronic components. The quartz resonator element includes a quartz base plate, a first electrode, a second electrode, and a conductive wiring pattern provided on the surface of the quartz base plate. The quartz base plate is a thin plate, and the outer shape in plan view is, for example, a circular shape, a square shape, or a tuning fork shape. The first electrode is provided at a predetermined position on the surface of the quartz base plate and excites at least a part of the quartz base plate. The conductive wiring pattern is provided on the surface of the quartz base plate so as to electrically connect, for example, a predetermined first electrode and a predetermined second electrode described later. The second electrode is provided at a predetermined position on the surface of the crystal base plate, and electrically connects the crystal resonator element and the container on which the crystal resonator element is mounted. In the case of manufacturing such a crystal resonator element, a crystal resonator element assembly wafer in which a plurality of crystal resonator elements are integrated and integrated is used.

  For example, a conventional crystal resonator element assembly wafer includes a plurality of crystal base plates that can be folded from a crystal wafer left by etching from a crystal substrate, a support portion, and a crystal base plate connected to the support portion. 1 connection part and 2nd connection part, The 1st electrode, the 2nd electrode, and the conductive wiring pattern are formed in the surface of this quartz base plate, This 1st connection part and said 2nd Are connected so as to extend from one short side of the crystal base plate along the direction in which the pair of long sides of the crystal base plate extends, and with the crystal base plate of the first connection portion The connection portion is provided with a bottomed groove only on one main surface, and the connection portion with the crystal base plate of the second coupling portion is provided with a bottomed groove only on the other main surface. (For example, refer to Patent Document 1).

JP 2010-178320 A

  When separating individual crystal resonator elements from the crystal resonator element assembly wafer on which a plurality of crystal resonator elements are formed, the connection portion is connected to the connection portion connecting the crystal resonator element and the frame portion of the crystal resonator element assembly wafer. The crystal resonator element is separated from the frame portion of the crystal resonator element assembly wafer by applying a force from one of the upper surface and the lower surface of the substrate. However, when a groove having an opening is provided on one main surface side of the connecting portion in the crystal vibration element assembly wafer as in the prior art, the shape is different between the upper surface side and the lower surface side of the connecting portion. In such a state, when the crystal resonator element is folded at the connecting portion, the crystal resonator element side is folded at a position where the force is applied from the upper surface side and when the force is applied from the lower surface side. Burr will occur. The occurrence of burrs in the crystal resonator element may cause an unnecessary vibration mode or an adverse effect on the main vibration mode.

  Therefore, the present invention provides a crystal resonator element assembly wafer capable of suppressing the occurrence of burrs in the broken crystal resonator element, regardless of which main surface side of the crystal resonator element assembly wafer is applied to the connecting portion. The purpose is to provide.

  The quartz resonator element assembly wafer according to the present invention is arranged in a plurality of rows in a flat frame portion having a rectangular shape in outer periphery and inner periphery in plan view, and in a space surrounded by the frame portion. A flat and rectangular crystal resonator element in plan view with two electrodes formed thereon, arranged along one side where the second electrode of each crystal resonator element is provided, and one side of the inner periphery of the frame portion, and each crystal A first connecting part and a second connecting part connected so as to extend from one side where the second electrode of the vibration element is provided, and a first penetration provided between the first connecting part and the second connecting part A hole, a third electrode extending from the second electrode through the surface of the first connecting portion and the second connecting portion to the surface of the frame portion, and both ends of the first connecting portion in the short side direction of the crystal resonator element A first bridge portion and a second bridge portion provided, and a second through-hole provided between the first bridge portion and the second bridge portion. A hole, a third bridge portion and a fourth bridge portion provided at both ends in the short side direction of the crystal resonator element of the second connecting portion, and provided between the third bridge portion and the fourth bridge portion. A first through-hole, a first bridge portion, a second bridge portion, a third bridge portion and a fourth bridge portion in plan view, the top surface shape and the bottom surface shape for each bridge portion are the same, The shape of the upper surface side opening of the second through hole is the same as the shape of the lower surface side opening, and the shape of the upper surface side opening of the third through hole is the same as the shape of the lower surface side opening. Features.

  The quartz resonator element assembly wafer according to the present invention is arranged in a plurality of rows in a flat frame portion having a rectangular shape in outer periphery and inner periphery in plan view, and in a space surrounded by the frame portion. A flat and rectangular crystal resonator element in plan view with two electrodes formed thereon, arranged along one side where the second electrode of each crystal resonator element is provided, and one side of the inner periphery of the frame portion, and each crystal A first connecting part and a second connecting part connected so as to extend from one side where the second electrode of the vibration element is provided, and a first penetration provided between the first connecting part and the second connecting part A hole, a third electrode extending from the second electrode through the surface of the first connecting portion and the second connecting portion to the surface of the frame portion, and both ends of the first connecting portion in the short side direction of the crystal resonator element A first bridge portion and a second bridge portion provided, and a second through-hole provided between the first bridge portion and the second bridge portion. A hole, a third bridge portion and a fourth bridge portion provided at both ends in the short side direction of the crystal resonator element of the second connecting portion, and provided between the third bridge portion and the fourth bridge portion. A first through-hole, a first bridge portion, a second bridge portion, a third bridge portion and a fourth bridge portion in plan view, the top surface shape and the bottom surface shape for each bridge portion are the same, The shape of the upper surface side opening of the second through hole and the shape of the lower surface side opening are the same, and the shape of the upper surface side opening of the third through hole and the shape of the lower surface side opening are the same. In such a configuration, the shape of the first connecting portion and the second connecting portion in plan view is the same between the upper and lower main surfaces, and it is possible to apply a force uniformly to the first connecting portion and the second connecting portion. It is possible to suppress the generation of burrs at the break-off portion on the vibration element side.

1 is a plan view showing a crystal resonator element assembly wafer according to an embodiment of the present invention. It is the elements on larger scale which expanded and showed the circle A part described in FIG. It is sectional drawing cut | disconnected by the BB line shown in FIG. FIG. 6 is a partial enlarged view showing, in an enlarged manner, the same portion as the circle A portion shown in FIG. 1 in the first modification of the crystal resonator element assembly wafer according to the embodiment of the present invention. FIG. 9 is a partially enlarged view showing, in an enlarged manner, the same portion as the circle A portion shown in FIG. 1 in a second modification of the quartz resonator element assembly wafer according to the embodiment of the present invention. It is sectional drawing cut | disconnected by the CC line | wire shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a crystal resonator element assembly wafer according to an embodiment of the present invention. FIG. 2 is a partially enlarged view showing the virtual circle A portion shown in FIG. 1 in an enlarged manner. FIG. 3 is a cross-sectional view taken along the virtual cutting line BB described in FIG. In addition, in each figure of FIGS. 1-6, in order to clarify description, a part of structure is not shown and the dimension is partially exaggerated and shown. In particular, the thickness direction of the cross section in FIGS. 3 and 6 is greatly exaggerated. In addition, in order to simplify the explanation, in FIGS. 1, 2, 4 and 5, the surface side shown in the drawing is the upper side, the opposite side is the lower side, and in FIGS. 3 and 6, the sheet on which the drawings are described. The upper part is described as the upper part of the crystal vibration element assembly wafer.

  As shown in FIGS. 1 to 3, the crystal resonator element assembly wafer 100 includes a crystal resonator element 110, a first connecting portion 120 including a first bridge portion 121, a second bridge portion 122, and a second through hole 123, The second connecting portion 130 includes a third bridge portion 131, a second bridge portion 132, and a third through hole 133, a first through hole 140, a third electrode 150, and a frame portion 160. The crystal vibration element assembly wafer 100 is used to simultaneously manufacture a plurality of crystal vibration elements 110 mounted in a crystal device in the process of manufacturing a crystal device such as a crystal resonator or a crystal oscillator.

  The crystal resonator element 110 has a first electrode 112 used for excitation of the crystal base plate 111 and a short side of the crystal base plate 111 drawn from the first electrode 112 on each of an upper surface and a lower surface of the crystal base plate 111. The second electrode 113 is attached and plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  The quartz base plate 111 has a rectangular shape in plan view. For example, in a rectangular coordinate system composed of an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis), the Z axis is -Y with the Y axis. When the axis tilted in the direction is the Z ′ axis and the Y axis is the Y ′ axis is the axis tilted in the + Z direction of the Z axis, the parallel top and bottom with the X axis direction as the long side and the Z ′ axis direction as the short side It consists of an AT-cut thin plate composed of the XZ ′ plane and having a thickness parallel to the Y ′ axis.

  The first electrode 112 is for causing the crystal base plate 111 to be excited in a predetermined vibration mode and frequency when an alternating voltage from the outside is applied to the crystal base plate 111 via the first electrode 112. The first electrode 112 is provided at a substantially central portion of the upper surface and the lower surface of the quartz base plate 111 so as to face each other between the upper surface and the lower surface.

  The second electrode 113 is for transmitting an alternating voltage from the outside to each first electrode 112. The second electrode 113 includes one short side of the two short sides of the crystal base plate 111 from each of the first electrode 112 provided on the top surface of the crystal base plate 111 and the first electrode 112 provided on the bottom surface. It extends so that it may not oppose between an upper surface and a lower surface to the edge part.

  The first electrode 112 and the second electrode 113 are formed at predetermined positions on the crystal base plate 111 using, for example, a photolithography technique and an etching technique. Specifically, a metal film to be the first electrode 112 and the second electrode 113 is formed on both main surfaces of the crystal vibrating element assembly wafer 100 on which the portions to be the plurality of crystal base plates 111 are formed. A photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed so that a predetermined pattern of this photosensitive resist (a portion to become the first electrode 112 and the second electrode 113) remains. Finally, the exposed metal film is peeled off, and the remaining photosensitive resist is removed. In this way, the first electrode 112 and the second electrode 113 are formed at predetermined positions of the portion to be the crystal element plate 111 of the crystal vibrating element assembly wafer 100 in which the portions to be the plurality of crystal element plates 111 are formed. Is done. Here, the case where the film is formed using the photolithography technique and the etching technique is described, but the film may be formed using, for example, a sputtering technique or a vapor deposition technique.

  The first electrode 112 and the second electrode 113 are formed so that silver or gold is laminated on chromium. By using chrome for the base, it is possible to ensure adhesion between the crystal base plate 111 and the first electrode 112 and the second electrode 113 while also ensuring adhesion with gold or silver.

  The first connecting part 120, together with the second connecting part 130 described later, mechanically connects the crystal vibrating element 110 and the frame part 160 of the crystal vibrating element assembly wafer 100, thereby the crystal vibrating element 110 described later. Used to support 160. The first connecting portion 120 extends from one short side where the second electrode 112 of the crystal resonator element 110 is provided along one of the two sides in the length direction of the crystal resonator element 110 to the one short side. The frame portion 160 is provided so as to extend to the front. The first connecting part 120 is formed integrally with the crystal resonator element 110 and the frame part 160. The first connecting portion 120 includes a first bridge portion 121, a second bridge portion 122, and a second through hole 123.

  The first bridge portion 121 and the second bridge portion 122 can absorb and distribute impacts and the like from the outside to the first bridge portion 121 and the second bridge portion 122, and maintain the rigidity of the entire first connecting portion 120. It is used to The first bridge portion 121 and the second bridge portion 122 are arranged so that the first bridge portion 121 is placed on one long side of the crystal resonator element 110 so as to sandwich a second through hole 123 described later in the first connection portion 120. The bridge portion 122 is provided so as to be on the second connecting portion 130 side provided in the same crystal resonator element 110. The thickness of the 1st bridge part 121 and the 2nd bridge part 122 is the same as the thickness of the crystal vibration element 110 and the frame part 160, The thickness dimension is 20-70 micrometers. Further, the upper surface shape and the lower surface shape of the first bridge portion 121 in plan view are the same shape. Furthermore, the upper surface shape in plan view and the lower surface shape of the second bridge portion 122 are the same shape.

  The second through-hole 123 is for making it easier to fold the crystal resonator element 110 from the first connecting portion 120. The second through-hole 123 is a hole that is provided substantially at the center of the first connecting portion 120 and penetrates the first connecting portion 120 from the upper surface to the lower surface. Moreover, the upper surface side opening part shape of the 2nd through-hole 123 and the lower surface side opening part shape are the same shapes. By providing the second through-hole 123, the rigidity of only a predetermined portion of the first connecting portion 120 can be weakened. When the crystal resonator element 110 is folded from the frame portion 160 in the first connecting portion 120, By folding at the two through holes 123, the folding position can be arbitrarily controlled.

  The second connecting portion 130, together with the first connecting portion 120 described above, mechanically connects the crystal resonator element 110 and the frame portion 160 of the crystal resonator element assembly wafer 100, whereby the crystal resonator element 110 will be described later. Used to support 160. The second connecting portion 130 extends from one short side where the second electrode 113 of the crystal resonator element 110 is provided along the other side of the two sides in the length direction of the crystal resonator element 110 to the one short side. The frame portion 160 is provided so as to extend to the front. The second connecting portion 130 is formed integrally with the crystal resonator element 110 and the frame portion 160. The second connecting portion 130 includes a third bridge portion 131, a fourth bridge portion 132, and a third through hole 133.

  The third bridge portion 131 and the fourth bridge portion 132 can absorb and absorb the impact etc. from the outside to the third bridge portion 131 and the fourth bridge portion 132, and maintain the rigidity of the entire second connecting portion 130. It is used to The third bridge portion 131 and the fourth bridge portion 132 are arranged on the other long side of the crystal resonator element 110 so that the third through hole 133 described later is sandwiched in the second connecting portion 130. The bridge portion 132 is provided so as to be on the first connecting portion 120 side provided in the same crystal resonator element 110. The thickness of the 3rd bridge part 131 and the 4th bridge part 132 is the same as the thickness of the crystal vibration element 110 and the frame part 160, The thickness dimension is 20-70 micrometers. Further, the upper surface shape and the lower surface shape of the third bridge portion 131 in plan view are the same shape. Further, the upper surface shape and the lower surface shape of the fourth bridge portion 132 in plan view are the same shape.

  The third through-hole 133 is for facilitating the folding of the crystal resonator element 110 from the second connecting portion 130. The third through hole 133 is a hole that is provided substantially at the center of the second connecting portion 130 and penetrates the second connecting portion 130 from the upper surface to the lower surface. Moreover, the upper surface side opening shape and the lower surface side opening shape of the third through-hole 133 are the same shape. By providing the third through-hole 133, the rigidity of only a predetermined portion of the second connecting portion 130 can be weakened, and when the crystal resonator element 110 is folded from the frame portion 160 in the second connecting portion 130, By folding at the three through-holes 133, the folding position can be arbitrarily controlled.

  A first through hole 140 is provided between the first connecting part 120 and the second connecting part 130. The first through hole 140 is a hole penetrating from the upper surface to the lower surface of the crystal resonator element assembly wafer 100, and the first connecting portion 120 and the second connecting portion 130 are symmetrical with respect to the first through hole 140. It is configured.

  The frame portion 160 is a thin plate made of crystal, and supports the plurality of crystal resonator elements 110 provided with the first connecting portion 120 and the second connecting portion 130 while maintaining the rigidity of the entire crystal resonator element assembly wafer 100. belongs to. The frame portion 160 includes an outer frame 161 and a crosspiece portion 162, and is configured integrally with a plurality of crystal resonator elements 110 provided with the first connecting portion 120 and the second connecting portion 130.

  The outer frame 161 is provided so as to surround four sides of the entire crystal resonator element assembly wafer 100. The outer peripheral shape in plan view is rectangular, and has a predetermined width for having the required rigidity. The crosspieces 162 are provided so as to connect two opposing sides of the inner periphery of the outer frame 161, and a plurality of the crosspieces 162 are provided in parallel with a certain interval. The inner peripheral shape of the frame portion 160 composed of the outer frame 161 and the crosspiece portion 162 is also rectangular.

  In the crystal resonator element 110 provided with the first connecting portion 120 and the second connecting portion 130, the long sides of the adjacent crystal resonator elements 110 are parallel in the space formed by the inner periphery of the outer frame 161 and the crosspiece 162. Are arranged side by side in the same direction. Further, the first connecting portion 120 and the second connecting portion 130 provided in each of the crystal resonator elements 110 are ends opposite to the end portions of the first connecting portion 120 and the second connecting portion 130 on the crystal resonator element 110 side. The part is connected to the inner periphery of the crosspiece 162 or the outer frame 161 located opposite to the end.

  The third electrode 150 is used as a terminal for measuring a characteristic value such as frequency or CI (crystal impedance) of each crystal resonator element 110 in the state of the crystal resonator element assembly wafer 100. In a state where a plurality of crystal resonator elements 110 are arranged and connected in the crystal resonator element assembly wafer 100, the third electrode 150 is connected to the first connecting portion 120 and the second electrode 113 provided on each crystal resonator element 110. The surface extends from the surface of the second connecting portion 130 to the surfaces of the outer frame 161 and the crosspiece 162 to which the first connecting portion 120 and the second connecting portion 130 are connected.

  The third electrode 150 is formed at a predetermined position of the first connecting portion 120, the second connecting portion 130, and the frame portion 160 simultaneously with the first electrode 112 and the second electrode 113 by using, for example, a photolithography technique and an etching technique. It is formed. Specifically, a metal film that becomes the third electrode 150 together with the first electrode 112 and the second electrode 113 is formed on both main surfaces of the crystal vibrating element assembly wafer 100 in which portions to be the plurality of crystal base plates 111 are formed. A film is formed, and a photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed so that a predetermined pattern of this photosensitive resist (portions that become the first electrode 112, the second electrode 113, and the third electrode 150) remains. Finally, the exposed metal film is peeled off, and the remaining photosensitive resist is removed. In this way, the third electrode 150 is formed at a predetermined position of the portion that becomes the first connection portion 120, the second connection portion 130, and the frame portion 160 of the crystal vibration element assembly wafer 100. Here, the case where the film is formed using the photolithography technique and the etching technique is described, but the film may be formed using, for example, a sputtering technique or a vapor deposition technique.

  The third electrode 150 is formed so that silver or gold is laminated on chromium. The third electrode 150 uses chromium as a base to ensure adhesion between the first connection part 120, the second connection part 130, the frame part 160, and the third electrode 150, and to adhere to gold or silver. Can also be secured.

  A quartz crystal resonator element assembly wafer 100 according to an embodiment of the present invention has a flat frame portion 160 whose outer and inner peripheral shapes are rectangular in plan view, and a plurality of the wafers arranged in a space surrounded by the frame portion 160. Are arranged along one side where the second electrode 113 of each crystal resonator element 110 is provided, and a rectangular plate-like crystal resonator element 110 having at least a first electrode 112 and a second electrode 113 formed in a plan view. The first connecting portion 120 and the second connecting portion 130 that are connected so as to extend from one side of the inner periphery of the frame portion 160 and one side where the second electrodes 113 of the individual crystal resonator elements 110 are provided. From the first through-hole 140 provided between the connecting part 120 and the second connecting part 130, and from the second electrode 113 to the surface of the frame part 160 through the surfaces of the first connecting part 120 and the second connecting part 130. Extended third electrode 50, a first bridge portion 121 and a second bridge portion 122 provided at both ends in the short side direction of the crystal resonator element 110 of the first connecting portion 120, the first bridge portion 121 and the second bridge portion 122, The third through-hole 123 provided between the third bridge portion 131 and the fourth bridge portion 132 provided at both ends in the short side direction of the crystal resonator element 110 of the second connecting portion 130, and the third bridge portion 132. A third through hole 133 provided between the bridge portion 131 and the fourth bridge portion 132, and the first bridge portion 121, the second bridge portion 122, the third bridge portion 131, and the fourth bridge portion 132 are In plan view, the upper surface shape and the lower surface shape of each bridge portion are the same, the shape of the upper surface side opening of the second through-hole 123 is the same as the shape of the lower surface side opening, and the third penetration The shape of the upper surface side opening of the hole 133 is the same as the shape of the lower surface side opening.

  With such a configuration, the planar view shapes of the first connecting portion 120 and the second connecting portion 130 are the same between the upper and lower surfaces. Therefore, when the crystal resonator element 110 is folded at the first connecting portion 120 and the second connecting portion 130 with such a configuration, the force is applied from the lower surface side when the force is applied from the upper surface side. In some cases, the first bridge portion 121 and the second bridge portion 122 constituting the first connecting portion 120 and the third bridge portion 131 and the fourth bridge portion 132 constituting the second connecting portion 130 are uniformly forced. Therefore, it is possible to suppress the occurrence of burrs at the broken portion on the quartz resonator element 110 side. Further, even when burrs are generated, the generated burrs may have substantially the same shape for each crystal vibration element 110 or each crystal vibration element assembly wafer 100. Thereby, the external shape of the crystal resonator element 110 can be unified, and generation of unnecessary vibration modes due to the external shape and adverse effects on the main vibration mode can be kept within a certain range.

  Conventionally, in order to unify the state of burrs, the direction of the force applied to the first connecting part 120 and the second connecting part 130 when folding the crystal resonator element 110 is changed to the first connecting part 120 and the second connecting part. In order to limit to the upper and lower surfaces having different shapes in the plan view of the portion 130, the difference in the outer shape of the first connecting portion 120 and the second connecting portion 130 is recognized, and based on the result, the quartz vibrating element assembly wafer 100 It is necessary to align the orientation of the main surface. When such a process is provided, there is a possibility that an impact is applied to the crystal resonator aggregate wafer 100 when the manufacturing is delayed or the directions are aligned, and the crystal resonator element aggregate wafer 100 is damaged or the crystal resonator element 110 is dropped. there were. However, by recognizing the difference in the outer shape of the first connecting part 120 and the second connecting part 130 by making the planar shape of the first connecting part 120 and the second connecting part 130 the same between the upper and lower main surfaces, Based on the result, it is not necessary to align the orientation of the main surface of the crystal resonator element assembly wafer 100. When delaying the production or aligning the orientation of the crystal resonator element assembly wafer 100, an impact is applied to the crystal resonator assembly wafer 100 to cause crystal vibration. It is possible to reduce the occurrence of damage to the element assembly wafer 100, dropout of the crystal vibration element 110 from the crystal vibration element assembly wafer 100, and the like.

  In addition, the crystal resonator element assembly wafer 100 according to the embodiment of the present invention includes a plurality of frame portions 160 that surround a space in which the crystal resonator element 110 is disposed by the outer frame 161 and the crosspiece portion 162 that constitute the frame portion 160. Adjacent to each other. With such a configuration, even when the crystal resonator element wafer 100 is enlarged, a large number of crystal resonator elements 110 can be disposed inside while maintaining the rigidity of the entire wafer.

(First modification)
FIG. 4 is a partially enlarged view showing the same place as the virtual circle A shown in FIG. 1 in the crystal resonator element assembly wafer according to the first modification of the embodiment described above. Further, in the crystal vibration element assembly wafer 100 according to the first modification of the above-described embodiment, one side of the crystal vibration element 110 is extended on one side outside the first bridge portion 121 constituting the first connecting portion 120. It is provided so that it may be located on a line, and one side outside the 3rd bridge part 131 which constitutes the 2nd connection part 130 is provided so that it may be located on the extension line of the other long side of crystal oscillation element 110 Is different from the first embodiment.

  With such a configuration, even when the crystal resonator element 110 is folded, even if a part of the first connecting portion 120 or the second connecting portion 130 is attached to the crystal resonator element 110, it is attached. The position is only near the corner where the vibration mode of the crystal resonator element 110 has little influence. Therefore, the broken crystal resonator element 110 can vibrate only in a desired vibration mode.

  In the crystal vibration element assembly wafer 100 according to the first modification of the embodiment, the first bridge portion 121 is provided outside the first connection portion 120, and one side outside the first bridge portion 121 is the crystal vibration element 110. The third bridge portion 131 is provided outside the second connecting portion 130, and one side outside the third bridge portion 131 is a crystal resonator element. 110 is provided so as to be located on an extension line of one long side of 110. With such a configuration, when the crystal resonator element 110 is folded, even if a part of the first connecting portion 120 or the second connecting portion 130 is attached to the crystal resonator element, the attached position However, it can be limited to the vicinity of the corner portion where the vibration mode of the crystal resonator element 110 is less affected. Therefore, the broken crystal resonator element 110 can vibrate only in a desired vibration mode.

(Second modification)
FIG. 5 is a partially enlarged view showing the same place as the virtual circle A shown in FIG. 1 in the crystal resonator element wafer according to the second modification of the embodiment described above. 6 is a cross-sectional view taken along the virtual cutting line CC shown in FIG.
The crystal resonator element assembly wafer 100 according to the second modification of the embodiment described above includes at least one of the first bridge portion 121 and the second bridge portion 122, and the third bridge portion 131 or the fourth bridge. It differs from the above-described embodiment in that at least one of the portions 132 is provided with a notch portion 170 extending from the upper surface to the lower surface of each bridge portion.

  The notch 170 is for making it easier to fold the quartz resonator element 110 from the first connecting portion 120 and the second connecting portion 130, and to prevent the burrs from adhering to the quartz resonator element 110 after being broken. It is for reducing. As shown in FIG. 5, for example, the notch portion 170 is provided with a first notch portion 171 in the second bridge portion 122 and a second notch portion 172 in the fourth bridge portion 132. The first cutout portion 171 is cut out from the side surface on the first through hole 140 side of the second bridge portion 122 toward the side surface on the second through hole 123 side, and one end of the first cutout portion 171. Is opened on the upper surface of the second bridge portion 122 and the other end is opened on the lower surface of the second bridge portion 122. The second notch 172 is notched from the side surface on the first through hole 140 side of the fourth bridge portion 132 toward the side surface on the third through hole 133 side. One end is opened on the upper surface of the fourth bridge portion 132 and the other end is opened on the lower surface of the fourth bridge portion 132. In addition, the shape of the upper surface side opening end portion of the first cutout portion 171 is the same as the shape of the lower surface side opening end portion.

  In addition, the depth dimension α1 from the first through hole 140 side opening of the second bridge portion 122 to the notch end portion on the second through hole 123 side in the first notch portion 171 is the width of the second bridge portion 122. It is desirable to be within a range of 25 to 75% of the dimension β1. In addition, the depth dimension α2 from the first through hole 140 side opening of the fourth bridge portion 132 to the notch end portion on the third through hole 133 side in the second notch portion 172 is the width of the fourth bridge portion 132. It is desirable to be within a range of 25 to 75% of the dimension β2.

  In addition, the notch part which comprises the 1st notch part 171 and the 2nd notch part 172 is at least one bridge part among the 1st bridge part 121 or the 2nd bridge part 122, and the 3rd bridge part 131. Alternatively, at least one of the fourth bridge portions 132 is provided from the upper surface to the lower surface of the bridge portion. By doing so, the crystal resonator element 110 is provided with the first connecting portion 120 including the first bridge portion 121 and the second bridge portion 122, and the second bridge portion including the third bridge portion 131 and the fourth bridge portion 132. This is intended to make it easier to break off from the connecting portion 130, and it is possible to reduce burrs from adhering to the crystal resonator element 110 after being broken.

  In addition, by providing the notch portions constituting the first notch portion 171 and the second notch portion 172, particularly in the second bridge portion 122 and the fourth bridge portion 132, the crystal resonator element 110 after being temporarily broken off. Even if burrs are formed, burrs are likely to be formed at the corners of the crystal resonator element 110, and the degree of adverse effects on the main vibration mode due to the outer shape abnormality is notched in the first bridge portion 121 and the third bridge portion 131. It is possible to obtain the crystal resonator element 110 that is smaller than the portion provided and vibrates in a desired main vibration mode.

  In addition, the position where the notch 170 is provided is desirably a position offset as far as possible from the second bridge portion 122 and the fourth bridge portion 132 toward the crystal resonator element 110 side. With such a configuration, when the crystal resonator element 110 is separated from the crystal resonator element assembly wafer 100 at the position where the notch 170 is formed, most of the first connecting portion 120 and the second connecting portion 130 are crystal resonator elements. The crystal resonator element 110 having a desired outer shape in which the first connecting portion 120 and the second connecting portion 130 are not attached to the crystal resonator element 110 can be obtained in the state left on the frame portion 160 side of the collective wafer 100. . Therefore, it is possible to suppress the influence of the unnecessary vibration mode due to the unauthorized outer shape that is generated when the crystal resonator element 110 is vibrated.

  In the crystal vibration element assembly wafer 100 according to the second modification of the embodiment, at least one of the first bridge part 121 or the second bridge part 122, and the third bridge part 131 or the fourth bridge part. At least one of the bridge portions 132 may be provided with a notch portion from the upper surface to the lower surface of the bridge portion. By doing so, the crystal resonator element 110 is provided with the first connecting portion 120 including the first bridge portion 121 and the second bridge portion 122, and the second bridge portion including the third bridge portion 131 and the fourth bridge portion 132. This is intended to make it easier to break off from the connecting portion 130, and it is possible to reduce burrs from adhering to the crystal resonator element 110 after being broken.

  In the crystal vibration element assembly wafer 100 according to the second modified example of the embodiment, the notch portion includes the first bridge portion 121, the second bridge portion 122, the third bridge portion 131, or the fourth bridge portion provided with the notch portion. The bridge portion 132 is provided at a position offset to the crystal resonator element 110 side. With such a configuration, when the crystal resonator element 110 is separated from the crystal resonator element assembly wafer 100 at the position where the notch 170 is formed, most of the first connecting portion 120 and the second connecting portion 130 are formed. The crystal resonator element 110 having a desired outer shape in which the first connecting portion 120 and the second connecting portion 130 are not attached to the crystal resonator element 110 is obtained in the state left on the frame 160 side of the crystal resonator element assembly wafer 100. be able to. Therefore, it is possible to suppress the influence of the unnecessary vibration mode due to the unauthorized outer shape that is generated when the crystal resonator element 110 is vibrated.

  The present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the quartz resonator element 110 has an AT cut and has a rectangular outer shape in plan view, but may be processed by another cut angle. The outer shape may also be a crystal resonator element having another outer shape such as a tuning fork shape.

DESCRIPTION OF SYMBOLS 100 ... Quartz vibration element assembly wafer 110 ... Quartz vibration element 111 ... Crystal base plate 112 ... First electrode 113 ... Second electrode 120 ... First connection part 121 ... First One bridge part 122 ... second bridge part 123 ... second through hole 130 ... second connection part 131 ... third bridge part 132 ... fourth bridge part 133 ... third penetration Hole 140 ... First through hole 150 ... Third electrode 160 ... Frame portion 161 ... Outer frame 162 ... Crosspiece 170 ... Notch portion 171 ... First notch portion 172 ... Second cutout

Claims (5)

The outer periphery and the inner periphery shape are rectangular in plan view, and a flat frame portion;
A plurality of crystal resonator elements arranged in a space surrounded by the frame portion and having a rectangular shape in plan view in which at least a first electrode and a second electrode are formed on the surface, and
It is arranged along one side where the second electrodes of the individual crystal resonator elements are provided, and extends from one side of the inner periphery of the frame portion and one side where the second electrodes of the individual crystal resonator elements are provided. A first connecting portion and a second connecting portion that are connected so as to come out,
A first through hole provided between the first connecting portion and the second connecting portion;
A third electrode extending from the second electrode to the surface of the frame portion through the surfaces of the first connection portion and the second connection portion;
A first bridge portion and a second bridge portion provided at both ends in the short side direction of the crystal resonator element of the first connection portion;
A second through hole provided between the first bridge portion and the second bridge portion;
A third bridge portion and a fourth bridge portion provided at both ends in the short side direction of the crystal resonator element of the second connecting portion;
A third through hole provided between the third bridge portion and the fourth bridge portion;
With
The first bridge part, the second bridge part, the third bridge part, and the fourth bridge part are in plan view, and the upper surface shape and the lower surface shape of each bridge part are the same,
The shape of the upper surface side opening of the second through hole is the same as the shape of the lower surface side opening, and the shape of the upper surface side opening of the third through hole is the same as the shape of the lower surface side opening. A quartz vibration element assembly wafer characterized by the above.   The frame portion is composed of an outer frame and a crosspiece, and a plurality of spaces surrounded by the frame made up of the outer frame and the crosspiece are provided adjacent to each other. The quartz crystal vibration element assembly wafer according to claim 1.   The first bridge portion is provided outside the first connecting portion, and one side outside the first bridge portion is provided so as to be located on an extension line of one long side of the crystal resonator element. The third bridge portion is provided outside the second connecting portion, and one side outside the third bridge portion is provided so as to be located on an extension line of one long side of the crystal resonator element. The crystal vibration element assembly wafer according to claim 1, wherein the crystal vibration element assembly wafer is provided.   From at least one of the first bridge portion and the second bridge portion, and at least one of the third bridge portion and the fourth bridge portion, from the upper surface of the bridge portion. The crystal vibration element assembly wafer according to claim 1, wherein a notch portion reaching the lower surface is provided.   The notch portion is provided at a position offset to the crystal vibration element side of the first bridge portion, the second bridge portion, the third bridge portion or the fourth bridge portion where the notch portion is provided. The crystal vibration element assembly wafer according to claim 4, wherein:

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