JP6525766B2 - Quartz crystal vibrator assembly wafer - Google Patents

Quartz crystal vibrator assembly wafer Download PDF

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JP6525766B2
JP6525766B2 JP2015129478A JP2015129478A JP6525766B2 JP 6525766 B2 JP6525766 B2 JP 6525766B2 JP 2015129478 A JP2015129478 A JP 2015129478A JP 2015129478 A JP2015129478 A JP 2015129478A JP 6525766 B2 JP6525766 B2 JP 6525766B2
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康平 笹岡
康平 笹岡
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Kyocera Corp
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Description

本発明は、水晶振動素子が集合して一体で構成された水晶振動素子集合ウエハに関する。   The present invention relates to a quartz crystal vibrating element assembly wafer in which quartz crystal vibrating elements are integrated and configured integrally.

電子部品の一つである水晶振動子や水晶発振器の内部には水晶振動素子が搭載されている。水晶振動素子は、水晶素板とその水晶素板の表面に設けられた第一電極、第二電極及び導配線パターンにより構成されている。水晶素板は薄板であり、平面視の外形形状が例えば円形状、四角形状又は音叉形状をしている。第一電極は水晶素板の表面の所定の位置に設けられており、少なくとも水晶素板の一部分を励振させる。導配線パターンは、例えば所定の第一電極と後述する所定の第二電極とを電気的に接続するように水晶素板の表面に設けられている。第二電極は水晶素板の表面の所定の位置に設けられており、水晶振動素子とそれを搭載する容器とを電気的に接続する。このような水晶振動素子を製造する場合、複数の水晶振動素子が集合して一体で構成された水晶振動素子集合ウエハが用いられる。   A quartz oscillator is mounted inside a quartz oscillator or a quartz oscillator that is one of the electronic components. The quartz crystal vibrating element is composed of a quartz crystal base plate and a first electrode, a second electrode, and a conductive wiring pattern provided on the surface of the quartz base plate. The quartz plate is a thin plate, and the outer shape in plan view has, for example, a circular shape, a square shape or a tuning fork shape. The first electrode is provided at a predetermined position on the surface of the quartz plate and excites at least a part of the quartz plate. The conductive wiring pattern is provided on the surface of the quartz substrate so as to electrically connect, for example, a predetermined first electrode and a predetermined second electrode described later. The second electrode is provided at a predetermined position on the surface of the quartz crystal plate, and electrically connects the quartz crystal vibrating element and the container on which it is mounted. In the case of manufacturing such a quartz crystal vibrating element, a quartz crystal vibrating element aggregate wafer in which a plurality of quartz crystal vibrating elements are integrated and configured is used.

例えば、従来の水晶振動素子集合ウエハは、水晶基板からエッチングにより残された水晶ウエハから折り取り可能な複数の水晶素板と、支持部と、水晶素板とが支持部に連結されている第一の連結部及び第二の連結部と、を含み、この水晶素板の表面には第一電極、第二電極及び導配線パターンwが形成されており、この第一の連結部及び前記第二の連結部は、水晶素板の一対の長辺が延びる方向に沿って、水晶素板の一方の短辺から、それぞれ延長するように設けられ、 かつ第一の連結部の水晶素板との接続部には、一方の主面にのみ有底の溝が設けられ、第二の連結部の水晶素板との接続部には、他方の主面にのみ有底の溝が設けられている(例えば、特許文献1参照)。   For example, in a conventional quartz crystal vibrator assembly wafer, a plurality of quartz crystal substrates which can be broken away from the quartz crystal wafer left by etching from the quartz substrate, a support portion, and a quartz crystal substrate are connected to the support portion A first electrode, a second electrode, and a conductive wiring pattern w are formed on the surface of the quartz substrate, and the first connection portion and the second connection portion are formed. The two connecting portions are provided so as to extend respectively from one short side of the quartz plate along the direction in which the long sides of the quartz plate extend, and the quartz plate of the first connecting portion A groove with a bottom is provided only on one of the main surfaces in the connection portion, and a groove with a bottom is provided only on the other main surface in the connection portion between the second connection portion and the quartz substrate (See, for example, Patent Document 1).

特開2010−178320号公報JP, 2010-178320, A

従来のような複数の水晶振動素子が形成された水晶振動素子集合ウエハから、個々の水晶振動素子を分離する場合、水晶振動素子と水晶振動素子集合ウエハの枠部とを接続している連結部で折り取ることにより、水晶振動素子を水晶振動素子集合ウエハの枠部より分離する。しかし、この連結部の表面に水晶振動素子の特性測定に用いる金属膜からなる電極が形成されている場合、連結部にて水晶振動素子を折り取る際に、連結部は折れても、その表面に形成された電極を構成する金属の延性のため電極が繋がったままの状態となり、水晶振動素子が水晶振動素子集合ウエハの枠部から完全に分離できないおそれがあった。   In the case of separating individual crystal vibrating elements from a quartz crystal vibrating element aggregate wafer on which a plurality of quartz crystal vibrating elements are formed as in the prior art, a connecting portion connecting the quartz crystal vibrating element and the frame portion of the quartz crystal vibrating element aggregate wafer The quartz crystal vibrating element is separated from the frame portion of the quartz crystal vibrating element-aggregated wafer by breaking it at a position of However, when an electrode made of a metal film used to measure the characteristics of the crystal vibrating element is formed on the surface of the connecting portion, the surface of the connecting portion may be broken even if the connecting portion breaks. Due to the ductility of the metal forming the electrode, the electrodes remain connected and there is a possibility that the quartz crystal vibrating element can not be completely separated from the frame portion of the quartz crystal vibrating element-aggregated wafer.

よって、本発明は、連結部の表面に水晶振動素子の特性測定に用いる金属膜からなる電極が形成されている場合でも、確実に水晶振動素子を水晶振動素子集合ウエハの枠部から分離することができる水晶振動素子集合ウエハを提供することを目的とする。   Therefore, according to the present invention, even when an electrode made of a metal film used to measure the characteristics of the quartz crystal vibrating element is formed on the surface of the connecting portion, the quartz quartz crystal vibrating element can be reliably separated from the frame of the quartz quartz crystal vibrating element assembly wafer. It is an object of the present invention to provide a quartz crystal vibrating element-aggregated wafer capable of

本発明の水晶振動素子集合ウエハは、外周及び内周形状が平面視矩形で平板状の枠部と、この枠部により囲われた空間に複数個並べて配置され、表面に少なくとも第一電極及び第二電極が形成された平面視矩形で平板状の水晶振動素子と、枠部の内周の一辺と、個々の水晶振動素子の第二電極が設けられた一辺から延出するようにして繋がれた第一連結部と第二連結部と、この同じ水晶振動素子に設けられている第一連結部と第二連結部との間に設けられた貫通孔と、第二電極から第一連結部及び第二連結部の表面を経て枠部の表面まで延設した第三電極と、第一連結部の上面又は下面のどちらか一方に設けられた開口部を有する第一溝部と、第二連結部の第一溝部が設けられた面と同じ面に設けられた開口部を有する第二溝部と、第一連結部の第一溝部を挟むようにして設けられた第一狭窄部及び第二狭窄部と、第一連結部が設けられた同じ水晶振動素子に対し設けられている第二連結部側の第二狭窄部に設けられた第三溝部と、第二連結部の第二溝部を挟むようにして設けられた第三狭窄部及び第四狭窄部と、第二連結部が設けられた同じ水晶振動素子に対し設けられた第一連結部側の第四狭窄部に設けられた第四溝部と、を備えたことを特徴とする。   A plurality of quartz crystal vibrating element-aggregated wafers according to the present invention are arranged side by side in a space surrounded by a flat frame having a rectangular outer periphery and an inner periphery in plan view and at least a first electrode and a It is connected so as to extend from one side provided with a quartz vibration element having a rectangular shape in plan view in which two electrodes are formed, one side of the inner periphery of the frame and the second electrode of each crystal oscillation element. First connecting portion and second connecting portion, a through hole provided between the first connecting portion and the second connecting portion provided in the same crystal vibrating element, and a second electrode to the first connecting portion And a third electrode extending through the surface of the second connection portion to the surface of the frame, and a first groove portion having an opening provided on either the upper surface or the lower surface of the first connection portion, and a second connection A second groove having an opening provided on the same surface as the surface on which the first groove of the part is provided, and the first connection The first narrowing portion and the second narrowing portion provided so as to sandwich the first groove portion, and the second narrowing portion on the second connection portion side provided for the same quartz crystal vibrating element provided with the first connection portion Provided for the same crystal vibrating element provided with the third groove portion provided, the third narrow portion and the fourth narrow portion provided so as to sandwich the second groove portion of the second connection portion, and the second connection portion And a fourth groove portion provided in a fourth narrowed portion on the first connection portion side.

本発明の水晶振動素子集合ウエハは、外周及び内周形状が平面視矩形で平板状の枠部と、この枠部により囲われた空間に複数個並べて配置され、表面に少なくとも第一電極及び第二電極が形成された平面視矩形で平板状の水晶振動素子と、枠部の内周の一辺と、個々の水晶振動素子の第二電極が設けられた一辺から延出するようにして繋がれた第一連結部と第二連結部と、この同じ水晶振動素子に設けられている第一連結部と第二連結部との間に設けられた貫通孔と、第二電極から第一連結部及び第二連結部の表面を経て枠部の表面まで延設した第三電極と、第一連結部の上面又は下面のどちらか一方に設けられた開口部を有する第一溝部と、第二連結部の第一溝部が設けられた面と同じ面に設けられた開口部を有する第二溝部と、第一連結部の第一溝部を挟むようにして設けられた第一狭窄部と第二狭窄部と、第一連結部が設けられた同じ水晶振動素子に対し設けられている第二連結部側となる第二狭窄部に設けられた第三溝部と、第二連結部の第二溝部を挟むようにして設けられた第三狭窄部と第四狭窄部と、第二連結部が設けられた同じ水晶振動素子に対し設けられた第一連結部側となる第四狭窄部に設けられた第四溝部と、が設けられている。このような構成では、第一連結部及び第二連結部の第三電極の膜厚を一部薄く形成することができるため、確実に水晶振動素子を水晶振動素子集合ウエハから分離することが可能となる。   A plurality of quartz crystal vibrating element-aggregated wafers according to the present invention are arranged side by side in a space surrounded by a flat frame having a rectangular outer periphery and an inner periphery in plan view and at least a first electrode and a It is connected so as to extend from one side provided with a quartz vibration element having a rectangular shape in plan view in which two electrodes are formed, one side of the inner periphery of the frame and the second electrode of each crystal oscillation element. First connecting portion and second connecting portion, a through hole provided between the first connecting portion and the second connecting portion provided in the same crystal vibrating element, and a second electrode to the first connecting portion And a third electrode extending through the surface of the second connection portion to the surface of the frame, and a first groove portion having an opening provided on either the upper surface or the lower surface of the first connection portion, and a second connection A second groove having an opening provided on the same surface as the surface on which the first groove of the part is provided, and the first connection A second narrowed portion provided on the same quartz vibrating element provided with a first narrowed portion and a second narrowed portion sandwiching the first groove portion, and a first coupled portion provided Are provided for the same quartz crystal vibrating element provided with a third connecting portion and a third narrowing portion and a fourth narrowing portion provided so as to sandwich the second groove of the second connection portion. A fourth groove portion provided in a fourth narrowed portion on the side of the first connection portion is provided. In such a configuration, since the film thickness of the third electrode of the first connection portion and the second connection portion can be partially reduced, the crystal vibration element can be reliably separated from the crystal vibration element aggregate wafer It becomes.

本発明の実施形態に係る水晶振動素子集合ウエハを示した平面図である。It is the top view which showed the crystal | crystallization vibration element accumulation | aggregation | set wafer which concerns on embodiment of this invention. 図1に記載された円A部分を拡大して示した部分拡大図である。It is the elements on larger scale which expanded and showed the circle A part described in FIG. 図2に示したB−B線で切断した断面図である。It is sectional drawing cut | disconnected by the BB line shown in FIG. 本発明の実施形態に係る水晶振動素子集合ウエハの変形例において、図1に記載された円A部分と同じ箇所を拡大して示した部分拡大図である。FIG. 13 is a partially enlarged view showing, in an enlarged manner, the same portion as the circle A portion described in FIG. 1 in a modified example of the quartz crystal vibrating element group wafer according to the embodiment of the present invention.

以下に本発明の実施形態を、図面を参照しながら説明する。図1は、本発明の実施形態に係る水晶振動素子集合ウエハを示した平面図である。図2は、図1に記載された仮想円A部分を拡大して示した部分拡大図である。図3は、図2に記載された仮想切断線B−Bで切断したときの断面図である。尚、各図では、説明を明りょうとするため構造体の一部を図示せず、また寸法も一部誇張して図示している。特に、図3における断面の厚み方向は著しく誇張して図示している。また、説明を平易とするため、図1、2及び4では、図示されている面側を上方、反対側の面側を下方とし、図3では、図面が記載されている用紙上方を水晶振動素子集合ウエハの上方として記述する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a quartz crystal vibrating element assembly wafer according to an embodiment of the present invention. FIG. 2 is a partially enlarged view showing a virtual circle A portion shown in FIG. 1 in an enlarged manner. FIG. 3 is a cross-sectional view taken along the imaginary cutting line B-B described in FIG. In each of the drawings, a part of the structure is not shown for the sake of clarity, and the dimensions are also shown in a partially exaggerated manner. In particular, the thickness direction of the cross section in FIG. Further, in order to simplify the description, in FIGS. 1, 2 and 4, the illustrated side is the upper side, the opposite side is the lower side, and in FIG. Described as the upper side of the element assembly wafer.

水晶振動素子集合ウエハ100は、図1〜3に示すように、水晶振動素子110と、第一溝部121、第一狭窄部122、第二狭窄部123及び第三溝部124を備えた第一連結部120と、第二溝部131、第三狭窄部132、第四狭窄部133及び第四溝部134を備えた第二連結部130と、貫通孔140と、第三電極150と、枠部160から構成されている。水晶振動素子集合ウエハ100は、水晶振動子や水晶発振器等の水晶デバイスを製造する過程において、水晶デバイス内に搭載する水晶振動素子を同時に複数個製造するために用いられている。   As shown in FIGS. 1 to 3, the quartz crystal vibrating element assembly wafer 100 includes a quartz vibrating element 110, and a first connection including a first groove portion 121, a first narrowing portion 122, a second narrowing portion 123, and a third groove portion 124. From the second connecting portion 130 including the portion 120, the second groove portion 131, the third narrowed portion 132, the fourth narrowed portion 133, and the fourth groove portion 134, the through hole 140, the third electrode 150, and the frame portion 160 It is configured. In the process of manufacturing a quartz crystal device such as a quartz crystal resonator or a quartz oscillator, the quartz crystal vibrator assembly wafer 100 is used to simultaneously manufacture a plurality of quartz crystal devices mounted in the quartz crystal device.

水晶振動素子110は、水晶素板111の上面及び下面のそれぞれに、水晶素板の励振に用いる第一電極112と、第一電極112から水晶素板111の一方の短辺の引き出された第二電極113を被着させたものであり、安定した機械振動と圧電効果により、電子装置等の基準信号を発振する役割を果たしている。   The quartz crystal vibrating element 110 has a first electrode 112 used for exciting the quartz crystal plate on the upper surface and the lower surface of the quartz crystal plate 111, and a short side of the quartz substrate 111 drawn from the first electrode 112. Two electrodes 113 are deposited and play a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and piezoelectric effect.

水晶素板111は、平面視矩形状であり、例えば、X軸(電気軸)、Y軸(機械軸)、Z軸(光学軸)からなる直交座標系において、Z軸をY軸の−Y方向へ傾けた軸をZ’軸とし、Y軸をZ軸の+Z方向へ傾けた軸をY’軸としたとき、X軸方向を長辺としZ’軸方向を短辺とした平行な上下XZ’面で構成され、Y’軸に平行な方向を厚みとするATカットの薄板からなる。   The quartz crystal plate 111 has a rectangular shape in a plan view. For example, in an orthogonal coordinate system including an X axis (electric axis), a Y axis (mechanical axis), and a Z axis (optical axis), the Z axis is -Y of Y axis. Assuming that the axis tilted in the direction is Z 'axis and the Y axis is tilted in the + Z direction of Z axis is Y' axis, parallel upper and lower sides with X axis direction as long side and Z 'axis direction as short side It consists of a thin plate of AT cut which is constituted by the XZ ′ plane and whose thickness is in the direction parallel to the Y ′ axis.

第一電極112は、外部からの交番電圧が第一電極112を介して水晶素板111に印加されると、水晶素板111が所定の振動モード及び周波数で励振を起こすためのものである。第一電極112は、水晶素板111の上面及び下面のほぼ中央部分に、上面と下面との間で対向するように設けられている。   The first electrode 112 is for causing the quartz crystal substrate 111 to excite in a predetermined vibration mode and frequency when an alternating voltage from the outside is applied to the quartz crystal substrate 111 via the first electrode 112. The first electrode 112 is provided substantially at the center between the upper surface and the lower surface of the quartz crystal base plate 111 so as to face each other between the upper surface and the lower surface.

第二電極113は、それぞれの第一電極112へ外部からの交番電圧を伝えるためのものである。第二電極113は、水晶素板111の上面に設けられた第一電極112と下面に設けられた第一電極112のそれぞれから、水晶素板111の2つの短辺のうちの一方の短辺の縁部まで、w上面と下面との間で対向しないように延設されている。   The second electrode 113 is for transmitting an alternating voltage from the outside to each first electrode 112. The second electrode 113 is one of the short sides of the two short sides of the quartz crystal substrate 111 from each of the first electrode 112 provided on the upper surface of the quartz crystal substrate 111 and the first electrode 112 provided on the lower surface. It is extended so that it does not face between the upper surface and the lower surface to the edge of.

第一電極112及び第二電極113は、例えば、フォトリソグラフィー技術およびエッチング技術を用いて、水晶素板111の所定の位置に形成される。具体的には、複数の水晶素板111となる部分が形成されている水晶振動素子集合ウエハ100の両主面に、第一電極112及び第二電極113となる金属膜を成膜し、この金属膜上に感光性レジストを塗布する。その後、この感光性レジストの所定のパターン(第一電極112及び第二電極113となる部分)が残留するように、露光、現像する。最後に、露出している金属膜を剥離させ、残留している感光性レジストを除去する。このようにして、複数の水晶素板111となる部分が形成されている水晶振動素子集合ウエハ100の水晶素板111となる部分の所定の位置に、第一電極112及び第二電極113が形成される。なお、ここで、フォトリソグラフィー技術およびエッチング技術を用いて形成している場合について説明しているが、例えば、スパッタリング技術または蒸着技術を用いて形成してもよい。   The first electrode 112 and the second electrode 113 are formed at predetermined positions of the quartz substrate 111 using, for example, a photolithographic technique and an etching technique. Specifically, metal films to be the first electrode 112 and the second electrode 113 are formed on both main surfaces of the quartz crystal vibrating wafer, on which the portions to be the plurality of quartz element plates 111 are formed. A photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed such that a predetermined pattern of this photosensitive resist (portion to be the first electrode 112 and the second electrode 113) remains. Finally, the exposed metal film is peeled off to remove the remaining photosensitive resist. In this manner, the first electrode 112 and the second electrode 113 are formed at predetermined positions of the portion to be the quartz crystal substrate 111 of the quartz crystal vibrating element assembly wafer 100 in which the portions to be the plurality of quartz crystal substrates 111 are formed. Be done. Although the case of forming using photolithography technology and etching technology is described here, it may be formed using, for example, sputtering technology or vapor deposition technology.

また、第一電極112及び第二電極113は、クロムの上に、銀又は金が積層されるようにして形成されている。下地にクロムを用いることで、水晶素板111と第一電極112及び第二電極113との密着性を確保しつつ、金又は銀との密着性も確保することが可能となる。   In addition, the first electrode 112 and the second electrode 113 are formed such that silver or gold is laminated on chromium. By using chromium as a base, it is possible to secure the adhesion between the quartz crystal plate 111 and the first electrode 112 and the second electrode 113 while also ensuring the adhesion with gold or silver.

第一連結部120は、後述する第二連結部130と共に、水晶振動素子110と水晶振動素子集合ウエハ100の枠部160とを機械的に接続することにより、水晶振動素子110を後述する枠部160と共に支持するために用いる。第一連結部120は、水晶振動素子110の長さ方向となる二辺うちの一方の辺に沿って、水晶振動素子110の第二電極112が設けられた一短辺から、この一短辺に向かい合う枠部160にまで延びて設けられている。また第一連結部120は、水晶振動素子110及び枠部160と一体で形成されている。この第一連結部120には、第一溝部121と、第一狭窄部122と、第二狭窄部123と、第三溝部124が備えられている。   The first connecting portion 120 mechanically connects the quartz crystal vibrating element 110 and the frame portion 160 of the quartz crystal vibrating element assembly wafer 100 together with the second connecting portion 130 described later, thereby the quartz vibrating element 110 will be described later. Used to support with 160. The first connecting portion 120 extends from one short side of the quartz crystal vibrating element 110 along the one side of the two sides in the length direction of the quartz crystal vibrating element 110 from the one short side where the second electrode 112 is provided. Extending to the frame 160 facing the Further, the first connecting portion 120 is integrally formed with the crystal vibrating element 110 and the frame portion 160. The first connection portion 120 is provided with a first groove portion 121, a first narrowed portion 122, a second narrowed portion 123, and a third groove portion 124.

第一溝部121は、水晶振動素子110を第一連結部120から折り取り易くするためのものである。第一溝部121は、第一連結部120の上面又は下面のどちらか一方に開口部を備えた有底の溝部である。第一溝部121を設けることにより、第一連結部120の所定の部分のみの剛性を弱めることができ、第一連結部120において枠部160から水晶振動素子111を折り取る際に、その第一溝部121の部分で折り取ることによって、折り取る位置を任意にコントロールすることができる。   The first groove portion 121 is for making it easy to break the crystal vibrating element 110 from the first connection portion 120. The first groove portion 121 is a bottomed groove portion having an opening on one of the upper surface and the lower surface of the first connecting portion 120. By providing the first groove portion 121, the rigidity of only a predetermined portion of the first connection portion 120 can be weakened, and when breaking the quartz crystal vibrating element 111 from the frame portion 160 in the first connection portion 120, the first By cutting off at the groove portion 121, the position to be cut off can be arbitrarily controlled.

第一狭窄部122及び第二狭窄部123は、外部から衝撃などを第一狭窄部122と第二狭窄部123とに分散させて吸収することができ、第一連結部120全体の剛性を保持するために用いられている。第一狭窄部122及び第二狭窄部123は、第一連結部120において第一溝部121を挟むようにして、第一狭窄部122が水晶振動素子110の一方の長辺側に、第二狭窄部123が同じ水晶振動素子110に設けられた第二連結部130側となるように設けられている。第一狭窄部122及び第二狭窄部123の厚みは、水晶振動素子111及び枠部160の厚みと同じである。また、第一狭窄部122及び第二狭窄部123の厚みは、20〜70μmとなっている。   The first constriction portion 122 and the second constriction portion 123 can absorb and absorb an impact or the like from the outside into the first constriction portion 122 and the second constriction portion 123, and maintain the rigidity of the entire first connection portion 120 It is used to The first narrowing portion 122 and the second narrowing portion 123 sandwich the first groove portion 121 in the first connecting portion 120, and the first narrowing portion 122 is located on one long side of the quartz crystal vibrating element 110. Are provided on the same side as the second connecting portion 130 provided on the same crystal vibrating element 110. The thicknesses of the first narrowed portion 122 and the second narrowed portion 123 are the same as the thicknesses of the quartz crystal vibrating element 111 and the frame portion 160. Moreover, the thickness of the 1st constriction part 122 and the 2nd constriction part 123 is 20-70 micrometers.

第三溝部124は、水晶振動素子110を第一連結部120からさらに折り取り易くするためのものであり、折り取った後の水晶振動素子110にバリが付着することを低減させるためのものである。第三溝部124は、第二狭窄部123に有底で設けられている。第三溝部124の開口部は、第一溝部121の開口部が設けられている面と同じ面に設けられている。第三溝部124の深さは、図3に示すように、第一溝部121の深さと同じ又は第一溝部121の深さよりも深くなっている。尚、第三溝部124は、第一狭窄部122に設けられていても構わない。しかし、第三溝部124を第一狭窄部122に設けた場合、水晶振動素子110を折り取ってバリが生じたとき、そのバリは、第三溝部124を設けていない第二狭窄部123側である水晶振動素子110の一方の短辺中央付近に生じる可能性が高い。水晶振動素子110において、バリなどの外形異常による主振動モードへの悪影響の度合いは、各辺の中央部分に外形異常があるよりも各辺端部、つまり水晶振動素子の角部付近に外形異常があるほうが小さい。よって、第三溝部124は第一狭窄部122に設けるよりも第二狭窄部123に設けるほうが好ましい。また、第三溝部124を設ける位置は、可能な限り第二狭窄部123の水晶振動素子110側にオフセットした位置とすることが望ましい。   The third groove portion 124 is for making it easier to break the crystal vibrating element 110 from the first connection portion 120, and to reduce the adhesion of burrs to the quartz crystal vibrating element 110 after it is broken. is there. The third groove portion 124 is provided at the second narrowed portion 123 with a bottom. The opening of the third groove 124 is provided on the same surface as the surface on which the opening of the first groove 121 is provided. The depth of the third groove 124 is the same as the depth of the first groove 121 or deeper than the depth of the first groove 121, as shown in FIG. The third groove 124 may be provided in the first narrowed portion 122. However, when the third groove portion 124 is provided in the first narrowed portion 122, when the quartz crystal vibrating element 110 is broken to generate a burr, the burr is on the second narrowed portion 123 side where the third groove portion 124 is not provided. It is likely to occur near the center of one short side of a certain quartz crystal vibrating element 110. In the quartz crystal vibrating element 110, the degree of the adverse effect on the main vibration mode due to the outer shape abnormality such as burrs is the outer shape abnormality in each side end, that is, the corner portion of the quartz crystal vibrating element than the outer shape abnormality in the central portion of each side. There is a smaller one. Therefore, it is more preferable to provide the third groove 124 in the second narrowed portion 123 than in the first narrowed portion 122. Further, it is desirable that the position where the third groove portion 124 is provided be a position offset to the crystal vibrating element 110 side of the second narrowed portion 123 as much as possible.

第二連結部130は、前述した第一連結部120と共に、水晶振動素子110と水晶振動素子集合ウエハ100の枠部160とを機械的に接続することにより、水晶振動素子110を後述する枠部160と共に支持するために用いる。第二連結部130は、水晶振動素子110の長さ方向となる二辺うちの他方の辺に沿って、水晶振動素子110の第二電極113が設けられた一短辺から、この一短辺に向かい合う枠部160にまで延びて設けられている。また第二連結部130は、水晶振動素子110及び枠部160と一体で形成されている。この第二連結部130には、第二溝部131と、第三狭窄部132、第四狭窄部133と、第四溝部134が備えられている。   The second connecting portion 130 mechanically connects the crystal vibrating element 110 and the frame portion 160 of the crystal vibrating element-aggregated wafer 100 together with the first connecting portion 120 described above to form a frame portion to be described later. Used to support with 160. The second connecting portion 130 extends from one short side of the quartz crystal vibrating element 110 along the other side of the two sides in the length direction of the quartz crystal vibrating element 110 from the one short side provided with the second electrode 113. Extending to the frame 160 facing the The second connection portion 130 is integrally formed with the crystal vibrating element 110 and the frame portion 160. The second connection portion 130 is provided with a second groove portion 131, a third narrowed portion 132, a fourth narrowed portion 133, and a fourth groove portion 134.

第二溝部131は、水晶振動素子110を第二連結部130から折り取り易くするためのものである。第二溝部131は、第一溝部121の開口部が設けられた同じ上面又は下面のどちらか一方に開口部を備えた有底の溝部である。第二溝部131を設けることにより、第二連結部130の所定の部分のみの剛性を弱めることができ、第二連結部130において枠部160から水晶振動素子110を折り取る際に、その第二溝部131の部分で折り取ることにより、折り取る位置を任意にコントロールすることができる。   The second groove portion 131 is for making it easy to break off the crystal vibrating element 110 from the second connection portion 130. The second groove 131 is a bottomed groove having an opening on one of the same upper surface or lower surface where the opening of the first groove 121 is provided. By providing the second groove portion 131, the rigidity of only a predetermined portion of the second connection portion 130 can be weakened, and when the crystal vibrating element 110 is broken off from the frame portion 160 in the second connection portion 130, the second By folding at the groove portion 131, the position to be folded can be arbitrarily controlled.

第三狭窄部132及び第四狭窄部133は、外部から衝撃などを第三狭窄部132と第四狭窄部133とに分散させて吸収することができ、第二連結部130全体の剛性を保持するためのものである。第三狭窄部132及び第四溝部133は、第二連結部130において第二溝部131を挟むようにして、第三狭窄部132が水晶振動素子110の他方の長辺側に、第四狭窄部133が同じ水晶振動素子110に設けられた第一連結部120側となるように設けられている。第三狭窄部132及び第四狭窄部133の厚みは、水晶振動素子111及び枠部160の厚みと同じである。また、第三狭窄部132及び第四狭窄部133の厚みは、20〜70μmとなっている。   The third narrowed portion 132 and the fourth narrowed portion 133 can absorb and absorb an impact or the like from the outside into the third narrowed portion 132 and the fourth narrowed portion 133, and maintain the entire rigidity of the second connection portion 130. It is to do. The third narrowed portion 132 and the fourth groove portion 133 sandwich the second groove portion 131 in the second connection portion 130, and the third narrowed portion 132 is on the other long side of the quartz crystal element 110 and the fourth narrowed portion 133 is It is provided so as to be on the side of the first connecting portion 120 provided in the same quartz crystal vibrating element 110. The thicknesses of the third narrowed portion 132 and the fourth narrowed portion 133 are the same as the thicknesses of the quartz crystal vibrating element 111 and the frame portion 160. In addition, the thickness of the third narrowed portion 132 and the fourth narrowed portion 133 is 20 to 70 μm.

第四溝部134は、水晶振動素子110を第二連結部130からさらに折り取り易くするためのものであり、水晶振動素子110にバリが付着することを低減させるためのものである。第四溝部134は、第四狭窄部133に有底で設けられている。第四溝部134の開口部は、第二溝部131の開口部が設けられている面と同じ面に設けられている。第四溝部134の深さは、図3に示すように、第二溝部131の深さと同じ又は第二溝部131の深さよりも深くなっている。尚、第四溝部134は、第三狭窄部132に設けられていても構わない。しかし、第四溝部134を第三狭窄部132に設けた場合、水晶振動素子110を折り取ってバリが生じたとき、そのバリは、第四溝部134を設けていない第四狭窄部133側である水晶振動素子110の一方の短辺中央付近に生じる可能性が高い。水晶振動素子110において、バリなどの外形異常による主振動モードへの悪影響の度合いは、各辺の中央部分に外形異常があるよりも各辺端部、つまり水晶振動素子の角部付近に外形異常があるほうが小さい。よって、第四溝部134は第三狭窄部132に設けるよりも第四狭窄部133に設けるほうが好ましい。また、第四溝部134を設ける位置は、可能な限り第四狭窄部133の水晶振動素子110側にオフセットした位置とすることが望ましい。   The fourth groove portion 134 is for making it easier to break the crystal vibrating element 110 from the second connection portion 130, and to reduce the adhesion of burrs to the crystal vibrating element 110. The fourth groove portion 134 is provided at the fourth narrowed portion 133 with a bottom. The opening of the fourth groove 134 is provided on the same surface as the surface on which the opening of the second groove 131 is provided. The depth of the fourth groove 134 is the same as the depth of the second groove 131 or deeper than the depth of the second groove 131, as shown in FIG. The fourth groove portion 134 may be provided in the third narrowed portion 132. However, in the case where the fourth groove portion 134 is provided in the third narrowed portion 132, when the quartz crystal vibrating element 110 is broken to generate burrs, the burrs are on the fourth narrowed portion 133 side where the fourth groove portion 134 is not provided. It is likely to occur near the center of one short side of a certain quartz crystal vibrating element 110. In the quartz crystal vibrating element 110, the degree of the adverse effect on the main vibration mode due to the outer shape abnormality such as burrs is the outer shape abnormality in each side end, that is, the corner portion of the quartz crystal vibrating element than the outer shape abnormality in the central portion of each side. There is a smaller one. Therefore, it is more preferable to provide the fourth groove portion 134 in the fourth narrowed portion 133 than in the third narrowed portion 132. In addition, it is desirable that the position where the fourth groove portion 134 is provided be a position offset to the side of the crystal vibrating element 110 of the fourth narrowed portion 133 as much as possible.

第三溝部124が第二狭窄部123の水晶振動素子110側にオフセットした位置に設けられており、第四溝部134が第四狭窄部133の水晶振動素子110側にオフセットした位置に設けられている。このような構成により、水晶振動素子110を水晶振動素子集合ウエハ100より第三溝部124及び第四溝部134が形成された位置で分離した場合、第一連結部120及び第二連結部130の大部分を水晶振動素子集合ウエハ100の枠部160側に残した状態、つまり水晶振動素子110には第一連結部120及び第二連結部130が付属していない所望する外形形状の水晶振動素子110を得ることができる。このように折り取り後の水晶振動素子110にバリが形成されることを抑えることができるので、水晶振動素子110を振動させたときに発生する不正外形による不要振動モードの影響を抑制することが可能となる。また、水晶振動素子110を基板に実装する際に、バリが基板に接触することを抑えることができるため、水晶振動素子110が傾いて実装されることを低減することができる。   The third groove portion 124 is provided at a position offset to the crystal vibrating element 110 side of the second narrowed portion 123, and the fourth groove portion 134 is provided at a position offset to the crystal vibrating element 110 side of the fourth narrowed portion 133 There is. With such a configuration, when the quartz crystal vibrating element 110 is separated from the quartz crystal vibrating element collecting wafer 100 at the position where the third groove 124 and the fourth groove 134 are formed, the sizes of the first connecting portion 120 and the second connecting portion 130 are large. In a state in which the portion is left on the frame portion 160 side of the quartz crystal vibrating element assembly wafer 100, that is, the quartz vibrating element 110 having a desired outer shape without the first connecting portion 120 and the second connecting portion 130 attached to the quartz vibrating element 110. You can get As described above, since it is possible to suppress the formation of burrs on the quartz crystal vibrating element 110 after being broken, it is possible to suppress the influence of the unnecessary vibration mode due to the incorrect outer shape generated when the quartz crystal vibrating element 110 is vibrated. It becomes possible. Further, since the burr can be prevented from contacting the substrate when the crystal vibrating device 110 is mounted on the substrate, it is possible to reduce the mounting of the crystal vibrating device 110 by tilting.

第一連結部120と第二連結部130の間には貫通孔140が設けられている。貫通孔140は水晶振動素子集合ウエハ100の上面から下面に貫通する孔であり、第一連結部120と第二連結部130は、この貫通孔140を挟んで対称となるように構成されている。   A through hole 140 is provided between the first connection portion 120 and the second connection portion 130. The through hole 140 is a hole penetrating from the upper surface to the lower surface of the quartz-crystal vibrating device aggregate wafer 100, and the first connecting portion 120 and the second connecting portion 130 are configured to be symmetrical with the through hole 140 interposed therebetween. .

枠部160は、水晶からなる薄板で、水晶振動素子集合ウエハ100全体の剛性を保持しつつ、第一連結部120及び第二連結部130が設けられた水晶振動素子110を複数個支持するためのものである。枠部160は、外枠161と桟部162とからなり、第一連結部120及び第二連結部130が設けられた複数の水晶振動素子110と一体で構成されている。この外枠161と桟部162とからなる枠部160の内周形状も矩形状となっている。   The frame portion 160 is a thin plate made of quartz, and supports a plurality of quartz vibrating elements 110 provided with the first connecting portion 120 and the second connecting portion 130 while maintaining the rigidity of the whole quartz vibrating element aggregate wafer 100. belongs to. The frame portion 160 includes an outer frame 161 and a bar portion 162, and is integrally configured with a plurality of crystal vibrating elements 110 in which the first connecting portion 120 and the second connecting portion 130 are provided. The inner peripheral shape of the frame portion 160 consisting of the outer frame 161 and the crosspieces 162 is also rectangular.

外枠161は、水晶振動素子集合ウエハ100全体の四方を囲うように設けられている。平面視の外周形状は矩形状であり、必要とする剛性を有するための所定の幅を有する。桟部162は、外枠161の内周の対向する二辺を繋ぐように設けられており、一定の間隔を開けて平行して複数個設けられている。   The outer frame 161 is provided to surround the four sides of the entire quartz crystal vibrating element assembly wafer 100. The outer peripheral shape in plan view is rectangular and has a predetermined width to have the required rigidity. The bar portions 162 are provided so as to connect two opposing sides of the inner periphery of the outer frame 161, and a plurality of bar portions 162 are provided in parallel at regular intervals.

第一連結部120及び第二連結部130が設けられた水晶振動素子110は、外枠161の内周と桟部162によって形成された空間内に、隣り合う水晶振動素子110の長辺が平行となるように同じ向きで複数個並べて配置されている。また、それぞれの水晶振動素子110に設けられた第一連結部120及び第二連結部130は、第一連結部120及び第二連結部130の水晶振動素子110側端部とは反対側の端部が、その端部と対向して位置する桟部162又は外枠161の内周と接続している。   In the quartz crystal vibrating element 110 provided with the first connecting part 120 and the second connecting part 130, the long sides of the adjacent quartz vibrating elements 110 are parallel in the space formed by the inner periphery of the outer frame 161 and the crosspieces 162. It is arranged side by side in the same direction so that In addition, the first connection portion 120 and the second connection portion 130 provided in each of the quartz crystal vibrating elements 110 are the ends of the first connecting portion 120 and the second coupling portion 130 on the opposite side to the crystal vibrating element 110 side end. The part is connected to the inner periphery of the crosspiece 162 or the outer frame 161 located opposite to the end.

第三電極150は、水晶振動素子集合ウエハ100の状態で個々の水晶振動子110の周波数或いはCI(クリスタルインピーダンス)等の特性値を測定するための端子として用いられる。第三電極150は、複数の水晶振動素子110が水晶振動素子集合ウエハ100内に配置接続された状態において、それぞれの水晶振動素子110に設けられた第二電極113から、第一連結部120及び第二連結部130の表面を経て、その第一連結部120及び第二連結部130が接続している外枠161及び桟部162の表面まで延設されている。第三溝部124及び第四溝部134の内部に形成される第三電極150の厚みは、第一連結部120又は第二連結部130の他の部分に形成される第三電極150の厚みに比べ非常に薄く形成されている。また、第一溝部121及び第二溝部131の内部に形成される第三電極150の厚みも、第三溝部124及び第四溝部134の内部に形成される第三電極150を除く第一連結部120又は第二連結部130の他の部分に形成される第三電極150の厚みに比べ薄く形成されている。   The third electrode 150 is used as a terminal for measuring a characteristic value such as the frequency or CI (crystal impedance) of each quartz vibrator 110 in the state of the quartz crystal vibrating element assembly wafer 100. The third electrode 150 is connected to the first connecting portion 120 from the second electrode 113 provided on each of the quartz crystal vibrating elements 110 in a state where the plurality of quartz crystal vibrating elements 110 are disposed and connected in the quartz crystal vibrating element aggregate wafer 100. Through the surface of the second connection portion 130, the first connection portion 120 and the second connection portion 130 are extended to the surfaces of the outer frame 161 and the cross portion 162 which are connected. The thickness of the third electrode 150 formed inside the third groove 124 and the fourth groove 134 is the same as the thickness of the third electrode 150 formed in the other portion of the first connecting portion 120 or the second connecting portion 130. It is very thin. In addition, the thickness of the third electrode 150 formed inside the first groove 121 and the second groove 131 is also the first connecting portion excluding the third electrode 150 formed inside the third groove 124 and the fourth groove 134. The thickness of the third electrode 150 is smaller than the thickness of the third electrode 150 formed on the second connection portion 130 or the second connection portion 130.

第三電極150は、例えば、フォトリソグラフィー技術およびエッチング技術を用いて、第一電極112及び第二電極113と同時に、第一連結部120、第二連結部130及び枠部160の所定の位置に形成される。具体的には、複数の水晶素板111となる部分が形成されている水晶振動素子集合ウエハ100の両主面に、第一電極112及び第二電極113と共に第三電極150となる金属膜を成膜し、この金属膜上に感光性レジストを塗布する。その後、この感光性レジストの所定のパターン(第一電極112、第二電極113及び第三電極150となる部分)が残留するように、露光、現像する。最後に、露出している金属膜を剥離させ、残留している感光性レジストを除去する。このようにして、水晶振動素子集合ウエハ100の第一連結部120、第二連結部130及び枠部160となる部分の所定の位置に、第三電極150が形成される。なお、ここで、フォトリソグラフィー技術およびエッチング技術を用いて形成している場合について説明しているが、例えば、スパッタリング技術または蒸着技術を用いて形成してもよい。   The third electrode 150 is formed at a predetermined position of the first connecting portion 120, the second connecting portion 130, and the frame 160 simultaneously with the first electrode 112 and the second electrode 113 using, for example, a photolithographic technique and an etching technique. It is formed. Specifically, metal films to be the third electrode 150 together with the first electrode 112 and the second electrode 113 are formed on both main surfaces of the quartz crystal vibrating element assembly wafer 100 in which the portions to be the plurality of quartz element plates 111 are formed. A film is formed, and a photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed such that a predetermined pattern of the photosensitive resist (portions to be the first electrode 112, the second electrode 113, and the third electrode 150) remains. Finally, the exposed metal film is peeled off to remove the remaining photosensitive resist. Thus, the third electrode 150 is formed at a predetermined position of the portion to be the first connecting portion 120, the second connecting portion 130, and the frame portion 160 of the quartz crystal vibrating element assembly wafer 100. Although the case of forming using photolithography technology and etching technology is described here, it may be formed using, for example, sputtering technology or vapor deposition technology.

また、第三電極150は、クロムの上に、銀又は金が積層されるようにして形成されている。下地にクロムを用いることで、第一連結部120、第二連結部130及び枠部160と第三電極150との密着性を確保しつつ、金又は銀との密着性も確保することが可能となる。   In addition, the third electrode 150 is formed so that silver or gold is laminated on chromium. By using chromium as a base, it is possible to secure adhesion between gold and silver while securing adhesion between the first connection portion 120, the second connection portion 130 and the frame portion 160 and the third electrode 150. It becomes.

本発明の実施形態に係る水晶振動素子集合ウエハ100は、外周及び内周形状が平面視矩形で平板状の枠部160と、この枠部160により囲われた空間に複数個並べて配置され、表面に少なくとも第一電極112及び第二電極113が形成された平面視矩形で平板状の水晶振動素子110と、枠部160の内周の一辺と、個々の水晶振動素子110の第二電極113が設けられた一辺から延出するようにして繋がれた第一連結部120と第二連結部130と、この同じ水晶振動素子110に設けられている第一連結部120と第二連結部130との間に設けられた貫通孔140と、第二電極113から第一連結部120及び第二連結部130の表面を経て枠部160の表面まで延設した第三電極150と、第一連結部120の上面又は下面のどちらか一方に設けられた開口部を有する第一溝部121と、第二連結部130の第一溝部121が設けられた面と同じ面に設けられた開口部を有する第二溝部131と、第一連結部120の第一溝部121を挟むようにして設けられた第一狭窄部122と第二狭窄部123と、第一連結部120が設けられた同じ水晶振動素子110に対し設けられている第二連結部130側となる第二狭窄部123に設けられた第三溝部124と、第二連結部130の第二溝部131を挟むようにして設けられた第三狭窄部132と第四狭窄部133と、第二連結部130が設けられた同じ水晶振動素子110に対し設けられた第一連結部120側となる第四狭窄部133に設けられた第四溝部134と、が設けられている。   A plurality of quartz crystal vibrating element assembly wafers 100 according to the embodiment of the present invention are arranged side by side in a space surrounded by a flat frame portion 160 whose outer and inner circumferential shapes are rectangular in plan view, and the frame portion 160. The quartz vibrating element 110 having a rectangular planar shape and a rectangular shape in plan view in which at least the first electrode 112 and the second electrode 113 are formed, one side of the inner periphery of the frame 160, and the second electrode 113 of each quartz vibrating element 110 The first connecting portion 120 and the second connecting portion 130 connected so as to extend from the provided one side, and the first connecting portion 120 and the second connecting portion 130 provided in the same crystal vibrating element 110 , A third electrode 150 extending from the second electrode 113 to the surface of the frame 160 through the surfaces of the first connecting portion 120 and the second connecting portion 130, and a first connecting portion Top or bottom of 120 A first groove 121 having an opening provided in one of the two, and a second groove 131 having an opening provided on the same surface as the surface provided with the first groove 121 of the second connection 130; The first narrowing portion 122 and the second narrowing portion 123 provided so as to sandwich the first groove portion 121 of the one connection portion 120, and the second provided for the same crystal vibrating element 110 in which the first connection portion 120 is provided A third groove portion 124 provided in the second narrowed portion 123 on the connecting portion 130 side, and a third narrowed portion 132 and a fourth narrowed portion 133 provided so as to sandwich the second groove portion 131 of the second connected portion 130; A fourth groove portion 134 provided in a fourth narrowed portion 133 on the side of the first connection portion 120 provided to the same quartz crystal vibrating element 110 in which the second connection portion 130 is provided is provided.

このような構成により、蒸着法及びスパッタリングにより設けられた第三溝部124及び第四溝部134の内部の第三電極150を構成する金属の量は、マスキングによる第三溝部124及び第四溝部134の側面側への金属のまわり込みが少なくなる影響で、第一連結部120及び第二連結部130の他の部分より付着する金属量が少なく、第三電極150の膜厚を薄くすることができる。従って、この第三溝部124及び第四溝部134が形成されている位置で第一連結部120及び第二連結部130を折り取った場合、第三電極150の膜厚が薄いので、その表面に形成された第三電極150が金属の延性の影響を著しく小さくすることができ、第一連結部120及び第二連結部130とその表面に形成された第三電極150とを同時に折り取ることが可能となる。   With such a configuration, the amount of metal constituting the third electrode 150 in the third groove 124 and the fourth groove 134 provided by the vapor deposition method and sputtering is equal to that of the third groove 124 and the fourth groove 134 by masking. The amount of metal attached is smaller than that of the other portions of the first connection portion 120 and the second connection portion 130 due to the effect of reducing the entrapment of metal on the side surface side, and the film thickness of the third electrode 150 can be reduced. . Therefore, when the first connecting portion 120 and the second connecting portion 130 are broken at the position where the third groove portion 124 and the fourth groove portion 134 are formed, the third electrode 150 has a thin film thickness, so The formed third electrode 150 can significantly reduce the influence of the ductility of the metal, and simultaneously breaking the first connection portion 120 and the second connection portion 130 and the third electrode 150 formed on the surface thereof. It becomes possible.

また、本発明の実施形態に係る水晶振動素子集合ウエハ100は、枠部160を構成する外枠161と桟部162によって、水晶振動素子110を内部に配置する空間を囲う枠部160が複数個隣接するようにして設けられている。このような構成により、水晶振動素子ウエハ100を大型化した場合でも、ウエハ全体の剛性を維持したまま多数の水晶振動素子110を内部に配置することができる。   Further, in the quartz crystal vibrating element aggregate wafer 100 according to the embodiment of the present invention, a plurality of the frame portions 160 enclosing the space in which the quartz crystal vibrating elements 110 are disposed inside by the outer frame 161 and the crosspieces 162 constituting the frame portion 160. It is provided so as to be adjacent. With such a configuration, even when the size of the quartz crystal vibrating element wafer 100 is increased, it is possible to dispose a large number of quartz vibrating elements 110 while maintaining the rigidity of the entire wafer.

また、本発明の実施形態に係る水晶振動素子集合ウエハ100において、第三溝部124が第二狭窄部123の水晶振動素子110側にオフセットした位置に設けられており、第四溝部134が第四狭窄部133の水晶振動素子110側にオフセットした位置に設けられている。このような構成により、水晶振動素子110を水晶振動素子集合ウエハ100より第三溝部124及び第四溝部134が形成された位置で分離した場合、第一連結部120及び第二連結部130の大部分を水晶振動素子集合ウエハ100の枠部160側に残した状態、つまり水晶振動素子110には第一連結部120及び第二連結部130が付属していない所望する外形形状の水晶振動素子110を得ることができる。よって、水晶振動素子110を振動させたときに発生する不正外形による不要振動モードの影響を抑制することが可能となる。   Further, in the crystal vibrating element collective wafer 100 according to the embodiment of the present invention, the third groove portion 124 is provided at a position offset to the crystal vibrating element 110 side of the second narrowed portion 123, and the fourth groove portion 134 is fourth It is provided at a position offset to the quartz crystal vibrating element 110 side of the narrowed portion 133. With such a configuration, when the quartz crystal vibrating element 110 is separated from the quartz crystal vibrating element collecting wafer 100 at the position where the third groove 124 and the fourth groove 134 are formed, the sizes of the first connecting portion 120 and the second connecting portion 130 are large. In a state in which the portion is left on the frame portion 160 side of the quartz crystal vibrating element assembly wafer 100, that is, the quartz vibrating element 110 having a desired outer shape without the first connecting portion 120 and the second connecting portion 130 attached to the quartz vibrating element 110. You can get Therefore, it becomes possible to suppress the influence of the unnecessary vibration mode due to the incorrect external shape generated when the quartz crystal vibrating element 110 is vibrated.

また、本発明の実施形態に係る水晶振動素子集合ウエハ100において、第三溝部124の深さが第一溝部121の深さに比べて深くなっており、且つ第四溝部134の深さが第二溝部131の深さに比べて深くなっている。このような構成により、第一連結部120のうち第三溝部124の部分が最も剛性を弱くでき、又第二連結部130のうち第四溝部134の部分が最も剛性を弱くできる。また、第三溝部124及び第四溝部134のおける水晶振動素子110を折り取る際に、マスキングによる第三溝部124及び第四溝部134の第三電極150の金属の側面側へのまわり込みが更に少なくなり、第一連結部120及び第二連結部130の他の部分より付着する金属量が著しく少なく、第三電極150の膜厚を非常に薄くすることができる。従って、この第三溝部124及び第四溝部134が形成されている位置で第一連結部120及び第二連結部130を折り取った場合、第三溝部124及び第三溝部124の厚み、更に第三電極150の膜厚が非常に薄いので、その表面に形成された第三電極150が金属の延性の影響を著しく小さくすることができ、第一連結部120及び第二連結部130とその表面に形成された第三電極150とを同時に折り取ることが容易となる。   Further, in the quartz crystal vibrating wafer according to the embodiment of the present invention, the depth of the third groove 124 is deeper than the depth of the first groove 121, and the depth of the fourth groove 134 is It is deeper than the depth of the two groove portion 131. With such a configuration, the rigidity of the portion of the third groove 124 in the first connection portion 120 can be the weakest, and the rigidity of the portion of the fourth groove 134 in the second connection portion 130 can be the weakest. Further, when the quartz crystal vibrating element 110 in the third groove portion 124 and the fourth groove portion 134 is broken, wrapping of the third groove portion 124 and the fourth groove portion 134 to the metal side of the third electrode 150 is further caused by masking. Thus, the amount of metal to be attached is significantly smaller than that of the first connection portion 120 and the other portions of the second connection portion 130, and the film thickness of the third electrode 150 can be made extremely thin. Therefore, when the first connecting portion 120 and the second connecting portion 130 are broken at the position where the third groove portion 124 and the fourth groove portion 134 are formed, the thickness of the third groove portion 124 and the third groove portion 124 Since the film thickness of the third electrode 150 is very thin, the third electrode 150 formed on the surface can significantly reduce the influence of the ductility of the metal, and the first connecting portion 120 and the second connecting portion 130 and the surface thereof At the same time, it is easy to break off the third electrode 150 formed on the

(変形例)
図4は、前述した実施形態の変形例に係る水晶振動素子集合ウエハを、図1に記載の仮想円Aと同じ箇所を示した部分拡大図である。また、前述した実施形態の変形例に係る水晶振動素子集合ウエハ100は、第一連結部120の外側の一辺が水晶振動素子110の一方の長辺の延長線上に位置するように設けられており、第二連結部130の外側の一辺が、水晶振動素子110の他方の長辺の延長線上に位置するように設けられている点において前述した実施形態と異なる。
(Modification)
FIG. 4 is a partially enlarged view showing a quartz crystal vibrating element assembly wafer according to a modification of the embodiment described above, in the same place as the imaginary circle A shown in FIG. In addition, the crystal vibrating element collective wafer 100 according to the modification of the embodiment described above is provided such that one side outside the first connecting portion 120 is positioned on the extension of one long side of the crystal vibrating element 110. The second embodiment is different from the above-described embodiment in that one side outside the second connection portion 130 is provided on the extension of the other long side of the crystal vibrating element 110.

このような構成により、水晶振動素子110を折り取った際に、仮に第一連結部120又は第二連結部130の一部が水晶振動素子110に付属した状態となったとしても、その付属する位置が水晶振動素子110の振動モードに影響が少ない角部付近のみとなる。よって、折り取った水晶振動素子110は所望する振動モードでのみ振動することが可能となる。   With such a configuration, even when a portion of the first connection portion 120 or the second connection portion 130 is attached to the quartz crystal vibrating element 110 when the quartz crystal vibrating element 110 is broken, it is attached. The position is only near the corner where the vibration mode of the quartz crystal element 110 is less affected. Therefore, the broken crystal vibrating element 110 can vibrate only in a desired vibration mode.

また、本発明は上述の各実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。例えば、前述した実施形態においては、水晶振動素子110はATカットで平面視矩形の外形形状であったが、他のカットアングルで加工されたものであっても良い。また、外形形状も、音叉形状などの他の外形形状の水晶振動素子でも構わない。   The present invention is not limited to the above-described embodiments, and various changes, improvements, and the like can be made without departing from the scope of the present invention. For example, in the embodiment described above, the quartz crystal vibrating element 110 is AT-cut and has a rectangular outer shape in plan view, but may be processed at another cut angle. Also, the external shape may be a crystal vibrating element having another external shape such as a tuning fork shape.

100・・・水晶振動素子集合ウエハ
110・・・水晶振動素子
111・・・水晶素板
112・・・第一電極
113・・・第二電極
120・・・第一連結部
121・・・第一溝部
122・・・第一狭窄部
123・・・第二狭窄部
124・・・第三溝部
130・・・第二連結部
131・・・第二溝部
132・・・第三狭窄部
133・・・第四狭窄部
134・・・第四溝部
140・・・貫通孔
150・・・第三電極
160・・・枠部
161・・・外枠
162・・・桟部
100 ... crystal vibration element assembly wafer 110 ... crystal vibration element 111 ... crystal base plate 112 ... first electrode 113 ... second electrode 120 ... first connection portion 121 ... first First groove portion 122 ··· First narrowed portion 123 ··· Second narrowed portion 124 ··· Third groove portion 130 ··· Second connecting portion 131 ··· Second groove portion 132 ··· Third narrowed portion 133 · · · · · Fourth narrowed portion 134 · · · fourth groove portion 140 · · · through hole 150 · · · third electrode 160 · · · frame portion 161 · · · outer frame 162 · · ·

Claims (4)

外周及び内周形状が平面視矩形で平板状の枠部と、
前記枠部により囲われた空間に複数個並べて配置され、表面に少なくとも第一電極及び第二電極が形成された平面視矩形で平板状の水晶振動素子と、
前記枠部の内周の一辺と、個々の前記水晶振動素子の前記第二電極が設けられた一辺から延出するようにして繋がれた第一連結部と第二連結部と、
同じ前記水晶振動素子に設けられている前記第一連結部と前記第二連結部との間に設けられた貫通孔と、
前記第二電極から前記第一連結部及び前記第二連結部の表面を経て前記枠部の表面まで延設した第三電極と、
前記第一連結部の上面又は下面のどちらか一方に設けられた開口部を有する第一溝部と、前記第二連結部の前記第一溝部が設けられた面と同じ面に設けられた開口部を有する第二溝部と、
前記第一連結部の前記第一溝部を挟むようにして設けられた第一狭窄部及び第二狭窄部と、
前記第一連結部に設けられた狭窄部に設けられた第三溝部と、
前記第二連結部の前記第二溝部を挟むようにして設けられた第三狭窄部と第四狭窄部と、前記第二連結部が設けられた狭窄部に設けられた第四溝部と、
を備え
前記第三溝部は、前記第二狭窄部の水晶振動素子側にオフセットした位置に設けられており、
前記第四溝部は前記第四狭窄部の水晶振動素子側にオフセットした位置に設けられていることを特徴とする水晶振動素子集合ウエハ。
The outer frame and the inner frame are rectangular in plan view and have a flat frame-like frame portion,
A quartz vibrating element having a rectangular shape in a plan view, arranged in a plurality and arranged in a space surrounded by the frame portion and having at least a first electrode and a second electrode formed on the surface;
A first connecting portion and a second connecting portion connected so as to extend from one side of the inner periphery of the frame portion and one side where the second electrode of each of the quartz crystal vibrating elements is provided;
A through hole provided between the first connection portion and the second connection portion provided in the same quartz crystal vibrating element;
A third electrode extending from the second electrode to the surface of the frame through the surfaces of the first connecting portion and the second connecting portion;
An opening provided on the same surface as a first groove having an opening provided on either the upper surface or the lower surface of the first connecting part, and the surface provided with the first groove on the second connecting part A second groove having
A first narrowed portion and a second narrowed portion provided so as to sandwich the first groove portion of the first connection portion;
A third groove portion provided in a narrowed portion provided in the first connection portion;
A third narrowed portion and a fourth narrowed portion provided so as to sandwich the second groove portion of the second connection portion, and a fourth groove portion provided in the narrowed portion provided with the second connection portion;
Equipped with
The third groove portion is provided at a position offset to the crystal vibrating element side of the second narrowed portion,
The wafer having the fourth groove portion is provided at a position offset to the crystal vibrating element side of the fourth narrowed portion .
外周及び内周形状が平面視矩形で平板状の枠部と、The outer frame and the inner frame are rectangular in plan view and have a flat frame-like frame portion,
前記枠部により囲われた空間に複数個並べて配置され、表面に少なくとも第一電極及び第二電極が形成された平面視矩形で平板状の水晶振動素子と、A quartz vibrating element having a rectangular shape in a plan view, arranged in a plurality and arranged in a space surrounded by the frame portion and having at least a first electrode and a second electrode formed on the surface;
前記枠部の内周の一辺と、個々の前記水晶振動素子の前記第二電極が設けられた一辺から延出するようにして繋がれた第一連結部と第二連結部と、A first connecting portion and a second connecting portion connected so as to extend from one side of the inner periphery of the frame portion and one side where the second electrode of each of the quartz crystal vibrating elements is provided;
同じ前記水晶振動素子に設けられている前記第一連結部と前記第二連結部との間に設けられた貫通孔と、A through hole provided between the first connection portion and the second connection portion provided in the same quartz crystal vibrating element;
前記第二電極から前記第一連結部及び前記第二連結部の表面を経て前記枠部の表面まで延設した第三電極と、A third electrode extending from the second electrode to the surface of the frame through the surfaces of the first connecting portion and the second connecting portion;
前記第一連結部の上面又は下面のどちらか一方に設けられた開口部を有する第一溝部と、前記第二連結部の前記第一溝部が設けられた面と同じ面に設けられた開口部を有する第二溝部と、An opening provided on the same surface as a first groove having an opening provided on either the upper surface or the lower surface of the first connecting part, and the surface provided with the first groove on the second connecting part A second groove having
前記第一連結部の前記第一溝部を挟むようにして設けられた第一狭窄部及び第二狭窄部と、A first narrowed portion and a second narrowed portion provided so as to sandwich the first groove portion of the first connection portion;
前記第一連結部に設けられた狭窄部に設けられた第三溝部と、A third groove portion provided in a narrowed portion provided in the first connection portion;
前記第二連結部の前記第二溝部を挟むようにして設けられた第三狭窄部と第四狭窄部と、前記第二連結部が設けられた狭窄部に設けられた第四溝部と、A third narrowed portion and a fourth narrowed portion provided so as to sandwich the second groove portion of the second connection portion, and a fourth groove portion provided in the narrowed portion provided with the second connection portion;
を備え、Equipped with
前記第三溝部の深さが前記第一溝部の深さに比べて深くなっており、且つ前記第四溝部の深さが前記第二溝部の深さに比べて深くなっていることを特徴とする水晶振動素子集合ウエハ。The depth of the third groove is deeper than the depth of the first groove, and the depth of the fourth groove is deeper than the depth of the second groove. Quartz crystal vibrator assembly wafer.
前記枠部が外枠と桟部とから構成されており、前記外枠の内側に、前記外枠と前記桟部により囲われた前記空間が複数個隣接するようにして設けられていることを特徴とする請求項1または2に記載された水晶振動素子集合ウエハ。 The frame is composed of an outer frame and a crosspiece, and a plurality of spaces surrounded by the outer frame and the crosspiece are provided adjacent to each other inside the outer frame. The quartz crystal vibrator assembly wafer according to claim 1 or 2 , characterized in that: 前記第一連結部の外側の一辺が前記水晶振動素子の一方の長辺の延長線上に位置するように設けられており、前記第二連結部の外側の一辺が、前記水晶振動素子の他方の長辺の延長線上に位置するように設けられていることを特徴とする請求項1乃至3に記載された水晶振動素子集合ウエハ。 One side of the outside of the first connecting portion is provided on an extension of one long side of the crystal vibrating element, and one side of the outside of the second connecting portion is the other side of the crystal vibrating element. crystal vibrating element set wafer according to claim 1 to 3, characterized in that are provided so as to be positioned on the extension of the long sides.
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