WO2018143006A1 - Quartz oscillation plate wafer and quartz oscillation plate thereof - Google Patents

Quartz oscillation plate wafer and quartz oscillation plate thereof Download PDF

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Publication number
WO2018143006A1
WO2018143006A1 PCT/JP2018/001930 JP2018001930W WO2018143006A1 WO 2018143006 A1 WO2018143006 A1 WO 2018143006A1 JP 2018001930 W JP2018001930 W JP 2018001930W WO 2018143006 A1 WO2018143006 A1 WO 2018143006A1
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crystal
quartz
diaphragm
corner
portions
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PCT/JP2018/001930
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French (fr)
Japanese (ja)
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幸田　直樹
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株式会社大真空
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Priority to JP2018566074A priority Critical patent/JP6888635B2/en
Publication of WO2018143006A1 publication Critical patent/WO2018143006A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Definitions

  • the present invention relates to a quartz crystal vibrating plate used for a quartz crystal vibrating device and a quartz vibrating plate wafer as an aggregate of a plurality of quartz vibrating plates.
  • crystal resonator devices such as crystal resonators and crystal filters are required to cope with higher frequencies and smaller packages.
  • quartz crystal devices that support such high frequencies and miniaturization, a group of quartz crystal plates that are supported by a support via a connecting part by means of photolithography and wet etching in the manufacturing process.
  • a wafer configured as a body is created, and a quartz crystal diaphragm is separated into pieces by folding the wafer from the connecting portion (see, for example, Patent Document 1).
  • the etching speed varies depending on the crystal axis (direction of the quartz plate).
  • a new axis shifted from the Y axis by ⁇ ° is referred to as a Y ′ axis.
  • the fastest wet etching rate is Z ′> + X> ⁇ X> Y ′, and the etching rate varies depending on each crystal axis.
  • the connecting portions of the quartz crystal plates and the side walls of the quartz crystal plates in the quartz crystal wafer constituted by wet etching have different inclination angles depending on the crystal axes, so that the strength at the connecting portions often varies. That is, when the strength of the connecting portion is weakened, the crystal diaphragm may fall off the crystal diaphragm wafer during production. On the other hand, if the strength of the connecting portion is too strong, when the quartz diaphragms are broken from the quartz diaphragm wafer and separated into individual pieces, appearance defects such as chipping of the quartz diaphragm and generation of burrs may be caused. It was.
  • the present invention has been made in view of the above-described problems, and suppresses variation in strength at the connection portion of each crystal diaphragm in the crystal diaphragm wafer so that the crystal diaphragm is not unnecessarily dropped and is easy.
  • An object of the present invention is to provide a quartz diaphragm wafer that can be broken into individual pieces. It is another object of the present invention to provide a crystal diaphragm with less chipping and burrs.
  • the crystal diaphragm wafer according to the present invention is an AT-cut crystal diaphragm wafer in which a plurality of crystal diaphragms are respectively connected to a support portion extending along an arrangement direction of the plurality of crystal diaphragms.
  • Each of the plurality of crystal diaphragms has a rectangular shape in a plan view composed of a side along the X axis which is a crystal axis of an AT cut crystal and a side along the Z ′ axis
  • the support portion includes a plurality of base portions projecting toward the quartz crystal diaphragm side at regular intervals along the arrangement direction, and each of the plurality of base portions has two first corner portions along the arrangement direction, respectively.
  • Two corners on both ends of one side of the quartz-crystal diaphragm having a rectangular shape in plan view on the side close to the support portion are defined as second corner portions,
  • the first corners of the two bases adjacent to each other along the arrangement direction are coupled to the first corners facing each other between the two bases, and the two second corners of the crystal diaphragm, respectively, and Of the two first corners of the base, one first corner is connected to the second corner of one of the two crystal diaphragms adjacent in the arrangement direction.
  • the other first corner is connected to the second corner of the other of the two adjacent quartz diaphragms.
  • the first corner of the base projecting from the support portion extending along the arrangement direction of the plurality of quartz plates to the quartz plate, and the second corner of the quartz plate
  • the corners are connected to each other, for example, compared to a configuration in which the crystal diaphragms are connected over a certain region along one side, the influence due to the difference in etching rate or the like is reduced. Variations in strength can be suppressed.
  • the crystal diaphragm wafer according to the present invention it is possible to suppress variation in strength at the connecting portion, and therefore, it is possible to reduce the crystal diaphragm from dropping from the crystal diaphragm wafer during production. Furthermore, even when the quartz diaphragm is broken off from the quartz diaphragm wafer, it can be easily broken at the corners to suppress the occurrence of chipping and burrs, thereby reducing the appearance defects. Can do.
  • first corner portion of the base portion and the second corner portion of the quartz crystal diaphragm are connected at the apex portions thereof.
  • the first corner portion of the base portion has a first taper portion that becomes gradually thinner toward a peripheral end
  • the second corner portion of the crystal diaphragm is a second portion that becomes gradually thinner toward the peripheral end.
  • the first corner portion of the base portion and the second corner portion of the quartz crystal diaphragm are connected by a thin portion between the first taper portion and the second taper portion. Is preferred.
  • the first corner portion of the base portion and the second corner portion of the crystal diaphragm are connected by a thin portion between the first taper portion and the second taper portion. Therefore, when the quartz diaphragm is folded from the quartz diaphragm wafer, the thin portion between the first taper portion and the second taper portion can be easily broken.
  • the shape of the base portion protruding from the support portion toward the crystal diaphragm side is a rectangular shape in plan view, and two corner portions on both ends of one side of the protruding end side are the first corner portions. .
  • the first corner portion of the base portion having a rectangular shape in plan view and the second corner portion of the quartz crystal plate having a rectangular shape in plan view are connected to each other at right-angled corner portions.
  • the quartz diaphragm When the quartz diaphragm is folded, it can be more easily broken at the connecting portion between the right-angled corners.
  • the quartz crystal plate according to the present invention is a quartz plate having a rectangular shape in a plan view composed of a side along the X axis that is an AT cut and a side along the Z ′ axis.
  • the peripheral portion of the crystal diaphragm includes a tapered portion formed gradually thinner toward each side of the rectangular shape, At the two corners of one side of the rectangular shape, the tapered portion formed gradually thinner toward the one side and the tapered portion formed gradually thinner toward the adjacent side adjacent to the one side.
  • the corners on both sides of one side of the quartz plate having a rectangular shape in a plan view are tapered portions that are gradually thinned toward the one side, and adjacent sides that are adjacent to the one side.
  • the tapered portion formed gradually thinner toward the surface is a discontinuous surface that becomes discontinuous, and the discontinuous surface at the corners at both ends of this side is obtained by folding the crystal vibration plate from the crystal vibration plate wafer. It is a fracture surface at the time of dividing into pieces. In this way, the fracture surface that is broken at the corner where the tapered portion that is thin toward each side intersects is compared with the fracture surface of the quartz diaphragm that is broken at the side of the rectangular shape. Generation of burrs is suppressed.
  • apex portions of the two corners at both ends of the one side are the discontinuous surfaces.
  • the discontinuous surface which is a fracture surface when the crystal diaphragm is broken from the crystal diaphragm wafer into pieces, is the apex portion of the corner portion. Since the crystal diaphragm can be easily broken off from the crystal diaphragm wafer, generation of chipping and burrs can be further suppressed.
  • the tapered portion includes a first inclined surface inclined toward one side of the rectangular shape from one main surface side of the crystal diaphragm, and each side of the rectangular shape from the other main surface side of the crystal diaphragm.
  • Each of the first inclined surface and each one end of the second inclined surface of the tapered portion formed gradually thinner toward the one side. It is preferable that the first inclined surface and each one end of the second inclined surface of the taper portion that are gradually formed thinner toward the adjacent side are partitioned.
  • the first inclined surface and the second inclined surface that form the tapered portion that becomes thinner toward one side of the rectangular crystal diaphragm in plan view, and the thinner toward the adjacent side adjacent to the one side.
  • each of the first inclined surface and the second inclined surface of the one side caused by breakage
  • a discontinuous surface that is a quadrangular fracture surface is defined by one end and each end generated by the breakage of the first inclined surface and the second inclined surface of the adjacent side.
  • the discontinuous surface is preferably recessed.
  • the discontinuous surface which is a fracture surface when the quartz crystal plate is broken from the quartz plate wafer and separated into pieces, becomes a fractured surface without a recessed burr.
  • the base portion of the crystal diaphragm wafer and each of the plurality of crystal diaphragms are coupled to each other at the corners, and thus, for example, coupled over a certain region along one side of the crystal diaphragm.
  • the quartz diaphragm is broken from the quartz diaphragm wafer to be separated into pieces, it can be easily broken at the corners to suppress chipping and burrs.
  • the discontinuous surface that is the fracture surface is a portion of the rectangle side.
  • the generation of chipping and burrs is suppressed.
  • FIG. 1 is a plan view showing a schematic configuration of a part of a quartz diaphragm wafer according to an embodiment of the present invention.
  • FIG. 2 is an enlarged view of a portion surrounded by a broken line in FIG.
  • FIG. 3 is a sectional view taken along line AA in FIG.
  • FIG. 4 is a plan view showing a schematic configuration of a crystal diaphragm according to an embodiment of the present invention.
  • FIG. 5 is a partial perspective view showing an enlarged portion viewed from the direction B of FIG.
  • FIG. 1 is a plan view showing a schematic configuration of a part of a quartz crystal wafer according to an embodiment of the present invention
  • FIG. 2 is an enlarged view of a portion surrounded by a broken line in FIG.
  • FIG. 3 is a sectional view taken along line AA in FIG.
  • the crystal diaphragm wafer 100 of this embodiment is a rectangular assembly in a plan view in which a plurality of crystal diaphragms 10 serving as piezoelectric substrates are arranged in a matrix and integrated.
  • the crystal diaphragm wafer 100 includes a plurality of crystal diaphragms 10 having a rectangular shape in a plan view with an AT cut composed of a side along the X-axis that is a crystal axis of crystal and a side along the Z′-axis.
  • a plurality of (three in FIG. 1) support portions 111 that extend in parallel with each other along the Z ′ axis, which is the arrangement direction of the vibration plates 10 (the vertical direction in FIG. 1), and respectively support the plurality of crystal vibration plates 10.
  • a frame portion 112 extending along the X-axis that is a direction orthogonal to the arrangement direction (the left-right direction in FIG. 1) and connecting the plurality of support portions 111.
  • the AT cut is an angle of 35 ° around the X axis with respect to the Z axis among the electric axis (X axis), the mechanical axis (Y axis), and the optical axis (Z axis), which are the three crystal axes of artificial quartz.
  • This is a processing method of cutting at an angle inclined by 15 '.
  • the X axis coincides with the crystal axis of the quartz crystal.
  • the Y′-axis and the Z′-axis coincide with the axes inclined by 35 ° 15 ′ from the Y-axis and Z-axis of the crystal axis of the quartz crystal.
  • the Y′-axis direction and the Z′-axis direction correspond to the cutting direction when cutting the AT-cut crystal diaphragm 10.
  • Each of the plurality of support portions 111 of the quartz plate wafer 100 includes a plurality of base portions 113 that protrude toward the quartz plate 10 at regular intervals along the Z ′ axis that is the arrangement direction.
  • Each base 113 protrudes in a rectangular shape in plan view, except for the bases 113 at both ends in the arrangement direction that are connected to the frame part 112.
  • the first side 115 on the protruding end side of the base 113 extends along the Z ′ axis, and has two first corners 113a and 113b at both ends of the first side 115, respectively.
  • a second side 116 and a third side 117 adjacent to both ends of the first side 115 are orthogonal to the first side 115 and extend along the X axis.
  • the plurality of base portions 113 are adjacent to two base portions 113 and 113 (for example, base portions 113 1 and 113 2 adjacent to a portion surrounded by a broken line in FIG. 1) along the Z ′ axis that is the arrangement direction of the crystal diaphragm 10. ) Of the opposite sides of the base portions 113 and 113 (113 1 , 113 2 ) are corner portions at both ends of the first side 11 (to be described later) of each crystal diaphragm 10. The two corner portions 11a and 11b are connected to each other at the vertex portion.
  • One first corner 113a of the two first corners 113a, 113b at both ends of the first side 115 of each base 113 is adjacent along the Z ′ axis.
  • Connected to the second corner portion 11b of one of the quartz crystal plates 10 (10 1 ) of the two matched quartz plates 10, 10 (the quartz plate 10 1 , 10 2 adjacent to the portion surrounded by the broken line in FIG.
  • the other first corner 113b is connected to the second corner 11a of the other quartz crystal plate 10 (10 2 ).
  • the quartz plate 10 is not supported between the base portions 113 adjacent to each other along the Z′-axis and the periphery except for the second corner portions 11 a and 11 b of the quartz plate 10.
  • a through region 400 is formed.
  • the first corners 113a and 113b of the base 113 protruding from the support part 111 toward the quartz diaphragm 10 and the second corners 11a and 11b of the quartz diaphragm 10 are corners. Because they are connected, for example, compared to a structure that is connected over a certain area along one side of the quartz diaphragm, the influence of the difference in etching rate can be reduced, and variations in strength at the connecting part are suppressed. can do. Thereby, for example, it is possible to reduce the crystal diaphragm 10 from dropping from the crystal diaphragm wafer 100 during the production due to the strength at the connecting portion being too weak.
  • each base 113 protruding from the support 111 toward the quartz diaphragm 10 is relatively large, for example, the impact transmitted from the support 111 to the quartz diaphragm 10 is compared even when an impact such as dropping is applied. It can be relaxed with a large base 113.
  • one base plate 113 is supported by two base portions 113 and 113 adjacent to each other along the arrangement direction of the crystal plate 10, and each base portion 113 has two of the first corner portions 113 a and 113 b.
  • the one first corner 113a supports one crystal diaphragm 10 of the two adjacent quartz diaphragms 10 and 10, and the other first corner 113b supports the other crystal diaphragm 10.
  • the stress transmitted from the support portion 111 to the crystal diaphragm 10 can be dispersed to the two adjacent crystal diaphragms 10 by the respective base portions 113 to suppress the concentration of stress on one crystal diaphragm 10. .
  • each base portion 113 has a first taper portion 114 that gradually becomes thin so that the crystal surface is exposed toward the peripheral end.
  • the first tapered portion 114 has a first inclined surface 114 a inclined from the surface side of the base portion 113 toward the peripheral end, and an inclination from the back surface side of the base portion 113 toward the peripheral end.
  • the second inclined surface 114b is inclined surfaces (crystal surfaces) that naturally occur due to a difference in the etching rate of the crystal axis of the crystal when the crystal is wet-etched with a fluorinated etchant.
  • FIG. 4 is a plan view showing a schematic configuration of the crystal diaphragm 10 that is broken off from the crystal diaphragm wafer 100 as described below.
  • the quartz diaphragm 10 is AT-cut and has a rectangular parallelepiped shape in plan view, and is configured such that the long side is parallel to the X axis and the short side is parallel to the Z ′ axis.
  • the crystal diaphragm 10 having a rectangular shape in plan view includes the first side 11 which is the short side close to the support portion 111 of the crystal diaphragm wafer 100 and a fourth side 14 which is parallel to the first side 11. And a second side 12 and a third side 13 which are long sides adjacent to the first side 11, respectively.
  • the second corner portions 11a and 11b which are the corners at both ends of the first side 11 of the quartz diaphragm 10, are shown in FIG. 100 adjacent base portions 113 (113 1 ) and 113 (113 2 ) are respectively connected to the first corner portions 113b and 113a on the opposite side.
  • the crystal diaphragm 10 of the present embodiment is a so-called inverted mesa structure that supports high frequency.
  • a concave portion having a rectangular shape in plan view is formed at the center of both main surfaces of the crystal diaphragm 10.
  • the quartz diaphragm 10 connects a thin vibrating portion 21 at the center of the plate surface, a thick outer frame portion 22 formed on the outer periphery of the vibrating portion 21, and the periphery of the vibrating portion 21 and the outer frame portion 22. And a stepped wall 23.
  • a first excitation electrode 31 is formed in the vicinity of the inner center of the concave portion on the surface that is one main surface of the quartz crystal plate 10, and in the vicinity of the inner center of the concave portion on the back surface that is the other main surface of the quartz crystal plate 10.
  • the second excitation electrode 32 is formed.
  • the first excitation electrode 31 and the second excitation electrode 32 are routed from the vibrating portion 21 through the step wall 23 by the first extraction electrode 33 and the second extraction electrode 34 to be electromechanically joined to an external electrode (not shown).
  • each of the outer frame portions 22 is extended to a part.
  • the first extraction electrode 33 extends the first excitation electrode 31 through the outer frame portion 22 of the crystal diaphragm 10 only in the vicinity of the second corner portion 11a which is one end portion of the first side 11. That is, the first extraction electrode 33 extends to one corner 11 a of the two second corners 11 a and 11 b at both ends of the first side 11.
  • the second extraction electrode 34 extends the second excitation electrode 32 only through the outer frame portion 22 of the crystal diaphragm 10 and in the vicinity of the second corner portion 11b which is the other end portion of the first side 11. That is, the second extraction electrode 34 extends to one corner 11b of the two second corners 11a and 11b at both ends of the first side 11.
  • the peripheral portion of the quartz crystal plate 10 includes a tapered portion 15 that is gradually formed so that the quartz crystal surface is exposed toward the sides 11 to 14 that are rectangular in plan view.
  • each tapered portion 15 includes a first inclined surface 15a inclined from the surface side of the quartz crystal plate 10 toward the sides 11 to 14, and each side from the back side of the crystal plate 10.
  • the inclined surfaces 15a and 15b are inclined surfaces (crystal surfaces) that naturally occur due to a difference in the etching rate of the crystal axis of the crystal when the crystal is wet-etched with a fluorinated etchant.
  • the second corners 11b and 11a at both ends of the first side 11 are connected to each other.
  • valley portions 201 and 202 that are thin are formed on the front and back surfaces at the boundary between the portions (second tapered portions) 15 and 15, respectively.
  • the valley portions 201 and 202 are formed at the apex portions of the first corner portions 113a and 113b of the base portions 113 and 113 and the second corner portions 11b and 11a of the crystal diaphragm 10, respectively.
  • the first tapered portion 114 of each base portion 113 and each tapered portion 15 of the crystal diaphragm 10 are connected by the thin portion near the valley portions 201 and 202.
  • the valleys 201 and 202 are the thinnest areas and are weaker in mechanical strength than the surrounding areas. Therefore, when the quartz diaphragm 10 is folded from the quartz diaphragm wafer 100, the valleys 201 and 202 are formed. It is broken along 202.
  • the first taper portions 114 and 114 of the first corner portions 113a and 113b of the base portions 113 and the second corner portions 11b of both ends of the first side 11 of the quartz crystal plate 10 are provided.
  • a plurality of crystal diaphragms 10 are obtained by being folded at the valley portions 201 and 202 that are thin at the boundary between the taper portions 15 and 15 of 11a.
  • the obtained quartz diaphragm 10 is broken at the thin valley portions 201 and 202 so that the second corner portions 11 a and 11 b at both ends of the first side 11 are tapered portions 15 of the first side 11. And the inclined surfaces of the tapered portions 15 and 15 of the second side 12 and the third side 13 adjacent to the first side 11 are discontinuous surfaces 16a, 16b.
  • FIG. 5 showing an enlarged view of the portion viewed from the B direction in FIG. 4 representatively shows the discontinuous surface 16a of one second corner portion 11a among the discontinuous surfaces 16a and 16b.
  • the discontinuous surface 16a shown in FIG. 5 is a portion where the tapered portion 15 of the first side 11 and the tapered portion 15 of the second side 12 adjacent to the first side 11 intersect.
  • the discontinuous surface 16 a includes the first inclined surfaces 15 a and the second inclined surfaces (15 b) of the tapered portion 15 on the first side 11, and the first ends of the tapered portions 15 on the second side 12.
  • Each of the inclined surfaces 15a and the second inclined surfaces (15b) has a substantially parallelogram shape defined by the respective one ends 15ae and (15be). In FIG. 5, only one end 15ae of the first inclined surface 15a inclined from the surface side of the crystal diaphragm 10 toward the sides 11 and 12 is shown.
  • the discontinuous surface 16b of the other second corner portion 11b is the same as the discontinuous surface 16a of the one second corner portion 11a.
  • the first taper portions 114 and 114 of the first corner portions 113a and 113b of the respective base portions 113 of the crystal vibration plate wafer 100 and the second corner portions 11b and 11a at both ends of the first side 11 of the crystal vibration plate 10 are used. Since it is broken off at the valley portions 201 and 202 at the boundary between the taper portions 15 and 15, stress can be concentrated on the valley portions 201 and 202 and easily broken at the valley portions 201 and 202. it can.
  • the troughs 201 and 202 are completely broken, and the first corners of the sides 11 to 13 around the second corners 11a and 11b, which are the ends of the quartz diaphragm 10, and the ends of the base 113 are provided. It is possible to suppress the breakage from unnecessarily spreading to the sides 115 to 117 around the portions 113a and 113b.
  • the discontinuous surfaces 16a and 16b of the second corner portions 11a and 11b of the quartz crystal plate 10 have a fractured surface that is recessed inward, and a fractured surface without burr.
  • the quartz diaphragm 10 configured as described above is housed in a package body (not shown), and after necessary electromechanical connection is made by a conductive bonding material such as a conductive resin adhesive, a metal bump, or a brazing material.
  • a conductive bonding material such as a conductive resin adhesive, a metal bump, or a brazing material.
  • the quartz vibration device is completed by hermetically sealing.
  • the discontinuous surfaces 16 a and 16 b which are fracture surfaces of the second corner portions 11 a and 11 b can be used as marks indicating the direction of the separated quartz diaphragm 10.
  • the extraction electrode when an extraction electrode for routing the front and back surfaces of the crystal diaphragm 10 is formed on the discontinuous surfaces 16a and 16b, the extraction electrode can be configured so that disconnection hardly occurs.
  • the conductive resin adhesive tends to creep up at the discontinuous surfaces 16a and 16b, and the rising portion of the conductive resin adhesive
  • the crystal diaphragm 10 can be stably connected, and the adhesive strength can be obtained.
  • the quartz diaphragm 10 of the present embodiment discloses a so-called bi-inverted mesa shape in which concave portions are formed on the front and back main surfaces of the quartz diaphragm, but a plano-inverted mesa shape may be used. It may be of a shape or can be applied to a mesa shape.
  • the present invention is not limited to the above-described crystal resonator, but can be applied to crystal vibration devices such as a crystal filter and a crystal oscillator.

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  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

In this AT-cut quartz oscillation plate wafer, two corners of each of a plurality of base parts which project, toward quartz oscillation plates, from a support part extending along the arrangement direction of the quartz oscillation plates are respectively connected to two corners of the corresponding quartz oscillation plate. Each of the crystal vibration plates is supported by two base parts adjacent to each other in the arrangement direction.

Description

水晶振動板ウエハとその水晶振動板Quartz diaphragm wafer and quartz diaphragm
　本発明は、水晶振動デバイスに用いる水晶振動板と、複数の水晶振動板の集合体としての水晶振動板のウエハに関する。 The present invention relates to a quartz crystal vibrating plate used for a quartz crystal vibrating device and a quartz vibrating plate wafer as an aggregate of a plurality of quartz vibrating plates.
　近年、各種電子機器の動作周波数の高周波化や、パッケージの小型化が進んでいる。そのような高周波化やパッケージの小型化に伴なって、例えば水晶振動子や水晶フィルタ等の水晶振動デバイスも高周波化やパッケージの小型化への対応が求められている。 In recent years, the operating frequency of various electronic devices has been increased and the size of packages has been reduced. With such higher frequency and smaller packages, for example, crystal resonator devices such as crystal resonators and crystal filters are required to cope with higher frequencies and smaller packages.
　このような高周波化や小型化に対応した水晶振動デバイスの中には、製造過程において、フォトリソグラフィーとウェットエッチングなどの手法により、水晶振動板が連結部を介して支持体に複数支持された集合体として構成されたウエハが作成され、前記連結部から折り取ることで水晶振動板が個片化されるものがある（例えば、特許文献１参照）。 Among quartz crystal devices that support such high frequencies and miniaturization, a group of quartz crystal plates that are supported by a support via a connecting part by means of photolithography and wet etching in the manufacturing process. A wafer configured as a body is created, and a quartz crystal diaphragm is separated into pieces by folding the wafer from the connecting portion (see, for example, Patent Document 1).
特開２００８－０９２５０５号公報JP 2008-092505 A
　しかし、上述したような水晶振動板が複数支持された集合体からなる水晶振動板ウエハを、ウェットエッチングにより構成する場合、結晶軸（水晶振動板の方向）によってエッチングされる速度が異なる。例えば、ＡＴカット水晶振動板の場合、Ｚ軸からθ°（＝３５°１５′）ずれた新たな軸をＺ´軸と称し、Ｙ軸からθ°ずれた新たな軸をＹ´軸と称している。この時のウェットエッチングされる速度の早い順番は、Ｚ´＞＋Ｘ＞－Ｘ＞Ｙ´となり、エッチングされる速度が各結晶軸により異なる。 However, when a quartz crystal wafer including a plurality of quartz crystal plates as described above is formed by wet etching, the etching speed varies depending on the crystal axis (direction of the quartz plate). For example, in the case of an AT-cut quartz diaphragm, a new axis shifted by θ ° (= 35 ° 15 ′) from the Z axis is referred to as a Z ′ axis, and a new axis shifted from the Y axis by θ ° is referred to as a Y ′ axis. ing. At this time, the fastest wet etching rate is Z ′> + X> −X> Y ′, and the etching rate varies depending on each crystal axis.
　このため、ウェットエッチングにより構成される水晶振動ウエハにおける各水晶振動板の連結部や水晶振動板の側壁は、結晶軸によって傾斜角度が異なるので、連結部における強度がばらつくことが多かった。つまり、連結部の強度が弱くなると、水晶振動板が生産途中で水晶振動板ウエハから脱落することがあった。逆に、連結部の強度が強すぎると、各水晶振動板を水晶振動板ウエハから折り取って個片化した際に、水晶振動板のチッピングやバリの発生などの外観不良を招くことがあった。 For this reason, the connecting portions of the quartz crystal plates and the side walls of the quartz crystal plates in the quartz crystal wafer constituted by wet etching have different inclination angles depending on the crystal axes, so that the strength at the connecting portions often varies. That is, when the strength of the connecting portion is weakened, the crystal diaphragm may fall off the crystal diaphragm wafer during production. On the other hand, if the strength of the connecting portion is too strong, when the quartz diaphragms are broken from the quartz diaphragm wafer and separated into individual pieces, appearance defects such as chipping of the quartz diaphragm and generation of burrs may be caused. It was.
　このように従来ではウェットエッチングによるエッチングレートの違いによって、水晶振動板ウエハにおける各水晶振動板の連結部における強度がばらつきやすいという問題点があった。 Thus, conventionally, there has been a problem that the strength at the connecting portion of each crystal diaphragm in the crystal diaphragm wafer tends to vary due to the difference in the etching rate by wet etching.
　本発明は、上記課題に鑑みてなされたものであって、水晶振動板ウエハにおける各水晶振動板の連結部における強度のばらつきを抑制して、水晶振動板が不要に脱落することなく、かつ容易に折り取って個片化することが可能な水晶振動板ウエハを提供することを目的とする。また、チッピングやバリの発生の少ない水晶振動板を提供することを目的とする。 The present invention has been made in view of the above-described problems, and suppresses variation in strength at the connection portion of each crystal diaphragm in the crystal diaphragm wafer so that the crystal diaphragm is not unnecessarily dropped and is easy. An object of the present invention is to provide a quartz diaphragm wafer that can be broken into individual pieces. It is another object of the present invention to provide a crystal diaphragm with less chipping and burrs.
　本発明では、上記目的を達成するために、次のように構成している。 In the present invention, in order to achieve the above object, the following configuration is provided.
　すなわち、本発明に係る水晶振動板ウエハは、複数の水晶振動板が、前記複数の水晶振動板の配列方向に沿って延びる支持部にそれぞれ連結されたＡＴカットの水晶振動板のウエハであって、
　前記複数の各水晶振動板は、ＡＴカットの水晶の結晶軸であるＸ軸に沿った辺とＺ´軸に沿った辺とから構成された平面視矩形状であり、
　前記支持部は、前記配列方向に沿って一定間隔で前記水晶振動板側へ突出する複数の基部を備え、複数の各基部は、前記配列方向に沿って２つの第１角部をそれぞれ有し、
　前記平面視矩形の前記水晶振動板の前記支持部に近接する側の一辺の両端の２つの角部を第２角部とし、
　前記配列方向に沿って隣合う２つの前記基部の、前記２つの基部間で対向する側の第１角部と、前記水晶振動板の２つの前記第２角部とがそれぞれ連結され、かつ、前記基部の２つの第１角部の内、一方の第１角部は、前記配列方向に沿って隣合う２つの前記水晶振動板の内の一方の水晶振動板の前記第２角部に連結され、他方の第１角部は、前記隣合う２つの前記水晶振動板の内の他方の水晶振動板の前記第２角部に連結されている。 That is, the crystal diaphragm wafer according to the present invention is an AT-cut crystal diaphragm wafer in which a plurality of crystal diaphragms are respectively connected to a support portion extending along an arrangement direction of the plurality of crystal diaphragms. ,
Each of the plurality of crystal diaphragms has a rectangular shape in a plan view composed of a side along the X axis which is a crystal axis of an AT cut crystal and a side along the Z ′ axis,
The support portion includes a plurality of base portions projecting toward the quartz crystal diaphragm side at regular intervals along the arrangement direction, and each of the plurality of base portions has two first corner portions along the arrangement direction, respectively. ,
Two corners on both ends of one side of the quartz-crystal diaphragm having a rectangular shape in plan view on the side close to the support portion are defined as second corner portions,
The first corners of the two bases adjacent to each other along the arrangement direction are coupled to the first corners facing each other between the two bases, and the two second corners of the crystal diaphragm, respectively, and Of the two first corners of the base, one first corner is connected to the second corner of one of the two crystal diaphragms adjacent in the arrangement direction. The other first corner is connected to the second corner of the other of the two adjacent quartz diaphragms.
　本発明に係る水晶振動板ウエハによると、複数の水晶振動板の配列方向に沿って延びる支持部から水晶振動板側へ突出する基部の第１角部と、水晶振動板の第２角部とが、角部同士で連結されているので、例えば、水晶振動板の一辺に沿って一定領域に亘って連結される構成に比べて、エッチングレートの相違等による影響を低減して、連結部における強度のばらつきを抑制することができる。また、水晶振動板ウエハから水晶振動板を折り取る際に、角部に応力が集中し、容易に破断できると共に、角部のみで破断が完結し、破断が周囲に広がるのを抑制することができる。 According to the quartz crystal wafer according to the present invention, the first corner of the base projecting from the support portion extending along the arrangement direction of the plurality of quartz plates to the quartz plate, and the second corner of the quartz plate However, since the corners are connected to each other, for example, compared to a configuration in which the crystal diaphragms are connected over a certain region along one side, the influence due to the difference in etching rate or the like is reduced. Variations in strength can be suppressed. Also, when folding the quartz diaphragm from the quartz diaphragm wafer, stress concentrates on the corners and can be easily broken, and it is possible to suppress breakage from being completed only at the corners and spreading to the surroundings. it can.
　つまり、本発明に係る水晶振動板ウエハによれば、連結部における強度のばらつきを抑制することがきるので、水晶振動板が生産途中で水晶振動板ウエハから脱落するのを低減することができる。更に、水晶振動板ウエハから水晶振動板を折り取って個片化する際にも角部で容易に破断して、チッピングやバリの発生を抑えることができ、外観不良を招くのを低減することができる。 That is, according to the crystal diaphragm wafer according to the present invention, it is possible to suppress variation in strength at the connecting portion, and therefore, it is possible to reduce the crystal diaphragm from dropping from the crystal diaphragm wafer during production. Furthermore, even when the quartz diaphragm is broken off from the quartz diaphragm wafer, it can be easily broken at the corners to suppress the occurrence of chipping and burrs, thereby reducing the appearance defects. Can do.
　前記基部の前記第１角部と前記水晶振動板の前記第２角部とは、その頂点部分同士で連結されているのが好ましい。 It is preferable that the first corner portion of the base portion and the second corner portion of the quartz crystal diaphragm are connected at the apex portions thereof.
　この構成によれば、支持部から水晶振動板側へ突出する基部の第１角部と、水晶振動板の第２角部とが、角部の頂点部分同士で連結されているので、水晶振動板ウエハから水晶振動板を折り取る際に、角部の頂点部分に応力が集中し、一層容易に破断できると共に、破断を頂点部分の狭い領域で完結させることができる。 According to this configuration, since the first corner of the base projecting from the support portion toward the quartz diaphragm and the second corner of the quartz diaphragm are connected to each other at the apex of the corner, When the quartz diaphragm is folded from the plate wafer, the stress concentrates on the apex portion of the corner portion and can be broken more easily, and the break can be completed in a narrow region of the apex portion.
　前記基部の前記第１角部は、周端に向かって次第に薄肉となる第１テーパ部を有し、前記水晶振動板の前記第２角部は、周端に向かって次第に薄肉となる第２テーパ部を有し、前記基部の前記第１角部と前記水晶振動板の前記第２角部とは、前記第１テーパ部と前記第２テーパ部との間の薄肉部分で連結されているのが好ましい。 The first corner portion of the base portion has a first taper portion that becomes gradually thinner toward a peripheral end, and the second corner portion of the crystal diaphragm is a second portion that becomes gradually thinner toward the peripheral end. The first corner portion of the base portion and the second corner portion of the quartz crystal diaphragm are connected by a thin portion between the first taper portion and the second taper portion. Is preferred.
　この構成によれば、前記基部の前記第１角部と前記水晶振動板の前記第２角部とは、前記第１テーパ部と前記第２テーパ部との間の薄肉部分で連結されているので、水晶振動板ウエハから水晶振動板を折り取る際に、第１テーパ部と前記第２テーパ部との間の強度的に弱い薄肉部分で容易に破断することができる。 According to this configuration, the first corner portion of the base portion and the second corner portion of the crystal diaphragm are connected by a thin portion between the first taper portion and the second taper portion. Therefore, when the quartz diaphragm is folded from the quartz diaphragm wafer, the thin portion between the first taper portion and the second taper portion can be easily broken.
　前記支持部から前記水晶振動板側へ突出する前記基部の形状が、平面視矩形状であって、突出端側の一辺の両端の２つの角部が、前記第１角部であるのが好ましい。 It is preferable that the shape of the base portion protruding from the support portion toward the crystal diaphragm side is a rectangular shape in plan view, and two corner portions on both ends of one side of the protruding end side are the first corner portions. .
　この構成によれば、平面視矩形状の基部の第１角部と平面視矩形の水晶振動板の第２角部とは、直角な角部同士で連結されているので、水晶振動板ウエハから水晶振動板を折り取る際に、直角な角部同士の連結部分で一層容易に破断することができる。 According to this configuration, the first corner portion of the base portion having a rectangular shape in plan view and the second corner portion of the quartz crystal plate having a rectangular shape in plan view are connected to each other at right-angled corner portions. When the quartz diaphragm is folded, it can be more easily broken at the connecting portion between the right-angled corners.
　本発明に係る水晶振動板は、ＡＴカットで水晶の結晶軸であるＸ軸に沿った辺とＺ´軸に沿った辺とから構成された平面視で矩形状の水晶振動板であって、
　当該水晶振動板の周縁部は、前記矩形状の各辺に向かって次第に薄肉に形成されたテーパ部を備え、
　前記矩形状の一辺の両端の２つの角部には、前記一辺に向かって次第に薄肉に形成された前記テーパ部と、前記一辺に隣接する隣接辺に向かって次第に薄肉に形成された前記テーパ部とが、不連続となる不連続面を有する。 The quartz crystal plate according to the present invention is a quartz plate having a rectangular shape in a plan view composed of a side along the X axis that is an AT cut and a side along the Z ′ axis.
The peripheral portion of the crystal diaphragm includes a tapered portion formed gradually thinner toward each side of the rectangular shape,
At the two corners of one side of the rectangular shape, the tapered portion formed gradually thinner toward the one side and the tapered portion formed gradually thinner toward the adjacent side adjacent to the one side. Have discontinuous surfaces that are discontinuous.
　本発明に係る水晶振動板によると、平面視で矩形状の水晶振動板の一辺の両端の角部は、前記一辺に向かって次第に薄肉に形成されたテーパ部と、前記一辺に隣接する隣接辺に向かって次第に薄肉に形成されたテーパ部とが、不連続となる不連続面であり、この一辺の両端の角部における不連続面は、当該水晶振動板を水晶振動板ウエハから折り取って個片化した際の破断面である。このように各辺に向かって薄肉となるテーパ部が交差する角部で折り取られた破断面は、矩形状の辺の部分で折り取られた水晶振動板の破断面に比べて、チッピングやバリの発生が抑制されたものとなる。 According to the quartz crystal plate according to the present invention, the corners on both sides of one side of the quartz plate having a rectangular shape in a plan view are tapered portions that are gradually thinned toward the one side, and adjacent sides that are adjacent to the one side. The tapered portion formed gradually thinner toward the surface is a discontinuous surface that becomes discontinuous, and the discontinuous surface at the corners at both ends of this side is obtained by folding the crystal vibration plate from the crystal vibration plate wafer. It is a fracture surface at the time of dividing into pieces. In this way, the fracture surface that is broken at the corner where the tapered portion that is thin toward each side intersects is compared with the fracture surface of the quartz diaphragm that is broken at the side of the rectangular shape. Generation of burrs is suppressed.
　前記一辺の両端の前記２つの角部の頂点部分が、それぞれ前記不連続面となっているのが好ましい。 It is preferable that apex portions of the two corners at both ends of the one side are the discontinuous surfaces.
　この構成によれば、当該水晶振動板を水晶振動板ウエハから折り取って個片化した際の破断面である不連続面は、角部の頂点部分であるので、この角部の頂点部分で当該水晶振動板を、水晶振動板ウエハから容易に折り取ることができるので、チッピングやバリの発生を一層抑制することができる。 According to this configuration, the discontinuous surface, which is a fracture surface when the crystal diaphragm is broken from the crystal diaphragm wafer into pieces, is the apex portion of the corner portion. Since the crystal diaphragm can be easily broken off from the crystal diaphragm wafer, generation of chipping and burrs can be further suppressed.
　前記テーパ部は、当該水晶振動板の一方の主面側から前記矩形状の各辺に向かって傾斜した第１傾斜面と、当該水晶振動板の他方の主面側から前記矩形状の各辺に向かって傾斜した第２傾斜面とをそれぞれ有し、前記不連続面は、前記一辺に向かって次第に薄肉に形成されたテーパ部の前記第１傾斜面及び前記第２傾斜面の各一端と、前記隣接辺に向かって次第に薄肉に形成されたテーパ部の前記第１傾斜面及び前記第２傾斜面の各一端とによって区画されているのが好ましい。 The tapered portion includes a first inclined surface inclined toward one side of the rectangular shape from one main surface side of the crystal diaphragm, and each side of the rectangular shape from the other main surface side of the crystal diaphragm. Each of the first inclined surface and each one end of the second inclined surface of the tapered portion formed gradually thinner toward the one side. It is preferable that the first inclined surface and each one end of the second inclined surface of the taper portion that are gradually formed thinner toward the adjacent side are partitioned.
　この構成によれば、平面視で矩形状の水晶振動板の一辺に向かって薄肉となるテーパ部を構成する第１傾斜面及び第２傾斜面と、前記一辺に隣接する隣接辺に向かって薄肉となるテーパ部を構成する第１傾斜面及び第２傾斜面とが、交差する角部の不連続面では、前記一辺の前記第１傾斜面及び前記第２傾斜面の、破断によって生じた各一端と、前記隣接辺の前記第１傾斜面及び前記第２傾斜面の、破断によって生じた各一端とによって、四角形状の破断面である不連続面が区画される。 According to this configuration, the first inclined surface and the second inclined surface that form the tapered portion that becomes thinner toward one side of the rectangular crystal diaphragm in plan view, and the thinner toward the adjacent side adjacent to the one side. In the discontinuous surface of the corner portion where the first inclined surface and the second inclined surface constituting the taper portion intersect, each of the first inclined surface and the second inclined surface of the one side caused by breakage A discontinuous surface that is a quadrangular fracture surface is defined by one end and each end generated by the breakage of the first inclined surface and the second inclined surface of the adjacent side.
　前記不連続面が、窪んでいるのが好ましい。 The discontinuous surface is preferably recessed.
　この構成によれば、当該水晶振動板を水晶振動板ウエハから折り取って個片化した際の破断面である不連続面は、窪んだバリのない破断面となる。 According to this configuration, the discontinuous surface, which is a fracture surface when the quartz crystal plate is broken from the quartz plate wafer and separated into pieces, becomes a fractured surface without a recessed burr.
　本発明によれば、水晶振動板ウエハの基部と複数の各水晶振動板とが、角部同士で連結されているので、例えば、水晶振動板の一辺に沿って一定領域に亘って連結される構成に比べて、エッチングレートの相違等による影響を低減して連結部における強度のばらつきを抑制することができる。これによって、例えば連結部における強度が弱くなり過ぎて、水晶振動板が生産途中で水晶振動板ウエハから脱落するのを低減することができる。更に、水晶振動板ウエハから水晶振動板を折り取って個片化する際に、角部で容易に破断して、チッピングやバリの発生を抑えることができる。 According to the present invention, the base portion of the crystal diaphragm wafer and each of the plurality of crystal diaphragms are coupled to each other at the corners, and thus, for example, coupled over a certain region along one side of the crystal diaphragm. Compared to the configuration, it is possible to reduce the influence due to the difference in etching rate and the like, and to suppress the variation in strength at the connecting portion. As a result, for example, it is possible to reduce the crystal diaphragm from dropping from the crystal diaphragm wafer during production because the strength at the connecting portion becomes too weak. Furthermore, when the quartz diaphragm is broken from the quartz diaphragm wafer to be separated into pieces, it can be easily broken at the corners to suppress chipping and burrs.
　また、水晶振動板は、平面視で矩形状の各辺に向かって薄肉となるテーパ部が交差する角部で折り取られるので、その破断面である不連続面は、矩形状の辺の部分で折り取られた水晶振動板の破断面に比べて、チッピングやバリの発生が抑制されたものとなる。 In addition, since the quartz diaphragm is broken off at the corners where the tapered portions that are thin toward each side of the rectangle in plan view intersect, the discontinuous surface that is the fracture surface is a portion of the rectangle side. As compared with the fractured surface of the quartz crystal plate that has been broken in step 3, the generation of chipping and burrs is suppressed.
図１は本発明の一実施形態に係る水晶振動板ウエハの一部の概略構成を示した平面図である。FIG. 1 is a plan view showing a schematic configuration of a part of a quartz diaphragm wafer according to an embodiment of the present invention. 図２は図１の破線で囲まれた部分を拡大した図である。FIG. 2 is an enlarged view of a portion surrounded by a broken line in FIG. 図３は図２のＡ－Ａ線に沿う断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 図４は本発明の一実施形態に係る水晶振動板の概略構成を示した平面図である。FIG. 4 is a plan view showing a schematic configuration of a crystal diaphragm according to an embodiment of the present invention. 図５は図４のＢ方向から見た部分を拡大して示す一部斜視図である。FIG. 5 is a partial perspective view showing an enlarged portion viewed from the direction B of FIG.
　以下、本発明の実施形態について図面を参照して説明する。なお、以下に示す実施形態では、水晶振動デバイスとして水晶振動子に本発明を適用した場合について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the embodiment described below, a case where the present invention is applied to a crystal resonator as a crystal resonator device will be described.
　図１は本発明の一実施形態に係る水晶振動板ウエハの一部の概略構成を示した平面図であり、図２は図１の破線で囲まれた部分を拡大した図であり、図３は図２のＡ－Ａ線に沿う断面図である。 1 is a plan view showing a schematic configuration of a part of a quartz crystal wafer according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a portion surrounded by a broken line in FIG. FIG. 3 is a sectional view taken along line AA in FIG.
　この実施形態の水晶振動板ウエハ１００は、圧電基板となる複数の水晶振動板１０がマトリックス状に配置されて一体化された平面視矩形の集合体である。 The crystal diaphragm wafer 100 of this embodiment is a rectangular assembly in a plan view in which a plurality of crystal diaphragms 10 serving as piezoelectric substrates are arranged in a matrix and integrated.
　この水晶振動板ウエハ１００は、水晶の結晶軸であるＸ軸に沿った辺とＺ´軸に沿った辺とで構成されたＡＴカットで平面視矩形状の複数の水晶振動板１０と、水晶振動板１０の配列方向（図１の上下方向）であるＺ´軸に沿って互いに平行に延びて、複数の水晶振動板１０をそれぞれ支持する複数（図１では３つ）の支持部１１１と、前記配列方向に直交する方向（図１の左右方向）であるＸ軸に沿って延びて複数の支持部１１１を連結する枠部１１２とを備えている。なお、図１では、複数の支持部１１１の一端側（図１の下方側）を連結する枠部１１２のみを示しているが、複数の支持部１１１の他端側（図１の上方側）も図示しない枠部１１２によって連結されている。 The crystal diaphragm wafer 100 includes a plurality of crystal diaphragms 10 having a rectangular shape in a plan view with an AT cut composed of a side along the X-axis that is a crystal axis of crystal and a side along the Z′-axis. A plurality of (three in FIG. 1) support portions 111 that extend in parallel with each other along the Z ′ axis, which is the arrangement direction of the vibration plates 10 (the vertical direction in FIG. 1), and respectively support the plurality of crystal vibration plates 10. And a frame portion 112 extending along the X-axis that is a direction orthogonal to the arrangement direction (the left-right direction in FIG. 1) and connecting the plurality of support portions 111. In FIG. 1, only the frame portion 112 that connects one end side (lower side in FIG. 1) of the plurality of support portions 111 is shown, but the other end side (upper side in FIG. 1) of the plurality of support portions 111. Are also connected by a frame portion 112 (not shown).
　これらは、フォトリソグラフィー技術を用いて水晶ウエハをフッ化水素、フッ化アンモニウムなどのフッ化系のエッチング液でウェットエッチングすることで形成される。 These are formed by wet etching a crystal wafer with a fluorinated etching solution such as hydrogen fluoride or ammonium fluoride using a photolithography technique.
　なお、ＡＴカットは、人工水晶の３つの結晶軸である電気軸（Ｘ軸）、機械軸（Ｙ軸）、および光学軸（Ｚ軸）のうち、Ｚ軸に対してＸ軸周りに３５°１５′だけ傾いた角度で切り出す加工手法である。ＡＴカット水晶振動板１０では、Ｘ軸は水晶の結晶軸に一致する。Ｙ´軸およびＺ´軸は、水晶の結晶軸のＹ軸およびＺ軸からそれぞ３５°１５′傾いた軸に一致する。Ｙ´軸方向およびＺ´軸方向は、ＡＴカット水晶振動板１０を切り出すときの切り出し方向に相当する。 The AT cut is an angle of 35 ° around the X axis with respect to the Z axis among the electric axis (X axis), the mechanical axis (Y axis), and the optical axis (Z axis), which are the three crystal axes of artificial quartz. This is a processing method of cutting at an angle inclined by 15 '. In the AT cut quartz crystal diaphragm 10, the X axis coincides with the crystal axis of the quartz crystal. The Y′-axis and the Z′-axis coincide with the axes inclined by 35 ° 15 ′ from the Y-axis and Z-axis of the crystal axis of the quartz crystal. The Y′-axis direction and the Z′-axis direction correspond to the cutting direction when cutting the AT-cut crystal diaphragm 10.
　水晶振動板ウエハ１００の複数の各支持部１１１は、前記配列方向であるＺ´軸に沿って一定間隔で水晶振動板１０側へ突出する複数の基部１１３をそれぞれ備えている。各基部１１３は、枠部１１２に連設された前記配列方向の両端の基部１１３を除いて、平面視矩形状に突出している。この基部１１３の突出端側の第１辺１１５は、Ｚ´軸に沿って延びており、この第１辺１１５の両端に、２つの第１角部１１３ａ，１１３ｂをそれぞれ有している。前記第１辺１１５の両端にそれぞれ隣接する第２辺１１６及び第３辺１１７は、第１辺１１５に直交し、Ｘ軸に沿って延びている。 Each of the plurality of support portions 111 of the quartz plate wafer 100 includes a plurality of base portions 113 that protrude toward the quartz plate 10 at regular intervals along the Z ′ axis that is the arrangement direction. Each base 113 protrudes in a rectangular shape in plan view, except for the bases 113 at both ends in the arrangement direction that are connected to the frame part 112. The first side 115 on the protruding end side of the base 113 extends along the Z ′ axis, and has two first corners 113a and 113b at both ends of the first side 115, respectively. A second side 116 and a third side 117 adjacent to both ends of the first side 115 are orthogonal to the first side 115 and extend along the X axis.
　複数の基部１１３は、水晶振動板１０の配列方向であるＺ´軸に沿って隣合う２つの基部１１３，１１３（例えば、図１の破線で囲まれた部分に近接する基部１１３1，１１３2）の、両基部１１３，１１３（１１３1，１１３2）間で対向する側の第１角部１１３ｂ，１１３ａが、各水晶振動板１０の後述する第１辺１１の両端の角部である第２角部１１ａ，１１ｂとそれぞれ頂点部分で連結されている。 The plurality of base portions 113 are adjacent to two base portions 113 and 113 (for example, base portions 113 1 and 113 2 adjacent to a portion surrounded by a broken line in FIG. 1) along the Z ′ axis that is the arrangement direction of the crystal diaphragm 10. ) Of the opposite sides of the base portions 113 and 113 (113 1 , 113 2 ) are corner portions at both ends of the first side 11 (to be described later) of each crystal diaphragm 10. The two corner portions 11a and 11b are connected to each other at the vertex portion.
　各基部１１３（例えば、図１の上記基部１１３2）の第１辺１１５の両端の２つの第１角部１１３ａ，１１３ｂの内の一方の第１角部１１３ａが、Ｚ´軸に沿って隣合う２つの水晶振動板１０，１０（図１の破線で囲まれた部分に近接する水晶振動板１０1，１０2）の一方の水晶振動板１０（１０1）の第２角部１１ｂに連結され、他方の第１角部１１３ｂが、他方の水晶振動板１０（１０2）の第２角部１１ａに連結されている。 One first corner 113a of the two first corners 113a, 113b at both ends of the first side 115 of each base 113 (for example, the base 113 2 in FIG. 1) is adjacent along the Z ′ axis. Connected to the second corner portion 11b of one of the quartz crystal plates 10 (10 1 ) of the two matched quartz plates 10, 10 (the quartz plate 10 1 , 10 2 adjacent to the portion surrounded by the broken line in FIG. The other first corner 113b is connected to the second corner 11a of the other quartz crystal plate 10 (10 2 ).
　なお、水晶振動板ウエハ１００において、Ｚ´軸に沿って隣合う基部１１３の間、及び、水晶振動板１０の第２角部１１ａ，１１ｂを除く周囲は、水晶振動板１０を支持していない貫通領域４００となっている。 In addition, in the quartz crystal plate wafer 100, the quartz plate 10 is not supported between the base portions 113 adjacent to each other along the Z′-axis and the periphery except for the second corner portions 11 a and 11 b of the quartz plate 10. A through region 400 is formed.
　水晶振動板ウエハ１００では、支持部１１１から水晶振動板１０側へ突出する基部１１３の第１角部１１３ａ，１１３ｂと、水晶振動板１０の第２角部１１ａ，１１ｂとが、角部同士で連結されているので、例えば、水晶振動板の一辺に沿って一定領域に亘って連結される構成に比べて、エッチングレートの相違による影響を低減することができ、連結部における強度のばらつきを抑制することができる。これによって、例えば連結部における強度が弱過ぎて、水晶振動板１０が生産途中で水晶振動板ウエハ１００から脱落するのを低減することができる。 In the quartz diaphragm wafer 100, the first corners 113a and 113b of the base 113 protruding from the support part 111 toward the quartz diaphragm 10 and the second corners 11a and 11b of the quartz diaphragm 10 are corners. Because they are connected, for example, compared to a structure that is connected over a certain area along one side of the quartz diaphragm, the influence of the difference in etching rate can be reduced, and variations in strength at the connecting part are suppressed. can do. Thereby, for example, it is possible to reduce the crystal diaphragm 10 from dropping from the crystal diaphragm wafer 100 during the production due to the strength at the connecting portion being too weak.
　また、支持部１１１から水晶振動板１０側へ突出する各基部１１３は、比較的大きいので、例えば、落下などの衝撃が加わっても支持部１１１から水晶振動板１０の方へ伝わる衝撃を、比較的大きな基部１１３で緩和することができる。 In addition, since each base 113 protruding from the support 111 toward the quartz diaphragm 10 is relatively large, for example, the impact transmitted from the support 111 to the quartz diaphragm 10 is compared even when an impact such as dropping is applied. It can be relaxed with a large base 113.
　更に、水晶振動板１０の配列方向に沿って隣合う２つの基部１１３，１１３によって、１つの水晶振動板１０を支持すると共に、各基部１１３は、その２つの第１角部１１３ａ，１１３ｂの内の一方の第１角部１１３ａによって、隣合う２つの水晶振動板１０，１０の一方の水晶振動板１０を支持し、他方の第１角部１１３ｂによって、他方の水晶振動板１０を支持するので、支持部１１１から水晶振動板１０へ伝わる応力を、各基部１１３によって隣合う２つの水晶振動板１０にそれぞれ分散させて、１つの水晶振動板１０へ応力が集中するのを抑制することができる。 Further, one base plate 113 is supported by two base portions 113 and 113 adjacent to each other along the arrangement direction of the crystal plate 10, and each base portion 113 has two of the first corner portions 113 a and 113 b. The one first corner 113a supports one crystal diaphragm 10 of the two adjacent quartz diaphragms 10 and 10, and the other first corner 113b supports the other crystal diaphragm 10. The stress transmitted from the support portion 111 to the crystal diaphragm 10 can be dispersed to the two adjacent crystal diaphragms 10 by the respective base portions 113 to suppress the concentration of stress on one crystal diaphragm 10. .
　したがって、水晶振動板１０が生産途中で水晶振動板ウエハ１００から脱落するのを一層効果的に抑制することができる。 Therefore, it is possible to more effectively suppress the crystal diaphragm 10 from falling off the crystal diaphragm wafer 100 during production.
　各基部１１３は、図２に示すように、周端に向かって水晶結晶面が露出するように次第に薄肉となる第１テーパ部１１４を有している。この第１テーパ部１１４は、図３の断面図に示すように、基部１１３の表面側から周端に向かって傾斜した第１傾斜面１１４ａと、基部１１３の裏面側から周端に向かって傾斜した第２傾斜面１１４ｂとをそれぞれ有している。この傾斜面１１４ａ，１１４ｂは、水晶をフッ化系のエッチング液でウェットエッチングした際に、水晶の結晶軸のエッチングレート差により自然に生じる傾斜面（結晶面）である。 As shown in FIG. 2, each base portion 113 has a first taper portion 114 that gradually becomes thin so that the crystal surface is exposed toward the peripheral end. As shown in the cross-sectional view of FIG. 3, the first tapered portion 114 has a first inclined surface 114 a inclined from the surface side of the base portion 113 toward the peripheral end, and an inclination from the back surface side of the base portion 113 toward the peripheral end. And the second inclined surface 114b. The inclined surfaces 114a and 114b are inclined surfaces (crystal surfaces) that naturally occur due to a difference in the etching rate of the crystal axis of the crystal when the crystal is wet-etched with a fluorinated etchant.
　図４は、水晶振動板ウエハ１００から後述のようにして折り取られた水晶振動板１０の概略構成を示す平面図である。 FIG. 4 is a plan view showing a schematic configuration of the crystal diaphragm 10 that is broken off from the crystal diaphragm wafer 100 as described below.
　水晶振動板１０は、ＡＴカットで、平面視矩形状の直方体形状であり、長辺がＸ軸に沿って平行に、短辺がＺ´軸に沿って平行になるように構成されている。 The quartz diaphragm 10 is AT-cut and has a rectangular parallelepiped shape in plan view, and is configured such that the long side is parallel to the X axis and the short side is parallel to the Z ′ axis.
　平面視矩形状の水晶振動板１０は、水晶振動板ウエハ１００の支持部１１１に近接する側の短辺である上記第１辺１１と、この第１辺１１に対向する平行な第４辺１４と、第１辺１１にそれぞれ隣接する長辺である第２辺１２と第３辺１３とを有している。 The crystal diaphragm 10 having a rectangular shape in plan view includes the first side 11 which is the short side close to the support portion 111 of the crystal diaphragm wafer 100 and a fourth side 14 which is parallel to the first side 11. And a second side 12 and a third side 13 which are long sides adjacent to the first side 11, respectively.
　水晶振動板ウエハ１００から折り取られる前の状態では、水晶振動板１０の第１辺１１の両端の角部である第２角部１１ａ，１１ｂが、図２に示すように、水晶振動板ウエハ１００の隣合う基部１１３（１１３1），１１３（１１３2）の対向する側の第１角部１１３ｂ，１１３ａとそれぞれ連結されている。 In a state before being broken off from the quartz diaphragm wafer 100, the second corner portions 11a and 11b, which are the corners at both ends of the first side 11 of the quartz diaphragm 10, are shown in FIG. 100 adjacent base portions 113 (113 1 ) and 113 (113 2 ) are respectively connected to the first corner portions 113b and 113a on the opposite side.
　本実施形態の水晶振動板１０は、高周波化対応のいわゆる逆メサ構造のものを例にしている。水晶振動板１０の両主面の中央に、平面視矩形の凹部が形成されている。この水晶振動板１０は、その板面中央の薄肉の振動部２１と、振動部２１の外周に形成された厚肉の外枠部２２と、振動部２１の周囲と外枠部２２とをつなぐ段差壁２３とを有している。 The crystal diaphragm 10 of the present embodiment is a so-called inverted mesa structure that supports high frequency. A concave portion having a rectangular shape in plan view is formed at the center of both main surfaces of the crystal diaphragm 10. The quartz diaphragm 10 connects a thin vibrating portion 21 at the center of the plate surface, a thick outer frame portion 22 formed on the outer periphery of the vibrating portion 21, and the periphery of the vibrating portion 21 and the outer frame portion 22. And a stepped wall 23.
　水晶振動板１０の一方の主面である表面の凹部の内部中央付近には、第１励振電極３１が形成され、水晶振動板１０の他方の主面である裏面の凹部の内部中央付近には、第２励振電極３２が形成される。第１励振電極３１と第２励振電極３２とは、図示しない外部電極と電気機械的に接合するために、第１引出電極３３と第２引出電極３４とによって振動部２１から段差壁２３を経由して外枠部２２の一部へとそれぞれ延出されている。 A first excitation electrode 31 is formed in the vicinity of the inner center of the concave portion on the surface that is one main surface of the quartz crystal plate 10, and in the vicinity of the inner center of the concave portion on the back surface that is the other main surface of the quartz crystal plate 10. The second excitation electrode 32 is formed. The first excitation electrode 31 and the second excitation electrode 32 are routed from the vibrating portion 21 through the step wall 23 by the first extraction electrode 33 and the second extraction electrode 34 to be electromechanically joined to an external electrode (not shown). Thus, each of the outer frame portions 22 is extended to a part.
　第１引出電極３３は、第１励振電極３１を水晶振動板１０の外枠部２２を経て第１辺１１の一端部である第２角部１１ａ付近のみに延出している。すなわち、第１引出電極３３は、第１辺１１の両端部にある２つの第２角部１１ａ，１１ｂの内の１つの角部１１ａに延出している。 The first extraction electrode 33 extends the first excitation electrode 31 through the outer frame portion 22 of the crystal diaphragm 10 only in the vicinity of the second corner portion 11a which is one end portion of the first side 11. That is, the first extraction electrode 33 extends to one corner 11 a of the two second corners 11 a and 11 b at both ends of the first side 11.
　第２引出電極３４は、第２励振電極３２を水晶振動板１０の外枠部２２を経て第１辺１１の他端部である第２角部１１ｂ付近のみに延出している。すなわち、第２引出電極３４は、第１辺１１の両端部にある２つの第２角部１１ａ，１１ｂの内の１つの角部１１ｂに延出している。 The second extraction electrode 34 extends the second excitation electrode 32 only through the outer frame portion 22 of the crystal diaphragm 10 and in the vicinity of the second corner portion 11b which is the other end portion of the first side 11. That is, the second extraction electrode 34 extends to one corner 11b of the two second corners 11a and 11b at both ends of the first side 11.
　水晶振動板１０の周縁部は、平面視矩形状の各辺１１～１４に向かって水晶結晶面が露出するように、次第に薄肉に形成されたテーパ部１５を備えている。各テーパ部１５は、図３に示すように、当該水晶振動板１０の表面側から各辺１１～１４に向かって傾斜した第１傾斜面１５ａと、当該水晶振動板１０の裏面側から各辺１１～１４に向かって傾斜した第２傾斜面１５ｂとをそれぞれ有している。この傾斜面１５ａ，１５ｂは、水晶をフッ化系のエッチング液でウェットエッチングした際に、水晶の結晶軸のエッチングレート差により自然に生じる傾斜面（結晶面）である。 The peripheral portion of the quartz crystal plate 10 includes a tapered portion 15 that is gradually formed so that the quartz crystal surface is exposed toward the sides 11 to 14 that are rectangular in plan view. As shown in FIG. 3, each tapered portion 15 includes a first inclined surface 15a inclined from the surface side of the quartz crystal plate 10 toward the sides 11 to 14, and each side from the back side of the crystal plate 10. And second inclined surfaces 15b inclined toward 11 to 14, respectively. The inclined surfaces 15a and 15b are inclined surfaces (crystal surfaces) that naturally occur due to a difference in the etching rate of the crystal axis of the crystal when the crystal is wet-etched with a fluorinated etchant.
　この実施形態の水晶振動板ウエハ１００では、上記のように、水晶振動板１０の配列方向であるＺ´軸に沿って隣合う基部１１３，１１３の第１角部１１３ａ，１１３ｂと、水晶振動板１０の第１辺１１の両端の第２角部１１ｂ，１１ａとがそれぞれ連結されている。 In the crystal diaphragm wafer 100 of this embodiment, as described above, the first corner portions 113a and 113b of the base portions 113 and 113 adjacent to each other along the Z ′ axis that is the arrangement direction of the crystal diaphragm 10 and the crystal diaphragm The second corners 11b and 11a at both ends of the first side 11 are connected to each other.
　この連結部において、隣合う基部１１３，１１３の第１角部１１３ａ，１１３ｂの第１テーパ部１１４，１１４と、水晶振動板１０の第１辺１１の両端の第２角部１１ｂ，１１ａのテーパ部（第２テーパ部）１５，１５との間の境界には、図３に示すように、薄肉となる谷部２０１，２０２が表裏面にそれぞれ形成される。各谷部２０１，２０２は、各基部１１３，１１３の第１角部１１３ａ，１１３ｂ及び水晶振動板１０の第２角部１１ｂ，１１ａの頂点部分に形成されている。このように各基部１１３の第１テーパ部１１４と、水晶振動板１０の各テーパ部１５とは、谷部２０１，２０２付近の薄肉部分で連結されている。 In this connecting portion, the first taper portions 114 and 114 of the first corner portions 113 a and 113 b of the adjacent base portions 113 and 113 and the taper of the second corner portions 11 b and 11 a at both ends of the first side 11 of the crystal diaphragm 10. As shown in FIG. 3, valley portions 201 and 202 that are thin are formed on the front and back surfaces at the boundary between the portions (second tapered portions) 15 and 15, respectively. The valley portions 201 and 202 are formed at the apex portions of the first corner portions 113a and 113b of the base portions 113 and 113 and the second corner portions 11b and 11a of the crystal diaphragm 10, respectively. Thus, the first tapered portion 114 of each base portion 113 and each tapered portion 15 of the crystal diaphragm 10 are connected by the thin portion near the valley portions 201 and 202.
　この谷部２０１，２０２は、最も薄肉の領域であり周囲に比べて機械強度的にも弱い領域となるため、水晶振動板ウエハ１００から水晶振動板１０を折り取る際に、この谷部２０１，２０２に沿って破断される。 The valleys 201 and 202 are the thinnest areas and are weaker in mechanical strength than the surrounding areas. Therefore, when the quartz diaphragm 10 is folded from the quartz diaphragm wafer 100, the valleys 201 and 202 are formed. It is broken along 202.
　本実施形態の水晶振動板ウエハ１００では、各基部１１３の第１角部１１３ａ，１１３ｂの第１テーパ部１１４，１１４と、水晶振動板１０の第１辺１１の両端の第２角部１１ｂ，１１ａのテーパ部１５，１５との間の境界の薄肉である谷部２０１，２０２の部分で折り取られることで、複数の水晶振動板１０が得られる。 In the quartz crystal plate wafer 100 of the present embodiment, the first taper portions 114 and 114 of the first corner portions 113a and 113b of the base portions 113 and the second corner portions 11b of both ends of the first side 11 of the quartz crystal plate 10 are provided. A plurality of crystal diaphragms 10 are obtained by being folded at the valley portions 201 and 202 that are thin at the boundary between the taper portions 15 and 15 of 11a.
　得られた水晶振動板１０は、薄肉の谷部２０１，２０２の部分で破断されることで、第１辺１１の両端の各第２角部１１ａ，１１ｂは、第１辺１１のテーパ部１５の傾斜面と、第１辺１１に隣接する隣接辺である第２辺１２及び第３辺１３の各テーパ部１５，１５の傾斜面とが、破断によって不連続となった不連続面１６ａ，１６ｂとなる。 The obtained quartz diaphragm 10 is broken at the thin valley portions 201 and 202 so that the second corner portions 11 a and 11 b at both ends of the first side 11 are tapered portions 15 of the first side 11. And the inclined surfaces of the tapered portions 15 and 15 of the second side 12 and the third side 13 adjacent to the first side 11 are discontinuous surfaces 16a, 16b.
　図４のＢ方向から見た部分を拡大して示す図５では、不連続面１６ａ，１６ｂの内、一方の第２角部１１ａの不連続面１６ａを代表的に示している。 FIG. 5 showing an enlarged view of the portion viewed from the B direction in FIG. 4 representatively shows the discontinuous surface 16a of one second corner portion 11a among the discontinuous surfaces 16a and 16b.
　この図５に示される不連続面１６ａは、第１辺１１のテーパ部１５と、第１辺１１に隣接する第２辺１２のテーパ部１５とが交差する部分である。この不連続面１６ａは、第１辺１１のテーパ部１５の第１傾斜面１５ａ及び第２傾斜面（１５ｂ）の各一端１５ａｅ，（１５ｂｅ）と、第２辺１２のテーパ部１５の第１傾斜面１５ａ及び第２傾斜面（１５ｂ）の各一端１５ａｅ，（１５ｂｅ）とによってそれぞれ区画された略平行四辺形状となっている。なお、図５では、水晶振動板１０の表面側から各辺１１，１２に向かって傾斜した第１傾斜面１５ａの一端１５ａｅのみが示されている。 The discontinuous surface 16a shown in FIG. 5 is a portion where the tapered portion 15 of the first side 11 and the tapered portion 15 of the second side 12 adjacent to the first side 11 intersect. The discontinuous surface 16 a includes the first inclined surfaces 15 a and the second inclined surfaces (15 b) of the tapered portion 15 on the first side 11, and the first ends of the tapered portions 15 on the second side 12. Each of the inclined surfaces 15a and the second inclined surfaces (15b) has a substantially parallelogram shape defined by the respective one ends 15ae and (15be). In FIG. 5, only one end 15ae of the first inclined surface 15a inclined from the surface side of the crystal diaphragm 10 toward the sides 11 and 12 is shown.
　他方の第２角部１１ｂの不連続面１６ｂも一方の第２角部１１ａの不連続面１６ａと同様である。 The discontinuous surface 16b of the other second corner portion 11b is the same as the discontinuous surface 16a of the one second corner portion 11a.
　上記のように水晶振動板ウエハ１００の各基部１１３の第１角部１１３ａ，１１３ｂの第１テーパ部１１４，１１４と、水晶振動板１０の第１辺１１の両端の第２角部１１ｂ，１１ａのテーパ部１５，１５との間の境界の谷部２０１，２０２の部分で折り取るので、谷部２０１，２０２に応力を集中させて、谷部２０１，２０２の部分で容易に破断することができる。また、谷部２０１，２０２の部分で破断が完結し、水晶振動板１０の端部である第２角部１１ａ，１１ｂの周囲の各辺１１～１３や基部１１３の端部である第１角部１１３ａ，１１３ｂの周囲の各辺１１５～１１７に破断が不要に広がるのを抑制することができる。 As described above, the first taper portions 114 and 114 of the first corner portions 113a and 113b of the respective base portions 113 of the crystal vibration plate wafer 100 and the second corner portions 11b and 11a at both ends of the first side 11 of the crystal vibration plate 10 are used. Since it is broken off at the valley portions 201 and 202 at the boundary between the taper portions 15 and 15, stress can be concentrated on the valley portions 201 and 202 and easily broken at the valley portions 201 and 202. it can. The troughs 201 and 202 are completely broken, and the first corners of the sides 11 to 13 around the second corners 11a and 11b, which are the ends of the quartz diaphragm 10, and the ends of the base 113 are provided. It is possible to suppress the breakage from unnecessarily spreading to the sides 115 to 117 around the portions 113a and 113b.
　これによって、水晶振動板１０に、チッピングやバリが発生するのが抑制され、外観不良が低減される。 This prevents the occurrence of chipping and burrs on the quartz diaphragm 10 and reduces the appearance defects.
　水晶振動板１０の第２角部１１ａ，１１ｂの不連続面１６ａ，１６ｂは、内方へ窪んだ破断面となっており、バリのない破断面となる。 The discontinuous surfaces 16a and 16b of the second corner portions 11a and 11b of the quartz crystal plate 10 have a fractured surface that is recessed inward, and a fractured surface without burr.
　以上のように構成された水晶振動板１０は、図示しないパッケージ体に収納され、導電性樹脂接着剤や金属バンプやろう材などの導電性接合材により必要な電気機械的な接続がなされた後に気密封止されることで水晶振動デバイスの完成となる。 The quartz diaphragm 10 configured as described above is housed in a package body (not shown), and after necessary electromechanical connection is made by a conductive bonding material such as a conductive resin adhesive, a metal bump, or a brazing material. The quartz vibration device is completed by hermetically sealing.
　水晶振動板１０では、第２角部１１ａ，１１ｂの破断面である不連続面１６ａ，１６ｂを、個片化された水晶振動板１０の方向を示す目印とすることができる。 In the quartz diaphragm 10, the discontinuous surfaces 16 a and 16 b which are fracture surfaces of the second corner portions 11 a and 11 b can be used as marks indicating the direction of the separated quartz diaphragm 10.
　また、不連続面１６ａ，１６ｂの部位に、水晶振動板１０の表裏面を引き回すための引出電極を形成する場合には、その引出電極は、断線が生じにくい構成とすることができる。 In addition, when an extraction electrode for routing the front and back surfaces of the crystal diaphragm 10 is formed on the discontinuous surfaces 16a and 16b, the extraction electrode can be configured so that disconnection hardly occurs.
　また、導電性樹脂接着剤を用いて水晶振動板１０を保持接合した場合には、不連続面１６ａ，１６ｂで導電性樹脂接着剤が這い上がりやすくなり、この導電性樹脂接着剤の這い上がり部分によって、水晶振動板１０の安定した接続が行え、接着強度が得られる。 Further, when the quartz vibration plate 10 is held and bonded using a conductive resin adhesive, the conductive resin adhesive tends to creep up at the discontinuous surfaces 16a and 16b, and the rising portion of the conductive resin adhesive Thus, the crystal diaphragm 10 can be stably connected, and the adhesive strength can be obtained.
　なお、本実施形態の水晶振動板１０では、水晶振動板の表裏主面に凹部が形成された、いわゆるバイ逆メサ形状のものを開示しているが、プラノ逆メサ形状のものでもよく、平板形状のものでもよく、メサ形状のものにも適用できる。 The quartz diaphragm 10 of the present embodiment discloses a so-called bi-inverted mesa shape in which concave portions are formed on the front and back main surfaces of the quartz diaphragm, but a plano-inverted mesa shape may be used. It may be of a shape or can be applied to a mesa shape.
　また、本発明は、上記の水晶振動子に限らず、水晶フィルタ、水晶発振器などの水晶振動デバイスにも適用できる。 Further, the present invention is not limited to the above-described crystal resonator, but can be applied to crystal vibration devices such as a crystal filter and a crystal oscillator.
　なお、上記に示した本発明の実施形態はいずれも本発明を具体化した例であって、本発明の技術的範囲を限定する性格のものではない。 It should be noted that the embodiments of the present invention described above are all examples embodying the present invention, and are not of a nature that limits the technical scope of the present invention.
　１０　　　　　　　　水晶振動板
　１１　　　　　　　　第１辺
　１１ａ，１１ｂ　　　第２角部
　１５　　　　　　　　テーパ部（第２テーパ部）
　１５ａ　　　　　　　第１傾斜面
　１５ｂ　　　　　　　第２傾斜面
　１６ａ，１６ｂ　　　不連続面
　１００　　　　　　　水晶振動板ウエハ
　１１１　　　　　　　支持部
　１１２　　　　　　　枠部
　１１３　　　　　　　基部
　１１３ａ，１１３ｂ　第１角部
　１１４　　　　　　　第１テーパ部
　１１４ａ　　　　　　第１傾斜面
　１１４ｂ　　　　　　第２傾斜面
　１１５　　　　　　　第１辺
　２０１，２０２　　　谷部　 DESCRIPTION OF SYMBOLS 10 Crystal diaphragm 11 1st edge | side 11a, 11b 2nd corner | angular part 15 Tapered part (2nd taper part)
15a First inclined surface 15b Second inclined surface 16a, 16b Discontinuous surface 100 Quartz diaphragm wafer 111 Support portion 112 Frame portion 113 Base portion 113a, 113b First corner portion 114 First tapered portion 114a First inclined surface 114b Second inclined surface Surface 115 First side 201, 202 Valley

Claims (8)

  1. 　複数の水晶振動板が、前記複数の水晶振動板の配列方向に沿って延びる支持部にそれぞれ連結されたＡＴカットの水晶振動板のウエハであって、
    　前記複数の各水晶振動板は、ＡＴカットの水晶の結晶軸であるＸ軸に沿った辺とＺ´軸に沿った辺とから構成された平面視矩形状であり、
    　前記支持部は、前記配列方向に沿って一定間隔で前記水晶振動板側へ突出する複数の基部を備え、複数の各基部は、前記配列方向に沿って２つの第１角部をそれぞれ有し、
    　前記平面視矩形の前記水晶振動板の前記支持部に近接する側の一辺の両端の２つの角部を第２角部とし、
    　前記配列方向に沿って隣合う２つの前記基部の、前記２つの基部間で対向する側の第１角部と、前記水晶振動板の２つの前記第２角部とがそれぞれ連結され、かつ、前記基部の２つの第１角部の内、一方の第１角部は、前記配列方向に沿って隣合う２つの前記水晶振動板の内の一方の水晶振動板の前記第２角部に連結され、他方の第１角部は、前記隣合う２つの前記水晶振動板の内の他方の水晶振動板の前記第２角部に連結されている、
    　水晶振動板ウエハ。     A plurality of quartz diaphragms are AT-cut quartz diaphragm wafers respectively connected to support portions extending along an arrangement direction of the plurality of quartz diaphragms,
    Each of the plurality of crystal diaphragms has a rectangular shape in a plan view composed of a side along the X axis which is a crystal axis of an AT cut crystal and a side along the Z ′ axis,
    The support portion includes a plurality of base portions projecting toward the quartz crystal diaphragm side at regular intervals along the arrangement direction, and each of the plurality of base portions has two first corner portions along the arrangement direction, respectively. ,
    Two corners on both ends of one side of the quartz-crystal diaphragm having a rectangular shape in plan view on the side close to the support portion are defined as second corner portions,
    The first corners of the two bases adjacent to each other along the arrangement direction are coupled to the first corners facing each other between the two bases, and the two second corners of the crystal diaphragm, respectively, and Of the two first corners of the base, one first corner is connected to the second corner of one of the two crystal diaphragms adjacent in the arrangement direction. The other first corner is connected to the second corner of the other of the two adjacent quartz diaphragms,
    Quartz diaphragm wafer.
  2. 　前記基部の前記第１角部と前記水晶振動板の前記第２角部とは、その頂点部分同士で連結されている、
    　請求項１に記載の水晶振動板ウエハ。     The first corner of the base and the second corner of the quartz diaphragm are connected at their apex portions,
    The crystal diaphragm wafer according to claim 1.
  3. 　前記基部の前記第１角部は、周端に向かって次第に薄肉となる第１テーパ部を有し、
    　前記水晶振動板の前記第２角部は、周端に向かって次第に薄肉となる第２テーパ部を有し、
    　前記基部の前記第１角部と前記水晶振動板の前記第２角部とは、前記第１テーパ部と前記第２テーパ部との間の薄肉部分で連結されている、
    　請求項１に記載の水晶振動板ウエハ。     The first corner portion of the base has a first taper portion that gradually becomes thinner toward a peripheral end,
    The second corner portion of the crystal diaphragm has a second taper portion that gradually becomes thinner toward a peripheral end,
    The first corner of the base and the second corner of the quartz plate are connected by a thin portion between the first taper and the second taper.
    The crystal diaphragm wafer according to claim 1.
  4. 　前記支持部から前記水晶振動板側へ突出する前記基部の形状が、平面視矩形状であって、突出端側の一辺の両端の２つの角部が、前記第１角部である、
    　請求項１ないし３のいずれか一項に記載の水晶振動板ウエハ。     The shape of the base portion protruding from the support portion toward the crystal diaphragm side is a rectangular shape in plan view, and two corner portions at both ends of one side of the protruding end side are the first corner portions,
    The crystal diaphragm wafer according to any one of claims 1 to 3.
  5. 　ＡＴカットで水晶の結晶軸であるＸ軸に沿った辺とＺ´軸に沿った辺とから構成された平面視で矩形状の水晶振動板であって、
    　当該水晶振動板の周縁部は、前記矩形状の各辺に向かって次第に薄肉に形成されたテーパ部を備え、
    　前記矩形状の一辺の両端の２つの角部には、前記一辺に向かって次第に薄肉に形成された前記テーパ部と、前記一辺に隣接する隣接辺に向かって次第に薄肉に形成された前記テーパ部とが、不連続となる不連続面を有する、
    　水晶振動板。     A quartz crystal plate having a rectangular shape in a plan view composed of a side along the X-axis and a side along the Z′-axis that is an AT-cut crystal axis,
    The peripheral portion of the crystal diaphragm includes a tapered portion formed gradually thinner toward each side of the rectangular shape,
    At the two corners of one side of the rectangular shape, the tapered portion formed gradually thinner toward the one side and the tapered portion formed gradually thinner toward the adjacent side adjacent to the one side. Have discontinuous surfaces that are discontinuous,
    Crystal diaphragm.
  6. 　前記一辺の両端の前記２つの角部の頂点部分が、それぞれ前記不連続面となっている、
    　請求項５に記載の水晶振動板。     The apex portions of the two corners at both ends of the one side are the discontinuous surfaces, respectively.
    The crystal diaphragm according to claim 5.
  7. 　前記テーパ部は、当該水晶振動板の一方の主面側から前記矩形状の各辺に向かって傾斜した第１傾斜面と、当該水晶振動板の他方の主面側から前記矩形状の各辺に向かって傾斜した第２傾斜面とをそれぞれ有し、
    　前記不連続面は、前記一辺に向かって次第に薄肉に形成されたテーパ部の前記第１傾斜面及び前記第２傾斜面の各一端と、前記隣接辺に向かって次第に薄肉に形成されたテーパ部の前記第１傾斜面及び前記第２傾斜面の各一端とによって区画されている、
    　請求項５に記載の水晶振動板。     The tapered portion includes a first inclined surface inclined toward one side of the rectangular shape from one main surface side of the crystal diaphragm, and each side of the rectangular shape from the other main surface side of the crystal diaphragm. Each having a second inclined surface inclined toward the
    The discontinuous surface includes each end of the first inclined surface and the second inclined surface of the tapered portion that is gradually thinned toward the one side, and a tapered portion that is gradually thinned toward the adjacent side. Each of the first inclined surface and the second inclined surface.
    The crystal diaphragm according to claim 5.
  8. 　前記不連続面が、窪んでいる、
    　請求項５ないし７のいずれか一項に記載の水晶振動板。     The discontinuous surface is recessed,
    The quartz crystal diaphragm according to any one of claims 5 to 7.
PCT/JP2018/001930 2017-02-03 2018-01-23 Quartz oscillation plate wafer and quartz oscillation plate thereof WO2018143006A1 (en)

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