JP2005192088A - Piezoelectric vibrating piece and piezoelectric vibrating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the dispersion of a serial resistance value in the configuration of a piezoelectric vibrating piece. <P>SOLUTION: Electrode patterns 8 are formed on both principal surfaces 73, 74 of a crystal plate 7, thereby forming a crystal vibrating piece 3. Each of the electrode patterns 8 formed on both the principal surfaces 73, 74 is comprised of an exciting electrode 81, a connecting electrode 84 and a lead out electrode 85. The exciting electrodes 81 are formed on approximate center areas of both the principal surfaces 73, 74, respectively. Furthermore, the connecting electrode 84 for conducting with electrode wiring of a support is formed in one end portion 71 in the direction of X axis of each of both the principal surfaces 73, 74. Moreover, the lead out electrode 85 for conducting the exciting electrode 81 and the connecting electrode 84 is formed on each of the principal surfaces 73, 74. A center position 82 of the exciting electrode 81 in the X-axis direction is then set to be shifted to the side of the connecting electrode 84 from the position equally bisecting the length of the crystal plate 7 in the X-axis direction except the length of the connecting electrode 84 in the X-axis direction. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric vibrating piece and a piezoelectric vibrating device.

  As a conventional piezoelectric vibrator, for example, there is a crystal vibrator having the following configuration.

  This crystal unit has a casing composed of a package and a cap. A crystal vibrating piece is mounted inside the package.

  The package is formed of a box-shaped body having one surface opened. A pair of supports for mounting and supporting the quartz crystal resonator element are provided on one side of the inner bottom surface of the package. The pair of supports are formed with electrodes that are electrically connected to an excitation electrode of a quartz crystal vibrating piece described below via a conductive adhesive.

  A cap consists of a plate-shaped body. The outer peripheral edge of the cap is joined to the opening surface of the package to hermetically seal the inside of the package.

  The quartz crystal vibrating piece is formed of a rectangular quartz plate composed of a side in the X-axis direction and a side in the Z′-axis direction. On both main surfaces of the quartz crystal vibrating piece, there are an excitation electrode, a connection electrode for electrically connecting the excitation electrode to an external electrode (electrode formed on the support), and an extraction electrode for electrically connecting the excitation electrode to the connection electrode. Is formed.

  By the way, in the conventional technique, there is one that sets the position of the excitation electrode on both main surfaces of the quartz crystal vibrating piece (see, for example, Patent Document 1).

In the case of the quartz crystal resonator element described in Patent Document 1 described below (referred to as a crystal element plate in Patent Document 1), the center position in the X-axis direction of the excitation electrode formed on both main surfaces of the crystal resonator element is the connection electrode. The length of the piezoelectric vibrating piece excluding the length in the X-axis direction is set to a position that bisects the length in the X-axis direction.
Japanese Patent Laid-Open No. 2003-17978

  However, in the case of the structure of the quartz crystal resonator element described in Patent Document 1, the series resistance value may vary. One reason for this is that when forming the quartz crystal resonator element, it is easily affected by variations in deposition due to the tolerance of the deposition apparatus used when depositing the excitation electrode on the quartz plate.

  This vapor deposition apparatus performs physical vapor deposition of a metal material for an electrode, and forms an electrode in a predetermined region on a main surface of a quartz plate by vacuum vapor deposition or sputtering. This vapor deposition apparatus is provided with a mechanical mask portion on which a crystal plate is disposed. This mechanical mask portion has a structure in which a lower chassis for storing a magnet, a lower mask, a spacer for storing a crystal plate, an upper mask, and an upper chassis are laminated in that order from the bottom. Positioning pins protrude from the lower chassis, and the lower mask, the spacer, the upper mask, and the upper chassis are provided with through holes of the same size through which the positioning pins pass. The lower chassis holds and positions other members by the penetration of the positioning pins into the through holes.

  The dimension of each through hole is normally set larger than the dimension of the positioning pin. Therefore, when the electrode pattern is formed on both main surfaces of the crystal plate via the upper mask and the lower mask, mask displacement may occur. In addition, the position of the positioning pin in the through hole and the diameter of the through hole may increase due to the sag of the vapor deposition apparatus using multiple times of vapor deposition, resulting in mask displacement. That is, it becomes easy to be affected by the mask tolerance due to the displacement of the positioning pins and the deposition variation due to the positioning tolerance. For this reason, variation occurs in the series resistance value of the quartz crystal vibrating piece on which the electrode pattern affected by the deposition variation is formed.

  Accordingly, in order to solve the above-described problems, an object of the present invention is to provide a piezoelectric vibrating piece and a piezoelectric vibrator that suppress variation in series resistance value.

  In order to achieve the above object, a piezoelectric vibrating piece according to the present invention is a plate-like body having a principal surface composed of a surface having an X-axis direction and a Z′-axis direction, and a substantially central region of both principal surfaces. An extraction electrode is formed on the main surface, a connection electrode is formed at one end of the two main surfaces in the X-axis direction, and is connected to the excitation electrode and the connection electrode on each main surface. In the piezoelectric vibrating piece in which is formed, the center position in the X-axis direction of the excitation electrode bisects the length in the X-axis direction of the plate-like body excluding the length in the X-axis direction of the connection electrode. The position is set at a position shifted from the position toward the connection electrode.

  According to the present invention, the center position in the X-axis direction of the excitation electrode is closer to the connection electrode side than the position that bisects the length in the X-axis direction of the plate-like body excluding the length in the X-axis direction of the connection electrode. Therefore, it is possible to form electrodes on the main surface of the plate-like body without being affected by variations in vapor deposition. As a result, it is possible to suppress variations in the series resistance value of the piezoelectric vibrating piece. Is possible. Specifically, the excitation electrode can be formed regardless of the mask tolerance due to the mask displacement of the vapor deposition apparatus and the positioning tolerance due to the displacement of the positioning pin. The piezoelectric vibrating piece is preferably a quartz vibrating piece.

  In the above configuration, the oscillation is preferably high-order overtone oscillation, and the above-described effects can be obtained remarkably.

  In order to achieve the above object, a piezoelectric vibration device according to the present invention is characterized in that the above-described piezoelectric vibrating piece is mounted.

  According to the present invention, since the above-described piezoelectric vibrating piece is mounted, it is possible to have the same effect as the above-described piezoelectric vibrating piece. Moreover, it is preferable that the piezoelectric vibration device is a crystal resonator.

  According to the piezoelectric vibrating piece and the piezoelectric vibrating device according to the present invention, variations in series resistance value can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the embodiment described below, a case where the present invention is applied to a crystal vibrating piece as a piezoelectric vibrating piece is shown.

  FIG. 1 shows a crystal resonator 1 according to the present embodiment.

  The crystal resonator 1 includes a ceramic package 2 (hereinafter referred to as a package) that is a casing, a crystal vibrating piece 3 that is a vibrating portion, and a cap 4 that is a flat lid.

  The package 2 has a box shape with one side open, and a pair of supports 23 for placing the crystal vibrating piece 3 is provided on one side portion 21 inside the box shape. The pair of supports 23 are provided with electrode wiring (not shown). In addition, an auxiliary support 24 made of alumina or the like is provided on the other side portion 22 inside the box shape to support the crystal vibrating piece 3 when the crystal vibrating piece 3 is placed on the pair of supports 23. It has been. Usually, a slight gap is formed between the auxiliary support 24 and the quartz crystal vibrating piece 3 as shown in FIG. A cap 4 is bonded to one surface of the package 2 having such a configuration via an adhesive 5, and the crystal vibrating piece 3 placed inside the package 2 is hermetically sealed.

  The quartz crystal vibrating piece 3 is based on a quartz plate 7 cut out and formed from an AT cut quartz wafer (not shown). In this quartz crystal plate 7, each main surface 73, 74 (see FIGS. 1 and 2) is formed in a rectangular shape including a side 75 in the X-axis direction and a side 76 in the Z′-axis direction (the plate referred to in the present invention). ).

  Chromium (Cr) and gold (Au) are vapor-deposited on both the main surfaces 73 and 74 of the crystal plate 7 by using a vapor deposition apparatus (see below) by a vacuum vapor deposition method or a sputtering method. Electrode pattern 8 is formed on 73 and 74, and crystal vibrating piece 3 is formed. The oscillation of the quartz crystal resonator element 3 is performed by third-order overtone oscillation. However, the present invention is not limited to this, and may be a fundamental wave or other high-order overtone oscillation.

  The electrode pattern 8 formed on both the main surfaces 73 and 74 includes an excitation electrode 81, a connection electrode 84, and an extraction electrode 85 described below.

  As shown in FIGS. 1 and 2, the excitation electrode 81 is formed in a substantially central region of both main surfaces 73 and 74. In addition, a connection electrode 84 is formed at one end 71 in the X-axis direction of both main surfaces 73 and 74 so as to be electrically connected to the electrode wiring of the support. In addition, an extraction electrode 85 that makes the excitation electrode 81 and the connection electrode 84 conductive is formed on each of the main surfaces 73 and 74.

  Further, the center position 82 of the excitation electrode 81 in the X-axis direction is closer to the connection electrode 84 than the position where the length of the crystal plate 7 in the X-axis direction excluding the length of the connection electrode 84 in the X-axis direction is bisected. It is set at a position shifted to.

  By the way, a vapor deposition apparatus (not shown) used for forming the electrode pattern 8 on both main surfaces 73 and 74 of the crystal plate 7 includes a vapor deposition source and a mask portion in a vacuum chamber, and a crystal plate is arranged on the mask portion. After that, the inside of the vacuum chamber is evacuated, and the metal material, which is the deposited material arranged in the vapor deposition source, is deposited on both main surfaces of the quartz plate by vacuum vapor deposition or sputtering. To form.

  By the way, there exists a mask part with which this vapor deposition apparatus is equipped as shown in FIG.

  As shown in FIG. 3, the mask portion 9 is configured to form a conductive pattern 8 on the other main surface 74 side of the crystal plate 7 and the lower chassis 91 that holds the magnet 96 and holds the magnet 96 from the bottom. The structure is such that a lower mask 92, a spacer 93 for accommodating the crystal plate 7, an upper mask 94 for forming the conductive pattern 8 on the one main surface 73 side of the crystal plate 7, and an upper chassis 95 for holding the upper mask 94 are laminated in order. Become.

  Positioning pins 97 project from the lower chassis 91. The lower mask 92, the spacer 93, the upper mask 94, and the upper chassis 95 are provided with through holes 921, 931, 941, and 951 having the same dimensions that allow the positioning pins 97 to pass therethrough. The lower chassis 91 positions and holds the other members 92, 93, 94, 95 by passing through the through holes 921, 931, 941, 951 of the positioning pins 97.

  The dimensions of the through holes 921, 931, 941, and 951 are set larger than the dimensions of the positioning pins 97. As illustrated in FIG. 4, through holes 931 (931 a, 931 b) are formed in both end portions 932, 933 in the longitudinal direction, taking the spacer 93 for accommodating the crystal plate 7 as an example. The hole diameter of the through hole 931a is formed in a rectangular shape. Moreover, the hole diameter of the through-hole 931b is formed in a circular shape. Further, when the dimensions of the through holes 931a and 931b are compared, the through hole 931a has a larger hole diameter than the through hole 931b. The number of crystal plates 7 on which the electrode patterns 8 are formed using the spacers 93 is twenty.

  In this embodiment, a plurality of crystal plates 7 are cut out from an AT-cut quartz wafer (not shown), but the present invention is not limited to this, and a single crystal plate is cut out from an AT-cut quartz wafer. May be. That is, in the present embodiment, the electrode pattern 8 can be simultaneously formed on the 20 crystal plates 7 by using the evaporation apparatus provided with the mask portion 9 shown in FIG. 3, but the present invention is not limited to this. is not. For example, one vapor deposition using a vapor deposition apparatus may be performed on one crystal plate 7. Therefore, in the present invention, the electrode pattern 8 can be vapor-deposited on an arbitrary quartz plate 7 using a vapor deposition apparatus.

  Then, next, using the spacer 93a that can store only one quartz plate 7 different from the above-described spacer 93, the deposition of the electrode pattern 8 on the quartz plate 7 according to the present invention described above, and the conventional example The electrode pattern 8 is deposited on the quartz crystal plate 7 (see FIGS. 5 and 6). However, although the embodiment 93 uses the spacer 93a that can accommodate only one quartz plate 7, it is needless to say that the present invention is not limited to this as described above. That is, the first embodiment is an embodiment used for explaining the effect of the present invention, and the same applies even when the spacer 93 capable of accommodating a plurality of (20) crystal plates 7 as described above is used. The result can be obtained.

  As shown in FIG. 5, the size of the quartz plate 7 used in Example 1 is 1.9 mm × 1.3 mm (X-axis direction × Z′-axis direction, the same applies hereinafter). The excitation electrode 81 is 1.0 mm × 0.9 mm. The connection electrode is 0.25 mm × 0.4 mm. Furthermore, the oscillation of the crystal resonator element 3 used in Example 1 is fundamental wave oscillation, and the frequency thereof is about 26 MHz. Note that the dimensions of the crystal plate 7 of the conventional example 1 used in the first embodiment are also the same dimensions. Further, the maximum series resistance value of the crystal resonator 1 to be manufactured is set to 50Ω.

  In the vapor deposition of the electrode pattern 8 on the crystal plate 7 according to the first embodiment, as shown in FIG. 5, the center in the X-axis direction of the excitation electrode 81 formed on both main surfaces 73 and 74 of the crystal vibrating piece 3 is shown. The position 82 is set at a position shifted by 25 μm toward the connection electrode 84 from the position that bisects the length in the X-axis direction of the crystal vibrating piece 3 excluding the length of the connection electrode 84 in the X-axis direction. . That is, the distance between the end surface of the other end 72 of the crystal plate 7 and the end surface 81a of the excitation electrode 81 is 350 μm.

  Further, in the vapor deposition formation of the electrode pattern 8 on the crystal plate 7 of the conventional example 1, as shown in FIG. 6, the center in the X-axis direction of the excitation electrode 81 formed on both main surfaces 73 and 74 of the crystal vibrating piece 3 The position 82 is set to a position that bisects the length of the crystal vibrating piece 3 in the X-axis direction excluding the length of the connection electrode 84 in the X-axis direction.

  Then, the series resistance values of the quartz crystal vibrating piece 3 according to Example 1 and the quartz crystal vibrating piece 3 of Conventional Example 1 each formed by depositing the electrode pattern 8 are measured, and the measurement results are shown in FIG. .

  As shown in FIG. 7, the average value of the series resistance value of the quartz crystal vibrating piece 3 according to the first embodiment composed of the quartz plate 7 shown in FIG. 5 is 26.7Ω, and the standard deviation of the series resistance value variation is 3 Double is 15.5Ω. On the other hand, the average value of the series resistance value of the quartz crystal resonator element 3 of the conventional example 1 including the quartz plate 7 shown in FIG. 6 is 31.9Ω, which is three times the standard deviation (σ) of the series resistance value variation. Is 35.1Ω. Therefore, it can be seen that the variation in the series resistance value of the crystal resonator element 3 according to the first embodiment is smaller than that of the crystal resonator element 3 of the first conventional example.

  In Example 1, the distance r between the end surface of the other end 72 of the quartz plate 7 and the end surface 81a of the excitation electrode 81 is 350 μm. Therefore, the relationship between the distance r and the series resistance value was measured, and the result is shown in FIG. FIG. 8 shows that the series resistance value increases and decreases as the distance r increases and decreases, and the distance r can be set according to the setting of the maximum series resistance value of the crystal resonator 1 to be manufactured. In Example 1, since the maximum series resistance value is set to 50Ω, the distance r is set to 340 μm or more. In addition, the A line shown in FIG. 8 has shown the approximate line.

  Next, the crystal vibrating piece 3 according to the present invention having a size different from that of the first embodiment is used. In addition, although this Example 2 is demonstrated using drawing (FIGS. 5, 6) same as Example 1, the dimension which accommodates the crystal plate 7 of the chassis 93 is made into the dimension of the crystal plate 7 used in this Example 2. FIG. It corresponds.

  As shown in FIG. 5, the size of the crystal plate 7 used in Example 2 is 2.7 mm × 1.4 mm (X-axis direction × Z′-axis direction, the same applies hereinafter). The excitation electrode 81 is 1.8 mm × 1.0 mm. The connection electrode is 0.4 mm × 0.55 mm. Furthermore, the oscillation of the crystal resonator element 3 used in Example 2 is a third-order overtone oscillation, and the frequency thereof is about 50.0 MHz. Note that the dimensions of the quartz plate 7 of the conventional example 2 used in the second embodiment are also the same dimensions.

  In the vapor deposition formation of the electrode pattern 8 on the crystal plate 7 according to the second embodiment, as shown in FIG. 5, the center in the X-axis direction of the excitation electrode 81 formed on both main surfaces 73 and 74 of the crystal vibrating piece 3 is used. The position 82 is set at a position shifted by 50 μm toward the connection electrode 84 from the position that bisects the length in the X-axis direction of the crystal vibrating piece 3 excluding the length of the connection electrode 84 in the X-axis direction. . That is, the distance between the end surface of the other end 72 of the crystal plate 7 and the end surface 81a of the excitation electrode 81 is 300 μm.

  Further, in the vapor deposition formation of the electrode pattern 8 on the crystal plate 7 of the conventional example 2, as shown in FIG. 6, the center in the X-axis direction of the excitation electrode 81 formed on both main surfaces 73 and 74 of the crystal vibrating piece 3 is used. The position 82 is set to a position that bisects the length of the crystal vibrating piece 3 in the X-axis direction excluding the length of the connection electrode 84 in the X-axis direction.

  Then, the series resistance values of the crystal vibrating piece 3 according to Example 2 and the crystal vibrating piece 3 of Conventional Example 2 formed by depositing the electrode patterns 8 respectively are measured, and the measurement results are shown in FIG. .

  As shown in FIG. 9, the average value of the series resistance value of the quartz crystal resonator element 3 according to the second embodiment composed of the quartz plate 7 shown in FIG. 5 is 65.0Ω, and the standard deviation of the series resistance value variation is 3 Double is 10.0Ω. On the other hand, the average value of the series resistance value of the quartz crystal resonator element 3 of the conventional example 2 including the quartz plate 7 shown in FIG. 6 is 67.5Ω, which is three times the standard deviation (σ) of the series resistance value variation. Is 17.3Ω. Therefore, it can be seen that the variation of the series resistance value of the crystal vibrating piece 3 according to the first embodiment is smaller than that of the crystal vibrating piece 3 of the conventional example 2.

  In the first embodiment, the oscillation of the crystal vibrating piece 3 is fundamental wave oscillation, and in the second embodiment, the oscillation of the crystal vibrating piece 3 is third-order overtone oscillation. Comparing these Examples 1 and 2 with reference to FIGS. 8 and 9, it can be seen that the oscillation of the crystal resonator element 3 used in Example 2 has less variation in series resistance value. As a result, it can be seen that the present invention is preferably applied to a crystal resonator element that performs higher-order overtone oscillation such as third-order overtone oscillation rather than fundamental wave oscillation.

  As described above, according to the crystal resonator element 3 according to the present embodiment and the crystal resonator 1 on which the crystal resonator element 3 is mounted, the center position of the excitation electrode 81 in the X-axis direction is the X of the connection electrode 84. Since the crystal vibrating piece 3 excluding the axial length is set to a position shifted toward the connection electrode 84 from the position where the length in the X-axis direction is divided into two equal parts, the crystal is not affected by variations in deposition. An electrode pattern 8 can be formed on the plate 7. As a result, variation in the series resistance value of the crystal vibrating piece 3 can be suppressed. Specifically, the excitation electrode 81 can be formed regardless of the mask tolerance due to the mask displacement of the vapor deposition apparatus and the positioning tolerance due to the displacement of the positioning pin 97. In this embodiment, since the crystal vibrating piece 3 is used as the piezoelectric vibrating piece, the variation in the series resistance value of the crystal can be suppressed. However, the present invention is not limited to this and is used for the piezoelectric vibrating piece. Depending on the material, it is possible to suppress variations in the resistance value peculiar to the material.

  Further, according to the crystal resonator 1 according to the present embodiment, since the above-described crystal vibrating piece 3 is mounted, the same effect as the above-described crystal vibrating piece 3 can be obtained.

  Further, when the crystal vibrating piece 3 is mounted on the package 2, it is preferable that the excitation electrode 81 is formed on the crystal plate 7 in a direction in which the excitation electrode 81 is separated from the auxiliary support 24. In other words, the excitation electrode 81 and the auxiliary support 24 are separated from each other, so that the oscillation of the crystal vibrating piece 3 by the excitation electrode 81 can be prevented from being interfered by the auxiliary support 24.

  In the present embodiment, for example, as shown in FIG. 2, the center position 82 of the excitation electrode 81 in the X-axis direction is the X-axis direction of the crystal plate 7 excluding the length of the connection electrode 84 in the X-axis direction. Is set to a position that is shifted to the connection electrode 84 side from the position that bisects the length. However, the present invention is not limited to this, and the center position of the excitation electrode 81 may be shifted in the Z′-axis direction as long as it is shifted in the X-axis direction and toward the connection electrode 84. That is, the deviation in the Z′-axis direction is not directly related to the variation of the series resistance value. For example, as shown in FIG. 10, the center position 83 of the excitation electrode 81 in the Z′-axis direction divides the length of the crystal plate 7 in the Z′-axis direction into two equal parts. It is assumed that the position is shifted to the side 75 side in the X axis direction. The series resistance value with respect to the amount of deviation in the Z′-axis direction at this time was measured, and the measurement result is shown in FIG. As can be seen from FIG. 11, there is almost no variation in the series resistance value with respect to the amount of displacement of the excitation electrode 81 in the Z′-axis direction, and the variation of the series resistance value with respect to the displacement of the excitation electrode 81 in the Z′-axis direction. It turns out that it is not directly related to. In addition, the B line shown in FIG. 11 has shown the approximate line.

  In this embodiment, the crystal resonator 1 is used as the piezoelectric vibration device. However, the present invention is not limited to this, and a piezoelectric oscillator, preferably a crystal having a circuit element that constitutes an oscillation circuit with a crystal diaphragm. It may be an oscillator.

  Further, although the crystal plate 7 according to the present embodiment is formed in a plate-like body composed of the side 75 in the X-axis direction and the side 76 in the Z′-axis direction, the present invention is not limited to this. That is, as long as the main surface is configured by a surface having an X-axis direction and a Z′-axis direction, and the displacement of the excitation electrode in the X direction can be set, the main surface is a plate-like body having a circular shape. It may be a form.

  Moreover, in this Embodiment, although the auxiliary | assistant support body 24 is integrally formed in the package 2, it is not limited to this, A separate member may be sufficient. Moreover, the structure which contacts the one side part 21 end surface inside the box shape of the package 2 as shown in FIG. 1 may not be sufficient.

  The present invention can be applied to a piezoelectric vibrating piece provided in an electronic apparatus and a piezoelectric vibrating device equipped with the piezoelectric vibrating piece. It is particularly suitable when the piezoelectric vibrating piece is a quartz vibrating piece. Further, it can be preferably used when the piezoelectric vibration device is a crystal resonator.

It is the side view which exhibited the inside of the crystal oscillator concerning this Embodiment. It is a top view of the crystal vibrating piece concerning this Embodiment. It is a plane sectional view of the mask part with which the vapor deposition apparatus for forming an electrode pattern in a crystal plate was equipped. It is a top view of the spacer which accommodated the crystal plate used as the base of the crystal vibrating piece concerning this Embodiment. FIG. 3 is a plan view of a spacer that accommodates a crystal plate serving as a base of a crystal resonator element according to the first embodiment. It is a top view of the spacer which accommodated the quartz plate used as the base of the quartz crystal resonator element concerning the prior art example 1 used in the present Example 1. FIG. 3 is a graph showing measurement results of series resistance values of the crystal vibrating piece 3 according to Example 1 and the crystal vibrating piece 3 of Conventional Example 1. FIG. It is the graph which showed the relationship between the distance r of the end surface of the excitation electrode formed in the quartz plate, and the other end part end surface of a quartz plate, and a series resistance value. 6 is a graph showing measurement results of series resistance values of the quartz crystal vibrating piece 3 according to Example 2 and the quartz crystal vibrating piece 3 of Conventional Example 1. FIG. FIG. 6 is a plan view of a crystal resonator element when the center position of an excitation electrode formed on a crystal plate is shifted in the Z′-axis direction. It is the graph which showed the relationship between the deviation | shift amount to the Z'-axis direction of the excitation electrode formed in the quartz plate, and series resistance value.

Explanation of symbols

1 Crystal resonator (piezoelectric vibration device)
3 Crystal vibrating piece (piezoelectric vibrating piece)
7 Crystal plate (plate)
71 One end of crystal plate (one end of main surface)
73, 74 Main surface 75 Side 76 in the X-axis direction Side 82 in the Z′-axis direction Center position 84 of the excitation electrode in the X-axis direction Connection electrode 85 Extraction electrode 91 Excitation electrode

Claims (3)

The main surface is a plate-like body composed of a surface having an X-axis direction and a Z′-axis direction, and an excitation electrode is formed in a substantially central region of both the main surfaces, and the X-axis direction of both the main surfaces is In the piezoelectric vibrating piece in which a connection electrode for conducting to the outside is formed at one end, and an extraction electrode for conducting the excitation electrode and the connection electrode is formed on each main surface,
The center position of the excitation electrode in the X-axis direction is shifted to the connection electrode side from the position that bisects the length of the plate-like body in the X-axis direction excluding the length of the connection electrode in the X-axis direction. A piezoelectric vibrating piece characterized by being set at a different position. The piezoelectric vibrating piece according to claim 1,
A piezoelectric vibrating piece characterized in that the oscillation is high-order overtone oscillation.   A piezoelectric vibration device comprising the piezoelectric vibrating piece according to claim 1 or 2 mounted thereon.

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