JP2017017201A - Washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a washing device that can effectively wash a wafer and further facilitate exchange of a sponge.SOLUTION: A cleaning device (1) cleans a wafer (W) by rotating a holding table (16) holding the wafer (W) and moving, on the surface of the wafer, a sponge bullet filled portion (41) in which a plurality of sponge bullets (35) are filled in series. The sponge bullet includes a columnar sponge (36) and a case portion (37) exposing the tip of the columnar sponge. The sponge bullet filled portion (41) includes a tubular body (42) for housing the sponge bullets, and a gripping portion (51) for gripping the leading sponge bullet in the tubular body, and pays out the sponge bullet from the tubular body every time the holding portion is opened and closed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cleaning apparatus for scrub cleaning a wafer with a sponge.

  2. Description of the Related Art As a wafer cleaning apparatus, a cleaning apparatus is known in which a cleaning roller is applied to a surface of a wafer while supplying cleaning water (for example, see Patent Documents 1 and 2). In the cleaning apparatuses described in Patent Documents 1 and 2, since the peripheral surface of the sponge roller is cleaned by contacting the wafer, the sponge roller is used when the surface of the wafer is uneven or the wafer is warped. However, there are places where the wafer cannot be cleaned away from the wafer surface. For this reason, there has also been proposed a cleaning apparatus that cleans a small columnar sponge while supplying cleaning water by scanning the surface of the rotating wafer in the radial direction (see, for example, Patent Documents 3 and 4).

JP-A-10-321572 Japanese Patent Laid-Open No. 11-031674 JP 2002-198345 A Japanese Patent No. 3964517

  In the cleaning apparatuses described in Patent Documents 3 and 4, it is possible to remove fine processing waste adhering to the surface of the wafer that is difficult to wipe off. However, if the surface of the wafer is continuously cleaned with a small columnar sponge, processing waste may adhere to the columnar sponge and damage the wafer. In this case, it is necessary to frequently replace the columnar sponge, but the replacement work is troublesome.

  This invention is made | formed in view of this point, and it aims at providing the washing | cleaning apparatus which can wash | clean a wafer effectively and can also make replacement | exchange of sponge easy.

  The cleaning device of the present invention is a cleaning device for cleaning the surface of a wafer with a sponge, a holding table for holding the wafer, a rotating means for rotating the holding table, and a sponge bullet loading unit for loading sponge bullets in series. And a means for moving the sponge bullet loading portion toward and away from the surface of the wafer held by the holding table, and a washing water supply means for supplying washing water. A case portion that exposes the front end of the columnar sponge and accommodates a rear end thereof, and the sponge bullet loading portion includes an inner peripheral cylindrical body that is larger than an outer periphery of the case portion, and a single one from the cylindrical body. A sponge part that exposes the columnar sponge of the sponge bullet and clamps the case part, and the sponge bullet can be exchanged by opening and closing the clamp part.

  According to this configuration, the wafer can be effectively cleaned by bringing the tip of the sponge-like columnar sponge into contact with the surface of the rotating wafer. Also, when the columnar sponge is soiled, the sandwiching portion of the sponge bullet filling portion is opened and closed, so that a plurality of sponge bullets filled in series with the cylindrical body advance, and the leading sponge bullet can be discarded. it can. At the same time, the columnar sponge of a new sponge bullet is exposed from the cylinder, and the wafer can be cleaned with the tip of the new columnar sponge. Thus, sponge bullets can be easily exchanged by opening and closing the clamping part, and the cleaning effect can be continuously maintained.

  According to the present invention, a plurality of sponge bullets are serially filled into the cylinder of the sponge bullet filling portion, and the sponge bullet is advanced by the sandwiching portion, so that the sponge bullet can be easily replaced, Further, the wafer can be effectively cleaned by the sponge-like columnar sponge.

1 is an external perspective view of a cleaning device according to a first embodiment. It is a perspective view of the sponge bullet concerning a 1st embodiment. It is a cross-sectional schematic diagram of the sponge bullet filling part which concerns on 1st Embodiment. It is explanatory drawing of the exchange operation | work of the sponge bullet which concerns on 1st Embodiment. It is explanatory drawing of the washing | cleaning operation | movement by the washing | cleaning apparatus which concerns on 1st Embodiment. It is explanatory drawing of the replacement | exchange operation | work of the sponge bullet which concerns on 2nd Embodiment. It is a cross-sectional schematic diagram of the sponge bullet and sponge bullet filling part which concerns on a modification.

  Hereinafter, the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is an external perspective view of the cleaning device according to the first embodiment. In addition, although the following description demonstrates the washing | cleaning apparatus integrated in a grinding apparatus, it is not limited to this structure. For example, the cleaning device may be incorporated in another processing device.

  As shown in FIG. 1, the cleaning device 1 is configured to perform scrub cleaning while rotating a holding table 16 that holds a wafer W and rotating a columnar sponge 36 in a radial direction on the surface of the wafer W. The wafer W may be an object to be cleaned and may be a semiconductor substrate such as silicon or gallium arsenide, or a ceramic, glass or sapphire inorganic material substrate. The wafer W may be a semiconductor wafer in which a semiconductor device is formed on a semiconductor substrate, or an optical device wafer in which an optical device is formed on an inorganic material substrate. Further, since cleaning is performed with the small columnar sponge 36, it is possible to cope with a wafer W having an uneven surface or a wafer W having a flat surface.

  The cleaning case 11 of the cleaning device 1 is formed in a bottomed cylindrical shape in which a circular base 13 is provided at the lower part of a cylindrical peripheral wall portion 12. The cleaning case 11 is positioned above the base plate 15 via a plurality of (three in the present embodiment) leg portions 14 provided on the lower surface of the circular base 13. A holding table 16 that holds the wafer W is rotatably accommodated in the cleaning case 11. The holding table 16 has a holding surface 17 made of a porous ceramic material, and the wafer W is sucked and held by the negative pressure generated on the holding surface 17. A rotating means 22 such as a motor is connected to the center of the lower surface of the holding table 16 via a rotating shaft 21.

  The rotating means 22 is supported by lifting / lowering means 23 arranged on the base plate 15. The holding table 16 is rotated at high speed in the cleaning case 11 by the rotating means 22 via the rotating shaft 21, and is moved up and down integrally with the rotating means 22 and the rotating shaft 21 by the lifting means 23. In the cleaning case 11, an L-shaped swiveling shaft 25 is supported by a moving means 26, and a cylindrical body 42 that holds a columnar sponge 36 is provided at the tip of the swiveling shaft 25. The moving means 26 moves the swivel shaft 25 in a swiveling and up-and-down movement so that the tip of the columnar sponge 36 held by the cylindrical body 42 approaches and separates from the surface of the wafer W.

  The cylindrical body 42 is provided with cleaning water supply means 31 (see FIG. 5) for supplying cleaning water to the wafer W. The cleaning water supply means 31 is configured by attaching a nozzle 33 connected to a cleaning water supply source 32 to the cylindrical body 42, and the cleaning water is jetted from the nozzle 33 toward the contact position between the columnar sponge 36 and the wafer W. . The cleaning device 1 is used for cleaning the wafer W after grinding. However, the processing waste after grinding is fine, and if the processing waste adheres to the small columnar sponge 36, it cannot be used in a short time. For this reason, when cleaning the wafer W after grinding, the columnar sponge 36 must be replaced with a new one before the dirt accumulates.

  The cleaning apparatus 1 according to the present embodiment is made by paying attention to the necessity of frequently replacing the columnar sponge 36 when cleaning the wafer W after grinding. The sponge bullet 35 to which the columnar sponge 36 is attached is used. (See FIG. 2) is provided with a sponge bullet filling portion 41 that can be continuously launched. The sponge bullets 35 filled in the cylindrical body 42 by the sponge bullet filling unit 41 are sequentially delivered from the cylindrical body 42, whereby the used sponge bullets 35 are discarded, and the column sponge 36 of a new sponge bullet 35 is replaced by the cylindrical body. 42 protrudes from 42. With such a configuration, it is possible to always clean the wafer W with the clean columnar sponge 36.

  Hereinafter, with reference to FIG.2 and FIG.3, a sponge bullet and a sponge bullet filling part are demonstrated in detail. FIG. 2 is a perspective view of the sponge bullet according to the first embodiment. FIG. 3 is a schematic cross-sectional view of the sponge bullet filling portion according to the first embodiment.

  As shown in FIG. 2, the sponge bullet 35 is configured by housing the rear end of the columnar sponge 36 in a case portion 37 so that the tip of the columnar sponge 36 is exposed. The columnar sponge 36 is formed in a columnar shape, and a scrubbing surface that contacts the surface of the wafer W is formed by fine pores. The case portion 37 is formed into a bottomed cylindrical shape with resin, metal, or the like, and is configured to be accommodated in a state in which the columnar sponge 36 is partially protruded. The inner diameter of the case portion 37 is formed slightly smaller than the outer diameter of the columnar sponge 36 and is attached to the case portion 37 in a state where the rear end side of the columnar sponge 36 is contracted.

  Thus, in the sponge bullet 35, the columnar sponge 36 is held on the case portion 37 by the repulsive force of the columnar sponge 36. Therefore, it is not necessary to bond the columnar sponge 36 to the case portion 37 with an adhesive or the like, and the sponge bullet 35 can be easily assembled. Since the columnar sponge 36 can be attached to and detached from the case portion 37, the case portion 37 can be reused by removing the used columnar sponge 36 from the case portion 37 and replacing it with a new columnar sponge 36. In this case, it is preferable that the case portion 37 is made of metal in consideration of the durability of the case portion 37.

  Further, a recess 38 (see FIG. 3) is formed on the rear end side of the case portion 37, and the recess 38 accommodates the tip end portion of the columnar sponge 36 protruding from the subsequent sponge bullet 35. Since the inner diameter of the concave portion 38 of the case portion 37 is formed larger than the outer diameter of the columnar sponge 36, the front and rear sponge bullets 35 are not connected to the columnar sponge 36 by the concave portion 38 of the case portion 37. Furthermore, the outer peripheral surface of the case part 37 is formed with a recess 39 into which a claw part 54 of a movable piece 53 of a clamping part 51 (see FIG. 3) described later enters. When the claw portion 54 of the movable piece 53 enters the recess 39 of the case portion 37, the sponge bullet 35 is prevented from coming off with respect to the sponge bullet filling portion 41 (see FIG. 3).

  As shown in FIG. 3, the sponge bullet filling portion 41 has a cylindrical body 42 that can be filled with a plurality of sponge bullets 35 in series. The cylindrical body 42 is formed so that the inner circumference (inner diameter) is larger than the outer circumference (outer diameter) of the sponge bullet 35, one end 43 serving as a filling port for the sponge bullet 35, and a disposal port for the sponge bullet 35. The other end 44 is opened. Further, on the other end 44 side of the cylindrical body 42, a clamping part 51 that clamps the case part 37 of the sponge bullet 35 between the inner peripheral surface of the cylindrical body 42 is provided. The sandwiching portion 51 is configured by connecting a long movable piece 53 to the outer peripheral surface of the cylindrical body 42 via a hinge portion 52 so as to be opened and closed.

  The distal end of the movable piece 53 is a claw portion 54 bent toward the cylindrical body 42, and is accommodated in a through hole 45 formed on the other end 44 side of the cylindrical body 42. A torsion spring 55 is attached to the hinge portion 52, one end of the torsion spring 55 is fixed to the outer peripheral surface of the cylindrical body 42, and the other end of the torsion spring 55 is fixed to the movable piece 53. The claw portion 54 of the movable piece 53 is always pressed toward the inside of the cylindrical body 42 by the torsion spring 55. Therefore, when the through hole 45 of the cylindrical body 42 and the recess 39 of the sponge bullet 35 coincide, the claw portion 54 of the movable piece 53 enters the recess 39 of the sponge bullet 35, and the movable piece 53 and the inner peripheral surface of the cylindrical body 42 The case portion 37 is held between the two.

  At this time, the through hole 45 of the cylindrical body 42 is formed at a position corresponding to the leading (lower end) sponge bullet 35. More specifically, the through hole 45 of the cylindrical body 42 and the depression 39 of the sponge bullet 35 are formed so as to coincide with each other at the position where the tip of the columnar sponge 36 of the leading sponge bullet 35 is exposed from the cylindrical body 42. Therefore, even when the sponge bullet 35 is replaced, the sponge bullet 35 can be held at an appropriate position where the tip of the new columnar sponge 36 is exposed from the cylindrical body 42. Further, a packing 58 is attached to the other end 44 of the cylindrical body 42, and the gap between the sponge bullet 35 and the cylindrical body 42 is sealed in a liquid-tight manner by the packing 58.

  As described above, in the sponge bullet filling portion 41, the case portion 37 of the sponge bullet 35 is sandwiched by the sandwiching portion 51 so that the columnar sponge 36 of one sponge bullet 35 is exposed from the other end 44. By opening and closing the clamping portion 51, the leading sponge bullet 35 is discarded from the other end 44 of the cylindrical body 42, and at the same time, a new sponge bullet 35 is exposed from the other end 44 of the cylindrical body 42, so that the sponge bullet 35 can be easily removed. It is possible to replace it.

  With reference to FIG. 4, the sponge bullet replacement operation will be described. FIG. 4 is an explanatory diagram of a sponge bullet replacement operation according to the first embodiment.

  As shown in FIG. 4A, a plurality of sponge bullets 35 are filled in series in the cylinder 42 of the sponge bullet filling portion 41, and each sponge bullet 35 is accommodated in the cylinder 42 in a state of being packed without gaps. ing. In the front and rear sponge bullets 35, the tips of the columnar sponges 36 of the rear sponge bullet 35 are inserted into the recesses 38 of the case portion 37 of the front sponge bullet 35, and a plurality of sponge bullets 35 are arranged in a row. When the leading sponge bullet 35 is replaced, the movable piece 53 of the clamping portion 51 is pushed against the repulsive force of the torsion spring 55 by the operator. As a result, the movable piece 53 opens in a direction away from the cylindrical body 42, and the claw portion 54 of the movable piece 53 is detached from the recess 39 of the leading sponge bullet 35.

  As shown in FIG. 4B, the claw portion 54 of the movable piece 53 that is removed from the recess 39 of the sponge bullet 35 rides on the outer peripheral surface of the case portion 37 of the leading sponge bullet 35. As a result, the lock of the leading sponge bullet 35 by the movable piece 53 is released, and the sponge bullets 35 in a row begin to slowly fall by their own weight. At this time, since the inner diameter of the cylindrical body 42 is larger than the outer diameter of the case portion 37 of the sponge bullet 35, the sponge bullet 35 is not prevented from dropping. In addition, since an appropriate braking force is applied to the leading sponge bullet 35 by the pressing force of the packing 58 and the movable piece 53 of the cylindrical body 42, all the rows of sponge bullets 35 do not fall at a stretch.

  As shown in FIG. 4C, when the claw portion 54 of the movable piece 53 enters the recess 39 of the succeeding sponge bullet 35, only the leading sponge bullet 35 falls into the collection box 59 prepared below the sponge bullet filling portion 41. To do. The tip of the columnar sponge 36 of the succeeding sponge bullet 35 is accommodated in the recess 38 of the leading sponge bullet 35. However, since the front and rear sponge bullets 35 are not connected to each other, only the leading sponge bullet 35 is dropped. be able to. Further, since the outer peripheral surfaces of the case portion 37 of the leading sponge bullet 35 and the succeeding sponge bullet 35 are flush with each other, the claw portion 54 of the movable piece 53 is inserted into the gap between the leading sponge bullet 35 and the succeeding sponge bullet 35. Never get in. Each time the operator opens and closes the clamping unit 51, the leading sponge bullet 35 is pushed out and replaced with a new sponge bullet 35.

  With reference to FIG. 5, the cleaning operation by the cleaning device will be briefly described. FIG. 5 is an explanatory diagram of a cleaning operation performed by the cleaning device according to the first embodiment.

  As shown in FIG. 5A, when the wafer W is placed on the holding table 16, the wafer W is held by the holding surface 17. A plurality of sponge bullets 35 are filled in series in the cylindrical body 42 of the sponge bullet filling portion 41, and the leading sponge bullet 35 is held on the movable piece 53 of the sandwiching portion 51 at a position protruding from the cylindrical body 42. . Further, the sponge bullet filling portion 41 is positioned at a position away from the wafer W, and cleaning water is sprayed from the nozzle 33 attached to the cylindrical body 42 toward the tip of the columnar sponge 36. Then, the sponge bullet filling portion 41 is lowered to a height at which the tip of the columnar sponge 36 contacts the surface of the wafer W.

  As shown in FIG. 5B, the holding table 16 is rotated at a high speed by the rotating means 22, and the sponge bullet filling portion 41 is turned by the moving means 26 (see FIG. 1). Thus, the surface of the wafer W is scrubbed and cleaned by the tip of the columnar sponge 36 while the cleaning water is jetted from the nozzle 33. At this time, since the columnar sponge 36 is small, it is possible to clean along the surface of the wafer W even when the surface of the wafer W is warped or uneven. As shown in FIG. 5C, when the columnar sponge 36 begins to get dirty, the sponge bullet filling portion 41 moves right above the collection box 59, and the leading sponge bullet 35 is discarded by opening and closing the clamping portion 51, The sponge bullet 35 is replaced.

  As described above, according to the cleaning apparatus 1 according to the first embodiment, the wafer W is effectively cleaned by bringing the tip of the columnar sponge 36 of the sponge bullet 35 into contact with the surface of the rotating wafer W. can do. Also, when the columnar sponge 36 is soiled, the sandwiching portion 51 of the sponge bullet filling portion 41 is opened and closed, so that the plurality of sponge bullets 35 filled in series with the cylindrical body 42 move forward, and the leading sponge bullet 35 can be discarded from the other end 44 of the cylinder 42. At the same time, the columnar sponge 36 of the new sponge bullet 35 is exposed from the other end 44 of the cylindrical body 42, and the wafer W can be cleaned with the tip of the new columnar sponge 36. Thus, the sponge bullet 35 can be easily replaced by opening and closing the clamping part 51, and the cleaning effect can be continuously maintained.

  Next, a cleaning apparatus according to the second embodiment will be described with reference to FIG. The cleaning device according to the second embodiment is different from the first embodiment in that sponge bullets are automatically supplied to the sponge bullet filling unit by the sponge bullet supply means. Therefore, only differences from the first embodiment will be described, and description of common configurations will be omitted as much as possible. The same components as those in the first embodiment will be described with the same reference numerals. FIG. 6 is an explanatory diagram of sponge bullet replacement work according to the second embodiment.

  As shown in FIG. 6A, the cylindrical body 42 of the sponge bullet filling portion 41 is filled with a plurality of sponge bullets 35 in series, and each sponge bullet 35 is accommodated in the cylindrical body 42 in a state of being packed without any gaps. ing. Above the sponge bullet filling portion 41, a sponge bullet supply means 61 for supplying the sponge bullet 35 from one end 43 of the cylindrical body 42 is provided. The sponge bullet supply means 61 is configured to horizontally move the suction pad 63 connected to the suction source 62 with the horizontal mechanism 64 and to move up and down with the lifting mechanism 65. When the sponge bullet 35 is replaced, the additional sponge bullet 35 sucked by the suction pad 63 of the sponge bullet supply means 61 is positioned directly above the cylindrical body 42.

  As shown in FIG. 6B, the suction pad 63 is lowered, and the additional sponge bullet 35 sucked by the suction pad 63 is pressed against the last sponge bullet 35 in the cylindrical body 42. When the sponge bullets 35 connected in a row are pushed in, the movable piece 53 opens outwardly against the repulsive force of the torsion spring 55, and the claw portion 54 of the movable piece 53 is pushed out from the recess 39 of the leading sponge bullet 35. And the lock is released. In this case, the claw portion 54 of the movable piece 53 is chamfered so as to open the movable piece 53 by receiving the force in the pushing direction of the sponge bullet 35. In addition, since an appropriate braking force is applied to the leading sponge bullet 35 by the pressing force of the packing 58 and the movable piece 53 at the other end 44 of the cylindrical body 42, all the rows of sponge bullets 35 fall at once. There is no.

  As shown in FIG. 6C, when the suction pad 63 is lowered by one sponge bullet 35, the claw portion 54 of the movable piece 53 enters the recess 39 of the subsequent sponge bullet 35 and is prepared below the sponge bullet filling portion 41. Only the leading sponge bullet 35 falls into the collected box 59. Further, since the outer peripheral surfaces of the case portion 37 of the leading sponge bullet 35 and the succeeding sponge bullet 35 are flush with each other, the claw portion 54 of the movable piece 53 is inserted into the gap between the leading sponge bullet 35 and the succeeding sponge bullet 35. Never get in. Each time an additional sponge bullet 35 is filled by the sponge bullet supply means 61, the leading sponge bullet 35 is pushed out and replaced with a new sponge bullet 35.

  As described above, also in the cleaning device 1 according to the second embodiment, the sponge bullet 35 can be automatically replaced by the addition of the sponge bullet 35 by the sponge bullet supply means 61, and the cleaning effect is continuously provided. Can be maintained.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the first and second embodiments described above, the cleaning water is supplied toward the tip of the columnar sponge 36 by the nozzle 33 of the cleaning water supply means 31, but the present invention is not limited to this configuration. As shown in the modification of FIG. 7, the cleaning water may be directly supplied to the columnar sponge 36. In this case, flow paths 66 and 67 connected to the nozzle 33 are formed in the cylindrical body 42 of the sponge bullet filling portion 41 and the case portion 37 of the sponge bullet 35, respectively. The washing water sprayed from the nozzle 33 is directly supplied to the rear end side of the columnar sponge 36 through the flow paths 66 and 67. Therefore, since cleaning water continues to come out from the columnar sponge 36, it is difficult for processing waste to adhere to the columnar sponge 36.

  In the second embodiment described above, the sponge bullet filling portion 41 is positioned above the wafer W on the holding table 16 and the wafer W is cleaned from above. It is not limited. In the second embodiment, the wafer W may be cleaned from below with the holding surface 17 of the holding table 16 facing downward. In this case, the sponge bullet supply means 61 fills the cylinder 42 of the sponge bullet filling portion 41 with the additional sponge bullet 35 from below. Further, the sponge bullet filling portions 41 may be provided on the upper and lower sides of the wafer W so as to clean the wafer W from the upper and lower sides.

  In the first and second embodiments described above, the holding table 16 sucks and holds the wafer W. However, the present invention is not limited to this structure. The holding table 16 only needs to hold the wafer W. For example, when the wafer W is supported by a ring frame via an adhesive tape, the wafer W may be configured by a frame clamp that holds the ring frame using centrifugal force.

  In the first and second embodiments described above, the moving means 26 is configured to cause the sponge bullet filling portion 41 to pivot and move up and down, but is not limited to this configuration. The moving means 26 may be configured to move the sponge bullet filling portion 41 toward and away from the surface of the wafer W held by the holding table 16. For example, the moving means 26 moves horizontally in the radial direction of the wafer W. Further, it may be configured to move up and down in the vertical direction perpendicular to the wafer W.

  In the first and second embodiments described above, the columnar sponge 36 is formed in a columnar shape, but is not limited to this configuration. The columnar sponge 36 only needs to be attached to the case portion 37 so that the tip of the columnar sponge 36 protrudes. For example, the columnar sponge 36 may be formed in a prismatic shape.

  Further, in the first and second embodiments described above, the clamping part 51 presses the claw part 54 of the movable piece 53 against the sponge bullet 35 so that the claw part 54 of the movable piece 53 and the inner surface of the cylindrical body 42 However, the present invention is not limited to this configuration. The clamping part 51 should just be comprised so that the head sponge bullet 35 can be hold | maintained in the cylinder 42. FIG.

  In the first and second embodiments described above, the recess 39 is partially formed in the case portion 37 of the sponge bullet 35. However, the present invention is not limited to this configuration. The recess 39 may be formed over the entire circumference of the case portion 37. Accordingly, the sponge bullet 35 can be held by the claw portion 54 of the movable piece 53 regardless of the direction of the sponge bullet 35.

  As described above, the present invention has an effect that the wafer can be effectively cleaned and the sponge can be easily replaced. In particular, the wafer after grinding or polishing can be obtained. It is useful for a cleaning device that can be cleaned.

DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 16 Holding table 22 Rotating means 26 Moving means 31 Washing water supply means 35 Sponge bullet 36 Columnar sponge 37 Case part 41 Sponge bullet filling part 42 Cylindrical body 51 Clamping part 53 Movable piece 54 Claw part 61 Sponge bullet supply means W Wafer

Claims (1)

A cleaning device for cleaning the surface of a wafer with a sponge,
A holding table for holding the wafer, a rotating means for rotating the holding table, a sponge bullet loading portion for loading sponge bullets in series, and the sponge bullet loading portion approaching the surface of the wafer held by the holding table And a moving means for separating, and a washing water supply means for supplying washing water,
The sponge bullet includes a columnar sponge, and a case portion that exposes the front end of the columnar sponge and accommodates the rear end thereof,
The sponge bullet loading unit includes an inner cylinder that is larger than the outer circumference of the case, and a clamping unit that exposes the columnar sponge of one sponge bullet from the cylinder and clamps the case.
A cleaning device characterized in that the sponge bullet can be exchanged by opening and closing the clamping portion.

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