JP2017015519A5 - - Google Patents

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Publication number
JP2017015519A5
JP2017015519A5 JP2015131486A JP2015131486A JP2017015519A5 JP 2017015519 A5 JP2017015519 A5 JP 2017015519A5 JP 2015131486 A JP2015131486 A JP 2015131486A JP 2015131486 A JP2015131486 A JP 2015131486A JP 2017015519 A5 JP2017015519 A5 JP 2017015519A5
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JP
Japan
Prior art keywords
semiconductor device
heat dissipation
mounting
heat
resistance
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JP2015131486A
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English (en)
Japanese (ja)
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JP2017015519A (ja
JP6652337B2 (ja
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Priority claimed from JP2015131486A external-priority patent/JP6652337B2/ja
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Publication of JP2017015519A5 publication Critical patent/JP2017015519A5/ja
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Publication of JP6652337B2 publication Critical patent/JP6652337B2/ja
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JP2015131486A 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 Expired - Fee Related JP6652337B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015131486A JP6652337B2 (ja) 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015131486A JP6652337B2 (ja) 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置

Publications (3)

Publication Number Publication Date
JP2017015519A JP2017015519A (ja) 2017-01-19
JP2017015519A5 true JP2017015519A5 (enrdf_load_stackoverflow) 2018-06-21
JP6652337B2 JP6652337B2 (ja) 2020-02-19

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ID=57830224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015131486A Expired - Fee Related JP6652337B2 (ja) 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置

Country Status (1)

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JP (1) JP6652337B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023209856A1 (ja) * 2022-04-27 2023-11-02 日立Astemo株式会社 車載制御装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594234A (en) * 1994-11-14 1997-01-14 Texas Instruments Incorporated Downset exposed die mount pad leadframe and package
JP2003297965A (ja) * 2002-03-29 2003-10-17 Toyota Motor Corp 半導体装置およびその製造方法
JP2004325363A (ja) * 2003-04-28 2004-11-18 Matsushita Electric Ind Co Ltd 実装済みプリント基板の検査方法およびプリント基板
JP2008166403A (ja) * 2006-12-27 2008-07-17 Toshiba Corp プリント配線板、プリント回路板、およびプリント回路板の接合部検査方法
US8823407B2 (en) * 2012-03-01 2014-09-02 Integrated Device Technology, Inc. Test assembly for verifying heat spreader grounding in a production test
US20150037575A1 (en) * 2012-03-30 2015-02-05 Showa Denko K.K. Curable heat radiation composition
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

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