JP2015035554A5 - - Google Patents

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Publication number
JP2015035554A5
JP2015035554A5 JP2013166808A JP2013166808A JP2015035554A5 JP 2015035554 A5 JP2015035554 A5 JP 2015035554A5 JP 2013166808 A JP2013166808 A JP 2013166808A JP 2013166808 A JP2013166808 A JP 2013166808A JP 2015035554 A5 JP2015035554 A5 JP 2015035554A5
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JP
Japan
Prior art keywords
terminal
exposed
resin sealing
sealing portion
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013166808A
Other languages
English (en)
Japanese (ja)
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JP2015035554A (ja
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Publication date
Application filed filed Critical
Priority to JP2013166808A priority Critical patent/JP2015035554A/ja
Priority claimed from JP2013166808A external-priority patent/JP2015035554A/ja
Publication of JP2015035554A publication Critical patent/JP2015035554A/ja
Publication of JP2015035554A5 publication Critical patent/JP2015035554A5/ja
Pending legal-status Critical Current

Links

JP2013166808A 2013-08-09 2013-08-09 半導体装置 Pending JP2015035554A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013166808A JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013166808A JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Publications (2)

Publication Number Publication Date
JP2015035554A JP2015035554A (ja) 2015-02-19
JP2015035554A5 true JP2015035554A5 (enrdf_load_stackoverflow) 2016-09-23

Family

ID=52543869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013166808A Pending JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Country Status (1)

Country Link
JP (1) JP2015035554A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6791794B2 (ja) * 2017-03-29 2020-11-25 旭化成エレクトロニクス株式会社 半導体装置
WO2019130474A1 (ja) * 2017-12-27 2019-07-04 三菱電機株式会社 半導体装置
CN108831871A (zh) * 2018-06-08 2018-11-16 郑州云海信息技术有限公司 一种提升qfn封装零件焊接质量的设计方法
JP7636186B2 (ja) * 2021-02-02 2025-02-26 ローム株式会社 半導体装置および検査方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3461720B2 (ja) * 1998-04-20 2003-10-27 松下電器産業株式会社 樹脂封止型半導体装置
JP2001177007A (ja) * 1999-12-21 2001-06-29 Hitachi Ltd 半導体装置及びその製造方法
JP3524545B2 (ja) * 2002-01-23 2004-05-10 松下電器産業株式会社 回路部品内蔵モジュールの製造方法
JP2007503721A (ja) * 2003-08-26 2007-02-22 アドバンスド インターコネクト テクノロジーズ リミテッド リバーシブル・リードレス・パッケージとその製造および使用方法

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