JP2016536804A5 - - Google Patents

Download PDF

Info

Publication number
JP2016536804A5
JP2016536804A5 JP2016542405A JP2016542405A JP2016536804A5 JP 2016536804 A5 JP2016536804 A5 JP 2016536804A5 JP 2016542405 A JP2016542405 A JP 2016542405A JP 2016542405 A JP2016542405 A JP 2016542405A JP 2016536804 A5 JP2016536804 A5 JP 2016536804A5
Authority
JP
Japan
Prior art keywords
light emitting
substrate
light
hole
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016542405A
Other languages
English (en)
Japanese (ja)
Other versions
JP6263628B2 (ja
JP2016536804A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2014/064106 external-priority patent/WO2015036887A1/en
Publication of JP2016536804A publication Critical patent/JP2016536804A/ja
Publication of JP2016536804A5 publication Critical patent/JP2016536804A5/ja
Application granted granted Critical
Publication of JP6263628B2 publication Critical patent/JP6263628B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016542405A 2013-09-13 2014-08-28 フリップチップｌｅｄ用のフレームベースのパッケージ Active JP6263628B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361877434P 2013-09-13 2013-09-13
US61/877,434 2013-09-13
US201461936360P 2014-02-06 2014-02-06
US61/936,360 2014-02-06
PCT/IB2014/064106 WO2015036887A1 (en) 2013-09-13 2014-08-28 Frame based package for flip-chip led

Publications (3)

Publication Number Publication Date
JP2016536804A JP2016536804A (ja) 2016-11-24
JP2016536804A5 true JP2016536804A5 (enExample) 2017-07-27
JP6263628B2 JP6263628B2 (ja) 2018-01-17

Family

ID=51743501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016542405A Active JP6263628B2 (ja) 2013-09-13 2014-08-28 フリップチップｌｅｄ用のフレームベースのパッケージ

Country Status (6)

Country Link
US (2) US9698323B2 (enExample)
EP (1) EP3044809B1 (enExample)
JP (1) JP6263628B2 (enExample)
KR (1) KR102264061B1 (enExample)
CN (1) CN105706237B (enExample)
WO (1) WO2015036887A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3044809B1 (en) * 2013-09-13 2019-04-24 Lumileds Holding B.V. Frame based package for flip-chip led
EP3093894B1 (en) * 2015-05-15 2020-08-05 OSRAM GmbH A method of producing lighting devices and corresponding device
US10763404B2 (en) * 2015-10-05 2020-09-01 Maven Optronics Co., Ltd. Light emitting device with beveled reflector and manufacturing method of the same
JP2017116372A (ja) * 2015-12-24 2017-06-29 日東電工株式会社 蛍光体層付光半導体素子の検査方法
US11424396B2 (en) 2015-12-29 2022-08-23 Lumileds Llc Flip chip LED with side reflectors and phosphor
CN109983589B (zh) 2015-12-29 2022-04-12 亮锐控股有限公司 具有侧面反射器和磷光体的倒装芯片led
DE102016104202A1 (de) 2016-03-08 2017-09-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
DE102016112293A1 (de) * 2016-07-05 2018-01-11 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement
DE102016115629A1 (de) 2016-08-23 2018-03-01 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen bauelements
WO2018036618A1 (en) * 2016-08-23 2018-03-01 Osram Opto Semiconductors Gmbh Method for producing a plurality of optoelectronic devices and optoelectronic device
DE102017103328A1 (de) * 2017-02-17 2018-08-23 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Konversionsvorrichtung mit einem Konversionselement und einer Streumaterialbeschichtung
KR20190033979A (ko) * 2017-09-22 2019-04-01 주식회사 루멘스 색 변환 전극부를 갖는 수직형 발광소자
KR20190051205A (ko) * 2017-11-06 2019-05-15 주식회사 루멘스 엘이디 패키지
DE102017130574A1 (de) * 2017-12-19 2019-06-19 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Konversionselements und Konversionselement
EP3543776B1 (en) * 2018-03-23 2024-06-26 Maven Optronics Co., Ltd. Chip-scale linear light-emitting device
DE102018121338A1 (de) 2018-08-31 2020-03-05 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung, optoelektronische beleuchtungseinrichtung und herstellungsverfahren
CN111969089A (zh) * 2020-08-27 2020-11-20 昆山兴协和光电科技有限公司 一种小角度发光装置及其制造方法
JP7594881B2 (ja) * 2020-10-22 2024-12-05 スタンレー電気株式会社 半導体発光装置及び半導体発光モジュール
JP7621783B2 (ja) 2020-12-10 2025-01-27 スタンレー電気株式会社 半導体発光装置及び半導体発光素子の支持基板
DE102022112418A1 (de) * 2022-05-18 2023-11-23 Ams-Osram International Gmbh Optoelektronische vorrichtung und verfahren zur herstellung einer optoelektronischen vorrichtung

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US6184544B1 (en) * 1998-01-29 2001-02-06 Rohm Co., Ltd. Semiconductor light emitting device with light reflective current diffusion layer
DE10041328B4 (de) * 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
JP4280050B2 (ja) 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
JP2004192720A (ja) * 2002-12-11 2004-07-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
CN101138094B (zh) * 2005-03-09 2010-10-13 旭化成电子材料元件株式会社 光学器件及光学器件的制造方法
CN100394621C (zh) * 2005-07-29 2008-06-11 东莞市福地电子材料有限公司 氮化镓基发光二极管芯片的制造方法
WO2007147278A2 (de) * 2006-06-21 2007-12-27 Gerhard Staufert Led-lichtquelle und verfahren
US7791096B2 (en) * 2007-06-08 2010-09-07 Koninklijke Philips Electronics N.V. Mount for a semiconductor light emitting device
KR101517644B1 (ko) * 2007-11-29 2015-05-04 니치아 카가쿠 고교 가부시키가이샤 발광장치 및 그 제조방법
CN102149965B (zh) * 2008-09-05 2016-08-31 皇家飞利浦电子股份有限公司 灯总成
US20100207140A1 (en) 2009-02-19 2010-08-19 Koninklijke Philips Electronics N.V. Compact molded led module
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置
CN101587933B (zh) * 2009-07-07 2010-12-08 苏州晶方半导体科技股份有限公司 发光二极管的晶圆级封装结构及其制造方法
DE102009036621B4 (de) 2009-08-07 2023-12-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
KR101039881B1 (ko) * 2009-12-21 2011-06-09 엘지이노텍 주식회사 발광소자 및 그를 이용한 라이트 유닛
KR100986571B1 (ko) * 2010-02-04 2010-10-07 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
DE102010025319B4 (de) 2010-06-28 2022-05-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines oberflächenmontierbaren Halbleiterbauelements und oberflächenmontierbare Halbleiterbauelemente
US20120074434A1 (en) * 2010-09-24 2012-03-29 Jun Seok Park Light emitting device package and lighting apparatus using the same
JP5840377B2 (ja) * 2011-04-14 2016-01-06 日東電工株式会社 反射樹脂シートおよび発光ダイオード装置の製造方法
JP5745319B2 (ja) * 2011-04-14 2015-07-08 日東電工株式会社 蛍光反射シート、および、発光ダイオード装置の製造方法
KR20130014256A (ko) * 2011-07-29 2013-02-07 엘지이노텍 주식회사 발광 소자 패키지 및 이를 이용한 조명 시스템
KR101219106B1 (ko) * 2011-08-01 2013-01-11 삼성전자주식회사 발광소자 패키지 및 그 제조방법
WO2013056927A1 (de) * 2011-10-20 2013-04-25 Osram Gmbh Aufsatzstück für einen träger einer halbleiterleuchtvorrichtung
JP2013118210A (ja) * 2011-12-01 2013-06-13 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
CN104125902B (zh) * 2011-12-02 2018-04-06 电力科技控股有限责任公司 用于混合车辆中的燃料优化的系统和方法
WO2013112435A1 (en) * 2012-01-24 2013-08-01 Cooledge Lighting Inc. Light - emitting devices having discrete phosphor chips and fabrication methods
JP2014112669A (ja) * 2012-11-12 2014-06-19 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
CN105453277B (zh) * 2013-07-30 2018-01-30 国立研究开发法人情报通信研究机构 半导体发光元件及其制造方法
EP3044809B1 (en) * 2013-09-13 2019-04-24 Lumileds Holding B.V. Frame based package for flip-chip led
WO2015119858A1 (en) * 2014-02-05 2015-08-13 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods

Similar Documents

Publication Publication Date Title
JP2016536804A5 (enExample)
JP6263628B2 (ja) フリップチップｌｅｄ用のフレームベースのパッケージ
WO2017180393A3 (en) High density pixelated multi-led chip, devices incorporating it, and methods for fabricating the same
EP3875850A3 (en) Light-emitting device
JP2011254079A5 (enExample)
JP2015097235A5 (enExample)
ATE519227T1 (de) Zusammengesetzte led-module
US9506663B2 (en) Light-emitting heat-dissipating device
JP2016503342A5 (enExample)
JP2010537420A5 (enExample)
JP2014517489A5 (enExample)
TW200742135A (en) Light emitting diode package
EP2056363A3 (en) Light emitting diode package and method for fabricating same
JP2017183578A5 (enExample)
JP2014075584A5 (enExample)
JP2009540615A5 (enExample)
TW200620718A (en) Bonding an optical element to a light emitting device
WO2013083528A3 (de) Halbleiterleuchte
WO2010150114A3 (en) Contact for a semiconductor light emitting device
JP2015008237A5 (enExample)
CN105409014A (zh) 用于生产转换器元件和光电组件的方法、转换器元件以及光电组件
JP2015505149A5 (enExample)
JP2009206504A5 (enExample)
JP2018531517A5 (enExample)
WO2012017304A3 (zh) 白光led装置及其制造方法