JP2016534299A5 - - Google Patents

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Publication number
JP2016534299A5
JP2016534299A5 JP2016534611A JP2016534611A JP2016534299A5 JP 2016534299 A5 JP2016534299 A5 JP 2016534299A5 JP 2016534611 A JP2016534611 A JP 2016534611A JP 2016534611 A JP2016534611 A JP 2016534611A JP 2016534299 A5 JP2016534299 A5 JP 2016534299A5
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JP
Japan
Prior art keywords
sealing groove
wall
dovetail
processing chamber
vacuum processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016534611A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016534299A (ja
JP6463755B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/050008 external-priority patent/WO2015023493A1/en
Publication of JP2016534299A publication Critical patent/JP2016534299A/ja
Publication of JP2016534299A5 publication Critical patent/JP2016534299A5/ja
Application granted granted Critical
Publication of JP6463755B2 publication Critical patent/JP6463755B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016534611A 2013-08-16 2014-08-06 半導体装置のためのシーリング溝の方法 Expired - Fee Related JP6463755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361866802P 2013-08-16 2013-08-16
US61/866,802 2013-08-16
PCT/US2014/050008 WO2015023493A1 (en) 2013-08-16 2014-08-06 Sealing groove methods for semiconductor equipment

Publications (3)

Publication Number Publication Date
JP2016534299A JP2016534299A (ja) 2016-11-04
JP2016534299A5 true JP2016534299A5 (cg-RX-API-DMAC7.html) 2017-09-14
JP6463755B2 JP6463755B2 (ja) 2019-02-06

Family

ID=52465965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016534611A Expired - Fee Related JP6463755B2 (ja) 2013-08-16 2014-08-06 半導体装置のためのシーリング溝の方法

Country Status (6)

Country Link
US (1) US9646807B2 (cg-RX-API-DMAC7.html)
JP (1) JP6463755B2 (cg-RX-API-DMAC7.html)
KR (1) KR102178150B1 (cg-RX-API-DMAC7.html)
CN (1) CN105474373B (cg-RX-API-DMAC7.html)
TW (1) TWI641043B (cg-RX-API-DMAC7.html)
WO (1) WO2015023493A1 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6339866B2 (ja) * 2014-06-05 2018-06-06 東京エレクトロン株式会社 プラズマ処理装置およびクリーニング方法
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
KR20180112794A (ko) * 2016-01-22 2018-10-12 어플라이드 머티어리얼스, 인코포레이티드 전도성 층들이 매립된 세라믹 샤워헤드
US20190368610A1 (en) * 2016-12-08 2019-12-05 Harmonic Drive Systems Inc. Seal structure with o-ring
JP7077072B2 (ja) * 2018-03-08 2022-05-30 株式会社アルバック プラズマ処理装置、および、プラズマ処理方法
JP7281968B2 (ja) * 2019-05-30 2023-05-26 東京エレクトロン株式会社 アリ溝加工方法及び基板処理装置
US20210020484A1 (en) * 2019-07-15 2021-01-21 Applied Materials, Inc. Aperture design for uniformity control in selective physical vapor deposition
CN113309905B (zh) * 2021-06-22 2022-03-01 中国核动力研究设计院 一种热室用保温贯穿装置
US12421826B1 (en) 2024-08-30 2025-09-23 Schlumberger Technology Corporation Sealing device

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US1303090A (en) * 1919-05-06 Thomas mcceay
US2889183A (en) * 1955-12-07 1959-06-02 Renault Packing ring
US4264009A (en) * 1977-04-27 1981-04-28 Tattam Francis E Box having a security strip
US4400137A (en) * 1980-12-29 1983-08-23 Elliott Turbomachinery Co., Inc. Rotor assembly and methods for securing a rotor blade therewithin and removing a rotor blade therefrom
US4564732A (en) * 1982-05-19 1986-01-14 Hi-Tek Corporation Dovetail base assembly for keyswitches
US4632060A (en) * 1984-03-12 1986-12-30 Toshiba Machine Co. Ltd Barrel type of epitaxial vapor phase growing apparatus
US5050534A (en) * 1989-08-03 1991-09-24 Cryco Twenty-Two, Inc. Mobile injector system
JPH04127460A (ja) * 1990-09-18 1992-04-28 Nec Corp 混成集積回路装置
US5080556A (en) * 1990-09-28 1992-01-14 General Electric Company Thermal seal for a gas turbine spacer disc
US6138353A (en) * 1998-01-05 2000-10-31 Mpr Associates, Inc. Method for repairing vertical welds in a boiling water reactor shroud
US6189821B1 (en) * 1999-03-25 2001-02-20 Raymond James Apparatus for plastic particle reduction using dove-tailed blade
US6245149B1 (en) * 1999-07-01 2001-06-12 Applied Materials, Inc. Inert barrier for high purity epitaxial deposition systems
FR2807976B1 (fr) * 2000-04-20 2002-06-28 Plastic Omnium Cie Reservoir a carburant de vehicule automobile
JP3590794B2 (ja) 2002-02-21 2004-11-17 益岡産業株式会社 アリ溝用シール材
JP3988557B2 (ja) * 2002-07-17 2007-10-10 株式会社ジェイテクト 転がり軸受装置
JP4962687B2 (ja) * 2005-08-30 2012-06-27 Ｎｏｋ株式会社 密封構造
GB0721383D0 (en) * 2007-10-31 2007-12-12 Aes Eng Ltd Bearing plate
KR101389247B1 (ko) * 2010-03-31 2014-04-24 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 플라즈마 처리 방법
US9349621B2 (en) * 2011-05-23 2016-05-24 Lam Research Corporation Vacuum seal arrangement useful in plasma processing chamber
KR101248382B1 (ko) * 2012-06-27 2013-04-02 시스템디엔디(주) 다단 밀봉구조를 갖는 밸브장치

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