JP2016533422A5 - - Google Patents
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- Publication number
- JP2016533422A5 JP2016533422A5 JP2016545261A JP2016545261A JP2016533422A5 JP 2016533422 A5 JP2016533422 A5 JP 2016533422A5 JP 2016545261 A JP2016545261 A JP 2016545261A JP 2016545261 A JP2016545261 A JP 2016545261A JP 2016533422 A5 JP2016533422 A5 JP 2016533422A5
- Authority
- JP
- Japan
- Prior art keywords
- species
- aromatic
- substituted
- range
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 241000894007 species Species 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 125000005647 linker group Chemical group 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 125000000732 arylene group Chemical group 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 125000000623 heterocyclic group Chemical group 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- 241000282941 Rangifer tarandus Species 0.000 claims 1
- 125000005024 alkenyl aryl group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000002877 alkyl aryl group Chemical group 0.000 claims 1
- 125000005025 alkynylaryl group Chemical group 0.000 claims 1
- 125000005018 aryl alkenyl group Chemical group 0.000 claims 1
- 125000006270 aryl alkenylene group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000005015 aryl alkynyl group Chemical group 0.000 claims 1
- 229920001400 block copolymer Polymers 0.000 claims 1
- 150000002431 hydrogen Chemical group 0.000 claims 1
- -1 polysiloxane Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 125000000547 substituted alkyl group Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361884844P | 2013-09-30 | 2013-09-30 | |
| US61/884,844 | 2013-09-30 | ||
| PCT/US2014/058000 WO2015048621A1 (en) | 2013-09-30 | 2014-09-29 | Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016533422A JP2016533422A (ja) | 2016-10-27 |
| JP2016533422A5 true JP2016533422A5 (OSRAM) | 2018-01-18 |
| JP6378346B2 JP6378346B2 (ja) | 2018-08-22 |
Family
ID=52744560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016545261A Active JP6378346B2 (ja) | 2013-09-30 | 2014-09-29 | 大型ダイ半導体パッケージのための導電性ダイアタッチフィルムおよびその調製に有用な組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9449938B2 (OSRAM) |
| EP (1) | EP3052566B1 (OSRAM) |
| JP (1) | JP6378346B2 (OSRAM) |
| KR (1) | KR101909353B1 (OSRAM) |
| CN (1) | CN105473657B (OSRAM) |
| TW (1) | TWI651387B (OSRAM) |
| WO (1) | WO2015048621A1 (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9672798B1 (en) * | 2012-11-29 | 2017-06-06 | Flexcon Company, Inc. | Systems and methods for providing decorative drum shell wraps |
| TWI816636B (zh) * | 2015-10-15 | 2023-10-01 | 德商漢高股份有限及兩合公司 | 鎳及含鎳合金做為黏著劑調配物中之導電填料之用途 |
| KR20180123009A (ko) * | 2016-02-04 | 2018-11-14 | 헨켈 아이피 앤드 홀딩 게엠베하 | 탈결합가능한 접착제 및 그의 고온 용도 |
| US9892999B2 (en) * | 2016-06-07 | 2018-02-13 | Globalfoundries Inc. | Producing wafer level packaging using leadframe strip and related device |
| CN120003120A (zh) * | 2017-03-17 | 2025-05-16 | 汉高股份有限及两合公司 | 多层制品的工作寿命改善及其制备方法和用途 |
| KR102351843B1 (ko) * | 2017-06-07 | 2022-01-18 | 쇼와덴코머티리얼즈가부시끼가이샤 | 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치 |
| KR102156470B1 (ko) * | 2017-09-11 | 2020-09-15 | 주식회사 엘지화학 | 폴딩 안정성이 우수한 점착제의 선정방법 |
| US11791237B2 (en) * | 2018-06-27 | 2023-10-17 | Intel Corporation | Microelectronic assemblies including a thermal interface material |
| JP7164386B2 (ja) * | 2018-10-04 | 2022-11-01 | タツタ電線株式会社 | 導電性塗料 |
| CN109971175B (zh) * | 2019-03-18 | 2021-09-21 | 苏州生益科技有限公司 | 改性马来酰亚胺树脂组合物及其制备的半固化片和层压板 |
| US12166004B2 (en) | 2019-05-08 | 2024-12-10 | Intel Corporation | Solder thermal interface material (STIM) with dopant |
| US12272614B2 (en) | 2019-05-28 | 2025-04-08 | Intel Corporation | Integrated circuit packages with solder thermal interface materials with embedded particles |
| US11682605B2 (en) | 2019-05-28 | 2023-06-20 | Intel Corporation | Integrated circuit packages with asymmetric adhesion material regions |
| CN112011181A (zh) * | 2019-05-31 | 2020-12-01 | 台光电子材料(昆山)有限公司 | 一种树脂组合物及其制品 |
| KR20210115293A (ko) * | 2020-03-12 | 2021-09-27 | 주식회사 두산 | 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판 |
| WO2025106944A1 (en) * | 2023-11-16 | 2025-05-22 | Henkel Ag & Co. Kgaa | Flexible conductive adhesive compositions |
| WO2025208057A1 (en) * | 2024-03-28 | 2025-10-02 | Henkel Ag & Co. Kgaa | Thermal conductivity promoter for electrically conductive compositions |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4020036A (en) | 1976-04-22 | 1977-04-26 | Phillips Petroleum Company | Thermosetting polyester composition containing normally solid carboxy-containing diene polymer |
| US4101604A (en) | 1977-07-18 | 1978-07-18 | The B. F. Goodrich Company | Unsaturated polyester molding compositions |
| US4160759A (en) | 1978-01-30 | 1979-07-10 | Exxon Research & Engineering Co. | Elastomer modified polyester molding compound |
| US4161471A (en) | 1978-04-13 | 1979-07-17 | E. I. Du Pont De Nemours And Company | Elastomer modified unsaturated molding compositions |
| JPS57205413A (en) * | 1981-06-11 | 1982-12-16 | Mitsui Toatsu Chem Inc | Curable resin composition |
| US5370921A (en) | 1991-07-11 | 1994-12-06 | The Dexter Corporation | Lightning strike composite and process |
| JPH0714962A (ja) | 1993-04-28 | 1995-01-17 | Mitsubishi Shindoh Co Ltd | リードフレーム材およびリードフレーム |
| US5717034A (en) | 1996-07-29 | 1998-02-10 | Quantum Materials, Inc. | Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor |
| US6750301B1 (en) * | 2000-07-07 | 2004-06-15 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
| US6583201B2 (en) * | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
| US6831132B2 (en) | 2002-03-28 | 2004-12-14 | Henkel Corporation | Film adhesives containing maleimide compounds and methods for use thereof |
| WO2004037878A2 (en) * | 2002-10-22 | 2004-05-06 | Henkel Corporation | Co-curable compositions |
| US7176044B2 (en) | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
| US7037447B1 (en) * | 2003-07-23 | 2006-05-02 | Henkel Corporation | Conductive ink compositions |
| US7326369B2 (en) | 2005-03-07 | 2008-02-05 | National Starch And Chemical Investment Holding Corporation | Low stress conductive adhesive |
| US20060235137A1 (en) * | 2005-04-18 | 2006-10-19 | Eunsook Chae | Die attach adhesives with improved stress performance |
| JP5228320B2 (ja) * | 2006-12-13 | 2013-07-03 | 住友ベークライト株式会社 | 樹脂組成物、支持基材付き絶縁材およびフレキシブルプリント回路板用金属張積層板 |
| US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
| WO2009014541A1 (en) * | 2007-07-26 | 2009-01-29 | Henkel Ag & Co. Kgaa | Alcohols containing imide moieties and reactive oligomers prepared therefrom |
| WO2009117345A2 (en) * | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
| WO2010016946A2 (en) * | 2008-08-08 | 2010-02-11 | Henkel Corporation | Low temperature curing compositions |
| JP5482077B2 (ja) * | 2009-10-09 | 2014-04-23 | 住友ベークライト株式会社 | 樹脂組成物及び樹脂組成物を使用して作製した半導体装置 |
| JP5356326B2 (ja) * | 2010-07-20 | 2013-12-04 | 日東電工株式会社 | 半導体装置の製造方法 |
| WO2012022011A1 (en) * | 2010-08-20 | 2012-02-23 | Ablestik (Shanghai) Limited | Stabilized, silver coated filler-containing curable compositions |
| KR20130102046A (ko) * | 2010-09-07 | 2013-09-16 | 스미또모 베이크라이트 가부시키가이샤 | 수지 조성물 및 수지 조성물을 사용해 제작한 반도체 장치 |
| CN102199413A (zh) * | 2011-03-26 | 2011-09-28 | 舟山维特新材料科技有限公司 | 一种聚酰亚胺柔性覆铜板用改性环氧树脂胶粘剂 |
| TWI569381B (zh) * | 2011-05-27 | 2017-02-01 | 住友電木股份有限公司 | 半導體裝置 |
| KR101722208B1 (ko) * | 2011-07-28 | 2017-05-02 | 주식회사 프로타빅 코리아 | 하이브리드 열경화 접착제 조성물 |
| US20140120356A1 (en) * | 2012-06-18 | 2014-05-01 | Ormet Circuits, Inc. | Conductive film adhesive |
| JP6272729B2 (ja) * | 2014-05-16 | 2018-01-31 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法 |
-
2014
- 2014-07-28 TW TW103125744A patent/TWI651387B/zh active
- 2014-09-29 CN CN201480042671.2A patent/CN105473657B/zh active Active
- 2014-09-29 EP EP14847431.5A patent/EP3052566B1/en active Active
- 2014-09-29 WO PCT/US2014/058000 patent/WO2015048621A1/en not_active Ceased
- 2014-09-29 JP JP2016545261A patent/JP6378346B2/ja active Active
- 2014-09-29 KR KR1020167007600A patent/KR101909353B1/ko active Active
-
2016
- 2016-01-29 US US15/010,531 patent/US9449938B2/en active Active
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