JP2016532974A5 - - Google Patents

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Publication number
JP2016532974A5
JP2016532974A5 JP2016538917A JP2016538917A JP2016532974A5 JP 2016532974 A5 JP2016532974 A5 JP 2016532974A5 JP 2016538917 A JP2016538917 A JP 2016538917A JP 2016538917 A JP2016538917 A JP 2016538917A JP 2016532974 A5 JP2016532974 A5 JP 2016532974A5
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JP
Japan
Prior art keywords
memory
umc
host interface
host
interface circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2016538917A
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English (en)
Japanese (ja)
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JP2016532974A (ja
Filing date
Publication date
Priority claimed from US14/016,717 external-priority patent/US10185515B2/en
Application filed filed Critical
Publication of JP2016532974A publication Critical patent/JP2016532974A/ja
Publication of JP2016532974A5 publication Critical patent/JP2016532974A5/ja
Ceased legal-status Critical Current

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JP2016538917A 2013-09-03 2014-07-09 マルチチップパッケージ上の異種メモリ用の統合メモリコントローラ Ceased JP2016532974A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/016,717 US10185515B2 (en) 2013-09-03 2013-09-03 Unified memory controller for heterogeneous memory on a multi-chip package
US14/016,717 2013-09-03
PCT/US2014/045983 WO2015034580A1 (en) 2013-09-03 2014-07-09 Unified memory controller for heterogeneous memory on a multi-chip package

Publications (2)

Publication Number Publication Date
JP2016532974A JP2016532974A (ja) 2016-10-20
JP2016532974A5 true JP2016532974A5 (https=) 2017-08-03

Family

ID=51293140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016538917A Ceased JP2016532974A (ja) 2013-09-03 2014-07-09 マルチチップパッケージ上の異種メモリ用の統合メモリコントローラ

Country Status (6)

Country Link
US (1) US10185515B2 (https=)
EP (1) EP3042295A1 (https=)
JP (1) JP2016532974A (https=)
KR (1) KR20160048911A (https=)
CN (1) CN105493061B (https=)
WO (1) WO2015034580A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102408613B1 (ko) 2015-08-27 2022-06-15 삼성전자주식회사 메모리 모듈의 동작 방법, 및 메모리 모듈을 제어하는 프로세서의 동작 방법, 및 사용자 시스템
US10268541B2 (en) 2016-08-15 2019-04-23 Samsung Electronics Co., Ltd. DRAM assist error correction mechanism for DDR SDRAM interface
KR102482896B1 (ko) 2017-12-28 2022-12-30 삼성전자주식회사 이종 휘발성 메모리 칩들을 포함하는 메모리 장치 및 이를 포함하는 전자 장치
US20210233585A1 (en) * 2020-01-29 2021-07-29 Micron Technology, Inc. Multichip memory package with internal channel
US12475068B2 (en) * 2022-09-15 2025-11-18 Micron Technology, Inc. Multi-interface memory

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100383774B1 (ko) 2000-01-26 2003-05-12 삼성전자주식회사 공통 인터페이스 방식의 메모리 장치들을 구비한 시스템
JP4049297B2 (ja) 2001-06-11 2008-02-20 株式会社ルネサステクノロジ 半導体記憶装置
JP4059002B2 (ja) 2001-06-13 2008-03-12 株式会社日立製作所 メモリ装置
KR101085406B1 (ko) 2004-02-16 2011-11-21 삼성전자주식회사 불 휘발성 메모리를 제어하기 위한 컨트롤러
WO2006080908A1 (en) 2005-01-25 2006-08-03 Chien-Chiang Chan A single chip having a magnetoresistive memory
CN101194235A (zh) 2005-06-09 2008-06-04 松下电器产业株式会社 存储器控制装置及存储器控制方法
US20060294295A1 (en) 2005-06-24 2006-12-28 Yukio Fukuzo DRAM chip device well-communicated with flash memory chip and multi-chip package comprising such a device
US8291295B2 (en) 2005-09-26 2012-10-16 Sandisk Il Ltd. NAND flash memory controller exporting a NAND interface
US7519754B2 (en) 2005-12-28 2009-04-14 Silicon Storage Technology, Inc. Hard disk drive cache memory and playback device
US20070147115A1 (en) 2005-12-28 2007-06-28 Fong-Long Lin Unified memory and controller
US7716411B2 (en) 2006-06-07 2010-05-11 Microsoft Corporation Hybrid memory device with single interface
TWI530791B (zh) 2007-01-10 2016-04-21 木比爾半導體股份有限公司 用於改善外部計算裝置效能的調適性記憶體系統
US8700830B2 (en) * 2007-11-20 2014-04-15 Spansion Llc Memory buffering system that improves read/write performance and provides low latency for mobile systems
CN101303885A (zh) 2008-07-01 2008-11-12 普天信息技术研究院有限公司 多芯片封装存储模块
US7778101B2 (en) 2008-09-05 2010-08-17 Genesys Logic, Inc. Memory module and method of performing the same
JP2011070470A (ja) 2009-09-28 2011-04-07 Toshiba Corp 半導体記憶装置

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