JP2016531004A5 - - Google Patents

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Publication number
JP2016531004A5
JP2016531004A5 JP2016532272A JP2016532272A JP2016531004A5 JP 2016531004 A5 JP2016531004 A5 JP 2016531004A5 JP 2016532272 A JP2016532272 A JP 2016532272A JP 2016532272 A JP2016532272 A JP 2016532272A JP 2016531004 A5 JP2016531004 A5 JP 2016531004A5
Authority
JP
Japan
Prior art keywords
workpiece
mirror
focusing optical
optical device
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016532272A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016531004A (ja
Filing date
Publication date
Priority claimed from DE102013215442.9A external-priority patent/DE102013215442A1/de
Application filed filed Critical
Publication of JP2016531004A publication Critical patent/JP2016531004A/ja
Publication of JP2016531004A5 publication Critical patent/JP2016531004A5/ja
Pending legal-status Critical Current

Links

JP2016532272A 2013-08-06 2014-06-17 レーザビームを用いた材料加工装置 Pending JP2016531004A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013215442.9 2013-08-06
DE102013215442.9A DE102013215442A1 (de) 2013-08-06 2013-08-06 Vorrichtung zur Materialbearbeitung mit einem Laserstrahl
PCT/EP2014/062679 WO2015018552A1 (de) 2013-08-06 2014-06-17 Vorrichtung zur materialbearbeitung mit einem laserstrahl

Publications (2)

Publication Number Publication Date
JP2016531004A JP2016531004A (ja) 2016-10-06
JP2016531004A5 true JP2016531004A5 (enExample) 2017-06-15

Family

ID=51033148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016532272A Pending JP2016531004A (ja) 2013-08-06 2014-06-17 レーザビームを用いた材料加工装置

Country Status (8)

Country Link
US (1) US20160158887A1 (enExample)
EP (1) EP3030375B1 (enExample)
JP (1) JP2016531004A (enExample)
KR (1) KR20160040205A (enExample)
CN (1) CN105473271A (enExample)
DE (1) DE102013215442A1 (enExample)
ES (1) ES2869908T3 (enExample)
WO (1) WO2015018552A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018192646A1 (en) 2017-04-19 2018-10-25 Volvo Truck Corporation A laser brazing system with a jig for contacting the brazing wire and for blocking a first part of a laser beam in association with a detector, method of monitoring a laser brazing system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487540A (en) * 1977-12-23 1979-07-12 Canon Inc Information processing terminal device
DE3339318C2 (de) * 1983-10-29 1995-05-24 Trumpf Gmbh & Co Laser-Bearbeitungsmaschine
US6034804A (en) * 1998-03-31 2000-03-07 The United States Of America As Represented By The Secretary Of The Navy Rapid, high-resolution scanning of flat and curved regions for gated optical imaging
JP4159738B2 (ja) * 2000-11-07 2008-10-01 株式会社小松製作所 ビームスキャン式レーザマーキング装置
US20020153639A1 (en) * 2001-01-22 2002-10-24 Hawkes Kimberly Suchar Method for marking a laminated film material
JP2003136267A (ja) * 2001-11-01 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
JP4660074B2 (ja) * 2003-05-26 2011-03-30 富士フイルム株式会社 レーザアニール装置
EP1547719A3 (en) * 2003-12-26 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing crystalline semiconductor film
EP1716963B1 (de) * 2005-04-26 2008-10-22 Highyag Lasertechnologie GmbH Optische Anordnung für die Remote-Laser-Materialbearbeitung zur Erzeugung eines dreidimensionalen Arbeitsraumes
JP4691166B2 (ja) * 2005-12-23 2011-06-01 トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト スキャナヘッド及び当該スキャナヘッドを用いた加工機器
EP1804100B1 (en) * 2005-12-30 2018-02-21 Datalogic IP TECH S.r.l. Device and method for focusing a laser light beam
FR2903923B1 (fr) * 2006-07-20 2008-09-26 Ly Son Systeme laser a noyau focal pour le travail thermique tel que le coupage, le percage, le soudage, le marquage et le traitement de surface de corps solide comme du metal.
JP2008194729A (ja) * 2007-02-13 2008-08-28 Fujitsu Ltd 小型デバイスの製造方法、レーザ加工方法及びレーザ加工装置
US8294062B2 (en) * 2007-08-20 2012-10-23 Universal Laser Systems, Inc. Laser beam positioning systems for material processing and methods for using such systems
JP6030299B2 (ja) * 2011-12-20 2016-11-24 株式会社ディスコ レーザー加工装置

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