JP2016530120A - 熱可塑性材料からなる予備成形体又は平面状又は予備成形された半製品を加熱する装置 - Google Patents
熱可塑性材料からなる予備成形体又は平面状又は予備成形された半製品を加熱する装置 Download PDFInfo
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- H05B3/40—Heating elements having the shape of rods or tubes
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
Description
材料の耐変形性は帯状の温度上昇により局所的に直ちに弱まる。帯状の温度上昇により、成形プロセスの開始時において特に強い伸延がもたらされ、成形プロセスの終了時において薄い壁厚がもたらされる。例えば、モールドのコーナー領域に薄いポイントが発生する時には、これらコーナー領域の「肥厚」を生成するより低温な加熱が原因で反対の挙動が実現される。
Claims (19)
- 熱可塑性樹脂からなる予備成形体又は平面状又は予備成形された半製品を加熱する装置であって、
その表面に少なくとも1つの第1層又はコーティング(1.1,2.1)が形成された少なくとも1つの本体(1.0,2.0)を備え、前記本体(1.0,2.0)は、幾何学的に平面的な形態で配置された導体ループが形成された少なくとも1つの電気加熱抵抗器(5)を有し、
更に、前記本体(1.0,2.0)は、接触要素を有し、前記接触要素を介して、少なくとも1つの加熱抵抗器(5)が電源(1.2,2.2)に接続され、定義された温度プロファイルは、幾何学的に配置された(単数又は複数の)導体ループの結果として生成され、前記温度プロファイルは、予備成形体(3)又は半製品の表面との接触により、及び/又は、対流及び/又は熱放射線を用いることによる非接触な方法により前記第1層又はコーティング(1.1,2.1)上に形成された外側コンタクト層(1.3,2.3)を介して前記予備成形体(3)又は前記半製品に転送され、前記定義された温度プロファイルの転送においては、前記予備成形体(3)又は前記半製品は(単数又は複数の)前記コンタクト層(1.3,2.3)から間隔をあけて配置され、加熱を少なくともタッチング接触で達成しようとする場合、複数の加熱抵抗器(5)が全体的に平面状の半製品に存在する装置。 - 請求項1に記載の装置において、
前記本体(1.0,2.0)及び/又は少なくとも前記外側コンタクト層(1.3,2.3)は、前記予備成形体(3)又は前記半製品の表面の少なくとも1つの部分領域に対応し、好ましくは前記予備成形体(3)の内表面に対応することを特徴とする装置。 - 請求項1又は2に記載の装置において、
少なくとも1つの電気加熱抵抗器(5)が、添加されたセラミック材料又はポリマー材料から形成され、又は、電気的に絶縁されたキャリア層の上に塗布され又は当該キャリア層の内部に埋め込まれた電気的に導電性のある金属層又は酸化物層で形成され、
前記キャリア層が、前記本体(1.0,2.0)に面する側と電気的に絶縁されることを特徴とする装置。 - 請求項1乃至3のいずれか1項に記載の装置において、
電気加熱抵抗器(5)は、1μm〜100 μmの厚さを有し、0.001 mm 〜5 mmの幅を有することを特徴とする装置。 - 請求項1乃至4のいずれか1項に記載の装置において、
(単数又は複数の)電気加熱抵抗器(5)の導体ループが、
前記本体(1.0,2.0)の表面上に、パス状、蛇行配置及び/又は螺旋配置のように形成されることを特徴とする装置。 - 請求項1乃至5のいずれか1項に記載の装置において、
(単数又は複数の)電気加熱抵抗器(5)の導体ループが、
前記本体(1.0,2.0)の表面上に直接印刷されることを特徴とする装置。 - 請求項1乃至6のいずれか1項に記載の装置において、
前記外側コンタクト層は、ガラス材料、セラミック材料又はポリマー材料から形成されることを特徴とする装置。 - 請求項1乃至7のいずれか1項に記載の装置において、
前記本体(1.0,2.0)は、前記第1層(1.1,2.1)と前記コンタクト層(1.3,2.3)との間に、流体を導くための通路及びポートが形成された第2層を更に備えることを特徴とする装置。 - 請求項1乃至8のいずれか1項に記載の装置において、
前記本体(1.0,2.0)の表面に形成された層又はコーティングの少なくとも一方、又は、その上の第3層、又は、温度決定について決定することができる(単数又は複数の)加熱抵抗器(5)の電気抵抗に、温度及び/又は接触圧力を検出するためのセンサが配置されたことを特徴とする装置。 - 請求項1乃至9のいずれか1項に記載の装置において、
前記本体(1.0,2.0)、及び、前記本体に適用され又は前記本体上に形成されたすべての層又はコーティングは多孔性を有し、及び/又は、通路を有し、この通路を通じて、真空又は過剰な圧力を生成するため流体、特には空気流が実現されることを特徴とする装置。 - 請求項1乃至10のいずれか1項に記載の装置において、
前記装置は、請求項1乃至9のいずれか1項に記載の更なる本体(2.0)を備え、
前記更なる本体(2.0)、及び/又は、前記更なる本体(2.0)の少なくとも外側のコンタクト層(2.3)は、前記第1の本体(1.0)に補足され、及び/又は、前記第1の本体(1.0)の前記外側コンタクト層(1.3)に少なくとも補足され、前記予備成形体(3)又は半製品の表面の少なくとも一部の領域に対応し、好ましくは前記予備成形体(3)又は半製品の外側面に対応し、それに接触していてもよいことを特徴とする装置。 - 請求項1乃至11のいずれか1項に記載の装置において、
少なくとも1つの加熱抵抗器(5)又は複数の加熱抵抗器は、局所的に区別された温度分布を有する定義された温度プロファイルが、熱伝導、対流及び/又は熱放射線の結果として前記予備成形体(3)上又は前記半製品上に転送されるように、配置され、構成され、及び/又は動作可能とされることを特徴とする装置。 - 請求項1乃至12のいずれか1項に記載の装置において、
複数の加熱抵抗器(5)は、個別に制御可能であることを特徴とする装置。 - 請求項1乃至13のいずれか1項に記載の装置において、
前記加熱抵抗器(5)は、パルス状に制御され、及び/又は、各々の加熱抵抗器の領域における各々の温度に依存して、又は、隣接する加熱抵抗器(5)の領域に依存して制御されることを特徴とする装置。 - 請求項1乃至14のいずれか1項に記載の装置において、
少なくとも本体/各本体(1.0,2.0)は、セラミック材料から形成され、電気的に導電性のある接続は、材料中のビアによって達成されることを特徴とする装置。 - 請求項1乃至15に記載の装置において、
少なくとも本体/各本体(1.0,2.0)は、LTCCセラミック材料又はHTCCセラミック材料から形成可能であることを特徴とする装置。 - 請求項1乃至16のいずれか1項に記載の装置において、
少なくとも一つの本体(1.0,2.0)が、相互に接続可能な個別のモジュールを複数有して形成され、少なくとも一つの加熱抵抗器(5)が、個々のモジュールの各々に存在することを特徴とする装置。 - 請求項1乃至17に記載の装置において、
前記予備成形体(3)は、コンタクト層(1.3,2.3)に備え付けた要素(4)間を通り抜けて又は要素(4)間の内部を移動可能であり、及び/又は、本体(1.0)は、前記予備成形体(3)の内部を移動可能であることを特徴とする装置。 - 請求項1乃至18のいずれか1項に記載の装置において、
前記コンタクト層(1.3,2.3)は、
前記予備成形体(3)又は前記半製品の材料によって少なくとも50%の割合で吸収される波長域で前記熱放射線が放出されるように構成され、コーティングが施され、及び/又は、動作可能とされることを特徴とする装置。
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